SI8641BD-B-ISR - 5kVrms 4-Ch 150Mbps Digital Isolator | Skyworks
Référence : SI8641BD-B-ISR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.13 | $3,13 |
| 10 | $2.78 | $27,80 |
| 100 | $2.31 | $231,00 |
| 500 | $1.95 | $975,00 |
| 1 000 | $1.62 | $1 620,00 |
SI8641BD-B-ISR Présentation
What is a digital isolator? A digital isolator is a semiconductor device that transfers logic-level signals across an isolation barrier (typically a high-voltage dielectric or RF-coupled transformer inside the chip) while blocking DC and low-frequency transients between the input and output domains. Digital isolators have largely replaced optocouplers because they offer higher data rates, tighter propagation delay, lower power consumption, better CMTI, and longer operational life. Within the broader power management and interface hierarchy, digital isolators sit beside gate drivers, isolated ADCs, and isolated transceivers as the core isolation primitives used in motor control, solar inverters, EV charging, factory automation, and medical equipment.
Key features of the SI8641BD-B-ISR include CMOS-based isolation technology, 2.375 V to 5.5 V supply range on both sides for flexible level translation, default-high or default-low fail-safe output options, and an enable pin for grouped output control. The wide-body SOIC-16 package provides a clearance and creepage distance compliant with reinforced insulation at 5 kVrms per UL 1577 and IEC 60747-17 (VDE 0884-17) requirements.
Typical applications include industrial Fieldbus isolation (RS-485, RS-232, CAN, SPI, I2C), solar inverter gate-driver signal isolation, motor-drive control signal interfaces, EV charging-station communication, and PLC I/O isolation. The high CMTI of 35 kV/µs ensures reliable data transmission in noisy switching environments such as SiC and IGBT power stages.
When designing with the SI8641BD-B-ISR, place decoupling capacitors (typically 0.1 µF ceramic) as close as possible to each VDD pin, observe PCB layout creepage rules for the 5 kV rating, and confirm that the upstream and downstream supplies can be independently enabled or disabled without violating the device's power-up/power-down sequencing requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, giving procurement teams and design engineers a single decision-ready reference.
Alternatives de remplacement direct pour SI8641BD-B-ISR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SI8641BD-B-ISR (même facteur de forme et même empreinte) — différant par Package, Common-Mode Transient Immunity (CMTI), Number of Channels, Operating Temperature Range, Data Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SI8641BD-B-IS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SI8641ED-B-IS2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SI8640BD-B-IS
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.89 / unité
Voir la fiche technique →SI8642BD-B-IS
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ISO7741QDWRQ1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADUM1411ARWZ
✅ Remplacement direct✓ En stock
$1.75 / unité
Voir la fiche technique →SI8641BD-B-ISR Spécifications
| Isolation Rating | 5000 Vrms |
| Number of Channels | 4 |
| Débit de données | 150 Mbps |
| Common-Mode Transient Immunity (CMTI) | 35 kV/µs (minimum) |
| Propagation Delay | 8 ns (typical) |
| Supply Voltage Range (VDD1, VDD2) | 2.375 V to 5.5 V |
| Plage de température de fonctionnement | -40C to +125C |
| Boîtier | 16-SOIC wide-body (0.295 inch / 7.5 mm) |
| Type de montage | Surface Mount |
| Isolation Technology | CMOS capacitive / RF digital isolation |
| Default Output State | Fail-safe high or fail-safe low (option dependent) |
| Broche d'activation | Yes |
| Channel Direction | Bidirectional / unidirectional configurations available in family |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de SI8641BD-B-ISR
| Broche 1 | VDD1 — Side 1 supply voltage (2.375 V to 5.5 V) |
| Broche 2 | GND1 — Side 1 ground reference |
| Broche 3 | A1 — Side 1 input/output channel 1 |
| Broche 4 | A2 — Side 1 input/output channel 2 |
| Broche 5 | A3 — Side 1 input/output channel 3 |
| Broche 6 | A4 — Side 1 input/output channel 4 |
| Broche 7 | EN1 — Side 1 enable input (active high) |
| Broche 8 | GND1 — Side 1 ground reference (second pin) |
| Broche 9 | GND2 — Side 2 ground reference (first pin) |
| Broche 10 | EN2 — Side 2 enable input (active high) |
| Broche 11 | B4 — Side 2 input/output channel 4 |
| Broche 12 | B3 — Side 2 input/output channel 3 |
| Broche 13 | B2 — Side 2 input/output channel 2 |
| Broche 14 | B1 — Side 2 input/output channel 1 |
| Broche 15 | GND2 — Side 2 ground reference (second pin) |
| Broche 16 | VDD2 — Side 2 supply voltage (2.375 V to 5.5 V) |
Applications typiques
SI8641BD-B-ISR convient pour 7 applications: Industrial Motor-Drive Control Signal Isolation, Solar Inverter Gate-Driver Signal Isolation, EV Charging Station Communication Isolation, PLC and Factory-Automation I/O Isolation, Medical Equipment Patient-Isolation Barrier, Battery Management System (BMS) Communication Isolation, Isolated SPI Bus Interface for Power Modules.
Industrial Motor-Drive Control Signal Isolation
The SI8641BD-B-ISR isolates control signals between a low-voltage MCU and the gate-driver side of a three-phase IGBT or SiC inverter in industrial motor drives. Its 5 kVrms isolation meets IEC 61800-5-1 reinforced insulation for adjustable-speed drives, while 35 kV/µs CMTI ensures PWM signals survive the fast dV/dt of modern SiC switches. Four channels carry PWM, fault, brake, and enable lines from control to power stage in one package. The wide-body SOIC maintains adequate creepage at 600 V and 690 V AC bus voltages. Engineers benefit from 8 ns propagation delay, which preserves dead-time accuracy and reduces motor current distortion at high switching frequencies.
Recommandé
Solar Inverter Gate-Driver Signal Isolation
In solar string inverters and three-phase grid-tie converters, the SI8641BD-B-ISR provides reinforced isolation between the DSP/MCU control board and the high-voltage DC-link and AC-side gate drivers. Its 150 Mbps data rate supports high-resolution PWM and fast serial communication links such as SPI for telemetry. The 35 kV/µs CMTI is critical because SiC MOSFETs in modern solar inverters switch at 50 to 100 kHz with edges faster than 50 V/ns. A wide-body SOIC package ensures the 8 mm creepage needed for 1500 V DC systems certified to IEC 62109-1. Using a single quad-channel isolator reduces BOM count compared to discrete optocouplers and improves long-term reliability under thermal cycling.
Recommandé
EV Charging Station Communication Isolation
EV charging stations require robust isolation between the AC-mains side and the low-voltage controller that handles CAN, RS-485, and PLC communication with the vehicle and the back-end network. The SI8641BD-B-ISR's 5 kVrms rating and 4-channel density provide one device for multiple control and feedback signals across the isolation barrier. Its 8 ns propagation delay keeps CAN-FD and RS-485 timing budgets intact for reliable vehicle-to-charger handshake. Wide-body SOIC with 7.5 mm clearance helps designers meet IEC 61851-1 and UL 2202 reinforced insulation. The device's 2.375 V to 5.5 V supplies simplify interfacing between 3.3 V MCUs and 5 V transceivers without level shifters.
Recommandé
PLC and Factory-Automation I/O Isolation
Programmable Logic Controllers (PLCs) and distributed I/O modules require isolation on every digital input/output channel that interfaces with field wiring subject to transients, ESD, and ground-potential differences. The SI8641BD-B-ISR's 5 kVrms rating, 4-channel density, and 35 kV/µs CMTI allow one device to isolate four 24 V digital I/O lines at a fraction of the cost and size of optocouplers. The 150 Mbps data rate is overkill for slow field I/O but enables integration with high-speed backplane SPI links. Wide-body SOIC maintains creepage for IEC 61131-2 industrial control ratings, and the device's -40C to +125C operating range supports unheated control cabinets and outdoor enclosures.
Recommandé
Medical Equipment Patient-Isolation Barrier
Patient-connected medical devices such as patient monitors, infusion pumps, and ECG machines require 5 kV reinforced isolation between the patient side and mains-connected circuitry to comply with IEC 60601-1. The SI8641BD-B-ISR provides 4 channels of low-power digital isolation in a wide-body SOIC package, suitable for isolating SPI communication, alarm lines, and control signals between isolated patient-side ADCs and the host processor. Its 8 ns propagation delay preserves timing of high-resolution ADC sample triggers. The CMOS-based isolation mechanism eliminates optocoupler aging concerns that affect medical device long-term reliability and lifetime predictions.
Recommandé
Battery Management System (BMS) Communication Isolation
In high-voltage battery packs for electric vehicles and grid storage, the SI8641BD-B-ISR isolates the BMS controller from the high-voltage cell-monitoring IC stack. The 5 kVrms isolation withstands 800 V or 1200 V battery systems, while four channels carry daisy-chain clock, data, fault, and wake signals between high-voltage and chassis-ground domains. 35 kV/µs CMTI ensures data integrity during adjacent inverter switching. The wide-body SOIC's 8 mm creepage satisfies IEC 62619 and UL 1973 for stationary and mobile battery systems. Wide 2.375 V to 5.5 V supply range supports both 3.3 V MCUs and 5 V BMS analog front ends.
Recommandé
Isolated SPI Bus Interface for Power Modules
Intelligent power modules (IPMs) and digital point-of-load converters often require an isolated SPI link between the digital controller and the power-stage telemetry. The SI8641BD-B-ISR provides four channels (clock, data, chip-select, fault) across a 5 kVrms barrier in a single wide-body SOIC, replacing three or four optocouplers. The 150 Mbps data rate supports SPI at 50 MHz or higher with margin, enabling fast telemetry of temperature, current, and fault flags from SiC and GaN modules. The 8 ns propagation delay preserves setup/hold timing on high-speed SPI transactions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SI8641BD-B-ISR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SI8641BD-B-IS | SI8641ED-B-IS2 | SI8640BD-B-IS | ISO7741QDWRQ1 | ADuM1411ARWZ |
|---|---|---|---|---|---|---|
| Package | 16-SOIC wide-body (7.5 mm) | 16-SOIC wide-body (7.5 mm) - same | 16-SOIC wide-body (7.5 mm) - same | 16-SOIC wide-body (7.5 mm) - same | 16-SOIC wide-body (DW) - same footprint | 16-SOIC wide-body (RW) - same footprint |
| Brand | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Texas Instruments | Analog Devices |
| Isolation Rating | 5000 Vrms | 5000 Vrms | 5000 Vrms | 5000 Vrms | 5000 Vrms | 2500 Vrms |
| Data Rate | 150 Mbps | 150 Mbps | 150 Mbps | 150 Mbps | 100 Mbps | 25 Mbps |
| Propagation Delay | 8 ns (typical) | 8 ns | 8 ns | 8 ns | 11 ns | 32 ns |
| CMTI | 35 kV/µs (minimum) | 35 kV/µs | 35 kV/µs | 35 kV/µs | 25 kV/µs | 25 kV/µs |
| Supply Voltage Range | 2.375 V to 5.5 V | 2.375 V to 5.5 V | 2.375 V to 5.5 V | 2.375 V to 5.5 V | 2.25 V to 5.5 V | 2.7 V to 5.5 V |
| Automotive Grade (AEC-Q100) | No | No | No | No | Yes | No |
| Approx. Unit Price (qty 1000) | 1.62 USD | 1.55 USD | 1.85 USD | 1.62 USD | 2.10 USD | 3.40 USD |
Principaux différenciateurs
- Industry-leading 150 Mbps data rate at 5 kVrms (vs ADuM1411ARWZ)
- Higher CMTI for SiC/IGBT inverter robustness (vs ISO7741QDWRQ1)
- Same-package pin compatibility with broader SI86xx family (vs ADuM1411ARWZ)
Notes de conception
Place 0.1 µF low-ESR ceramic decoupling capacitors (X7R or better) within 2 mm of each VDD pin (VDD1 at pin 1, VDD2 at pin 16) and tie GND1 and GND2 to solid ground planes. The wide-body SOIC's 7.5 mm body width provides 8 mm clearance for 5 kVrms reinforced insulation - do not place any traces, vias, or copper pours under or between the input and output sides of the package, otherwise creepage is compromised and the isolation rating is invalidated.
Do not assume channel-direction codes are interchangeable across the SI86xx family. SI8641 has all 4 channels forward (input on side 1, output on side 2). SI8640 has 3 forward / 1 reverse, and SI8642 has 2 forward / 2 reverse. Substituting one for another without checking the pinout table will create non-functional boards. Always verify pin 3-6 (side 1) versus pin 11-14 (side 2) assignments against your schematic before sourcing alternatives.
Estimated: at 150 Mbps the SI8641BD-B-ISR's 8 ns propagation delay contributes 8 ns of channel-to-channel skew worst-case (channel 1 to channel 4). For protocols sensitive to channel skew such as parallel PWM or synchronous SPI, place the slowest-tolerance channel on the A1/B1 pair and verify with a timing budget. Source-terminate long PCB traces (>50 mm) with 33 Ω series resistors near the driver side to prevent ringing on the isolation capacitive barrier.
The wide-body SOIC-16 dissipates approximately 25 mW per channel at 150 Mbps, totaling around 100 mW for a fully-loaded 4-channel SI8641BD-B-ISR. With θJA near 80 °C/W on a standard 4-layer JEDEC board, junction temperature rise is roughly 8 °C above ambient - well within the -40C to +125C rating. No heatsink or thermal copper pour is required, but on densely packed boards maintain at least 5 mm clearance around the package for high-voltage safety creepage.
Informations de conformité
RoHS and REACH compliant per Skyworks product page. Safety certifications per SI864x datasheet: UL 1577 recognized, IEC 60747-17 (VDE 0884-17) certified. Not AEC-Q100 qualified - select automotive-grade equivalent (e.g., ISO7741QDWRQ1 or automotive SI86xx variant) for vehicle applications.
