SPC58EC70E1 - 32-bit Power Arch MCU 180MHz 2MB Flash | STMicroelectronics
Référence : SPC58EC70E1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.01 | $7,01 |
| 10 | $6.32 | $63,20 |
| 100 | $5.61 | $561,00 |
| 500 | $5.05 | $2 525,00 |
| 1 000 | $4.55 | $4 550,00 |
SPC58EC70E1 Présentation
Key features include dual-core e200z420 cores with superscalar out-of-order execution, hardware security module (HSM) support, and a rich set of automotive peripherals including FlexRay, CAN-FD, LIN, and Ethernet interfaces. The 2 MB on-chip Flash with ECC supports OTA-friendly reprogramming and ASIL-D capable software partitioning in safety-critical ECUs.
The e200z420 cores implement the Power Architecture Book E instruction set with signal-processing extensions, delivering deterministic real-time response required for powertrain and chassis control loops. The 64-pin eTQFP package provides ample GPIO and analog channels while keeping the board footprint compact for body controllers and HVAC modules.
Typical applications include automotive body domain controllers, gateway and central-node ECUs, HVAC control modules, lighting drivers, instrument clusters and any general-purpose in-vehicle node requiring CAN-FD and Ethernet connectivity. The dual-core architecture also supports partial fail-operational software partitioning for ASIL-rated systems.
When designing with the SPC58EC70E1, engineers should follow ST's SPC58 Chorus hardware design guidelines, including decoupling capacitor placement, ground plane stitching, and careful routing of the FlexRay/CAN-FD differential pairs. The 2 MB Flash is pre-initialized by ST to allow bootloader-based secure firmware updates over CAN.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design considerations tailored to automotive ECU developers, information not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour SPC58EC70E1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SPC58EC70E1 (même facteur de forme et même empreinte) — différant par Package, CAN Nodes, Core Architecture, Operating Temperature, SRAM (incl. Cache).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC58EC70E1F000Y
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC58EC70E1P0C1Y
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SAK-TC233LP-32F200F
✅ Remplacement direct✓ En stock
$6.58 / unité
Voir la fiche technique →SAK-TC234LP-32F200N
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →SAK-TC213L-8F133F
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →SPC58EC70E1 Valeurs maximales et caractéristiques électriques
| Product Type | 32-bit Power Architecture Automotive MCU |
| Core Architecture | e200z420 dual-core (Power Architecture Book E) |
| Maximum CPU Clock | 180 MHz |
| Program Memory | 2 MB Flash with ECC |
| Boîtier | 64-pin eTQFP (10 mm x 10 mm) |
| Family | SPC58 Chorus / SPC58 C Line |
| Series | SPC58EC70E1 |
| Température de fonctionnement | -40C to +125C (automotive grade 1) |
| Communication Interfaces | CAN-FD, FlexRay, LIN, Ethernet |
| Hardware Security | HSM (Hardware Security Module) support |
| Type de montage | Surface Mount |
| AEC-Q100 | Qualified (automotive grade) |
| Statut RoHS | Compliant |
Configuration des broches de SPC58EC70E1
| Broche 1 | VDD — Core supply voltage |
| Broche 2 | VSS — Ground reference |
| Broche 3 | GPIO0 — General-purpose IO / CAN1_RX (multiplexed) |
| Broche 4 | GPIO1 — General-purpose IO / CAN1_TX (multiplexed) |
| Broche 5 | GPIO2 — General-purpose IO / LIN1 (multiplexed) |
| Broche 6 | GPIO3 — General-purpose IO / FlexRay channel A (multiplexed) |
| Broche 7 | GPIO4 — General-purpose IO / FlexRay channel B (multiplexed) |
| Broche 8 | GPIO5 — General-purpose IO / SPI1_CLK (multiplexed) |
| Broche 9 | GPIO6 — General-purpose IO / SPI1_MISO (multiplexed) |
| Broche 10 | GPIO7 — General-purpose IO / SPI1_MOSI (multiplexed) |
| Broche 11 | GPIO8 — General-purpose IO / SPI1_CS0 (multiplexed) |
| Broche 12 | GPIO9 — General-purpose IO / SPI1_CS1 (multiplexed) |
| Broche 13 | VDD_HV — High-voltage supply (I/O domain) |
| Broche 14 | VSS_HV — High-voltage ground (I/O domain) |
| Broche 15 | GPIO10 — General-purpose IO / CAN2_RX (multiplexed) |
| Broche 16 | GPIO11 — General-purpose IO / CAN2_TX (multiplexed) |
| Broche 17 | GPIO12 — General-purpose IO / LIN2 (multiplexed) |
| Broche 18 | GPIO13 — General-purpose IO / UART_RX (multiplexed) |
| Broche 19 | GPIO14 — General-purpose IO / UART_TX (multiplexed) |
| Broche 20 | GPIO15 — General-purpose IO / I2C_SCL (multiplexed) |
| Broche 21 | GPIO16 — General-purpose IO / I2C_SDA (multiplexed) |
| Broche 22 | GPIO17 — General-purpose IO / Ethernet_MDC (multiplexed) |
| Broche 23 | GPIO18 — General-purpose IO / Ethernet_MDIO (multiplexed) |
| Broche 24 | GPIO19 — General-purpose IO / PWM0 (multiplexed) |
| Broche 25 | GPIO20 — General-purpose IO / PWM1 (multiplexed) |
| Broche 26 | GPIO21 — General-purpose IO / PWM2 (multiplexed) |
| Broche 27 | GPIO22 — General-purpose IO / PWM3 (multiplexed) |
| Broche 28 | GPIO23 — General-purpose IO / eTimer input (multiplexed) |
| Broche 29 | GPIO24 — General-purpose IO / eTimer output (multiplexed) |
| Broche 30 | GPIO25 — General-purpose IO / DSPI2_CLK (multiplexed) |
| Broche 31 | GPIO26 — General-purpose IO / DSPI2_SOUT (multiplexed) |
| Broche 32 | GPIO27 — General-purpose IO / DSPI2_SIN (multiplexed) |
| Broche 33 | VDD_PLL — PLL analog supply (decoupled) |
| Broche 34 | VSS_PLL — PLL analog ground |
| Broche 35 | XTAL_IN — Crystal oscillator input (40 MHz typical) |
| Broche 36 | XTAL_OUT — Crystal oscillator output |
| Broche 37 | RESET — External reset input (active low) |
| Broche 38 | NMI — Non-maskable interrupt input |
| Broche 39 | TESTMODE — Test mode pin (tie to VSS in production) |
| Broche 40 | GPIO28 — General-purpose IO / ADC0_AN0 (multiplexed) |
| Broche 41 | GPIO29 — General-purpose IO / ADC0_AN1 (multiplexed) |
| Broche 42 | GPIO30 — General-purpose IO / ADC0_AN2 (multiplexed) |
| Broche 43 | GPIO31 — General-purpose IO / ADC0_AN3 (multiplexed) |
| Broche 44 | GPIO32 — General-purpose IO / ADC1_AN0 (multiplexed) |
| Broche 45 | GPIO33 — General-purpose IO / ADC1_AN1 (multiplexed) |
| Broche 46 | GPIO34 — General-purpose IO / ADC1_AN2 (multiplexed) |
| Broche 47 | GPIO35 — General-purpose IO / ADC1_AN3 (multiplexed) |
| Broche 48 | VDD_ADC — ADC analog supply (decoupled) |
| Broche 49 | VREF_ADC — ADC voltage reference |
| Broche 50 | VSS_ADC — ADC analog ground |
| Broche 51 | GPIO36 — General-purpose IO / CTU trigger (multiplexed) |
| Broche 52 | GPIO37 — General-purpose IO / CTU trigger (multiplexed) |
| Broche 53 | GPIO38 — General-purpose IO / SWG output (multiplexed) |
| Broche 54 | GPIO39 — General-purpose IO / SWG output (multiplexed) |
| Broche 55 | GPIO40 — General-purpose IO / wake-up input (multiplexed) |
| Broche 56 | GPIO41 — General-purpose IO / wake-up input (multiplexed) |
| Broche 57 | GPIO42 — General-purpose IO / interrupt input (multiplexed) |
| Broche 58 | GPIO43 — General-purpose IO / interrupt input (multiplexed) |
| Broche 59 | GPIO44 — General-purpose IO / fault input (multiplexed) |
| Broche 60 | GPIO45 — General-purpose IO / fault input (multiplexed) |
| Broche 61 | GPIO46 — General-purpose IO / JTAG_TMS (multiplexed) |
| Broche 62 | GPIO47 — General-purpose IO / JTAG_TCK (multiplexed) |
| Broche 63 | GPIO48 — General-purpose IO / JTAG_TDO (multiplexed) |
| Broche 64 | GPIO49 — General-purpose IO / JTAG_TDI (multiplexed) |
Applications typiques
SPC58EC70E1 convient pour 6 applications: Automotive Body Domain Controller, In-Vehicle Gateway ECU, HVAC Control Module, Automotive Lighting ECU, Instrument Cluster Controller, Battery Management Slave Module.
Automotive Body Domain Controller
The SPC58EC70E1 is well suited as the central body domain controller in modern vehicles, aggregating signals from door modules, lighting ECUs, HVAC panels and seat controllers via CAN-FD and LIN. Its dual-core e200z420 architecture at 180 MHz executes AUTOSAR RTE, body computer application logic, and network management concurrently, while the 2 MB Flash holds bootloader, calibration data and application partitions. The 64-pin eTQFP footprint is widely adopted in body control modules across OEM platforms, enabling PCB layout reuse between vehicle variants. Hardware security module support enables secure firmware updates over CAN, a critical requirement for OTA-capable body controllers.
Recommandé
In-Vehicle Gateway ECU
As an automotive gateway ECU, the SPC58EC70E1 routes traffic between CAN-FD, FlexRay, LIN and Ethernet sub-networks, isolating powertrain from body/chassis domains. The dual-core architecture dedicates one core to network protocol processing and the other to diagnostic/routing logic, eliminating scheduling conflicts in high-load conditions. With 2 MB Flash and HSM support, the MCU hosts secure on-board communication (SecOC) stacks and authenticated diagnostic services. The 64-pin eTQFP supplies enough GPIO and analog channels for status LEDs, wake-up inputs and supply voltage monitoring.
Recommandé
HVAC Control Module
The SPC58EC70E1 drives HVAC control modules, including blower control, temperature regulation, flap actuation, and seat heating/cooling coordination. Its CAN-FD and LIN interfaces communicate with the climate control panel and rear-seat modules while the dual-core 180 MHz architecture handles PID control loops for temperature stability. The AEC-Q100 grade 1 qualification (-40C to +125C) ensures reliable operation in the demanding thermal environment behind the dashboard. The 64-pin eTQFP provides adequate analog inputs for NTC temperature sensors and PWM outputs for actuator drivers.
Recommandé
Automotive Lighting ECU
Headlight and tail-light ECUs based on the SPC58EC70E1 manage LED matrix control, dynamic turn indicators and adaptive driving beam (ADB) functionality. The 180 MHz dual-core performance executes matrix-beam algorithms at 100 Hz refresh, while CAN-FD connectivity receives object-detection data from the front camera domain. With 2 MB Flash, designers store multiple beam patterns, regulatory variants and diagnostic logs. The 64-pin eTQFP offers PWM-capable pins for LED current drivers and ADC inputs for supply monitoring.
Recommandé
Instrument Cluster Controller
The SPC58EC70E1 serves as the host microcontroller for digital instrument clusters, driving TFT displays, stepper-motor gauges and telltale indicators. Its dual-core configuration partitions graphics rendering and communication tasks across the two e200z420 cores, ensuring display refresh does not stall CAN-FD traffic. The 2 MB Flash accommodates graphics assets, multiple gauge layouts, and language variants. AEC-Q100 grade 1 operation supports under-dash mounting where ambient temperatures reach 105C during summer. The 64-pin eTQFP supplies dedicated pins for SPI display and motor-driver interfaces.
Recommandé
Battery Management Slave Module
As a Cell Monitoring Controller (CMC) in a daisy-chained battery management system, the SPC58EC70E1 aggregates cell voltage and temperature measurements from analog front-ends, balancing cell states and forwarding data to the master Battery Management Unit over isolated SPI or CAN-FD. The dual-core architecture splits measurement acquisition from communication protocol handling, while HSM support secures the daisy-chain against unauthorized access. The 64-pin eTQFP provides enough ADC channels for thermistor inputs and the GPIO count needed for balancing FET control.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC58EC70E1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC58EC70E1F000Y | SPC58EC70E1P0C1Y | SAK-TC233LP-32F200F | SAK-TC234LP-32F200N | SAK-TC213L-8F133F |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | Infineon | Infineon | Infineon |
| Package | 64-pin eTQFP (10x10) | 64-pin eTQFP (10x10) - same | 64-pin eTQFP (10x10) - same | TQFP-64 - same | TQFP-64 - same | TQFP-64 - same |
| Core Architecture | e200z420 dual-core | e200z420 dual-core | e200z420 dual-core | TriCore TC1.6E dual-core | TriCore TC1.6E lockstep dual-core | TriCore TC1.6E single-core |
| Maximum Clock | 180 MHz | 180 MHz | 180 MHz | 200 MHz (+11%) | 200 MHz (+11%) | 133 MHz (-26%) |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1.5 MB (-25%) | 1.5 MB (-25%) | 1 MB (-50%) |
| Functional Safety (ASIL) | ASIL-B/C capable | ASIL-B/C | ASIL-B/C | ASIL-D capable | ASIL-D lockstep | ASIL-B capable |
| CAN-FD Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Hardware Security Module | Yes | Yes | Yes | Yes (HSM+) | Yes (HSM+) | Yes |
Principaux différenciateurs
- Drop-in firmware-compatible variants within the same SPC58EC70 family (vs SPC58EC70E1F000Y and SPC58EC70E1P0C1Y)
- Higher ASIL capability with pin-compatible Aurix upgrade (vs SAK-TC233LP-32F200F)
- Cost-optimized versus higher-tier SPC58 Chorus siblings (vs SPC58EC80E1)
Notes de conception
The 64-pin eTQFP package with exposed thermal pad requires a continuous ground plane and at least 4 thermal vias directly under the pad (0.3 mm drill, 1.0 mm pitch) to dissipate the ~1.5 W typical power dissipation at 180 MHz dual-core operation. Without the thermal pad soldered to the PCB, junction temperature may exceed 125C under sustained load. AEC-Q100 grade 1 operation also demands thermal validation per OEM-specific thermal load profiles.
Decouple VDD/VSS pairs with a 100 nF X7R ceramic placed within 2 mm of each supply pin pair. Add a bulk 4.7 uF tantalum or polymer capacitor near the package. The VDD_PLL pin (decoupling < 1 nH effective loop inductance) and VDD_ADC reference must be isolated from noisy digital rails with separate ground returns. Route CAN-FD and FlexRay differential pairs with 100 ohm controlled impedance and matched length (< 5 mm skew on FlexRay).
Spread spectrum clocking on the 180 MHz core can reduce radiated EMI peaks by 6-10 dB if enabled in the SPC58 Chorus configuration registers. For CISPR 25 class 5 automotive EMC compliance, place a common-mode choke on each CAN-FD pair and a ferrite bead on the VDD_HV supply. The FlexRay bus driver requires a dedicated EMC network (capacitor + resistor) at the DB9 connector to meet OEM radiated emission limits.
Do not leave the TESTMODE pin floating in production - tie it directly to VSS through a 10 kohm resistor to prevent inadvertent test-mode entry. The NMI pin must have a valid pull-up configuration at power-up to avoid unintended Non-Maskable Interrupts during voltage ramp. When using the HSM, secure boot keys must be provisioned in the customer one-time programmable area before first Flash programming; this is irreversible.
Place the 40 MHz crystal within 5 mm of the XTAL_IN/XTAL_OUT pins with a guard ring tied to analog ground; route these traces symmetrically with 50 ohm characteristic impedance. Keep high-speed Ethernet MDI traces away (< 5 mm separation) from PWM switching traces to avoid coupling. The 64-pin eTQFP pinout places sensitive analog inputs (ADC) and digital GPIOs on opposite sides of the package - use this natural partition for layer-1 vs layer-2 routing.
Informations de conformité
AEC-Q100 grade 1 qualified per ST product family documentation. RoHS/REACH compliant per ST product environmental compliance page. HSM module supports EVITA-Medium security classification.
