STA559BW13TR - 2-Channel 2A Audio IC | STMicroelectronics
Référence : STA559BW13TR ✓ ActifSTA559BW13TR Présentation
A digital audio amplifier is a power-management and signal-processing semiconductor that converts digital audio information into efficient pulse-width-modulated output suitable for driving loudspeakers. The STA559BW family belongs to the broader FFX digital amplifier category, integrating system-level audio control with an efficient power stage. This integration reduces the number of separate processing and amplifier blocks required in compact home-theater, portable-speaker, DVD, and active-speaker designs.
Key features include support for 2.1-channel audio, a 5 V operating supply, 2 A output capability, and three output-power configurations identified in the product documentation. The device can provide two channels of ternary PWM output and incorporates FFX digital amplifier control. Its integrated approach allows digital audio processing and power-stage management to share one package, reducing board complexity compared with a conventional processor plus separate output-amplifier arrangement.
The STA559BW architecture is intended to deliver high audio quality with high conversion efficiency. FFX control manages the digital amplification process, while the integrated output stage provides the electrical drive required for compact speaker systems. Designers must still account for supply decoupling, speaker configuration, thermal behavior, output filtering, and the exposed thermal pad when laying out the PCB.
Typical applications include 2.1-channel home-theater systems, DVD and television audio equipment, active speakers, compact multimedia speakers, and other consumer products requiring integrated digital amplification. A two-channel mode is suitable for stereo playback, while the subwoofer channel can provide low-frequency reinforcement in a 2.1-channel configuration. The number of populated output channels should follow the application’s channel map and supported FFX configuration.
For reliable implementation, place the input, output, and supply connections according to the manufacturer datasheet and preserve the exposed-pad thermal and electrical requirements. The exposed pad must be connected to the appropriate ground plane with adequate copper area and thermal vias. Avoid placing high-current return paths through the signal-ground region, and follow the recommended passive network and output-filter values exactly.
This product summary consolidates the verified package, channel, voltage, current, audio-performance, and ordering information with practical implementation guidance. It also distinguishes confirmed characteristics from parameters that must be checked in the manufacturer datasheet, helping engineers evaluate the STA559BW13TR before beginning a PCB or power-supply design.
Alternatives de remplacement direct pour STA559BW13TR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STA559BW13TR (même facteur de forme et même empreinte) — différant par Package.
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesSTA559BW13TR Valeurs maximales et caractéristiques électriques
| Device Type | Fully integrated digital audio processor and power amplifier |
| Product Family | STA559BW FFX digital amplifier family |
| Nominal Supply Voltage | 5 V |
| Wide-Range Supply Voltage | 16 V |
| Courant de sortie maximal | 2 A |
| Supported Channel Configuration | 2.1 channels |
| Power Output Configurations | 3 configurations |
| Output Modulation | Ternary PWM |
| Audio Performance | 100 dB |
| Distortion Specification | 0.2% |
| Boîtier | PowerSSO-36 exposed-pad package |
| Package Family | 36-BFSOP exposed-pad package, 7.50 mm width |
| Type de montage | Surface mount |
| Packaging | Tape and reel |
Guide de configuration des broches du STA559BW13TR 36-bfsop exposed-pad package, 7.50 mm width
Configuration des broches du STA559BW13TR (boîtier 36-bfsop exposed-pad package, 7.50 mm width). Ce composant analogique comporte des broches d'entrée, de sortie et d'alimentation. Consultez la fiche technique du fabricant pour les configurations des broches d'annulation d'offset, de compensation et d'activation. Idéal pour le conditionnement de signaux et les circuits amplificateurs.
Aucune donnée de brochage détaillée disponible pour STA559BW13TR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
STA559BW13TR convient pour 6 applications: Home-Theater 2.1-Channel System, Active Stereo Speakers, DVD and Television Audio, Portable Multimedia Speaker, Powered Subwoofer, Digital Audio Processing Platform.
Home-Theater 2.1-Channel System
The STA559BW13TR fits a compact home-theater system requiring two main channels and a subwoofer channel in a 5 V-powered design. Its integrated processor, FFX digital amplifier control, and power output stage reduce the number of separate audio blocks, while the 2.1-channel architecture matches common 5.1-source downmix systems. The nominal 5 V supply and 2 A current rating make channel count and load impedance important constraints. Designers should use the documented output configurations, verify continuous and peak loading, and reserve PCB copper for the exposed pad before finalizing the amplifier board.
Active Stereo Speakers
The STA559BW13TR can serve as the integrated digital amplification core of a powered stereo speaker when the system uses compatible digital audio signaling and FFX control. A 2.1-channel device can support left and right channels while adding a subwoofer output when the enclosure provides adequate space and cooling. Its 2 A output capability, 100 dB audio-performance specification, and ternary PWM output provide useful starting points for system design. The final speaker load, output filter, thermal design, and channel routing should follow the manufacturer application guidance.
DVD and Television Audio
The STA559BW13TR is suitable for compact DVD, television, and multimedia products that need digital amplification in a limited board area. Integrating digital audio processing, amplifier control, and the output stage can reduce external circuitry and simplify the signal path compared with separate controller and power-amplifier components. Its 2.1-channel capability supports stereo playback with optional low-frequency reinforcement, while the 5 V nominal supply aligns with many consumer power systems. Product developers should verify source format, FFX configuration, EMI filtering, and the exposed-pad thermal path before layout release.
Portable Multimedia Speaker
A battery-powered portable multimedia speaker can use the STA559BW13TR when its supply, load, thermal, and audio-interface requirements are compatible with the device. The integrated digital processing and output architecture is useful in a compact enclosure, while the documented 2.1-channel support permits main-channel and subwoofer operation. Since the nominal supply is 5 V and the wide-range supply characteristic extends to 16 V, the power-system design must account for conversion efficiency, peak current, protection behavior, and sound-pressure requirements rather than relying on battery voltage alone.
Powered Subwoofer
The STA559BW13TR can support powered-subwoofer designs within the limits of its 2 A output-current and 2.1-channel architecture. Integrating digital processing with the FFX power stage can simplify a dedicated low-frequency amplifier and provide configurable output behavior. However, subwoofer impedance, amplifier topology, peak-power demand, and filter settings can materially affect thermal and acoustic performance. Use the manufacturer’s supported output modes and protection guidance, and validate worst-case loudspeaker loading rather than treating the 2 A figure as guaranteed continuous power for every impedance.
Digital Audio Processing Platform
The STA559BW13TR is useful as the processing-and-amplification element of a compact digital audio platform that requires local volume or output management close to the speaker drive stage. Its integrated FFX control, ternary PWM output, three power-output configurations, and 2.1-channel architecture can shorten the analog output path in a multi-zone consumer design. The implementation should preserve signal integrity with controlled ground return paths, follow the recommended output-network values, and provide adequate supply decoupling. The exposed pad requires a low-impedance thermal and electrical ground connection.
Données de référence d'ingénierie pour STA559BW13TR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit |
|---|---|
| Package | PowerSSO-36 exposed-pad package |
| Brand | STMicroelectronics |
| Device Type | Fully integrated digital audio processor |
| Nominal Supply Voltage | 5 V |
| Wide-Range Supply Voltage | 16 V |
| Maximum Output Current | 2 A |
| Channel Configuration | 2.1 channels |
| Audio Performance | 100 dB |
| Distortion Specification | 0.2% |
| Output Modulation | Ternary PWM |
| Mounting Type | Surface mount |
Notes de conception
Treat the exposed pad as both an electrical ground connection and the primary thermal path. Place a continuous PCB ground-plane region beneath the package, use the manufacturer-recommended via pattern where space permits, and keep the thermal-via current path short. Validate the hottest expected channel, speaker load, supply level, and enclosure temperature. If the enclosure limits airflow, increase copper area or add a thermal interface and heatsink only after thermal simulation and junction-temperature calculations.
Use a compact, partitioned power layout with the digital-audio inputs, configuration signals, and power-stage outputs kept separate. Place the required input, output, and bypass capacitors at the pins identified in the manufacturer datasheet rather than concentrating them at the board edge. Return speaker-current paths directly to the power ground and avoid routing them beneath sensitive audio traces. The exposed pad should connect to the same ground reference with low impedance and without accidental isolation by an inner-layer split.
Class-D output stages can produce high-frequency switching energy on speaker and supply connections. Follow the documented output-filter values, keep the switching-current loop physically small, and provide the recommended supply bypass network near the device. Check emissions and emissions-susceptibility with the intended output cables, speaker loads, chassis, and enclosure. Changes to filter components or board geometry can alter switching-node behavior, so validate EMI after assembly rather than relying only on schematic compliance.
Do not equate the 2 A current rating with guaranteed continuous output power for every speaker impedance or channel combination. Verify the selected output configuration, load limits, thermal conditions, and protection behavior in the manufacturer datasheet. Also distinguish the nominal 5 V operating supply from the 16 V wide-range capability, and confirm all digital-audio and FFX settings before production release. A related shortened MPN is not a drop-in substitute unless its complete pinout and ratings match.
Informations de conformité
The product is described as a surface-mount, tape-and-reel audio IC. Specific RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations are not stated in the available product information and must be confirmed on the manufacturer product page or current material-compliance documentation.
