STM32F103RDT6 - 384KB Flash Cortex-M3 MCU 64-LQFP | STMicroelectronics
Référence : STM32F103RDT6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.72 | $12,72 |
| 10 | $11.45 | $114,50 |
| 100 | $10.18 | $1 018,00 |
| 500 | $9.15 | $4 575,00 |
| 1 000 | $8.2 | $8 200,00 |
STM32F103RDT6 Présentation
Background: An ARM Cortex-M3 microcontroller is a 32-bit RISC core with Thumb-2 instruction set, hardware divide, NVIC interrupt controller, and tightly coupled memory interfaces, designed for deterministic real-time embedded control. Within the broader taxonomy, the Cortex-M3 belongs to the ARM Cortex-M family -> 32-bit RISC microcontrollers -> embedded microcontrollers -> microprocessors -> semiconductors. The STM32F1 series is ST's mainstream Cortex-M3 line spanning low-, medium-, high-, and XL-density sub-families with progressively richer peripheral sets.
Key specifications include a 2.0-3.6 V single supply range, 4-16 MHz crystal driver with internal 8 MHz RC and 40 kHz LSI for RTC, 12-bit ADC with up to 16 channels, two 12-bit DACs, an FS USB PHY, and a CAN 2.0B controller. The device also features a 7-channel DMA, an SDIO interface for SD/MMC cards, and a CRC engine for embedded communication stacks. Performance is rated up to 90 DMIPS at 72 MHz, with single-cycle multiply and hardware divide.
Architecturally, the STM32F103RDT6 uses a multi-AHB bus matrix connecting the Cortex-M3 core, DMA engines, and on-chip peripherals, allowing simultaneous memory and peripheral access without contention. Standard peripherals include three general-purpose 16-bit timers, one PWM timer for motor control, two watchdog timers (independent and window), and a SysTick timer. Embedded Flash is zero-wait state up to 24 MHz; above that, a prefetch buffer maintains 72 MHz operation without software wait states.
Typical applications include three-phase motor drives (BLDC, PMSM, induction), industrial control PLCs, USB-CAN bridges, HVAC controllers, low-cost data loggers, biometric instrumentation, and handheld POS equipment. The combination of CAN, USB, and 12-bit ADC resolution in a 64-LQFP package makes the STM32F103RDT6 especially common in automotive aftermarket and 24 V industrial designs where USB diagnostics and CAN fieldbus must coexist.
Design consideration: At 72 MHz and 1.8 V core, idle current is roughly 27 mA; selecting sleep or stop modes with RTC wake-up can drop this to the tens-of-microamp range for battery-backed nodes. The 64-LQFP 10x10 mm footprint with 0.5 mm pitch can be hand-soldered, but a 4-layer PCB with continuous ground pour under the exposed pad is recommended for stable ADC performance.
This page synthesizes distributor inventory, drop-in alternatives including pin-compatible GD32F103RDT6, application-specific design notes, and verification cross-references not present on any single distributor or manufacturer page.
Alternatives de remplacement direct pour STM32F103RDT6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32F103RDT6 (même facteur de forme et même empreinte) — différant par Package, ADC, Communication Interfaces, Operating Temperature, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
STM32F103RET6
✅ Remplacement direct✓ En stock
$2.2148 / unité
Voir la fiche technique →STM32F103RFT6
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →STM32F103RCT6
✅ Remplacement direct✓ En stock
$1.6406 / unité
Voir la fiche technique →GD32F103RDT6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
APM32F103RDT6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
STM32F103RDT6 Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M3 32-bit RISC |
| Fréquence d'horloge maximale | 72 MHz |
| Performance | 90 DMIPS |
| Program Memory (Flash) | 384 KB |
| SRAM | 64 KB |
| Boîtier | 64-LQFP (10x10 mm), 0.5 mm pitch |
| Tension d'alimentation | 2.0 V to 3.6 V |
| GPIO Pins | 51 |
| ADC | 3 x 12-bit, up to 16 channels, 1 us conversion |
| DAC | 2 x 12-bit |
| Timers | 11 (including 1 PWM, 2 watchdog, SysTick) |
| Communication Interfaces | USB 2.0 FS, CAN 2.0B, 2x I2C, 3x USART + 2x UART, 2x SPI, 1x I2S, SDIO |
| DMA Channels | 7 |
| Température de fonctionnement | -40 C to +85 C (TA) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de STM32F103RDT6
| Broche 1 | PC13 — GPIO/Tamper-RTC; can wake from standby |
| Broche 2 | PC14 — GPIO/OSC32_IN for external 32.768 kHz crystal |
| Broche 3 | PC15 — GPIO/OSC32_OUT for external 32.768 kHz crystal |
| Broche 4 | VSS_1 — Ground reference |
| Broche 5 | VDD_1 — Digital supply 2.0-3.6 V |
| Broche 6 | OSC_IN — Main oscillator input |
| Broche 7 | OSC_OUT — Main oscillator output |
| Broche 8 | NRST — Reset input, active low |
| Broche 9 | PA0 — GPIO/ADC0_IN0/TIM2_CH1_ETR |
| Broche 10 | PA1 — GPIO/ADC0_IN1/TIM2_CH2 |
| Broche 11 | PA2 — GPIO/USART2_TX/ADC0_IN2 |
| Broche 12 | PA3 — GPIO/USART2_RX/ADC0_IN3 |
| Broche 13 | PA4 — GPIO/SPI1_NSS/USART2_CK/ADC1_IN4 |
| Broche 14 | PA5 — GPIO/SPI1_SCK/ADC1_IN5/DAC_OUT1 |
| Broche 15 | PA6 — GPIO/SPI1_MISO/ADC1_IN6/TIM3_CH1 |
| Broche 16 | PA7 — GPIO/SPI1_MOSI/ADC1_IN7/TIM3_CH2 |
| Broche 17 | PC4 — GPIO/ADC1_IN14 |
| Broche 18 | PC5 — GPIO/ADC1_IN15 |
| Broche 19 | PB0 — GPIO/ADC1_IN8/TIM3_CH3 |
| Broche 20 | PB1 — GPIO/ADC1_IN9/TIM3_CH4 |
| Broche 21 | PB2/BOOT1 — GPIO/Boot mode selection |
| Broche 22 | PB10 — GPIO/I2C2_SCL/USART3_TX |
| Broche 23 | PB11 — GPIO/I2C2_SDA/USART3_RX |
| Broche 24 | VSS_2 — Ground reference |
| Broche 25 | VDD_2 — Digital supply 2.0-3.6 V |
| Broche 26 | PB12 — GPIO/SPI2_NSS/I2C2_SMBAI/TIM1_BKIN |
| Broche 27 | PB13 — GPIO/SPI2_SCK/TIM1_CH1N |
| Broche 28 | PB14 — GPIO/SPI2_MISO/TIM1_CH2N |
| Broche 29 | PB15 — GPIO/SPI2_MOSI/TIM1_CH3N |
| Broche 30 | PC6 — GPIO/TIM8_CH1 |
| Broche 31 | PC7 — GPIO/TIM8_CH2 |
| Broche 32 | PC8 — GPIO/TIM8_CH3 |
| Broche 33 | PC9 — GPIO/TIM8_CH4 |
| Broche 34 | PA8 — GPIO/USART1_CK/TIM1_CH1/MCO |
| Broche 35 | PA9 — GPIO/USART1_TX/TIM1_CH2 |
| Broche 36 | PA10 — GPIO/USART1_RX/TIM1_CH3 |
| Broche 37 | PA11 — GPIO/USB_DM/CAN1_RX/TIM1_CH4 |
| Broche 38 | PA12 — GPIO/USB_DP/CAN1_TX |
| Broche 39 | PA13 — GPIO/JTMS-SWDIO |
| Broche 40 | VSS_3 — Ground reference |
| Broche 41 | VDD_3 — Digital supply 2.0-3.6 V |
| Broche 42 | PA14 — GPIO/JTCK-SWCLK |
| Broche 43 | PA15 — GPIO/JTDI/TIM2_CH1_ETR/SPI1_NSS |
| Broche 44 | PC10 — GPIO/UART4_TX/USART3_TX/I2S_BCLK |
| Broche 45 | PC11 — GPIO/UART4_RX/I2S_WS |
| Broche 46 | PC12 — GPIO/UART5_TX/USART3_CK/I2S_CK |
| Broche 47 | PD2 — GPIO/TIM3_ETR/UART5_RX |
| Broche 48 | PB3 — GPIO/JTDO/TIM2_CH2/SPI1_SCK |
| Broche 49 | PB4 — GPIO/JTRST/TIM3_CH1/SPI1_MISO |
| Broche 50 | PB5 — GPIO/I2C1_SMBAI/TIM3_CH2/SPI1_MOSI |
| Broche 51 | PB6 — GPIO/I2C1_SCL/TIM4_CH1/USART1_TX |
| Broche 52 | PB7 — GPIO/I2C1_SDA/TIM4_CH2/USART1_RX |
| Broche 53 | BOOT0 — Boot mode selection (Flash / Bootloader / RAM) |
| Broche 54 | PB8 — GPIO/TIM4_CH3 |
| Broche 55 | PB9 — GPIO/TIM4_CH4/I2C1_SDA |
| Broche 56 | PC0 — GPIO/ADC1_IN10 |
| Broche 57 | PC1 — GPIO/ADC1_IN11 |
| Broche 58 | PC2 — GPIO/ADC1_IN12 |
| Broche 59 | PC3 — GPIO/ADC1_IN13 |
| Broche 60 | VSS_4 — Ground reference |
| Broche 61 | VDD_4 — Digital supply 2.0-3.6 V |
| Broche 62 | PA0/PA0_WKUP — GPIO/Standby wake-up |
| Broche 63 | VREF+ — ADC/DAC reference positive |
| Broche 64 | VREF- — ADC/DAC reference negative (ground) |
Applications typiques
STM32F103RDT6 convient pour 6 applications: Three-Phase BLDC and PMSM Motor Control, Industrial USB-to-CAN Fieldbus Bridge, HVAC Climate Control and Variable-Frequency Drives, USB-Enabled Handheld POS Terminals, Biometric and Medical Instrumentation, Industrial Sensors and Data Acquisition Modules.
Three-Phase BLDC and PMSM Motor Control
The STM32F103RDT6 is widely used in three-phase BLDC, PMSM, and induction motor drives. Its 72 MHz Cortex-M3 core executes sensorless FOC and field-weakening calculations in real time, while the advanced 16-bit PWM timer produces three complementary PWM channels with programmable dead time for safe half-bridge switching. The three 12-bit ADCs sample phase currents at the same instant via simultaneous trigger, and zero-crossing sensing uses internal comparators to reduce BOM cost. The 384 KB Flash holds reference firmware plus application code for torque control and fault handling. The peripheral complement (CAN for system communication, USART for debug, TIM for encoder feedback) fits mid-power HVAC and small EV auxiliary drives. Compared to the Cortex-M4 STM32F407, the F103 line avoids an FPU cost when integer DSP is sufficient, lowering the bill of materials in motor-control boards where tens of thousands of units ship yearly.
Recommandé
Industrial USB-to-CAN Fieldbus Bridge
In industrial networking, the STM32F103RDT6 anchors USB-to-CAN bridges, CANopen and DeviceNet nodes, and 24 V bus-powered sensor hubs. The integrated USB 2.0 Full-Speed PHY enumerates as a CDC or vendor-class device with up to 12 Mbps throughput, while the CAN 2.0B controller communicates at 1 Mbps for industrial fieldbus. The 64 KB SRAM comfortably buffers CAN frames and USB packet descriptors, while the 384 KB Flash hosts the protocol stack plus vendor extensions. Three USART plus two UART handle RS-232/422/485 channels used for legacy equipment in factory-floor retrofits. Operating from a wide 2.0-3.6 V supply enables direct 3.3 V industrial rail connection. Combined with the 64-LQFP footprint's 51 GPIOs, the F103RDT6 enables gateway designs where separate controllers would otherwise be required, simplifying the BOM.
Recommandé
HVAC Climate Control and Variable-Frequency Drives
Heating, ventilation, and air-conditioning (HVAC) equipment employs the STM32F103RDT6 to drive variable-frequency compressor motors, read temperature and pressure sensors, and control dampers. The 12-bit ADC measures analog thermistor and 4-20 mA sensor signals with 1 microsecond conversion, while two 12-bit DACs generate reference voltages for external trim and feedback loops. Eleven timers cover compressor VFD switching, fan speed capture, and a real-time clock tick; the on-chip 40 kHz LSI drives stop-mode wake-up for timer-based defrost cycles. The 64-LQFP package survives 85 C ambient operation required in equipment enclosures. The 384 KB Flash supports energy-modulation firmware with combined pressure/temperature control loops, while CAN connectivity aids integration into building-management systems as a slave node.
Recommandé
USB-Enabled Handheld POS Terminals
Point-of-sale terminals, handheld scanners, and payment peripherals rely on the STM32F103RDT6 for USB host or device operation, display driving, and secure keypad handling. The USB 2.0 Full-Speed On-The-Go controller attaches to printer peripherals, USB keyboards, or upstream PCs as a virtual COM port, while three USARTs connect to Bluetooth/WiFi/GSM modules for cloud-connected payment. The 12-bit ADC reads battery voltage and thermal sensors; two 12-bit DACs control display brightness and piezo-buzzer volume. The 64-LQFP footprint's 51 GPIOs drive TFT or OLED panels, matrix keypads, and external flash storage for transactional buffering. With 384 KB Flash, terminal firmware fits with OTA update partitioning. Compared with Cortex-M0 alternatives, the F103 offers the math throughput required for cryptographic operations in payment-class firmware.
Recommandé
Biometric and Medical Instrumentation
Medical devices including blood-pressure monitors, glucose meters, infusion pumps, and portable ECG units integrate the STM32F103RDT6 for measurement, display, and low-noise analog signal conditioning. Three 12-bit ADCs simultaneously sample optical pulse oximeter waveforms, body-impedance measurement channels, and battery telemetry; two 12-bit DACs drive sensor excitation and patient-safe reference voltages. The 11 timers generate PWM excitation, time capacitive sensor discharge, and drive haptic-feedback buzzers. USB device connectivity enables tethering to clinician workstations, while CAN connectivity integrates devices into hospital monitoring networks where IEC 60601-1 isolation is added externally. The wide 2.0-3.6 V supply tolerates battery boost/buck outputs and supports portable battery-powered operation, with low-power RTC sleep reducing quiescent current for shelf-life stretching.
Recommandé
Industrial Sensors and Data Acquisition Modules
Programmable Logic Controllers and 24 V industrial data-acquisition modules use the STM32F103RDT6 as the digital front-end for analog signal conditioning, Modbus communication, and isolated CAN outputs. The three 12-bit ADCs read 4-20 mA current-loop channels, thermocouple outputs after amplification, and digital potentiometer scaling; the SDIO interface records to SD cards for black-box event logging. Two SPI channels drive 0-10 V analog output DACs and isolated digital I/O expanders. The 51 GPIOs interface to optocoupler input cards with interrupt-driven EXTI handling. With CAN connectivity, the device clusters as a remote I/O node in industrial cabinets; with USB device capability, technicians tune parameters from a laptop without opening the panel.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32F103RDT6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32F103RET6 | STM32F103RFT6 | STM32F103RCT6 | GD32F103RDT6 | APM32F103RDT6 |
|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics (same-brand) | STMicroelectronics (same-brand) | STMicroelectronics (same-brand) | GigaDevice (cross-brand) | GigaDevice (cross-brand) |
| Core Architecture | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum Clock Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 108 MHz | 96 MHz |
| Flash Memory | 384 KB | 512 KB | 768 KB | 256 KB | 384 KB | 384 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 48 KB | 64 KB | 64 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| USB and CAN | USB FS + CAN 2.0B | USB FS + CAN 2.0B | USB FS + CAN 2.0B | USB FS + CAN 2.0B | USB FS + CAN 2.0B | USB FS + CAN 2.0B |
Principaux différenciateurs
- Same 64-LQFP family with higher Flash upgrade path (vs STM32F103RET6)
- ST ecosystem and toolchain support (vs GD32F103RDT6)
- Decades-long lifecycle stability with broad distributor inventory (vs APM32F103RDT6)
Notes de conception
Estimated: At 72 MHz with all peripherals active, the LQFP-64 package dissipates roughly 250-350 mW worst-case, giving a theta_JA of approximately 46 C/W on a 4-layer JEDEC test board. This translates to about 25-30 C junction-to-ambient rise at 250 mW; at 85 C ambient, the junction reaches 110-115 C, leaving reasonable margin under the 125 C limit. For enclosed industrial cabinets, verify with on-board thermal instrumentation. Estimated values based on STMicroelectronics STM32F103xD typical power figures and a 4-layer PCB with internal ground pour; actual dissipation depends on enabled peripherals and duty cycle.
Per ST datasheet, decouple VDD pins individually with 100 nF ceramic capacitors placed as close as possible to the package pins, plus a bulk 4.7-10 uF capacitor within 20 mm. Keep the analog VREF+ trace short and surround it with digital ground; if the analog 3.3 V is shared with digital supply, add a ferrite bead for ADC noise isolation. Use a 4-layer PCB with continuous ground plane; a 2-layer board works for low-speed GPIO designs but degrades ADC performance above 100 kSPS conversions.
When routing high-speed USB DP/DM traces, keep them matched-length within 1 mm and surrounded by continuous ground. The 12 MHz external HSE crystal should have 12 pF load capacitors per the ST datasheet Crystal section; mismatched loading causes inaccurate 48 MHz USB clocking and enumeration failures on industrial machines with long cables. For CAN bus, place TJA1050 or ISO1050DUB within 50 mm of the CAN1_RX/TX pins and use twisted-pair cable with 120 ohm termination at each end.
When migrating firmware from GD32F103RDT6 to STM32F103RDT6, do not assume identical timing: GD32's zero-wait-state Flash buffering alters bus-cycle counts versus ST's wait-state Flash, so any timing-sensitive code that depends on cycle-accurate instruction delays should be revalidated. ADC peripheral initialization sequences also differ slightly between the two manufacturers. Conversely, migrating up to STM32F103RET6 only changes the Flash size; the entire pinout, peripheral map, and register layout are identical, so recompilation with the appropriate memory-map linker script is the entire porting task.
Informations de conformité
STM32F1 industrial-grade parts are RoHS and lead-free compliant per STMicroelectronics product specifications. The STM32F1 line is not AEC-Q100 qualified for automotive; STM32F103RDT6TR is the tape-and-reel packaging variant of the same die. For automotive use, see STM32 family automotive-grade devices.
