STM32F429NIH6G - 180MHz Cortex-M4 MCU 2MB Flash | ST | TFBGA-216
Référence : STM32F429NIH6G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.45 | $134,50 |
| 100 | $11.95 | $1 195,00 |
| 250 | $11.2 | $2 800,00 |
| 500 | $10.55 | $5 275,00 |
STM32F429NIH6G Présentation
What is a Cortex-M4 microcontroller? An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core with single-precision FPU, DSP instructions, and optional MPU, designed for deterministic real-time control. It sits in the wider hierarchy: microcontroller -> embedded processor -> semiconductor IC, balancing cost, power, and performance for embedded systems. The STM32F429 family is ST's high-performance line within the STM32 portfolio, optimized for graphics, connectivity, and DSP workloads.
Key features include 225 DMIPS / 1.25 DMIPS/MHz (Dhrystone 2.1), an integrated TFT-LCD controller (up to XGA resolution), USB 2.0 OTG full-speed and high-speed, two CAN 2.0B interfaces, an Ethernet MAC, three 12-bit ADCs (2.4 MSPS), two 12-bit DACs, plus cryptographic accelerators (AES, Hash, TRNG). The 216-ball TFBGA exposes up to 168 I/O ports across multiple 5V-tolerant banks, supporting SDRAM and SRAM parallel interfaces.
Architecturally, the device pairs the Cortex-M4 core with a multi-layer AHB/APB bus matrix, the Adaptive Real-Time (ART) accelerator that prefetches instructions into a 64-bit-wide path, and dedicated DMA controllers (two 8-stream DMA + one MDMA). The optional crypto/hash block accelerates TLS handshakes and secure boot, while the FSMC and Chrom-ART engine drive displays with minimal CPU overhead.
Typical applications include industrial HMI panels with TFT touchscreens, point-of-sale terminals, medical patient monitors, building automation controllers, smart-grid metering, GPS/navigation handhelds, and high-end consumer appliances that demand both DSP audio processing and graphical feedback.
Designers should provide a low-ESR 100 nF decoupling cap on each VDD pin and a 4.7 µF bulk capacitor on VDDA, and ensure the VCAP pins each have a 1 µF capacitor. The TFBGA's 0.8 mm pitch requires careful PCB layout, micro-via-in-pad may be advisable for high-speed SDRAM traces, and unused balls should be left floating per ST's PCB design guidelines.
This page synthesizes distributor pricing (as of 2026-10-21), drop-in alternatives within the STM32F429 family and broader STM32 portfolio, and practical hardware design notes that go beyond the data brief.
Alternatives de remplacement direct pour STM32F429NIH6G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32F429NIH6G (même facteur de forme et même empreinte) — différant par Flash Memory, Package, SRAM, Operating Temperature, CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
STM32F429NIH6
✅ Remplacement direct✓ En stock
$8.63 / unité
Voir la fiche technique →STM32F429NIH6U
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
STM32F427NIH6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32F429NIH632MCU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
STM32F429VGT6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.85 / unité
Voir la fiche technique →STM32F429NIH6G Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4 with FPU |
| Maximum CPU Frequency | 180 MHz |
| DMIPS Performance | 225 DMIPS / 1.25 DMIPS/MHz (Dhrystone 2.1) |
| Flash Memory | 2 MB (0-wait-state via ART Accelerator) |
| SRAM | 256 KB (includes 64 KB CCM) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Température de fonctionnement | -40 C to +85 C (grade 6) |
| Boîtier | TFBGA-216 (13x13 mm, 0.8 mm pitch) |
| I/O Count (max) | 168 I/Os (5V-tolerant FT/FTf pins) |
| Display Controller | TFT-LCD controller up to XGA resolution |
| Chrom-ART Accelerator | Yes (DMA2D graphics engine) |
| USB | USB 2.0 OTG FS + USB 2.0 OTG HS (with ULPI) |
| Ethernet | 10/100 Ethernet MAC (IEEE 1588) |
| CAN | 2x CAN 2.0B active |
| ADC / DAC | 3x 12-bit ADC (2.4 MSPS) / 2x 12-bit DAC |
| Crypto / Hash Accelerators | AES-128/192/256, Hash (SHA-1/MD5), TRNG |
| Statut RoHS | Compliant |
| Order Code Suffix | H6G = TFBGA-216 tray, industrial grade 6 |
Guide de configuration des broches du STM32F429NIH6G tfbga-216 (13x13 mm, 0.8 mm pitch)
Configuration des broches du STM32F429NIH6G (boîtier tfbga-216 (13x13 mm, 0.8 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour STM32F429NIH6G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
STM32F429NIH6G convient pour 8 applications: Industrial HMI with TFT Touchscreen, Point-of-Sale (POS) Terminal, Medical Patient Monitor, Building Automation Controller, GPS / Navigation Handheld, Smart Energy Meter / Data Concentrator, High-End Audio DSP Appliance, Vehicle Telematics / Fleet Tracker.
Industrial HMI with TFT Touchscreen
The STM32F429NIH6G drives industrial HMI panels where the integrated TFT-LCD controller (XGA-class resolution) and Chrom-ART DMA2D engine render complex graphics with minimal CPU overhead. With 168 GPIOs and an external SDRAM interface via FSMC, the device handles 7-10 inch touchscreens running emWin/ TouchGFX while polling 5V-tolerant digital inputs from PLC backplanes. The -40 to +85 C industrial temperature grade and 2 MB 0-wait-state Flash make it a strong fit for factory-floor panels requiring deterministic response under heavy GUI load.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals depend on the STM32F429NIH6G's combined Cortex-M4 DSP throughput, AES/Hash crypto accelerators, USB OTG high-speed, and Ethernet MAC with IEEE 1588 timestamping. The 180 MHz core handles PIN-pad encryption (AES-256) and dual-MAC packet timestamping for transaction audit trails. With 256 KB SRAM and TFT-LCD support, the chip drives color receipt displays and customer-facing keypads while sustaining EMV secure transactions at sub-100 ms response times.
Recommandé
Medical Patient Monitor
The STM32F429NIH6G suits patient-monitor main boards where its three 12-bit 2.4 MSPS ADCs sample multi-lead ECG and SpO2 waveforms while the TFT-LCD renders 800x480 graphical vital-sign displays. The FPU accelerates SPO2/IBP DSP filters in real time, and the dual CAN 2.0B interfaces link bedside monitors to central nursing stations. Note that IEC 60601 compliance is at the system level - the device's -40 to +85 C industrial grade supports hospital-grade enclosures.
Recommandé
Building Automation Controller
For BACnet/Modbus building controllers, the STM32F429NIH6G provides Ethernet MAC with hardware IEEE 1588 timestamping for synchronized HVAC scheduling, two CAN 2.0B interfaces for elevator/lift control, and the TFT-LCD controller for in-wall touch panels. The ART Accelerator ensures 0-wait-state interrupt latency under heavy multi-protocol traffic, while the AES block secures over-the-air firmware updates. The 2 MB Flash comfortably stores BACnet objects, Modbus maps, and graphical UI assets.
Recommandé
GPS / Navigation Handheld
GPS/navigation handhelds benefit from the STM32F429NIH6G's Cortex-M4 DSP for map-rendering acceleration, TFT-LCD support for sunlight-readable displays, and USB OTG high-speed for fast map uploads. The Chrom-ART DMA2D engine accelerates 2D map tiles while the FPU handles coordinate transforms and dead-reckoning sensor fusion at 100 Hz. With 256 KB SRAM and SDRAM expansion via FSMC, the device maintains multi-zoom map caches without external memory controllers.
Recommandé
Smart Energy Meter / Data Concentrator
Smart-grid metering leverages the STM32F429NIH6G's Ethernet MAC with IEEE 1588, dual CAN 2.0B for local DER aggregation, AES-256 crypto for DLMS/COSEM security, and 12-bit ADC for power-quality metrology at 2.4 MSPS. The 2 MB Flash stores DLMS/COSEM object tables, time-of-use tariffs, and graphical user menus on the local TFT. The -40 to +85 C industrial range covers outdoor cabinet installations, and the integrated TRNG supports DRM-grade key generation.
Recommandé
High-End Audio DSP Appliance
Audio appliances and prosumer mixers exploit the STM32F429NIH6G's Cortex-M4 DSP engine for 32-bit IIR/FIR filter chains running at 48/96 kHz, plus the TFT-LCD controller for graphical EQ and spectrum displays. Two 12-bit DACs provide analog monitor outputs, while USB OTG high-speed streams 8-channel audio to a host DAW. The 256 KB SRAM (plus optional SDRAM via FSMC) sustains multi-tap convolver structures up to 4096 taps without CPU saturation.
Recommandé
Vehicle Telematics / Fleet Tracker
Telematics boxes rely on the STM32F429NIH6G's dual CAN 2.0B interfaces for OBD-II vehicle bus access, Ethernet MAC for in-cabin network backbones, and AES-128 for secure OTA firmware. The TFT-LCD can drive small in-vehicle status displays, while the GPS hardware timestamping via Ethernet 1588 enables sub-millisecond event correlation between vehicle CAN traces and satellite pings. Industrial temperature grade -40 to +85 C covers under-dash automotive environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32F429NIH6G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32F429NIH6 | STM32F429NIH6U | STM32F427NIH6 | STM32F429NIH632MCU | STM32F429VGT6 |
|---|---|---|---|---|---|---|
| Package | TFBGA-216 (13x13 mm) | TFBGA-216 - same | TFBGA-216 - same | TFBGA-216 - same | TFBGA-216 - same | LQFP-100 (different) |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core / Max Frequency | Cortex-M4 / 180 MHz | Cortex-M4 / 180 MHz | Cortex-M4 / 180 MHz | Cortex-M4 / 180 MHz | Cortex-M4 / 180 MHz | Cortex-M4 / 180 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 192 KB |
| TFT-LCD Controller | Yes (up to XGA) | Yes | Yes | No | Yes | No |
| Crypto / Hash | AES + Hash + TRNG | AES + Hash + TRNG | AES + Hash + TRNG | AES + Hash + TRNG | AES + Hash + TRNG | AES + Hash + TRNG |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Lead Time (typical) | 10-16 weeks | 10-16 weeks | 12-18 weeks | 10-16 weeks | 10-14 weeks | In stock |
Principaux différenciateurs
- 2 MB Flash with ART zero-wait-state (vs STM32F429NIH6)
- Industrial-grade TFT-LCD + Chrom-ART (vs STM32F427NIH6)
- TFBGA-216 exposes SDRAM FSMC + Ethernet MAC (vs STM32F429VGT6 (LQFP-100))
- On-chip crypto + TRNG + AES-256 + Hash accelerator (vs GD32F450 (GigaDevice))
Notes de conception
Estimated: TFBGA-216 at 0.8 mm pitch requires 0.4 mm drilled micro-vias with 0.2 mm capture pads. Use a 4-layer PCB with continuous ground plane under the BGA. Per ST AN4661, place a 100 nF X7R 0402 decoupling capacitor within 2 mm of each VDD pin pair and a single 4.7 µF bulk on VDDA. Use 1.27 mm ball-to-ball escape routing for top-layer fan-out to avoid via stubs.
Per ST's reference manual, each VCAP pin must have a dedicated 1 µF low-ESR ceramic capacitor routed with a short trace (<5 mm) to ground. Do not share VCAP capacitance with VDD bypassing - the internal regulator stability depends on it. Add a power-on reset circuit to NRST with a 10 kΩ pull-up and 100 nF cap for clean reset sequencing.
Estimated: at 180 MHz with all peripherals active, the STM32F429NIH6G draws approximately 90 mA (TBD verify with datasheet IDD measurements). The 13x13 mm TFBGA thermal pad must be soldered to a ground copper pour of at least 1 square inch for theta_JA under 25 C/W. Avoid placing heat-generating components within 5 mm of the BGA to prevent thermal coupling during reflow.
The external SDRAM interface via FSMC runs at up to 90 MHz; route address/command lines matched within ±5 ps and use 30 Ω series source termination for clock and DQS lines. Per AN4661, the SDRAM should be placed within 50 mm of the BGA with matched trace lengths. For USB OTG HS, use a 90 Ω differential pair routed over continuous ground with no more than two vias total.
Common pitfalls: (1) Do not leave NRST floating - it must have a pull-up; (2) BOOT0 must be sampled at the rising edge of NRST for valid boot mode; (3) Do not exceed 3.6 V on any 5V-tolerant FT pin (FTf pins are 5V tolerant but only when VDD >= 2.0 V); (4) The internal high-speed PLL requires HSE crystal load capacitance to be tuned to within ±10 ppm; (5) Always unlock the write-protection option bytes before mass-erase during production programming.
Informations de conformité
G suffix denotes RoHS-compliant Pb-free terminal finish. ST Microcontrollers are not AEC-Q100 qualified unless the order code includes a Q-grade suffix (e.g., STM32F429NIH6G is industrial grade 6, not automotive).
