STM32F765IIK7 - 216MHz Cortex-M7 2MB MCU | STMicroelectronics
Référence : STM32F765IIK7 ✓ ActifSTM32F765IIK7 Présentation
A microcontroller, or MCU, integrates a processor core, Flash memory, SRAM, peripherals, and interface controllers into one package. The STM32F765 belongs to the STM32F7 high-performance MCU family, combining an Arm Cortex-M7 CPU core with embedded Flash, RAM, real-time peripherals, and connectivity hardware. This places it above general-purpose Cortex-M devices in the hierarchy of MCU, embedded processor, and semiconductor.
Verified headline features include a 32-bit Arm Cortex-M7 core with FPU, a maximum operating frequency of 216 MHz, 462 DMIPS computational performance, and 2 MB of Flash memory. The supplied distributor data identifies a 176+25 UFBGA package measuring 10 x 10 mm. Its performance is useful for control loops, real-time signal processing, communications gateways, and human-machine-interface systems where deterministic execution and external peripheral integration matter.
The Cortex-M7 architecture is designed for efficient real-time execution and includes hardware floating-point support for DSP-oriented workloads. The STM32F765 device family also provides features associated with the STM32F7 platform, including multi-layer bus architecture, DMA, and high-speed peripherals. However, exact RAM capacity, voltage limits, peripheral variants, timing limits, and package pin assignments must be confirmed in the manufacturer datasheet before a new design is released.
Typical uses include industrial automation, communications infrastructure, audio and signal-processing equipment, display controllers, and connected embedded products. Designers can pair the MCU with Ethernet PHY, USB interface, memory, and sensor components when their electrical and protocol requirements match. Firmware configuration, clock planning, peripheral pin multiplexing, and package-level escape routing remain central to successful implementation.
For PCB design, provide a regulated supply, decoupling close to power pins, an exposed-pad-aware thermal strategy, and clean clock routing. SWD programming and recovery should remain accessible in production. Because detailed electrical limits and pin names are not fully available in the supplied verified data, they must be checked directly against the STMicroelectronics family datasheet.
This page consolidates verified distributor specifications, package information, sourcing data, practical application guidance, and same-family replacement analysis. It is intended to accelerate engineering evaluation while clearly separating verified facts from parameters that still require manufacturer-datasheet confirmation.
Alternatives de remplacement direct pour STM32F765IIK7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32F765IIK7 (même facteur de forme et même empreinte) — différant par Flash Memory, Package.
STM32F765IIK6
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →STM32F765IIH6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32F767IIK7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32F769IIK7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32F768IIK7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32F765IIK7 Valeurs maximales et caractéristiques électriques
| Product Type | 32-bit Arm Cortex-M7 microcontroller with FPU |
| CPU Maximum Frequency | 216 MHz |
| Core Architecture | Arm Cortex-M7 |
| Instruction Width | 32 bit |
| Floating-Point Unit | Yes |
| Peak Performance | 462 DMIPS |
| Flash Memory | 2 MB (2M x 8) |
| Boîtier | 176+25 UFBGA (10 x 10 mm) |
| Tension d'alimentation | 3.3 V |
| ADC Resolution | 12 bit |
| Temperature Grade Code | K7 |
Guide de configuration des broches du STM32F765IIK7 176+25 ufbga (10 x 10 mm)
Configuration des broches du STM32F765IIK7 (boîtier 176+25 ufbga (10 x 10 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour STM32F765IIK7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
STM32F765IIK7 convient pour 6 applications: Industrial Automation Controller, Communications Gateway, Audio Signal Processing, Industrial Sensor Hub, Human-Machine Interface Controller, Programmable Logic Controller.
Industrial Automation Controller
The STM32F765IIK7 fits industrial automation controllers that combine real-time supervisory logic with signal-processing tasks. Its verified 216 MHz Arm Cortex-M7 core, FPU, 462 DMIPS performance, and 2 MB Flash provide substantial processing capacity for motion sequencing, state machines, data acquisition, and communications tasks. The device can sit above sensors, actuator controllers, and fieldbus interfaces, using DMA and event-driven peripherals to reduce central CPU intervention. Its 176+25 UFBGA package is only 10 x 10 mm, which supports compact control hardware. The manufacturer datasheet must be checked for the exact operating-temperature grade, supply limits, analog performance, and exposed-pad requirements before industrial deployment.
Recommandé
Communications Gateway
STM32F765IIK7 is appropriate for a communications gateway that must aggregate serial, network, and user-interface data without relying on a separate higher-level processor. Its 216 MHz Cortex-M7 performance and FPU provide headroom for protocol processing, buffering, and real-time diagnostics. The 2 MB Flash supports a substantial bootloader and application partition, while the 10 x 10 mm 176+25 UFBGA package leaves board area for radios and interfaces. A practical design can pair the MCU with an Ethernet PHY, such as LAN8742A-CZ, and an I2C expander such as PCA9515AD. Exact serial, Ethernet, USB, and memory interface availability must be verified against the selected STM32F765 order code before schematic signoff.
Recommandé
Audio Signal Processing
The STM32F765IIK7 supports audio and digital signal-processing workloads that benefit from a 216 MHz Cortex-M7 core with floating-point hardware. Verified performance of 462 DMIPS allows the MCU to execute filtering, mixing, decoding, and interface management while preserving deterministic control-loop response. Its 2 MB Flash is suitable for embedded code and fixed audio data, and the compact UFBGA package supports space-constrained audio modules. Designers can connect the MCU to audio converters through supported digital interfaces and use DMA to move samples with limited CPU involvement. Before implementation, confirm the exact I2S, SAI, PDM, codec, and memory resources in the official datasheet, along with clock-jitter and acoustic-noise requirements.
Recommandé
Industrial Sensor Hub
STM32F765IIK7 can serve as the processing center of a compact industrial sensor hub that gathers measurements, performs local filtering, and forwards results over a network. Its 216 MHz Cortex-M7 execution rate supports concurrent acquisition, scaling, calibration, and protocol tasks, while FPU support benefits filter and transform workloads. The 2 MB Flash capacity accommodates application firmware and configuration data, and the 10 x 10 mm package helps meet enclosure-size constraints. An Ethernet-capable design could add LAN8742A-CZ, while PCA9515AD can expand I2C-connected sensors. The key engineering checks are exact peripheral selection, RAM requirement, ADC performance, sensor timing, and whether the K7 suffix satisfies the installation's environmental temperature range.
Recommandé
Human-Machine Interface Controller
The STM32F765IIK7 is suitable for an HMI controller managing graphical updates, touch input, status indicators, and communications. The 216 MHz Cortex-M7 core and 462 DMIPS rating provide responsive multitasking for display updates and user-interface logic, while 2 MB Flash stores application code and interface resources. Its compact 176+25 UFBGA package reduces the footprint of embedded control panels and allows the display interface circuitry to dominate board-area requirements. I2C GPIO expansion through PCA9515AD can support touch or control inputs, while a bus transceiver can connect longer communication links. The designer must confirm the exact LCD or display interface, external memory interface, touch controller, and GPIO allocation before selecting the MCU.
Recommandé
Programmable Logic Controller
STM32F765IIK7 provides the compute density needed for a compact programmable logic controller handling digital inputs, outputs, counters, timers, and communications. Its verified 216 MHz Cortex-M7 performance and FPU support allow deterministic logic execution alongside higher-level diagnostics, while 2 MB Flash provides room for application code. The 10 x 10 mm UFBGA package is useful where PLC functionality must coexist with communications or analog modules on a compact board. SN75174DWR can provide a differential communications interface where required, and PCA9515AD can expand low-speed I/O. Final design approval must confirm pin multiplexing, timer and DMA resources, logic thresholds, watchdog behavior, memory requirements, and the K7 temperature grade.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32F765IIK7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32F765IIK6 | STM32F765IIH6 | STM32F767IIK7 | STM32F769IIK7 | STM32F768IIK7 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176+25 UFBGA (10 x 10 mm) | 176+25 UFBGA (10 x 10 mm) | 176+25 UFBGA (10 x 10 mm) | 176+25 UFBGA (10 x 10 mm) | 176+25 UFBGA (10 x 10 mm) | 176+25 UFBGA (10 x 10 mm) |
| CPU Core | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 |
| Maximum Frequency | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | Up to 2 MB | Up to 2 MB | Up to 2 MB |
| Floating-Point Unit | Yes | Yes | Yes | Yes | Yes | Yes |
| Order-Code Grade | K7 | K6 | H6 | K7 | K7 | K7 |
Principaux différenciateurs
- Known 216 MHz performance configuration (vs STM32F767IIK7)
- Exact K7 ordering target (vs STM32F765IIK6)
- Compact 10 x 10 mm package (vs STM32F765IIH6)
- Verified high-performance DSP capability (vs STM32F769IIK7)
Notes de conception
Place all required bulk and high-frequency decoupling capacitors directly at the corresponding 3.3 V and ground balls, following the capacitor values and placement rules in the STMicroelectronics family datasheet. Keep the supply return path short and preserve the exposed-pad connection specified by the package drawing. Because individual pin names and capacitor recommendations are absent from the supplied data, do not substitute a generic BGA power layout; verify the reference schematic and PCB stack-up before release.
The 176+25 UFBGA package requires a deliberate thermal strategy because the supplied evidence describes a 10 x 10 mm body with 201 balls but does not provide junction-temperature or package-thermal data. Connect the exposed thermal pad as directed in the manufacturer package drawing, use a multilayer PCB with suitable copper area, and avoid placing heat-generating components directly beneath the MCU. Validate the final assembly with worst-case ambient temperature, regulator loss, and switching activity rather than relying on package size alone.
Route high-speed clocks, memory, Ethernet, and other perimeter-sensitive interfaces according to the STMicroelectronics STM32F7 hardware-development guidance. Maintain short return paths, provide a continuous ground reference, and avoid split-plane transitions beneath active signal routes. The supplied data does not include the complete pinout, so pin assignment and exact interface constraints must be checked in the official datasheet and selected package drawing. Program and debug access should also be testable without removing the assembled board.
Do not treat a related STM32F7 order code as automatically interchangeable. Although the listed alternatives use the same 176+25 UFBGA format and Cortex-M7 platform, the K6, H6, and K7 suffixes may change temperature limits, while STM32F767, F768, and F769 devices may differ in RAM, peripherals, pin multiplexing, or firmware requirements. Compare the exact order-information rows, electrical limits, boot configuration, pin definitions, and exposed-pad requirements before substitution.
Informations de conformité
The supplied verified sources identify the manufacturer and package but do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These values must be confirmed from the current STMicroelectronics product page or material-declaration documentation.
