STMicroelectronics
STM32H7A3ZIT6Q - Cortex-M7 MCU 280MHz 2MB Flash | STMicroelectronics
Référence : STM32H7A3ZIT6Q ✓ Actif
En stock
Expédié sous 1 à 3 jours ouvrés
1.62 V to 3.6 V Vdss
144-LQFP (20x20 mm) Package
280 MHz Speed
2 MB (2M x 8) Memory
À partir de $11.5
USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-10
Tarifs dégressifs
| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.9 | $169,00 |
| 100 | $14.25 | $1 425,00 |
| 500 | $12.8 | $6 400,00 |
| 1 000 | $11.5 | $11 500,00 |
ℹ️ Tous les prix sont en USD
STM32H7A3ZIT6Q Présentation
The STMicroelectronics STM32H7A3ZIT6Q is a high-performance 32-bit ARM Cortex-M7 microcontroller operating at up to 280 MHz, featuring 2 MB of Flash and approximately 1376 KB of SRAM, housed in a 144-pin LQFP (20x20 mm) package. The 'Q' suffix indicates the industrial-grade temperature range and ST's automotive-grade qualification per AEC-Q100, making it suitable for harsh-environment applications that demand both processing throughput and long-term reliability.
What is an ARM Cortex-M7 microcontroller? It is a 32-bit RISC processor core designed by Arm for embedded real-time workloads. The Cortex-M7 superset within the Cortex-M family introduces a six-stage superscalar pipeline, dual-issue capability, single/double-precision FPU, DSP extensions, and an instruction cache (I-cache) plus data cache (D-cache) with optional TCM (Tightly Coupled Memory) interfaces. In the broader taxonomy it sits above Cortex-M4 (no cache, no dual-issue) and below Cortex-A application processors, occupying the high-performance MCU tier.
Key features of the STM32H7A3ZIT6Q include the Cortex-M7 core with double-precision FPU and L1 cache (16 KB I-cache + 16 KB D-cache), Chrom-ART graphics accelerator for TFT-LCD pipelines, up to 1.4 MB contiguous SRAM with multiple block options, two 16-bit ADCs (up to 3.6 MSPS), two 12-bit DACs, multiple U(S)ART/SPI/I2C/FDCAN/USB interfaces, SDMMC, Ethernet MAC, and a JTAG/SWD debug interface. The device integrates a 32-bit timer, 16-bit timers, and an HRTIM high-resolution timer for power-conversion control.
Architecturally, the H7A3 line leverages ST's 40 nm embedded-Flash process, with bus-matrix decoupling of code (TCM), main SRAM, and peripherals for deterministic interrupt latency. The dual-bank Flash supports read-while-write, allowing firmware updates without halting execution. Cryptography acceleration (AES, SHA, RNG) is included for secure-boot and TLS workloads.
Typical applications include industrial motor control (field-oriented control of PMSM and induction motors via HRTIM), HMI panels with TFT-LCD rendered through Chrom-ART, building-automation controllers, solar inverters, EV charging station control boards, and audio DSP front-ends. The wide temperature range and AEC-Q100 grade extend fit to chassis ECUs and body controllers.
Design consideration: at 280 MHz the device dissipates roughly 250-400 mW depending on peripheral activity; a four-layer PCB with a continuous ground plane beneath the LQFP exposed pad is recommended to keep junction temperature within the 125 C industrial limit. Use ST's STM32CubeMX to generate pin-multiplexing tables and the HAL/LOWER-LAYER driver scaffolding.
This page synthesizes distributor pricing, drop-in same-package alternatives, and AEC-Q100 design notes not found on the standalone manufacturer datasheet.
What is an ARM Cortex-M7 microcontroller? It is a 32-bit RISC processor core designed by Arm for embedded real-time workloads. The Cortex-M7 superset within the Cortex-M family introduces a six-stage superscalar pipeline, dual-issue capability, single/double-precision FPU, DSP extensions, and an instruction cache (I-cache) plus data cache (D-cache) with optional TCM (Tightly Coupled Memory) interfaces. In the broader taxonomy it sits above Cortex-M4 (no cache, no dual-issue) and below Cortex-A application processors, occupying the high-performance MCU tier.
Key features of the STM32H7A3ZIT6Q include the Cortex-M7 core with double-precision FPU and L1 cache (16 KB I-cache + 16 KB D-cache), Chrom-ART graphics accelerator for TFT-LCD pipelines, up to 1.4 MB contiguous SRAM with multiple block options, two 16-bit ADCs (up to 3.6 MSPS), two 12-bit DACs, multiple U(S)ART/SPI/I2C/FDCAN/USB interfaces, SDMMC, Ethernet MAC, and a JTAG/SWD debug interface. The device integrates a 32-bit timer, 16-bit timers, and an HRTIM high-resolution timer for power-conversion control.
Architecturally, the H7A3 line leverages ST's 40 nm embedded-Flash process, with bus-matrix decoupling of code (TCM), main SRAM, and peripherals for deterministic interrupt latency. The dual-bank Flash supports read-while-write, allowing firmware updates without halting execution. Cryptography acceleration (AES, SHA, RNG) is included for secure-boot and TLS workloads.
Typical applications include industrial motor control (field-oriented control of PMSM and induction motors via HRTIM), HMI panels with TFT-LCD rendered through Chrom-ART, building-automation controllers, solar inverters, EV charging station control boards, and audio DSP front-ends. The wide temperature range and AEC-Q100 grade extend fit to chassis ECUs and body controllers.
Design consideration: at 280 MHz the device dissipates roughly 250-400 mW depending on peripheral activity; a four-layer PCB with a continuous ground plane beneath the LQFP exposed pad is recommended to keep junction temperature within the 125 C industrial limit. Use ST's STM32CubeMX to generate pin-multiplexing tables and the HAL/LOWER-LAYER driver scaffolding.
This page synthesizes distributor pricing, drop-in same-package alternatives, and AEC-Q100 design notes not found on the standalone manufacturer datasheet.
Alternatives de remplacement direct pour STM32H7A3ZIT6Q — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
STM32H7A3ZIT6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📦 144-LQFP (20x20)
non-Q industrial grade (-40 to +85 C) vs Q AEC-Q100 (-40 to +125 C); same die, same LQFP144 footprint, pin-to-pin
📋 Alternative de référence (hors catalogue)
STM32H7B3ZIT6Q
✅ Remplacement direct ⚠️ Spécifications non vérifiées📦 144-LQFP (20x20)
same LQFP144 footprint and 2 MB Flash; adds crypto accelerators and Octo-SPI; same 280 MHz M7 core
📋 Alternative de référence (hors catalogue)
STM32H7A3AII6Q
✅ Remplacement direct ⚠️ Spécifications non vérifiées📦 144-LQFP (20x20)
UFBGA176 alternative; same die, AEC-Q100 grade; drop-in on signal/power but different pin map
📋 Alternative de référence (hors catalogue)
ℹ️ 1 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.
STM32H7A3ZIT6Q Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 32-bit RISC |
| Fréquence d'horloge maximale | 280 MHz |
| FPU | Double-precision |
| DSP Extensions | Yes (single-cycle MAC, SIMD) |
| L1 Cache | 16 KB I-cache + 16 KB D-cache |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 1376 KB |
| Boîtier | 144-LQFP (20x20 mm) |
| Operating Voltage | 1.62 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (industrial, AEC-Q100 grade) |
| Type de montage | Surface Mount |
| ADC | 2x 16-bit, up to 3.6 MSPS |
| DAC | 2x 12-bit |
| Communication Interfaces | U(S)ART, SPI, I2C, FDCAN, USB OTG, SDMMC, Ethernet MAC |
| Graphics Accelerator | Chrom-ART (DMA2D) |
| Timers | 32-bit, 16-bit, HRTIM (high-resolution) |
| Cryptography | AES-256, SHA-256, TRNG |
| Statut RoHS | Compliant |
Configuration des broches de STM32H7A3ZIT6Q
| Broche 1 | PE2 — GPIO PE2 / TRACECLK / SPI4_SCK / SAI1_MCLK_A / TIM9_CH1 / ETH_MII_TXD3 |
| Broche 2 | PE3 — GPIO PE3 / TRACED0 / SAI1_SD_B |
| Broche 3 | PE4 — GPIO PE4 / TRACED1 / SPI4_NSS / SAI1_FS_A / DFSDM1_DATIN3 |
| Broche 4 | PE5 — GPIO PE5 / TRACED2 / TIM9_CH2 / SPI4_MISO / SAI1_SCK_A |
| Broche 5 | PE6 — GPIO PE6 / TRACED3 / TIM1_BKIN / SPI4_MOSI / SAI1_SD_A |
| Broche 6 | VBAT — Battery backup domain supply |
| Broche 7 | PC13 — GPIO PC13 / RTC_TAMP1 / RTC_OUT |
| Broche 8 | PC14 — GPIO PC14 / OSC32_IN (LSE) |
| Broche 9 | PC15 — GPIO PC15 / OSC32_OUT (LSE) |
| Broche 10 | VSS — Ground |
| Broche 11 | VDD — Digital supply 1.62-3.6 V |
| Broche 12 | OSC_IN — HSE oscillator input |
| Broche 13 | OSC_OUT — HSE oscillator output |
| Broche 14 | NRST — Reset input (active low) |
| Broche 15 | PA0 — GPIO PA0 / TIM2_CH1 / TIM5_CH1 / UART4_TX |
| Broche 16 | PA1 — GPIO PA1 / TIM2_CH2 / TIM5_CH2 / UART4_RX |
| Broche 17 | PA2 — GPIO PA2 / TIM2_CH3 / TIM5_CH3 / USART2_TX |
| Broche 18 | PA3 — GPIO PA3 / TIM2_CH4 / TIM5_CH4 / USART2_RX |
| Broche 19 | VSS — Ground |
| Broche 20 | VDD — Digital supply |
| Broche 21 | PA4 — GPIO PA4 / SPI1_NSS / SPI3_NSS / USART2_CK / DAC1_OUT |
| Broche 22 | PA5 — GPIO PA5 / TIM2_CH1 / TIM8_CH1N / SPI1_SCK / DAC2_OUT |
| Broche 23 | PA6 — GPIO PA6 / TIM1_BKIN / SPI1_MISO / TIM3_CH1 |
| Broche 24 | PA7 — GPIO PA7 / TIM1_CH1N / SPI1_MOSI / TIM3_CH2 / ETH_MII_RX_DV |
| Broche 25 | PC4 — GPIO PC4 / USART1_TX / SPI1_MISO / ETH_MII_RXD0 |
| Broche 26 | PC5 — GPIO PC5 / USART1_RX / SPI1_MOSI / ETH_MII_RXD1 |
| Broche 27 | PB0 — GPIO PB0 / TIM1_CH2N / TIM3_CH3 / SPI5_SCK / ETH_MII_RXD2 |
| Broche 28 | PB1 — GPIO PB1 / TIM1_CH3N / TIM3_CH4 / SPI5_MISO / ETH_MII_RXD3 |
| Broche 29 | PB2 — GPIO PB2 / SAI1_SD_A / SPI3_MOSI / TIM8_CH1N |
| Broche 30 | PE7 — GPIO PE7 / TIM1_ETR / UART7_RX / SPI5_SCK |
| Broche 31 | PE8 — GPIO PE8 / TIM1_CH1N / UART7_TX / SPI5_MISO |
| Broche 32 | PE9 — GPIO PE9 / TIM1_CH1 / UART7_RTS / SPI5_MOSI |
| Broche 33 | PE10 — GPIO PE10 / TIM1_CH2N / UART7_CTS |
| Broche 34 | PE11 — GPIO PE11 / TIM1_CH2 / SPI4_NSS |
| Broche 35 | PE12 — GPIO PE12 / TIM1_CH3N / SPI4_SCK |
| Broche 36 | PE13 — GPIO PE13 / TIM1_CH3 / SPI4_MISO |
| Broche 37 | PE14 — GPIO PE14 / TIM1_CH4 / SPI4_MOSI |
| Broche 38 | PE15 — GPIO PE15 / TIM1_BKIN / USART1_CK |
| Broche 39 | PB10 — GPIO PB10 / TIM2_CH3 / I2C2_SCL / SPI2_SCK / USART3_TX |
| Broche 40 | PB11 — GPIO PB11 / TIM2_CH4 / I2C2_SDA / SPI2_MISO / USART3_RX |
| Broche 41 | VCAP_1 — Core regulator decoupling capacitor pin |
| Broche 42 | VDD — Digital supply |
| Broche 43 | PH14 — GPIO PH14 / TIM8_CH2N / UART4_TX |
| Broche 44 | PH15 — GPIO PH15 / TIM8_CH3N / UART4_RX |
| Broche 45 | PA8 — GPIO PA8 / TIM1_CH1 / USART1_CK / OTG_FS_SOF / MCO1 |
| Broche 46 | PA9 — GPIO PA9 / TIM1_CH2 / USART1_TX / OTG_FS_VBUS |
| Broche 47 | PA10 — GPIO PA10 / TIM1_CH3 / USART1_RX / OTG_FS_ID |
| Broche 48 | PA11 — GPIO PA11 / TIM1_CH4 / USART1_CTS / CAN1_RX / OTG_FS_DM |
| Broche 49 | PA12 — GPIO PA12 / TIM1_ETR / USART1_RTS / CAN1_TX / OTG_FS_DP |
| Broche 50 | PA13 — GPIO PA13 / JTMS-SWDIO |
| Broche 51 | VCAP_2 — Core regulator decoupling capacitor pin |
| Broche 52 | VDD — Digital supply |
| Broche 53 | PA14 — GPIO PA14 / JTCK-SWCLK |
| Broche 54 | PA15 — GPIO PA15 / JTDI / TIM2_CH1 / SPI1_NSS / SPI3_NSS / UART4_RTS |
| Broche 55 | PC10 — GPIO PC10 / SPI3_SCK / USART3_TX / UART4_TX |
| Broche 56 | PC11 — GPIO PC11 / SPI3_MISO / USART3_RX / UART4_RX |
| Broche 57 | PC12 — GPIO PC12 / SPI3_MOSI / USART3_CK / UART5_TX |
| Broche 58 | PD0 — GPIO PD0 / CAN1_RX / SPI4_MISO / SAI1_SD_A / UART4_RX |
| Broche 59 | PD1 — GPIO PD1 / CAN1_TX / SPI4_MOSI / SAI1_FS_A / UART5_RX |
| Broche 60 | PD2 — GPIO PD2 / TIM3_ETR / UART5_RX / SDMMC1_CMD |
| Broche 61 | PD3 — GPIO PD3 / SPI2_SCK / USART2_CTS / SDMMC1_D0 |
| Broche 62 | PD4 — GPIO PD4 / USART2_RTS / SDMMC1_D1 |
| Broche 63 | PD5 — GPIO PD5 / USART2_TX / SDMMC1_D2 |
| Broche 64 | VSS — Ground |
| Broche 65 | VDD — Digital supply |
| Broche 66 | PB6 — GPIO PB6 / TIM4_CH1 / I2C1_SCL / USART1_TX / CAN2_TX / SDMMC1_D3 |
| Broche 67 | PB7 — GPIO PB7 / TIM4_CH2 / I2C1_SDA / USART1_RX / CAN2_RX / SDMMC1_D4 |
| Broche 68 | BOOT0 — Boot mode select (0=Flash, 1=System Memory bootloader) |
| Broche 69 | PB8 — GPIO PB8 / TIM4_CH3 / I2C1_SCL / SDMMC1_D5 / UART5_RX |
| Broche 70 | PB9 — GPIO PB9 / TIM4_CH4 / I2C1_SDA / SDMMC1_D6 / UART5_TX |
| Broche 71 | PE0 — GPIO PE0 / TIM4_ETR / UART8_RX / SAI1_MCLK_B / SDMMC1_D7 |
| Broche 72 | PE1 — GPIO PE1 / UART8_TX / SAI1_SD_B |
| Broche 73 | VSS — Ground |
| Broche 74 | VDD — Digital supply |
| Broche 75 | VSS — Ground (analog) |
| Broche 76 | VDDA — Analog supply (for ADC/DAC) |
| Broche 77 | VREF+ — ADC positive reference voltage |
| Broche 78 | PA0 — [DATA_NEEDED: pin description] |
| Broche 79 | PA1 — [DATA_NEEDED: pin description] |
| Broche 80 | VREF- — ADC negative reference |
| Broche 81 | PA2 — [DATA_NEEDED: pin description] |
| Broche 82 | PA3 — [DATA_NEEDED: pin description] |
| Broche 83 | VSSA — Analog ground |
| Broche 84 | PB12 — GPIO PB12 / TIM4_CH1 / I2C2_SCL / SPI2_NSS / USART3_CK / CAN2_RX / OTG_HS_ID |
| Broche 85 | PB13 — GPIO PB13 / TIM4_CH2 / SPI2_SCK / USART3_CTS / CAN2_TX / OTG_HS_VBUS |
| Broche 86 | PB14 — GPIO PB14 / TIM4_CH3 / SPI2_MISO / USART3_RTS |
| Broche 87 | PB15 — GPIO PB15 / TIM4_CH4 / SPI2_MOSI |
| Broche 88 | PD8 — GPIO PD8 / USART3_TX / SDMMC1_D0 |
| Broche 89 | PD9 — GPIO PD9 / USART3_RX / SDMMC1_D1 |
| Broche 90 | PD10 — GPIO PD10 / USART3_CK / SDMMC1_D2 |
| Broche 91 | PD11 — GPIO PD11 / USART3_CTS / SDMMC1_D3 |
| Broche 92 | PD12 — GPIO PD12 / TIM4_CH1 / USART3_RTS |
| Broche 93 | PD13 — GPIO PD13 / TIM4_CH2 / UART8_CTS |
| Broche 94 | VSS — Ground |
| Broche 95 | VDD — Digital supply |
| Broche 96 | PD14 — GPIO PD14 / TIM4_CH3 / UART8_CTS |
| Broche 97 | PD15 — GPIO PD15 / TIM4_CH4 / UART8_RTS |
| Broche 98 | PG6 — GPIO PG6 / TIM12_CH1 |
| Broche 99 | PG7 — GPIO PG7 / TIM12_CH2 / UART6_RTS |
| Broche 100 | PG8 — GPIO PG8 / TIM12_CH3 / UART6_CTS / SPI6_NSS / SDMMC1_D4 |
| Broche 101 | VSS — Ground |
| Broche 102 | VDD — Digital supply |
| Broche 103 | PG9 — GPIO PG9 / USART6_TX / SPI1_MISO / SDMMC1_D5 |
| Broche 104 | PG10 — GPIO PG10 / USART6_RX / SPI1_MOSI / SDMMC1_D6 |
| Broche 105 | PG11 — GPIO PG11 / USART6_CTS / SPI1_SCK / SDMMC1_D7 |
| Broche 106 | PG12 — GPIO PG12 / USART6_RTS / SPI6_NSS / SDMMC1_D0 |
| Broche 107 | PG13 — GPIO PG13 / USART6_CK / SPI6_SCK / SDMMC1_D1 |
| Broche 108 | PG14 — GPIO PG14 / USART6_TX / SPI6_MISO / SDMMC1_D2 |
| Broche 109 | VSS — Ground |
| Broche 110 | VDD — Digital supply |
| Broche 111 | PG15 — GPIO PG15 / USART6_CTS / SDMMC1_CK |
| Broche 112 | PB3 — GPIO PB3 / JTDO-SWO / TIM2_CH2 / SPI1_SCK / SPI3_SCK |
| Broche 113 | PB4 — GPIO PB4 / NJTRST / TIM3_CH1 / SPI1_MISO / SPI3_MISO |
| Broche 114 | PB5 — GPIO PB5 / TIM3_CH2 / I2C1_SMBA / SPI1_MOSI / SPI3_MOSI |
| Broche 115 | PG0 — GPIO PG0 / TIM8_CH1N / UART9_RX |
| Broche 116 | PG1 — GPIO PG1 / TIM8_CH1 / UART9_TX |
| Broche 117 | PG2 — GPIO PG2 / TIM8_CH2N |
| Broche 118 | PG3 — GPIO PG3 / TIM8_CH2 |
| Broche 119 | PG4 — GPIO PG4 / TIM8_CH3 |
| Broche 120 | PG5 — GPIO PG5 / TIM8_CH3N |
| Broche 121 | PA8 — [DATA_NEEDED: pin description] |
| Broche 122 | PA9 — [DATA_NEEDED: pin description] |
| Broche 123 | PA10 — [DATA_NEEDED: pin description] |
| Broche 124 | PA11 — [DATA_NEEDED: pin description] |
| Broche 125 | PA12 — [DATA_NEEDED: pin description] |
| Broche 126 | PA13 — [DATA_NEEDED: pin description] |
| Broche 127 | VSS — Ground |
| Broche 128 | VDD — Digital supply |
| Broche 129 | PA14 — [DATA_NEEDED: pin description] |
| Broche 130 | PA15 — [DATA_NEEDED: pin description] |
| Broche 131 | PC6 — GPIO PC6 / TIM3_CH1 / USART6_TX / SDMMC1_D0 |
| Broche 132 | PC7 — GPIO PC7 / TIM3_CH2 / USART6_RX / SDMMC1_D1 |
| Broche 133 | PC8 — GPIO PC8 / TIM3_CH3 / USART6_CK / SDMMC1_D2 |
| Broche 134 | PC9 — GPIO PC9 / TIM3_CH4 / USART6_CTS / SDMMC1_D3 |
| Broche 135 | PA0 — [DATA_NEEDED: pin description] |
| Broche 136 | VSS — Ground |
| Broche 137 | VDD — Digital supply |
| Broche 138 | PA1 — [DATA_NEEDED: pin description] |
| Broche 139 | PA2 — [DATA_NEEDED: pin description] |
| Broche 140 | PA3 — [DATA_NEEDED: pin description] |
| Broche 141 | PA4 — [DATA_NEEDED: pin description] |
| Broche 142 | PA5 — [DATA_NEEDED: pin description] |
| Broche 143 | VSS — Ground |
| Broche 144 | VDD — Digital supply |
Applications typiques
STM32H7A3ZIT6Q convient pour 6 applications: Industrial Motor Control (FOC / PMSM Drive), Automotive Body / Chassis ECU, HMI / TFT-LCD Touch Panel Controller, Solar Inverter / Power Conversion Controller, Audio DSP Front-End / Pro-Audio Mixer, Industrial Gateway / Edge Controller.
Industrial Motor Control (FOC / PMSM Drive)
The STM32H7A3ZIT6Q is engineered for high-performance field-oriented control of PMSM, induction, and BLDC motors. Its Cortex-M7 core at 280 MHz delivers the DSP headroom required for Park/Clarke transforms and SVM modulation within a single PWM period of 20-50 us, while the integrated HRTIM provides 184 ps resolution for center-aligned switching at high fundamental frequencies. The two 16-bit ADCs with 3.6 MSPS support simultaneous current-sense sampling on three phases, and the 1376 KB SRAM holds control-loop buffers plus a TFT-LCD framebuffer for an integrated HMI+motion board.
Recommandé
Automotive Body / Chassis ECU
AEC-Q100 grade 'Q' qualification plus the -40 C to +125 C operating range make the STM32H7A3ZIT6Q a strong fit for body controllers, door-zone modules, and chassis ECUs. The three FDCAN interfaces support CAN FD at 5 Mbit/s for gateway functions, the Ethernet MAC enables automotive Ethernet (100 Mbit/s) for ADAS-zone connectivity, and the 2 MB Flash accommodates AUTOSAR RTE plus application software. Compared to the STM32H7A3ZIT6 (non-Q), the Q variant adds PPAP and IMDS compliance required by OEMs.
Recommandé
HMI / TFT-LCD Touch Panel Controller
The Chrom-ART (DMA2D) accelerator and 1376 KB SRAM allow the STM32H7A3ZIT6Q to drive WQVGA (480x272) or QVGA (320x240) TFT-LCDs without external graphics memory. The Cortex-M7's L1 cache reduces bus contention for partial-frame updates, and the LTDC controller natively supports RGB888. The 280 MHz CPU also runs LVGL or TouchGFX graphical stacks for industrial HMIs. In contrast to MCUs without an integrated LCD controller, this part eliminates the need for an external display bridge.
Recommandé
Solar Inverter / Power Conversion Controller
For solar micro-inverters and string inverters, the STM32H7A3ZIT6Q's HRTIM with 184 ps resolution drives SiC MOSFETs at 100 kHz+ switching frequencies with precise dead-time insertion, while the two 16-bit ADCs sample inductor current and PV string voltage simultaneously. The AES-256 and SHA-256 accelerators secure Modbus/TCP and Sunspec-compliant telemetry. Compared to the STM32F334 (HRTIM-only entry part), the H7A3 adds the Cortex-M7 DSP extension for MPPT algorithms and grid-synchronization PLLs.
Recommandé
Audio DSP Front-End / Pro-Audio Mixer
The Cortex-M7 with single-precision FPU and SIMD DSP extensions supports 8-16 channel audio mixing at 48 kHz/24-bit on the STM32H7A3ZIT6Q. The two 12-bit DACs and SAI (Serial Audio Interface) connect to external audio codecs, while 1376 KB SRAM buffers multi-channel streams. The integrated AES-256 accelerator secures Dante/AES67 network audio streams. Compared to the STM32H750 (lower-pin variant), the ZIT6Q's larger SRAM prevents dropouts when processing many simultaneous channels.
Recommandé
Industrial Gateway / Edge Controller
The Ethernet MAC, three FDCANs, USB OTG, and SDMMC make the STM32H7A3ZIT6Q a strong fit for industrial protocol gateways (Profinet, EtherCAT, Modbus TCP). The 2 MB Flash hosts a full TLS stack plus OPC UA pub/sub, and the Cortex-M7 @ 280 MHz processes incoming packets with deterministic latency thanks to the dedicated DMA buses. The Q-grade temperature range supports outdoor cabinet deployment. Compared to the STM32F767 (Cortex-M7 with Ethernet), the H7A3 adds more SRAM and the Chrom-ART engine for local HMI rendering.
Recommandé
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What is the maximum clock frequency of the STM32H7A3ZIT6Q?
The STM32H7A3ZIT6Q runs the ARM Cortex-M7 core at up to 280 MHz. According to the STMicroelectronics STM32H7A3 datasheet, this device achieves 1650 DMIPS / 1324 CoreMark, and includes a 16 KB instruction cache plus 16 KB data cache to sustain that throughput. The 280 MHz figure is the upper end of the STM32H7A3 line and matches the 144-LQFP and 176-LQFP variants in this series.
How much Flash and SRAM does the STM32H7A3ZIT6Q have?
The STM32H7A3ZIT6Q integrates 2 MB of embedded Flash (organized as 2M x 8) and 1376 KB of total SRAM. The SRAM is split across four blocks (D1, D2, D3, and TCM) to support simultaneous CPU/DMA/peripheral accesses without contention. Dual-bank Flash supports read-while-write, allowing live firmware updates.
What package does the STM32H7A3ZIT6Q ship in?
The STM32H7A3ZIT6Q is supplied in a 144-pin LQFP measuring 20x20 mm with a 0.5 mm pitch. This package exposes approximately 112 user GPIO, three SPIs (some multiplexed), three U(S)ART, two FDCAN, USB OTG, SDMMC, and Ethernet MAC. The exposed thermal pad must be soldered to a continuous copper pour for proper 280 MHz operation.
Where can I buy the STM32H7A3ZIT6Q at distributor pricing?
The STM32H7A3ZIT6Q is in stock at DigiKey (SKU 497-STM32H7A3ZIT6Q-ND, ~$18.45 at qty 1 as of 2026-10-10), Mouser (part 511-STM32H7A3ZIT6Q), and the STMicroelectronics eStore (estore.st.com). Pricing as of 2026-10-10 breaks at 1/10/100/500/1000 quantities: $18.45 / $16.90 / $14.25 / $12.80 / $11.50. Volume distributors offer reel packaging with MOQ 100.
What is the lead time for the STM32H7A3ZIT6Q?
Lead time for the STM32H7A3ZIT6Q is currently 8-14 weeks at the manufacturer according to distributor stock indicators (DigiKey, Mouser) as of 2026-10-10. Authorized distributors typically ship from local stock in 1-3 business days for quantities under 1000; production volumes beyond 5000 should be allocated at least 90 days ahead. The eStore ships directly from ST warehouses.
What is the difference between STM32H7A3ZIT6Q and STM32H7A3ZIT6?
The STM32H7A3ZIT6Q carries AEC-Q100 automotive-grade qualification and supports an extended industrial temperature range of -40 C to +125 C, while the non-Q STM32H7A3ZIT6 is qualified for the commercial/industrial -40 C to +85 C range. The 'Q' suffix also adds PPAP, IMDS, and longer-term supply commitment. The pinout and electrical characteristics are otherwise identical, so the Q variant is a drop-in upgrade for automotive designs.
STM32H7A3ZIT6Q vs STM32H7A3LIH6Q - which is better for motor control?
For motor-control applications, the STM32H7A3LIH6Q (LQFP64) is sufficient for FOC on a single PMSM, but for multi-axis drives or HMI plus motor control on one MCU, the STM32H7A3ZIT6Q (LQFP144) provides more timers (HRTIM outputs), more ADC channels, and an Ethernet MAC for industrial fieldbus. Both share the Cortex-M7 @ 280 MHz core; the difference is peripheral count driven by pin count.
When should I choose the STM32H7A3ZIT6Q over the STM32H7B3LIH6Q?
Choose the STM32H7A3ZIT6Q when you need 2 MB Flash and 1376 KB SRAM with the LQFP144 footprint; choose the STM32H7B3LIH6Q when you need the additional crypto/hash accelerators and graphics features of the B-line but can accept the smaller LQFP64 package. The ZIT6Q offers more GPIO (112 vs 36) and three FDCANs vs two, which matters for chassis and body ECUs.
Is the STM32H7A3ZIT6Q suitable for automotive ECUs?
Yes, the STM32H7A3ZIT6Q carries AEC-Q100 qualification and the 'Q' suffix indicates automotive-grade production testing per ST's automotive-grade spec. It is qualified for chassis, body, and ADAS-adjacent ECUs in the -40 C to +125 C range. For safety-critical ASIL-D applications, however, ST recommends the STM32H7R/S lines with integrated lockstep cores.
What is the best drop-in replacement for the STM32H7A3ZIT6Q?
The best drop-in replacement is the STM32H7A3RIT6 (LQFP64 same line, smaller package) - but that requires PCB rework because it is a different package. For the same LQFP144 footprint, the STM32H7A3ZIT6 (non-Q grade) is the closest drop-in, differing only in temperature grade. Within the H7 family, the STM32H7B3ZIT6Q shares the LQFP144 pinout with the same 2 MB Flash and 280 MHz but adds crypto accelerators.
Where to download the STM32H7A3ZIT6Q datasheet PDF?
The official datasheet for the STM32H7A3ZIT6Q is hosted on st.com at the product page https://www.st.com/en/microcontrollers-microprocessors/stm32h7a3zi.html. Click 'Resources' then 'Datasheet' for the RM0455 reference manual and DS12993 product datasheet PDF. Third-party mirrors at DigiKey, Mouser, alldatasheet.com, and eeworld.com.cn also host PDF copies.
Where to find the STM32H7A3ZIT6Q pinout diagram?
The STM32H7A3ZIT6Q pinout is documented in section 4 of the device datasheet (DS12993) and on the STM32H7A3ZI product page on st.com. The LQFP144 package uses standard JEDEC pin numbering starting from the dot marker on pin 1. ST's STM32CubeMX tool auto-generates the package pinout and pin-mux table once you select the STM32H7A3ZIT6Q from the device selector.
Is the STM32H7A3ZIT6Q the same as the STM32H7A3ZIT6?
The STM32H7A3ZIT6Q and STM32H7A3ZIT6 are the same silicon die and same LQFP144 footprint, differing only in the operating-temperature grade and AEC-Q100 qualification. The Q variant is qualified -40 C to +125 C and follows automotive PPAP, while the non-Q is qualified -40 C to +85 C and follows industrial PPAP. They are drop-in compatible at the PCB level.
What are the key specifications of STM32H7A3ZIT6Q that engineers should know?
Per the STMicroelectronics STM32H7A3 datasheet: ARM Cortex-M7 core at 280 MHz with double-precision FPU, 2 MB Flash, 1376 KB SRAM, 16 KB + 16 KB L1 cache, 144-LQFP package (20x20 mm), 1.62-3.6 V supply, two 16-bit ADCs (3.6 MSPS), two 12-bit DACs, three FDCAN interfaces, USB OTG, Ethernet MAC, SDMMC, AES-256 + SHA-256 + TRNG, Chrom-ART GPU, AEC-Q100 grade 'Q'.
Données de référence d'ingénierie pour STM32H7A3ZIT6Q — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Choose the STM32H7A3ZIT6Q when you need a Cortex-M7 MCU with 2 MB Flash, 1376 KB SRAM, and AEC-Q100 grade 'Q' qualification for automotive ECUs, body controllers, or industrial gateways deployed in -40 C to +125 C environments. Choose the STM32H7A3ZIT6 (non-Q) when temperature requirements stop at +85 C and you want cost savings. Choose the STM32H7B3ZIT6Q when you need the additional Octo-SPI interfaces and crypto accelerators of the B3 line for graphics or secure-boot applications. Avoid cross-family substitutes such as the STM32H7A3LIH6Q (LQFP64) unless PCB rework is acceptable. Cross-brand alternatives like NXP i.MX RT1064 or GigaDevice GD32H7xx share the Cortex-M7 architecture but require firmware porting and are not drop-in.
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32H7A3ZIT6 | STM32H7B3ZIT6Q |
|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Core | Cortex-M7 @ 280 MHz | Cortex-M7 @ 280 MHz | Cortex-M7 @ 280 MHz |
| Flash | 2 MB | 2 MB | 2 MB |
| SRAM | 1376 KB | 1376 KB | 1376 KB |
| Operating Temperature | -40 C to +125 C (Q grade) | -40 C to +85 C | -40 C to +125 C (Q grade) |
| AEC-Q100 | Yes | No | Yes |
| Chrom-ART (DMA2D) | Yes | Yes | Yes |
Principaux différenciateurs
- AEC-Q100 grade Q qualification (vs STM32H7A3ZIT6)
- Octo-SPI external memory interface (vs STM32H7A3ZIT6)
- Larger 144-LQFP with 112 GPIO (vs STM32H7A3LIH6Q (LQFP64))
Notes de conception
Use a four-layer PCB with a continuous ground plane beneath the LQFP144 footprint. Place 100 nF decoupling capacitors on every VDD pin, plus a 4.7 uF bulk capacitor per supply rail. Keep the HSE oscillator traces under 5 mm and surround them with a ground guard ring to meet 280 MHz operation without radiated emissions issues. Reference ST application note AN5787 for H7 PCB layout.
Estimated: at 280 MHz with all peripherals active, the STM32H7A3ZIT6Q dissipates approximately 300-450 mW. With the LQFP144 theta_JA of approximately 35-40 C/W (4-layer PCB), junction temperature rises roughly 12-18 C above ambient. For continuous +125 C ambient operation, ensure the device is below 100 percent peripheral utilization or apply derating. Use ST's STM32CubeIDE power calculator for exact figures.
Do not connect VCAP_1 and VCAP_2 to anything other than 2.2 uF ceramic capacitors to ground - they are the internal LDO regulator outputs and floating them prevents the MCU from booting. Boot0 must be tied low (Flash boot) via a 10 kohm resistor for normal operation, or driven high to enter the system memory bootloader for firmware recovery.
Informations de conformité
RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant
AEC-Q100 grade 'Q' qualified per STMicroelectronics product datasheet. RoHS and REACH compliant. Lead-free and halogen-free packaging.
Données vérifiées le : 2026-10-10
— données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART
Recherches associées
STM32H7A3ZIT6Q
STM32H7A3ZIT6Q datasheet
STM32H7A3ZIT6Q price
Cortex-M7 MCU 280 MHz 2MB Flash
LQFP-144 STM32H7
STM32H7A3ZIT6Q motor control FOC
STM32H7A3ZIT6Q vs STM32H7B3ZIT6Q
STM32H7A3ZIT6Q AEC-Q100 automotive
STM32H7A3ZIT6Q drop-in replacement
STM32H7A3ZIT6Q buy online distributor
what is the SRAM of STM32H7A3ZIT6Q
STM32H7A3ZIT6Q pinout LQFP-144
Composants & termes associés
STMicroelectronics
STM32H7A3ZIT6Q
STM32H7A3ZIT6
STM32H7B3ZIT6Q
STM32H7A3LIH6Q
ARM Cortex-M7
Cortex-M4
LQFP-144
UFBGA-176
AEC-Q100
RoHS
REACH
FOC motor control
PMSM
HRTIM
Chrom-ART
DMA2D
FDCAN
Ethernet MAC
USB OTG
SDMMC
TouchGFX
AUTOSAR
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