SY89826LHY - 1 GHz 22-LVDS Fanout Buffer | Microchip
Référence : SY89826LHY ✓ ActifSY89826LHY Présentation
A clock fanout buffer is a clock-management IC that receives one source clock and generates multiple buffered copies. Clock buffers and drivers belong to the clock and timing IC family, where they provide fanout, translation, isolation, and signal conditioning. The SY89826LHY combines this function with differential signal translation and input multiplexing for systems requiring flexible clock-source selection.
The principal features are a 1 GHz operating frequency, 1:22 fanout ratio, 22 differential LVDS output pairs, 2:1 input multiplexing, and a 3.3 V supply. These functions allow one device to select between two input sources and distribute the selected clock to a large number of LVDS receivers while maintaining consistent edge relationships across the output network.
The device is intended for low-voltage 3.3 V clock-distribution systems where many receivers require differential clock inputs. Its LVDS outputs suit point-to-point interconnects on circuit boards, backplanes, and rack-level systems. The exposed pad beneath the 64-TQFP package provides a thermal connection to the PCB, while the multiplexed inputs reduce the number of separate source-selection components required in a multi-clock architecture.
Typical applications include synchronized computing and networking equipment, communication backplanes, test and measurement systems, industrial control electronics, server clock distribution, and high-speed instrumentation. In each case, the central design objective is to provide many low-skew differential clock outputs from one or two incoming sources.
Layout is critical because 22 differential outputs magnify trace-length, impedance, return-path, and crosstalk sensitivity. Follow the pin-description table and recommended decoupling arrangement in the Microchip datasheet, preserve controlled-impedance routing for LVDS pairs, and connect the exposed pad to a low-impedance thermal plane. Validate output skew and signal integrity on the finished board because package and routing effects can influence system-level timing margins.
This product page combines the manufacturer's functional description with package, sourcing, comparison, and layout guidance. It also distinguishes true drop-in options from ordering-code variants and documents which electrical details require confirmation from the complete manufacturer datasheet before a production release.
Alternatives de remplacement direct pour SY89826LHY — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
SY89826LHI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SY89826L
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SY89826LHY Spécifications
| Product Type | Precision LVDS fanout buffer and translator |
| Tension d'alimentation | 3.3 V |
| Maximum Operating Frequency | 1 GHz |
| Fanout Ratio | 1:22 |
| Differential Output Count | 22 LVDS output pairs |
| Input Multiplexing | 2:1 |
| Output Logic Standard | LVDS |
| Input Signal | Differential clock input |
| Boîtier | 64-TQFP with exposed pad |
| Type de montage | Surface mount |
| Statut RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
Guide de configuration des broches du SY89826LHY 64-tqfp with exposed pad
Configuration des broches du SY89826LHY (boîtier 64-tqfp with exposed pad). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour SY89826LHY.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
SY89826LHY convient pour 6 applications: Server and Racksystem Clock Distribution, Telecommunications Backplane Clocking, High-Speed Test and Measurement, Industrial Control and Synchronization, Synchronized Communication Modules, Precision Instrumentation.
Server and Racksystem Clock Distribution
The SY89826LHY fits systems that need to distribute one common clock to as many as 22 LVDS receivers in a server, rack, or accelerator chassis. Its 1:22 fanout reduces the number of separate clock-driver stages, while the 2:1 input multiplexer can select between two operating sources. At frequencies up to 1 GHz, precise edge alignment is important for maintaining downstream transfer and capture margins. The design should use equal-length clock topology where practical, preserve differential impedance, and verify source-to-destination skew on the assembled board.
Recommandé
Telecommunications Backplane Clocking
In telecommunications backplanes, the SY89826LHY can distribute a selected differential clock across many line-card or switching domains. Its 22 differential LVDS output pairs provide a high fanout ratio in one 64-TQFP device, and the 2:1 multiplexer supports two clock sources. LVDS signaling is well suited to controlled-impedance board interconnects when return paths and terminations are implemented correctly. Engineers should evaluate loss, jitter, crosstalk, and skew across the complete backplane rather than relying only on the device's 1 GHz frequency rating.
Recommandé
High-Speed Test and Measurement
The SY89826LHY is useful in test and measurement equipment that must deliver coherent sampling or trigger clocks to many instrument channels. The 1:22 fanout provides a common timing reference, while the 2:1 input multiplexer can accept separate operating modes. Differential LVDS outputs reduce sensitivity to common-mode noise on properly terminated interconnects. The exposed pad should be connected to a low-impedance ground plane for thermal performance, and output skew should be characterized with the intended cables, probes, and receiver loads.
Recommandé
Industrial Control and Synchronization
Industrial controllers can use the SY89826LHY to distribute a 3.3 V differential clock to multiple acquisition, motion, or communication sections that must operate from a common timing reference. The 2:1 multiplexer permits source selection during operating or maintenance modes, while 22 LVDS outputs reduce the number of separate distribution devices. Care must be taken during mode changes to prevent unwanted clock transients. Industrial systems should also examine temperature grade, clock-jitter budget, grounding, and isolation boundaries before approving the device for field deployment.
Recommandé
Synchronized Communication Modules
The SY89826LHY suits communication modules that fan a low-skew clock into multiple transmit, receive, or processing paths. Its 22 differential outputs can support a high endpoint count without requiring a multi-level external fanout tree, which may help reduce clock-tree depth and jitter accumulation. The two input sources offer a way to select normal and alternate clocks. Board implementation should preserve pair symmetry, avoid splits in differential routing, and include receiver termination consistent with the complete LVDS interface specification.
Recommandé
Precision Instrumentation
Precision instrumentation can benefit from the SY89826LHY when multiple converters, digitizers, or acquisition channels require aligned differential clocks. A common 1 GHz-class source distributed through 22 LVDS outputs can reduce channel-to-channel timing variation when the routing topology is carefully matched. The 2:1 input multiplexer can support clock selection without duplicating the output network. Signal-integrity validation should include channel skew, output jitter, receiver thresholds, connector or cable effects, and simultaneous switching noise near the 64-TQFP device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SY89826LHY — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SY89826LHI | SY89826L |
|---|---|---|---|
| Package | 64-TQFP with exposed pad | 64-TQFP with exposed pad | 64-TQFP with exposed pad |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Product Type | Precision LVDS fanout buffer and translator | Precision LVDS fanout buffer | Precision fanout buffer |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Maximum Operating Frequency | 1 GHz | 1 GHz | 1 GHz |
| Fanout Ratio | 1:22 | 1:22 | 1:22 |
| Differential Output Count | 22 LVDS output pairs | 22 differential LVDS output pairs | 22 differential LVDS output pairs |
| Input Multiplexing | 2:1 | 2:1 | 2:1 |
| Output Logic Standard | LVDS | LVDS | LVDS |
| Exposed Thermal Pad | Yes | Yes | Yes |
Principaux différenciateurs
- Combines a wide fanout ratio with integrated source selection (vs SY89826L)
- Provides 22 differential outputs from one clock distribution stage (vs SY89826LHI)
- Supports high-speed differential clock distribution (vs SY89826L)
Notes de conception
Route every LVDS output as a tightly coupled differential pair with continuous reference plane beneath it. Keep pair spacing and intra-pair geometry consistent, avoid plane splits, and minimize stubs to unused outputs. The 22 outputs should use a symmetric fanout topology where channel-to-channel skew is critical. Confirm which outputs may remain unconnected and follow the Microchip recommended-land-pattern and termination guidance.
Connect the exposed pad to a low-impedance ground plane with multiple short vias, following the manufacturer land pattern. The pad is an electrical and thermal connection, not only a heat-spreading feature. Keep dense switching or high-current return paths away from sensitive clock inputs and output pairs. A thermal assessment should use the actual PCB copper area, airflow, ambient temperature, and worst-case clock activity.
Use the complete Microchip LVDS interface guidance to select source and receiver termination. Account for trace loss, receiver loading, input slew rate, and the clock's jitter requirement rather than treating every differential endpoint as an ideal 100-ohm load. Validate output timing with the intended receiver thresholds and confirm source-to-destination skew across the assembled system.
Do not substitute SY89826LHY-TR as an engineering alternative without separating its tape-and-reel ordering suffix from the base device identity. Likewise, verify the exact meaning of the HY and HI suffixes before approving SY89826LHI as a substitute. Check pin assignments, temperature grade, exposed-pad requirements, qualification status, and production lifecycle during any replacement review.
Informations de conformité
Compliance attributes were not stated in the part information. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification status with Microchip for the exact ordering code.
