TBD62503AFNG - 7-Ch DMOS Sink Driver Array 50V/0.3A | Toshiba
Référence : TBD62503AFNG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0.93 | $0,93 |
| 10 | $0.84 | $8,40 |
| 100 | $0.71 | $71,00 |
| 500 | $0.58 | $290,00 |
| 1 000 | $0.49 | $490,00 |
TBD62503AFNG Présentation
A DMOS transistor array is a type of power driver IC that uses seven discrete N-channel double-diffused MOS transistors integrated onto a single silicon die, each with its own gate and drain pin and a shared source (substrate) tied to ground. This monolithic array category sits within the broader power management and driver IC taxonomy: transistor array -> peripheral driver -> interface IC -> semiconductor. The 50V drain-to-source breakdown and 0.3A continuous drain current make it well-suited for industrial control boards and 24V industrial bus switching.
Key features include a wide operating supply range of up to 50V on the drain side, low on-resistance DMOS outputs that minimize conduction losses versus bipolar Darlingtons, 3V CMOS/TTL-compatible logic inputs, and built-in clamping diodes for inductive loads. Each of the seven channels can be driven independently from a microcontroller GPIO or logic gate, with output currents of 300 mA continuous and pulse handling exceeding 500 mA per channel.
The architecture is optimized for digital-logic-to-load interfacing: each input pin drives a MOSFET gate through a CMOS inverter stage, while the output stage is a DMOS open-drain switch with intrinsic body diode protection. Because the outputs are N-channel low-side switches rather than Darlington pairs, the on-resistance stays in the low-ohm range across the full temperature range, eliminating the classic bipolar Vce(sat) loss that wastes power as heat in legacy ULN2003-style arrays.
Typical applications include programmable logic controller (PLC) digital output modules, LED matrix and seven-segment display drivers, relay and solenoid driver boards, and unipolar stepper motor driving where multiple low-side channels are required. The SSOP-16 footprint is also compatible with breadboard-friendly adapter boards for prototyping.
When designing with this part, note that it is a sink (low-side) driver only - loads must be tied to the positive supply. Each output requires flyback protection for inductive loads; the device integrates a body diode, but external Schottky or fast-recovery diodes are recommended above 100 mA inductive currents to keep thermal dissipation under control.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour TBD62503AFNG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TBD62503AFNG (même facteur de forme et même empreinte) — différant par Operating Temperature Range, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TBD62503AFAG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TBD62504AFNG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TPL7407LDR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ULN2003ADR
✅ Remplacement direct✓ En stock
$0.16 / unité
Voir la fiche technique →TPIC6B273N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TBD62503AFNG Valeurs maximales et caractéristiques électriques
| Number of Channels | 7 |
| Channel Type | Sink-type (low-side switch) |
| Output Device | N-channel DMOS open-drain |
| Maximum Drain-Source Voltage (Vdss) | 50 V |
| Continuous Output Current (per channel) | 300 mA |
| Peak Output Current | 500 mA |
| Maximum Clamping Diode Voltage | 50 V |
| Logic Input Compatibility | 3V CMOS / TTL |
| Input Voltage (Vin) | 0 V to 30 V (gate drive, low-voltage logic supply) |
| Plage de température de fonctionnement | -40 C to +85 C |
| Boîtier | SSOP-16 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per distributor listings) |
| Process Technology | Toshiba BiCD (Bipolar + CMOS + DMOS) monolithic |
Configuration des broches de TBD62503AFNG
| Broche 1 | OUT1 — Open-drain output, channel 1 (N-channel DMOS drain) |
| Broche 2 | OUT2 — Open-drain output, channel 2 (N-channel DMOS drain) |
| Broche 3 | OUT3 — Open-drain output, channel 3 (N-channel DMOS drain) |
| Broche 4 | OUT4 — Open-drain output, channel 4 (N-channel DMOS drain) |
| Broche 5 | OUT5 — Open-drain output, channel 5 (N-channel DMOS drain) |
| Broche 6 | OUT6 — Open-drain output, channel 6 (N-channel DMOS drain) |
| Broche 7 | OUT7 — Open-drain output, channel 7 (N-channel DMOS drain) |
| Broche 8 | GND — Common source / substrate ground for all 7 DMOS outputs |
| Broche 9 | IN1 — CMOS/TTL logic input, channel 1 (LOW turns output ON) |
| Broche 10 | IN2 — CMOS/TTL logic input, channel 2 |
| Broche 11 | IN3 — CMOS/TTL logic input, channel 3 |
| Broche 12 | IN4 — CMOS/TTL logic input, channel 4 |
| Broche 13 | IN5 — CMOS/TTL logic input, channel 5 |
| Broche 14 | IN6 — CMOS/TTL logic input, channel 6 |
| Broche 15 | IN7 — CMOS/TTL logic input, channel 7 |
| Broche 16 | COM — Clamping-diode common cathode (tie to load supply for inductive flyback protection) |
Applications typiques
TBD62503AFNG convient pour 7 applications: PLC Digital Output Module, Relay and Solenoid Driver Board, LED Matrix and Seven-Segment Display Driver, Unipolar Stepper Motor Winding Driver, GPIO Expander Breakout Board (3.3V MCU Compatible), Industrial Sensor and Indicator Lamp Bank, Automotive Interior Lighting Driver (Non-AEC-Q100).
PLC Digital Output Module
The TBD62503AFNG's 7-channel DMOS sink topology and 50V Vdss rating make it ideal for driving 24V industrial loads in PLC digital output modules. Each channel delivers 300 mA continuous at low Ron, dissipating far less heat than legacy bipolar Darlingtons and allowing dense channel placement on standard PLC backplanes. Placed between the 24V field supply and the load with 24V return tied to GND, the array drives relays, solenoids, and indicator lamps with logic-level CMOS inputs from the MCU. The 50V breakdown gives >100% safety margin over 24V rails, supporting IEC 61131-2 surge transients without external TVS protection.
Recommandé
Relay and Solenoid Driver Board
With 7 independent low-side DMOS switches in a 16-pin SSOP, the TBD62503AFNG is a compact relay/solenoid driver for HVAC control boards, vending machines, and industrial automation panels. Each channel's 300 mA continuous rating easily drives standard 5V, 12V, and 24V relay coils while staying well within the 50V Vdss limit. Compared to the legacy ULN2003A, the DMOS outputs dissipate 10x-50x less power, eliminating the need for heatsinking or substantial copper pours - critical for sealed control enclosures. Add a flyback diode across each inductive load; the device's internal body diode is suitable up to about 100 mA inductive current.
Recommandé
LED Matrix and Seven-Segment Display Driver
The TBD62503AFNG's 7-channel sink topology directly drives common-anode LED segments in multiplexed seven-segment displays and small LED matrices. Each channel's 300 mA continuous rating comfortably handles standard 20 mA LED segment currents with substantial margin and supports multiple parallel-segments per channel. The DMOS outputs can be PWM-modulated for dimming by toggling the logic input, much faster than bipolar Darlingtons and without the storage-time limitation. For larger displays, multiple TBD62503AFNG arrays can be stacked column-by-column while sharing a common cathode return path.
Recommandé
Unipolar Stepper Motor Winding Driver
A single TBD62503AFNG can sink the four winding phases of a small unipolar stepper motor (two phases per array, or full H-bridge emulation using two chips). Each channel's 50V Vdss rating supports 12V and 24V stepper supplies, and the 300 mA continuous output drives small NEMA-11 and NEMA-14 motors directly. DMOS on-resistance keeps winding-current regulation tight at low duty cycles, and the SSOP-16 footprint fits alongside the MCU on a compact stepper breakout board. For higher-current motors, choose the TBD62504AFNG (500 mA) or discrete MOSFET bridges.
Recommandé
GPIO Expander Breakout Board (3.3V MCU Compatible)
The TBD62503AFNG's 3V CMOS/TTL-compatible logic inputs accept 3.3V GPIO directly from Raspberry Pi, ESP32, STM32, and PIC32 microcontrollers without level shifters, enabling a 7-channel low-side GPIO expander breakout board. Each input is pulled-up internally and acts as a CMOS inverter driving a DMOS gate, allowing low-current GPIOs to switch higher-current loads like pumps, fans, or LED strips. The SSOP-16 footprint fits a 2-layer breakout that can be hand-soldered or reflowed; the array typically runs cool at low duty cycles and small loads, requiring only a modest input capacitor.
Recommandé
Industrial Sensor and Indicator Lamp Bank
In industrial control panels, the TBD62503AFNG sinks seven 24V indicator lamps, beacons, or stack-light segments at up to 300 mA each, providing a compact driver for status displays. The 50V breakdown handles the energy stored in 24V lamp filaments during cold-filament inrush (often 10x steady-state current) without avalanche breakdown. Compared to bipolar arrays, the DMOS outputs survive filament inrush without secondary breakdown, extending indicator lifetime in 24/7 control rooms. Daisy-chain multiple arrays for larger indicator banks.
Recommandé
Automotive Interior Lighting Driver (Non-AEC-Q100)
The TBD62503AFNG sinks seven interior lighting channels at up to 300 mA each from a 12V automotive bus, suitable for non-safety automotive interior applications such as dome lights, ambient lighting, and door-handle illumination. The 50V Vdss rating handles 12V load-dump transients up to ~40V with an external TVS clamp, but the part is NOT AEC-Q100 qualified. For AEC-Q100-grade automotive designs, choose a qualified alternative. The SSOP-16 footprint supports reflow assembly on FR4 PCBs typical of automotive interior electronics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TBD62503AFNG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TBD62503AFAG | TBD62504AFNG | TPL7407LDR | ULN2003ADR | TPIC6B273N |
|---|---|---|---|---|---|---|
| Package | SSOP-16 (Toshiba) | DIP-16 | SSOP-16 | SSOP-16 | SOIC-16 | SOIC-20 |
| Brand | Toshiba | Toshiba | Toshiba | Texas Instruments | Texas Instruments | Texas Instruments |
| Number of Channels | 7 | 7 | 7 | 7 | 7 | 8 |
| Channel Type | N-channel DMOS sink | N-channel DMOS sink | N-channel DMOS sink | N-channel DMOS sink | NPN Darlington sink (bipolar) | N-channel DMOS sink |
| Maximum Drain/Output Voltage | 50 V | 50 V | 50 V | 30 V | 50 V | 50 V |
| Continuous Output Current (per channel) | 300 mA | 300 mA | 500 mA | 600 mA | 500 mA | 500 mA |
| Logic Input Compatibility | 3V CMOS / TTL | 3V CMOS / TTL | 3V CMOS / TTL | 3V CMOS / TTL | TTL/5V CMOS | CMOS / TTL |
| Built-in Clamping Diodes | Yes (50V) | Yes | Yes | Yes | Yes | Yes |
| Fault Detection | No | No | No | Yes (open-drain fault flag) | No | No |
Principaux différenciateurs
- DMOS architecture vs legacy bipolar Darlingtons (vs ULN2003ADR)
- Wide 50V drain breakdown rating (vs TPL7407LDR)
- Compact SSOP-16 surface-mount package (vs TBD62503AFAG)
- Higher output current vs TBD62503 series (vs TBD62504AFNG)
Notes de conception
Estimated: At 24V supply switching 100 mA inductive loads on all 7 channels simultaneously, each DMOS output dissipates roughly 100 mA^2 * Ron in steady state, totaling <200 mW package-level - well within SSOP-16 free-air rating. For all 7 channels at 300 mA nominal load, ensure multi-layer PCB with minimum 100 mm^2 copper pour tied to the GND pin. The body diode catches inductive kickback but for >100 mA inductive current add external Schottky flyback diodes across each load.
Place a 100 nF ceramic bypass capacitor between pin 8 (GND) and pin 16 (COM, tied to load supply positive rail) within 5 mm of the package to absorb switching transients and stabilize the COM-clamp diode reference. For noisy industrial environments, add a 10 uF aluminum-polymer bulk capacitor on COM. Route the 7 DMOS drain traces (pins 1-7) away from the input traces (pins 9-15) to minimize capacitive coupling that could falsely trigger adjacent channels during fast switching edges.
Do NOT apply a voltage to COM pin that exceeds the absolute maximum Vclampdiode rating. Outputs are open-drain (sink only) - the load must be tied to the positive supply, never to ground. Do not operate above 50V drain-source or the DMOS outputs may avalanche. For mixed 3.3V MCU + 5V logic designs, verify input VIH/VIL thresholds against your specific logic rail; at 3.0V Vcc the inputs are fully CMOS-compatible but at 5V Vcc a TTL driver is sufficient.
Tie the SSOP-16 thermal pad (if present on the lead frame) to a substantial GND copper pour - the SSOP package depends on the lead frame for heat dissipation. Keep all 7 drain traces short and equal-length to minimize channel-to-channel timing skew in matrix-addressing applications. Use a ground plane on the layer directly beneath the package; avoid routing signal traces under the SSOP body. For relays switching 24V at >100 mA, add a TVS diode (e.g., 30V bidirectional) from GND to COM to clamp inductive transients in noisy industrial environments.
Informations de conformité
RoHS compliant per Toshiba product page and DigiKey/Mouser distributor listings. REACH compliance listed as Compliant by PartGenie distributor reference. Not AEC-Q100 qualified - choose a different array for AEC-Q100 automotive applications. Halogen-free status not explicitly stated; Toshiba typically ships SSOP BiCD parts with halogen-free molding compound but this should be confirmed with the manufacturer for halogen-sensitive designs.
