TS3A44159RGTR - 0.45Ω Quad SPDT Analog Switch | TI
Référence : TS3A44159RGTR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.05 | $1,05 |
| 10 | $0.94 | $9,40 |
| 100 | $0.74 | $74,00 |
| 500 | $0.62 | $310,00 |
| 1 000 | $0.55 | $550,00 |
TS3A44159RGTR Présentation
An analog switch is a solid-state semiconductor device that routes analog or digital signals between two or more terminals under the control of a logic-level signal. It belongs to the analog switch and multiplexer family, which sits inside the broader interface IC category of integrated circuits. Quad SPDT switches are commonly used to swap between two sources on four channels at once, an arrangement also called a 2-channel DPDT function in this device.
Key features include 0.45 Ω typical on-state resistance, 50 pA typical switch leakage, break-before-make switching to prevent momentary channel cross-connection, and a -3 dB bandwidth greater than 35 MHz. The control inputs are 1.8 V logic-compatible, while supply operation extends from 1.65 V to 4.3 V. ESD protection on the switch pins exceeds 2000 V per the HBM model.
Architecturally the part uses CMOS transmission gates with integrated charge-pump-derived well biasing, enabling low Ron and rail-to-rail signal swing on a single positive supply. Ron flatness is held tight across the input common-mode range, which preserves harmonic distortion performance in audio paths. The device draws only microamps of quiescent current, which is essential for battery-powered systems.
Typical applications include portable audio routing between headphone jack and Bluetooth receiver, USB 2.0 high-speed signal switching, SPI/I²C bus multiplexing, smartphone audio codec path selection, and PDA or portable media player source switching. Industrial uses include 4-wire resistance measurement multiplexing and analog front-end signal routing.
When designing with this part, ensure that the logic-high level on IN1/IN2 exceeds 0.85 x VDD and the logic-low is below 0.15 x VDD to guarantee full CMOS-level switching. Place 0.1 µF bypass capacitors within 5 mm of the VDD pin to keep digital control noise out of the analog path.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical PCB layout guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour TS3A44159RGTR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TS3A44159PWR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TS3A44159PWRG4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TS3A44159RSVR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TS3A44159RSVRG4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TS3A44159RGTRG4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MAX4675EUE+
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TS3A44159RGTR Valeurs maximales et caractéristiques électriques
| Fonction | Quad SPDT (2:1) analog switch |
| Number of Channels | 4 |
| On-State Resistance (Ron) | 0.45 Ω (typical) |
| Supply Voltage (VDD) | 1.65 V to 4.3 V |
| Logic Input Voltage (IN1, IN2) | 1.8 V logic compatible |
| On-State Leakage | 50 pA (typical) |
| Switching Time (Break-Before-Make) | Yes |
| Signal Path Bandwidth (-3 dB) | > 35 MHz |
| ESD Protection (HBM, switch pins) | > 2000 V |
| Plage de température de fonctionnement | -40 °C to +85 °C |
| Boîtier | 16-pin VQFN (RGT) 3x3 mm |
| Type de montage | Surface Mount |
| Niveau MSL | 2 (1 year) |
| Statut RoHS | Compliant |
| Sans halogène | Compliant (per GlobalSpec) |
Configuration des broches de TS3A44159RGTR
| Broche 1 | NC1 — Normally-closed terminal of switch 1 |
| Broche 2 | COM1 — Common terminal of switch 1 |
| Broche 3 | NO1 — Normally-open terminal of switch 1 |
| Broche 4 | NC2 — Normally-closed terminal of switch 2 |
| Broche 5 | COM2 — Common terminal of switch 2 |
| Broche 6 | NO2 — Normally-open terminal of switch 2 |
| Broche 7 | GND — Ground |
| Broche 8 | NO3 — Normally-open terminal of switch 3 |
| Broche 9 | COM3 — Common terminal of switch 3 |
| Broche 10 | NC3 — Normally-closed terminal of switch 3 |
| Broche 11 | NO4 — Normally-open terminal of switch 4 |
| Broche 12 | COM4 — Common terminal of switch 4 |
| Broche 13 | NC4 — Normally-closed terminal of switch 4 |
| Broche 14 | IN2 — Logic control input for switches 3 and 4 |
| Broche 15 | IN1 — Logic control input for switches 1 and 2 |
| Broche 16 | VDD — Positive supply voltage |
Applications typiques
TS3A44159RGTR convient pour 7 applications: Portable Audio Routing, USB 2.0 High-Speed Signal Switching, Smartphone Headset Path Selection, Portable Media Player Source Switching, PDA and Handheld Audio Routing, Industrial 4-Wire Resistance Measurement Multiplexing, Analog Front-End Signal Routing.
Portable Audio Routing
The TS3A44159's 0.45 Ω on-resistance and break-before-make switching make it a strong fit for portable audio routing between codec outputs, headphone amplifiers, and Bluetooth receivers. Its 1.65 V to 4.3 V supply range covers the Li-ion battery voltage directly, eliminating a separate analog rail. The 4-channel SPDT topology routes four audio signals (left/right plus mic/ground) between two sources with matched Ron across channels, preserving channel-to-channel gain balance critical for stereo imaging. Designers place the switch between the audio DAC output and the headphone jack, with IN1 and IN2 driven by the codec's GPIO to swap between source paths.
Recommandé
USB 2.0 High-Speed Signal Switching
The TS3A44159 can route USB 2.0 high-speed differential pairs when bandwidth (-3 dB > 35 MHz) and Ron flatness are sufficient for the application. Its 1.8 V logic inputs interface directly with USB power switches and microcontrollers, while its low on-resistance (0.45 Ω) introduces negligible series loss on the D+ and D- lines. Used between the USB connector and the on-board USB PHY, the switch lets a single port serve two downstream functions such as charging only or data sync. For USB 3.0 or higher signaling, an SPDT switch with wider bandwidth such as the TMUX1574 should be used instead.
Recommandé
Smartphone Headset Path Selection
The TS3A44159's compact 3x3 mm VQFN package and 1.65 V to 4.3 V operation are the key fit for smartphone headset path selection between the on-board microphone amplifier, headphone output, and an accessory connector. Each of the four SPDT channels routes one signal pin between the handset and the accessory, while two control inputs select all four paths simultaneously through a single GPIO pair. The 50 pA typical on-state leakage preserves the bias currents of high-impedance microphone pre-amplifiers. Designers often place the switch inside the audio accessory connector BOM to keep routing short.
Recommandé
Portable Media Player Source Switching
The TS3A44159 is ideal for portable media player source switching between line-in, FM tuner, and codec outputs in handheld audio devices. Its break-before-make action prevents clicks and pops when swapping sources mid-playback, while its 0.45 Ω on-resistance preserves the audio band flatness above 20 kHz. Two logic inputs driven by the system MCU select between source A and source B on all four channels in a single I/O write, simplifying firmware. The 50 pA leakage current is well below the bias current of typical line-level op-amp stages, so it does not degrade signal integrity.
Recommandé
PDA and Handheld Audio Routing
The TS3A44159's low quiescent current and small footprint make it well-suited to PDA and handheld audio routing between an internal speaker amplifier and an external docking connector. Its 1.8 V logic inputs interface directly with PDA application processors without level shifters, while its -40 °C to +85 °C operating range covers harsh handheld thermal environments. Designers use the switch to multiplex four audio lines between the handheld body and a docking cradle, eliminating mechanical relays and improving reliability.
Recommandé
Industrial 4-Wire Resistance Measurement Multiplexing
The TS3A44159's bidirectional signal path and 0.45 Ω Ron enable accurate 4-wire (Kelvin) resistance measurement multiplexing in industrial test systems. Its low leakage (50 pA typical) preserves measurement accuracy on high-impedance sensors, while its break-before-make switching prevents momentary shorts between current source and sense lines. Each of the four SPDT channels routes one of the four Kelvin leads to either an internal reference resistor or the device under test, allowing a single measurement front-end to scan multiple DUTs. The 1.65 V to 4.3 V supply range also supports 3.3 V industrial backplanes.
Recommandé
Analog Front-End Signal Routing
The TS3A44159's low on-resistance flatness and bidirectional paths make it a strong fit for analog front-end signal routing between sensor arrays and a single ADC in data-acquisition systems. Its -3 dB bandwidth above 35 MHz preserves signal integrity for audio-bandwidth sensors, and the four independent SPDT channels allow up to four sensors to be multiplexed into a single ADC channel. The 1.8 V logic inputs interface directly with FPGAs or microcontrollers used as the timing controller. The small 3x3 mm QFN footprint keeps the analog signal traces short and minimizes PCB area.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TS3A44159RGTR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TS3A44159PWR | TS3A44159PWRG4 | TS3A44159RSVR | TS3A44159RSVRG4 | TS3A44159RGTRG4 | MAX4675EUE+ |
|---|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Maxim Integrated |
| Package | VQFN-16 (RGT) 3x3 mm | TSSOP-16 (PW) | TSSOP-16 (PW) | UQFN-16 (RSV) | UQFN-16 (RSV) | VQFN-16 (RGT) 3x3 mm - same | TSSOP-16 |
| On-State Resistance (Ron) | 0.45 Ω typical | 0.45 Ω typical | 0.45 Ω typical | 0.45 Ω typical | 3 Ω typical | ||
| Number of Channels | 4 (quad SPDT) | 4 (quad SPDT) | 4 (quad SPDT) | 4 (quad SPDT) | 2 (dual SPDT) | ||
| Supply Voltage Range | 1.65 V to 4.3 V | 1.65 V to 4.3 V | 1.65 V to 4.3 V | 1.65 V to 4.3 V | 1.8 V to 5.5 V | ||
| Logic Compatibility | 1.8 V CMOS | 1.8 V CMOS | 1.8 V CMOS | 1.8 V CMOS | CMOS/TTL | ||
| Break-Before-Make | Yes | Yes | Yes | Yes | Yes | ||
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Principaux différenciateurs
- Quad (4-channel) SPDT vs dual (2-channel) (vs MAX4675EUE+)
- Lower Ron (0.45 Ω vs 3 Ω typical) (vs MAX4675EUE+)
- Compact 3x3 mm VQFN package (vs TS3A44159PWR)
Notes de conception
Keep the analog switch traces short and matched. Place the TS3A44159 within 5 mm of the connector or source pins to minimize trace capacitance and preserve bandwidth above 35 MHz. Use a continuous ground plane under the device and stitch vias around the exposed thermal pad of the RGT package to keep return paths short. According to TI's analog switch layout guide, separating the analog traces from the IN1/IN2 digital control lines by at least 3 mm prevents digital switching noise from coupling into the audio path.
Decouple the VDD pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of pin 16, and add a 1 µF bulk capacitor nearby for low-frequency suppression. Without proper decoupling, the charge-pump-derived well drive can introduce voltage transients on VDD during switching events, which may briefly modulate Ron and degrade THD. For battery-powered applications drawing VDD directly from a Li-ion cell, place a 10 µF tantalum or polymer capacitor at the device supply pin to suppress source-impedance peaks.
Do not exceed the absolute maximum signal voltage of VDD + 0.3 V on any NO, NC, or COM pin. Floating any unused switch channel by leaving its NC and NO pins unconnected can inject leakage into adjacent channels through the substrate, so unused switches should have their COM pin tied to ground and their NC/NO pins tied to a defined DC voltage. Driving IN1 or IN2 with an intermediate voltage (between 0.2 x VDD and 0.8 x VDD) can cause simultaneous conduction on both NO and NC paths - always drive these pins rail-to-rail.
Informations de conformité
RoHS, lead-free, and halogen-free compliant per the TI product page and GlobalSpec listing. Not AEC-Q100 qualified - this part is intended for portable consumer and industrial use, not automotive.
