VSC7395XYV - 5+1 Gigabit Ethernet Switch | Microchip
Référence : VSC7395XYV ✗ Fin de vieVSC7395XYV Présentation
An integrated Gigabit Ethernet switch is a network-interface IC that combines multiple Ethernet physical-layer transceivers, frame-processing logic, and a switching fabric in one device. Within the product hierarchy, it is an Ethernet switch, network interface IC, communications semiconductor, and power-management-dependent mixed-signal component designed for telecommunications and embedded networking equipment.
The principal features include five integrated copper transceivers, one RGMII/GMII tri-speed port, support for 10, 100, and 1000 Mbps operation, nonblocking wire-speed performance, and a single 3.3 V supply. The copper interfaces are identified as IEEE 802.3ab compliant. Its 364-BGA package provides a high pin count suitable for parallel data, clock, control, power, and ground connectivity.
Technically, the device consolidates multiple PHY channels and switch resources on one silicon die, reducing the number of separate Ethernet components required in a multiport design. The RGMII/GMII port provides a flexible processor- or switch-facing uplink when the five copper ports are used for downstream connections. Exact clocking, latency, MAC-table, management-interface, and power-consumption details require confirmation in the manufacturer documentation and were not present in the supplied excerpts.
Typical applications include industrial Ethernet gateways, telecommunications access equipment, embedded routers, network-interface controllers, and managed switching products. Its five copper PHYs suit equipment that must connect several wired endpoints while retaining a high-speed uplink through RGMII or GMII. The obsolete lifecycle status means new designs should confirm availability, lifecycle options, or a supported successor with Microchip before committing to the part.
Designers should pay particular attention to the 364-BGA escape routing, high-speed RGMII/GMII signal integrity, power-plane integrity, and thermal performance. Because the VSC7395XYV is listed as end-of-life and obsolete by verified sources, board revisions should preserve the footprint and power architecture when long-term maintenance is required.
This page consolidates the verified port, speed, voltage, package, lifecycle, and environmental information with same-family replacement context and practical design guidance. It also clearly identifies parameter gaps, avoiding unsupported claims about latency, management features, pricing, or full pin-level connectivity.
Alternatives de remplacement direct pour VSC7395XYV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
VSC7395XYV-03
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
VSC7395XYV Valeurs maximales et caractéristiques électriques
| Product Type | 5+1-port integrated Gigabit Ethernet switch |
| Total Port Configuration | 5+1 ports |
| Integrated Copper Ethernet Ports | 5 ports |
| Uplink Interface | 1 tri-speed RGMII/GMII port |
| Copper Port Speeds | 10/100/1000 Mbps |
| Maximum Data Rate | 1 Gbps |
| Switching Performance | Nonblocking wire-speed performance |
| Copper PHY Compliance | IEEE 802.3ab compliant |
| Single Supply Voltage | 3.3 V |
| Boîtier | 364-BGA (23x23) |
| Type de montage | Surface Mount |
| Shipping Package | Tray |
| Statut du cycle de vie | End of Life / Obsolete |
| Lead-Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Application Category | Telecommunications |
| Ethernet PHY Count | 5 integrated tri-speed copper PHYs |
Guide de configuration des broches du VSC7395XYV tray
Configuration des broches du VSC7395XYV (boîtier tray). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour VSC7395XYV.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
VSC7395XYV convient pour 6 applications: Industrial Ethernet Gateway, Telecommunications Access Equipment, Embedded Network Interface Controller, Managed Network Switching, Industrial Network Bridge, Legacy Communications Controller.
Industrial Ethernet Gateway
The VSC7395XYV fits a legacy industrial gateway that must present several wired Ethernet connections to sensors, controllers, or service equipment. Its five integrated tri-speed copper PHYs support 10, 100, and 1000 Mbps per port, while the RGMII/GMII uplink can connect the switching fabric to a host processor or another switching ASIC. This integration reduces the number of separate PHY devices in a multiport gateway. The design must still account for the 364-BGA escape routing, controlled-impedance RGMII/GMII traces, 3.3 V power integrity, and industrial temperature verification because no operating-temperature range was present in the supplied excerpts.
Recommandé
Telecommunications Access Equipment
The VSC7395XYV is suitable for legacy telecommunications access equipment requiring a concentrated set of copper Ethernet interfaces. Five IEEE 802.3ab-compliant PHYs provide 10/100/1000 Mbps service on the access side, and the dedicated tri-speed RGMII/GMII interface supports a high-speed uplink to line-card or aggregation logic. Its single 3.3 V supply simplifies rail planning compared with a multi-rail implementation. Because the verified lifecycle information marks the switch as End of Life and obsolete, an equipment revision must preserve the existing footprint and verify telecom temperature, surge, EMC, and long-term supply requirements before use.
Recommandé
Embedded Network Interface Controller
An embedded router or network-interface controller can use the VSC7395XYV when one processor-facing RGMII/GMII uplink must fan out to five physical Ethernet connections. The uplink interface provides a practical separation between host connectivity and downstream copper ports, while the five integrated PHYs avoid five separate magnetics-and-PHY channels at the component level. Engineering work must focus on RGMII/GMII timing, impedance-controlled routing, isolation between high-speed and copper interfaces, and thermal planning for the 23x23 mm BGA. The supplied data does not specify MAC-table capacity or management features, so firmware requirements must be checked against the complete Microchip documentation.
Recommandé
Managed Network Switching
The VSC7395XYV can serve as the switching element in a compact managed network product when five copper ports and one high-speed uplink satisfy the port plan. Its nonblocking wire-speed switching architecture and tri-speed support on the integrated PHYs allow mixed 10, 100, and 1000 Mbps links, which is useful during migration from legacy Fast Ethernet equipment to Gigabit connections. Management functionality, MAC-table behavior, and switching latency were not included in the verified excerpts, so software and control-plane requirements must be confirmed before design selection. The obsolete lifecycle status also makes this device best suited to sustaining an established product rather than entering a new long-term platform.
Recommandé
Industrial Network Bridge
The VSC7395XYV is appropriate for a bridge joining legacy 10/100 Mbps devices to a Gigabit network because each copper PHY supports all three rates of 10, 100, and 1000 Mbps. Five integrated PHY channels can serve multiple machine or building-network endpoints, while the RGMII/GMII uplink provides a connection to a higher-capacity segment. The design benefit is consolidation of switching and copper transceiver functions into one 364-BGA device operating from 3.3 V. The main engineering risks are obsolete-part procurement, lead time, PCB assembly at 364-ball density, and the absence of verified temperature and power specifications in the supplied data; all require manufacturer-document review before release.
Recommandé
Legacy Communications Controller
The VSC7395XYV can be retained in a legacy communications controller when its existing board architecture depends on five copper PHYs and a separate RGMII/GMII host interface. Its 1 Gbps maximum rate per copper port supports Gigabit Ethernet equipment, while tri-speed operation permits interoperability with older 10 Mbps and 100 Mbps nodes. The 3.3 V single-supply architecture and nonblocking wire-speed switching provide established functions for sustained product maintenance. However, a modernization program should document the exact package revision, compare controller firmware, and secure written Microchip lifecycle guidance. The part should not be treated as an active, future-proof procurement choice based solely on distributor availability pages.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour VSC7395XYV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | VSC7395XYV-03 |
|---|---|---|
| Package | 364-BGA (23x23) | 364-BGA (23x23) - same-family package |
| Brand | Microchip Technology | Microchip Technology |
| Port Configuration | 5+1 ports | 5+1 ports |
| Integrated Copper PHYs | 5 tri-speed copper PHYs | 5 tri-speed copper PHYs |
| Uplink Interface | 1 tri-speed RGMII/GMII port | 1 tri-speed RGMII/GMII port |
| Copper Port Speeds | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Maximum Data Rate | 1 Gbps | 1 Gbps |
| Supply Voltage | 3.3 V | 3.3 V |
| IEEE 802.3ab Compliance | Compliant for integrated copper PHYs | Compliant for integrated copper PHYs |
| Switching Performance | Nonblocking wire-speed performance | Nonblocking wire-speed performance |
| Lead-Free Status | Lead Free | Lead Free |
| RoHS Status | RoHS Compliant | RoHS Compliant |
Principaux différenciateurs
- Integrated five-port copper PHY array (vs VSC7398XYU)
- Single 3.3 V operating supply (vs VSC7398XYU)
- Direct processor-facing RGMII/GMII uplink (vs Broadcom BCM53134)
Notes de conception
Route the RGMII/GMII interface as a controlled-impedance, point-to-point high-speed network and follow the manufacturer reference layout for length matching and clock topology. The 364-BGA footprint also requires deliberate via-in-pad or escape-routing strategy. Do not derive the ball map from third-party listings; obtain the official package drawing because one incorrectly assigned power, ground, or clock ball can prevent operation.
Plan a low-impedance 3.3 V distribution network with local bulk and high-frequency decoupling placed directly beneath or close to the device's supply and ground balls. The supplied excerpts do not provide current consumption, recommended capacitance, or allowable ripple, so values must be taken from the complete Microchip datasheet. Estimate worst-case dissipation from actual port loading before assigning copper area and thermal constraints.
Do not assume that a distributor's ready-to-ship message guarantees production availability for an obsolete part. Confirm the exact ordering code, date code, tray quantity, condition, traceability, and manufacturer lifecycle status before ordering. Likewise, do not treat VSC7398XYU, BCM53134, 88E6393X, or RTL8370N as drop-in replacements merely because they perform Ethernet switching; their packages and pin assignments require separate verification.
Informations de conformité
The supplied VSC7395XYV-03 listings identify the family as lead free and RoHS compliant. No verified REACH, halogen-free, conflict-minerals, or automotive-qualification statement was supplied for the exact target.
