VSC7436XMT - 10-Port Carrier Ethernet Switch | Microchip
Référence : VSC7436XMT ✓ ActifVSC7436XMT Présentation
A Carrier Ethernet switch is a specialized Ethernet switching IC that combines frame forwarding, port management, and carrier-oriented network functions. Unlike a general-purpose desktop Ethernet switch, the VSC7436XMT targets telecommunications infrastructure where port density, uplink bandwidth, timing functions, and interoperability with network equipment are important. Its device family belongs to the broader hierarchy of Ethernet switch, network interface IC, telecommunications IC, and integrated semiconductor categories.
The principal connectivity is provided by eight 1G ports and two 10G ports. Two integrated Cu PHYs support copper-connected links without requiring a separate physical-layer transceiver for those interfaces. The VSC7436 family also includes ViSAATM and VeriTime IEEE 1588 capabilities. IEEE 1588 timing support is especially relevant to Carrier Ethernet systems that distribute precise timing across packet networks, while ViSAATM addresses ATM-related transport functions.
The 324-BGA package provides a high pin count suitable for a switch containing multiple port interfaces, digital control logic, high-speed serial interfaces, and integrated physical-layer functions. Its 19 x 19 mm body supports compact telecommunications designs while requiring careful PCB layout, high-density escape routing, and assembly processes capable of handling the large ball grid array. The surface-mount package is identified as MSL3, so handling, baking, and reflow controls should follow the manufacturer's assembly guidance.
Typical equipment uses include telecom access shelves, mobile backhaul, carrier aggregation platforms, industrial Ethernet gateways, and network appliances with 1G access ports plus 10G uplinks. In these systems, the eight 1G ports can connect subscriber, service, or management equipment, while the two 10G ports provide higher-bandwidth links toward aggregation or core equipment. The integrated copper PHYs can reduce board-level component count where copper connectivity is required.
The principal design challenge is not only pin assignment but high-speed signal integrity. Differential Ethernet routes, clocks, power distribution, and decoupling must be designed to prevent insertion loss, reflections, crosstalk, and reference-plane discontinuities from impairing port performance. The manufacturer's pin-description table, layout guidance, and reference design should therefore be treated as the controlling documents during schematic capture and PCB implementation.
This page combines the manufacturer's Carrier Ethernet feature description with package, environmental-handling, purchasing, replacement, and engineering guidance. It also identifies where a complete public pin list, detailed electrical limits, lifecycle declarations, and qualified drop-in replacements require separate verification before a board is released for production.
Alternatives de remplacement direct pour VSC7436XMT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesVSC7436XMT Valeurs maximales et caractéristiques électriques
| Product Type | Carrier Ethernet switch |
| Total Port Configuration | 10 ports |
| 1G Ethernet Ports | 8 ports |
| 10G Ethernet Ports | 2 ports |
| Integrated Copper PHYs | 2 PHYs |
| Timing Support | VeriTime IEEE 1588 |
| Transport Feature | ViSAATM |
| Package Type | 324-BGA |
| Package Dimensions | 19 x 19 mm |
| Type de montage | Surface mount |
| RoHS Version | RoHS3 |
| Moisture Sensitivity Level | MSL3 |
| Ethernet Interface Category | Telecom interface IC |
| Maximum Ethernet Line Rate | 10 Gb/s |
Guide de configuration des broches du VSC7436XMT 19 x 19 mm
Configuration des broches du VSC7436XMT (boîtier 19 x 19 mm). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour VSC7436XMT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
VSC7436XMT convient pour 6 applications: Carrier Ethernet Access Equipment, Mobile Backhaul Aggregation, Industrial Ethernet Gateway, Network Appliance with 1G and 10G Ports, Timing-Aware Transport System, Telecom Service Aggregation Shelf.
Carrier Ethernet Access Equipment
The VSC7436XMT fits telecom access equipment requiring eight 1G service connections and two 10G uplink ports within one switching device. The eight 1G ports can terminate subscriber, service, or management traffic, while the two 10G ports connect toward a higher-capacity aggregation layer. Microchip's 8x1G plus 2x10G configuration, integrated copper PHYs, and VeriTime IEEE 1588 support distinguish it from a basic enterprise switch. PCB implementation must accommodate the 324-BGA footprint, high-speed differential routing, dense power distribution, and controlled MSL3 handling.
Mobile Backhaul Aggregation
The VSC7436XMT is suitable for mobile backhaul and service-aggregation platforms that combine numerous access links with high-speed uplinks. Eight 1G ports provide connectivity for base-station transport or aggregation clients, while two 10G ports provide greater bandwidth toward the packet network. Its Carrier Ethernet focus and IEEE 1588 timing support are useful in transport equipment requiring synchronized timing. Design effort should focus on lossless Ethernet behavior, clocking, thermal performance, and the high-density 19 x 19 mm 324-BGA assembly rather than treating the device like a low-density consumer switch.
Industrial Ethernet Gateway
The VSC7436XMT can serve as the switching core of an industrial Ethernet gateway that needs multiple 1G device connections and at least one high-speed uplink. Eight 1G ports support cameras, sensors, controllers, and service equipment, while the two 10G ports provide aggregation capacity for upstream networks or redundant links. The integrated copper PHYs can simplify board integration for copper ports. For industrial deployment, engineers should validate temperature requirements, transient immunity, grounding, fiber or copper media support, and the carrier-oriented feature set against the actual gateway specification.
Network Appliance with 1G and 10G Ports
The VSC7436XMT is appropriate for edge appliances, protocol gateways, and test equipment that need a balanced mix of access and uplink bandwidth. Eight 1G ports connect management, service, or endpoint interfaces, while two 10G ports handle backbone traffic or high-rate data collection. The 10 Gb/s maximum line rate gives the design clear separation between access and uplink tiers without requiring two unrelated switching devices. Engineers should use the manufacturer's reference design and layout guidance to control insertion loss, clock jitter, return loss, and power-plane noise across the large 324-BGA package.
Timing-Aware Transport System
The VSC7436XMT supports transport systems that require precise network timing alongside Carrier Ethernet switching. VeriTime IEEE 1588 capability allows the device family to participate in packet timing and synchronization, making it relevant to infrastructure where clocks must be distributed consistently across network elements. Eight 1G and two 10G ports support a mix of service and aggregation links. System-level validation must evaluate the timing accuracy, holdover behavior, clock source, and configuration requirements defined by the VSC7436 documentation rather than assuming timing performance from port counts alone.
Telecom Service Aggregation Shelf
The VSC7436XMT can be integrated into a telecom service aggregation shelf where many lower-rate access ports must be consolidated toward high-speed uplinks. Eight 1G ports handle service or subscriber-facing connections, and two 10G ports connect the line card to switching fabric or aggregation equipment. The Carrier Ethernet positioning, ViSAATM support, and integrated copper PHYs make the device more specialized than an office switch. Board and enclosure design should account for the 324-BGA assembly, 19 x 19 mm footprint, MSL3 handling, thermal dissipation, and the high-speed layout demands of 10G interfaces.
Données de référence d'ingénierie pour VSC7436XMT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit |
|---|---|
| Package | 324-BGA (19 x 19 mm) |
| Brand | Microchip Technology |
| Total Ethernet Ports | 10 ports |
| 1G Ethernet Ports | 8 ports |
| 10G Ethernet Ports | 2 ports |
| Integrated Copper PHYs | 2 PHYs |
| Timing Support | VeriTime IEEE 1588 |
| Transport Feature | ViSAATM |
| RoHS Version | RoHS3 |
| Moisture Sensitivity Level | MSL3 |
Principaux différenciateurs
- Combines eight 1G access ports with two 10G uplinks (vs General-purpose 10-port Ethernet switches)
- Adds carrier timing and transport capabilities (vs Basic enterprise Ethernet switch controllers)
- Integrates two copper PHYs (vs Switch solutions requiring separate copper PHYs)
Notes de conception
Treat the 324-BGA as a high-speed mixed-signal design rather than a generic processor package. Follow the Microchip reference design for ball escape routing, layer transitions, via placement, and reference planes. Keep Ethernet differential pairs continuous, matched, and isolated from switching and clock-return paths. Incorrect escape routing or abrupt reference-plane changes can add insertion loss and reflections, directly reducing margin on the 10G ports.
Decouple each supply domain at the device pins with the capacitance and placement prescribed by the manufacturer. Confirm which BGA balls belong to each voltage rail and which are power or ground connections before schematic release. Use a low-impedance distribution structure for high-speed transceiver current and validate voltage droop during line-rate traffic. Do not infer rail names or capacitor values from package size; use the pin-description table and power-supply design guidance.
Estimate junction temperature from total dissipated power, board thermal resistance, and the actual airflow before defining product operating conditions. The 324-BGA exposes its thermal-performance path mainly through the PCB rather than through a simple top-side heat spreader. Preserve the recommended ground-via field beneath the device, avoid copper-starved voids, and evaluate the assembled board in its enclosure. Final thermal validation must use the finished system because airflow and neighboring components materially alter junction temperature.
Do not approve a substitute solely because it is described as a 10-port Ethernet switch. The VSC7436XMT combines eight 1G ports, two 10G ports, two integrated copper PHYs, Carrier Ethernet functions, ViSAATM, and IEEE 1588 timing in a specific 324-ball map. A replacement must match the footprint and pin assignments and must preserve clocking, software, thermal, and regulatory behavior. Use manufacturer cross-reference data and a prototype comparison before authorizing a drop-in change.
Informations de conformité
The component listing identifies the 324-BGA package as RoHS3. No explicit REACH, halogen-free, conflict-minerals, or automotive qualification statement was identified for this ordering code.
