XC2V1500-4FFG896C - Virtex-II 1.5M Gates FPGA | AMD/Xilinx
Référence : XC2V1500-4FFG896C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $264.6 | $264,60 |
| 10 | $245 | $2 450,00 |
| 100 | $220 | $22 000,00 |
| 500 | $195 | $97 500,00 |
| 1 000 | $175 | $175 000,00 |
XC2V1500-4FFG896C Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure post-manufacture to implement arbitrary digital circuits, from glue logic to full processor subsystems. Within the IC hierarchy, an FPGA sits between an ASIC and a programmable logic device (PLD/CPLD): ASICs are application-specific and fixed, CPLDs handle simpler glue logic with non-volatile configuration, and FPGAs sit above for the highest logic density and highest-speed serial I/O. Virtex-II is the Xilinx generation built on a 0.15 micrometer CMOS process with 1.5V core, introducing dedicated 18x18 hardware multipliers and block RAM tiles tuned for DSP and datapath acceleration.
Key parameters worth highlighting: 1.5 million system gates (a marketing-derived gate count), 17,280 logic cells, 1,920 Configurable Logic Blocks / CLBs (the 17,280-cell / 1920-LAB count matches Virtex-II datasheet convention), 884,736 bits of embedded block RAM organized into selectable 18-Kbit blocks, and 528 user I/O pins distributed across the package perimeter. The device supports configuration via SelectMAP, JTAG (IEEE 1149.1), and serial modes, with on-chip clock management through eight Digital Clock Managers (DCMs).
Architecturally, Virtex-II uses a symmetrical array of CLBs each containing four slices, each slice carrying two 4-input Look-Up Tables (LUTs), dedicated carry logic for fast arithmetic, and distributed SelectRAM. The hard IP blocks of 18x18 multipliers and 18-Kbit block RAMs allow DSP and buffering functions to run at hundreds of MHz without consuming general logic resources.
Typical applications include high-throughput data acquisition front-ends, telecom baseband processing (3G and early LTE line cards), broadcast video processing, avionics prototype platforms (mil/aero-grade variants exist but the -4 C grade is commercial), and ASIC prototyping shells. The 528 I/Os and large logic capacity also suit test-and-measurement backplanes.
Designers should be aware that this part is now classified Obsolete (EOL) in the supply chain; long-term designs should consider Virtex-4, Virtex-5, or current Kintex 7-series equivalents from AMD/Xilinx, while PCN documentation must be reviewed for any in-production designs. Power estimation should be performed pre-layout using the Xilinx Power Estimator (XPE) because the VQFN-style multi-rail FCBGA demands a substantial decoupling network and a thermal solution capable of sustaining typical Virtex-II junction profiles.
This page synthesizes distributor inventory from DigiKey, parametric data from the manufacturer Virtex-II datasheet, and practical pin-compatibility notes not bundled into the bare datasheet PDF.
Alternatives de remplacement direct pour XC2V1500-4FFG896C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC2V1500-5FFG896C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC2V1500-6FFG896C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC2V1000-4FFG896C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC2V2000-4FFG896C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC2V1500-4FF896I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC2V1500-4FFG896C Valeurs maximales et caractéristiques électriques
| Product Type | FPGA (Field-Programmable Gate Array) |
| Family | Virtex-II |
| System Gates | 1,500,000 |
| Logic Cells | 17,280 |
| Number of LABs/CLBs | 1920 |
| Total RAM Bits | 884736 |
| Number of User I/O | 528 |
| Boîtier | 896-BBGA, FCBGA (Flip-Chip FFG, 31x31 mm) |
| Speed Grade | -4 |
| Temperature Grade | Commercial (C): 0C to 85C (TJ) |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 um CMOS |
| Type de montage | Surface Mount (SMT) |
| Configuration Interface | JTAG (IEEE 1149.1) / SelectMAP / Serial |
| Block RAM | 18-Kbit dual-port blocks |
| DSP Resources | Dedicated 18x18 hardware multipliers |
| Clock Management | 8 Digital Clock Managers (DCMs) |
| Statut RoHS | Non-Compliant (contains lead) |
Guide de configuration des broches du XC2V1500-4FFG896C 896-bbga, fcbga (flip-chip ffg, 31x31 mm)
Configuration des broches du XC2V1500-4FFG896C (boîtier 896-bbga, fcbga (flip-chip ffg, 31x31 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC2V1500-4FFG896C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC2V1500-4FFG896C convient pour 6 applications: ASIC Prototyping Platforms, High-Speed Data Acquisition Front-Ends, Telecom Baseband Processing, Broadcast Video Processing, Test & Measurement Backplanes, Industrial Control & DSP Front-Ends.
ASIC Prototyping Platforms
The XC2V1500-4FFG896C suits ASIC prototyping because of its 1.5M system gates, 17,280 logic cells, and 528 user I/O pins, which together provide enough logic capacity and pin bandwidth to partition mid-complexity ASICs (10M-30M gate equivalent) across multiple FPGAs. Engineers typically map a single ASIC RTL block onto one Virtex-II device and then spread the prototype across two or four devices with SSTL/HSTL or LVDS pin-pair signalling. The 884,736 bits of block RAM and dedicated 18x18 multipliers allow DSP-heavy ASIC IPs to run at full ASIC-equivalent throughput. Unlike a discrete ASIC tape-out, designer iterations on this FPGA footprint can finish in hours rather than weeks, dramatically accelerating bring-up and validation.
Recommandé
High-Speed Data Acquisition Front-Ends
The XC2V1500-4FFG896C delivers up to 528 SelectIO pins with LVDS, LVPECL, HSTL, and SSTL compatibility, making it well suited for interfacing with multi-channel high-speed ADCs and DACs at sample rates in the 100-500 MSPS range. The 884 Kbit block RAM absorbs line-rate FIFO buffers while 8 Digital Clock Managers (DCMs) generate the precise internal clocking required by deserialization ISERDES logic. Eighteen-by-eighteen hardware multipliers also accelerate the digital-down-conversion (DDC) and finite impulse response (FIR) decimation filters commonly used in SDR and instrumentation digitizers. Compared to fixed-function DSP processors, this Virtex-II provides parallel datapath throughput per clock cycle.
Recommandé
Telecom Baseband Processing
In telecom line cards and base station prototypes, the XC2V1500-4FFG896C provides sufficient logic, block RAM (884 Kbit), and 528 I/O lanes to implement baseband modulation, channel coding (Viterbi, Turbo), and digital up/down-conversion for 3G/UMTS and pre-4G line cards. The 0.15 micron process with 1.5V core voltage balances performance and power efficiency at typical operating frequencies of 200-300 MHz for general logic and up to 500 MHz for the dedicated multipliers. Hard 18x18 multipliers accelerate matched filtering and correlators without consuming fabric LUTs, leaving slices free for Viterbi and convolutional decoders. The 528 I/O budget also supports high-density backplane interfaces such as LVDS bused serial buses.
Recommandé
Broadcast Video Processing
The XC2V1500-4FFG896C targets broadcast video switching and processing because its 528 I/O pins can ingest and broadcast multiple D1 / SD-SDI / HD-SDI flows in parallel, and its 884 Kbit block RAM serves as line buffers for color-space conversion, scaling, and de-interlacing pipelines. Designers can implement two to four complete D1 video processing channels in a single Virtex-II device, with the 18x18 multipliers running polyphase scalers and 2D convolutions for filtering. The 1920 CLBs (17,280 cells) absorb motion-estimation logic and scaling engines in parallel architectures. Compared to fixed-video ASICs, the FPGA flexibility allows multi-format studios to upgrade by reconfiguring the device rather than respinning the board.
Recommandé
Test & Measurement Backplanes
The XC2V1500-4FFG896C fits high-pin-count bench instruments because it integrates 528 SelectIO pins supporting LVDS 2.5V/3.3V with per-pin direction, slew rate, and on-chip termination. A bench oscilloscope, logic analyzer, or protocol tester typically requires wide parallel buses (64-128 channels) and clock-domain bridges, both of which fit comfortably in this Virtex-II device. The 884 Kbit block RAM serves as acquisition memory or pattern memory, while the 17,280 logic cells allow stateful decoders for protocols like I2C, SPI, JTAG, and parallel asynchronous buses. Operational stability comes from JTAG (IEEE 1149.1) boundary-scan for pin-level diagnostics across the 528 I/O channels.
Recommandé
Industrial Control & DSP Front-Ends
The XC2V1500-4FFG896C targets industrial motor control, machine vision, and DSP front-ends because its 18x18 multipliers enable high-speed control-loop arithmetic (Park/Clarke transforms, PID, MRAS estimators) while 528 I/Os interface to encoders, resolvers, and power-stage PWM peripherals. The Commercial 0-85C temperature grade suits factory-floor enclosures with controlled air, and the 884 Kbit block RAM provides acquisition FIFOs for inspection cameras running at hundreds of MHz pixel clocks. Designers evaluate processing latency in FPGA hardware rather than DSP software stacks, achieving sub-microsecond deterministic response. Compared to MCU-based controllers, the FPGA absorbs multiple parallel loops with deterministic timing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC2V1500-4FFG896C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC2V1500-5FFG896C | XC2V1500-6FFG896C | XC2V1000-4FFG896C | XC2V2000-4FFG896C | XC2V1500-4FF896I |
|---|---|---|---|---|---|---|
| Brand | Xilinx (now AMD) | Xilinx (now AMD) | Xilinx (now AMD) | Xilinx (now AMD) | Xilinx (now AMD) | Xilinx (now AMD) |
| Package | 896-BBGA, FCBGA (FFG) | 896-BBGA, FCBGA (FFG) - same | 896-BBGA, FCBGA (FFG) - same | 896-BBGA, FCBGA (FFG) - same | 896-BBGA, FCBGA (FFG) - same | 896-FBGA - same footprint |
| System Gates | 1.5M | 1.5M - identical | 1.5M - identical | 1.0M (-33%) | 2.0M (+33%) | 1.5M - identical |
| Speed Grade | -4 (mid) | -5 (faster ~5-10%) | -6 (fastest ~10-15%) | -4 (mid) | -4 (mid) | -4 (mid) |
| Temperature Grade | Commercial 0-85C | Commercial 0-85C | Commercial 0-85C | Commercial 0-85C | Commercial 0-85C | Industrial -40C to +100C |
| User I/O | 528 | 528 - identical | 528 - identical | Fewer (XC2V1000 has smaller I/O count) | More (XC2V2000 has larger I/O count) | 528 - identical |
| Block RAM (bits) | 884736 | 884736 - identical | 884736 - identical | Lower (XC2V1000 scale-down) | Higher (XC2V2000 scale-up) | 884736 - identical |
| RoHS Compliance | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Principaux différenciateurs
- Industry-standard 1.5M gate Virtex-II with mature IP ecosystem (vs XC2V1000-4FFG896C)
- Drop-in speed-grade upgrade without PCB rework (vs XC2V1500-5FFG896C)
- Commercial temperature grade with wide third-party support (vs XC2V1500-4FF896I)
Notes de conception
Estimated: Virtex-II parts at high toggle density can draw 5-15W steady-state in commercial applications. The -4 (mid) speed grade draws less dynamic current than -6 (fastest); estimate ~70-85% of the -6 worst-case power when budgeting supply regulators. Use Xilinx Power Estimator (XPE) for accurate numbers before board bring-up.
The 896-ball FCBGA package (31x31 mm) requires ball-grid-array PCB geometry with 1.0 mm pitch traces routed as buried vias/escape microvias. Use at least 6 PCB layers with dedicated power planes for VCCINT (1.5V core) and VCCO (per-bank I/O voltage). Decoupling must include a 1:1 ratio of decoupling capacitors to VCCINT balls plus bulk ceramic bank capacitors per the Virtex-II datasheet DS031.
Place the configuration PROM (e.g., XCF08PFSG48C) within 5 cm of the FPGA to keep the CCLK trace short and matched for SelectMAP modes. JTAG chain routing must use the AMD-Xilinx recommended TAP pod termination; long JTAG chains (>10 inches total) degrade IR shift clock integrity. MGT pairs (if any) should follow 100-ohm differential routing rules with ground-guard vias.
Do not apply an indeterminate configuration pattern at boot - the FPGA will draw full power but generate no logic transitions, sometimes confusing power analysis. Always populate a configuration bitstream (even a stub) or strap PROG_B low during board bring-up to avoid accidental spurious logic activity. After pinout changes, regenerate the .ucf/.xdc constraints and re-export the bitstream; stale constraints cause pin-mismatch failures that look like ESD damage.
Informations de conformité
Per FindIC datasheet comparison page, XC2V1500-4FFG896C is RoHS Non-Compliant ('Lead-Free Status: Lead Free - Contains Lead'). Virtex-II family predates full RoHS lead-free conversion; REACH and conflict-mineral statements not found in the verified distributor data, set to 'unknown'. AEC-Q100 not applicable to commercial-grade FPGAs.
