XC3S1000-5FG676C - 1M Gate 676-BGA Spartan-3 FPGA | AMD
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A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and interconnect resources are configured after manufacture. In the broader hierarchy, an FPGA belongs to programmable logic devices, alongside complex programmable logic devices, and operates as a configurable element within an embedded control or signal-processing system. This flexibility allows one physical device to implement multiple hardware functions and supports product revisions without changing the printed circuit board.
The Spartan-3 architecture provides 442,368 total RAM bits alongside 17,280 logic cells. Its 391 user I/Os support integration with external memory, converters, clocks, communications links, and control peripherals. The -5 speed designation identifies the device's performance grade, while the C suffix denotes the commercial temperature grade associated with an operating range of 0°C to 85°C. The 676-ball FBGA package supports dense board routing while requiring careful escape routing and multilayer PCB construction.
Technical complexity increases with the number of available logic and I/O resources. Designers must account for clock-domain constraints, supported I/O standards, memory bandwidth, pin placement, and the finite routing capacity of the selected FPGA. Configuration data controls the implemented circuit, so the bitstream, configuration interface, clock source, startup behavior, and reset strategy should be validated as one complete design rather than treated as isolated device features.
Typical uses include industrial automation, communications equipment, embedded video control, test and measurement, and general-purpose digital signal processing. In an industrial controller, the FPGA can combine parallel interface logic, protocol conversion, and deterministic sampling in one device. In communications equipment, the same programmable fabric can adapt to different framing and signaling requirements while providing 442,368 RAM bits for buffering or packet processing.
PCB implementation is the principal practical consideration for this 676-ball package. Use a board stackup that supports the required escape-routing density, place decoupling close to every supply ball, and follow the manufacturer's ball-map and layout guidance for power, ground, and configuration pins. Confirm the selected footprint and pin assignments against the package drawing before releasing the design.
This product page combines the device specifications, same-footprint replacement options, engineering guidance, application fit, and package-related constraints into a practical engineering reference. It also distinguishes exact published attributes from parameters that still require confirmation before schematic or PCB sign-off.
Alternatives de remplacement direct pour XC3S1000-5FG676C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S1000-5FG676C (même facteur de forme et même empreinte) — différant par Logic Cells, Process Technology, User I/O.
XC3S1000-4FG676C
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XC3S1000-4FGG676C
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XC3S1000-5FGG676C
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XC3S1000-4FG676I
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Voir la fiche technique →XC3S1000-5FG676C Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-3 Field-Programmable Gate Array (FPGA) |
| System Gates | 1,000,000 gates |
| Logic Cells | 17,280 cells |
| Total RAM | 442,368 bits |
| User I/O | 391 I/Os |
| Package Pins | 676 balls |
| Package Type | 676-ball FBGA, 27 mm x 27 mm |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Température de fonctionnement | 0°C to 85°C |
| Type de montage | Surface Mount |
| Terminal Form | Ball |
| Package Shape | Square |
| Lead-Free Status | Lead Free |
Guide de configuration des broches du XC3S1000-5FG676C square
Configuration des broches du XC3S1000-5FG676C (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S1000-5FG676C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S1000-5FG676C convient pour 6 applications: Industrial Automation Controllers, Communications Interface Consolidation, Test and Measurement Equipment, Embedded Signal Processing, Data Acquisition and Control, Programmable Logic Platforms.
Industrial Automation Controllers
The AMD XC3S1000-5FG676C fits industrial automation controllers that require parallel machine interfaces, deterministic control logic, and programmable data handling on one device. Its 17,280 logic cells can implement sequencing, state machines, and protocol logic, while 442,368 RAM bits provide on-chip buffering for sampled and processed data. The 391 user I/Os simplify connections to sensors, actuators, counters, and operator interfaces without requiring a large external bus fabric. A designer can place the FPGA beside sensor-conditioning circuits and industrial communications hardware, using its programmable architecture to adapt control logic across product variants. The principal engineering trade-off is timing verification: the -5 grade should be analyzed with realistic I/O and clock constraints rather than treated as an unlimited performance guarantee.
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Communications Interface Consolidation
The AMD XC3S1000-5FG676C is suitable for consolidating communications interfaces, framing logic, and protocol conversion because it combines 17,280 programmable logic cells with 391 user I/Os. The fabric can be partitioned into transmit and receive channels, protocol state machines, test patterns, and data buffers without requiring several discrete interface devices. Its 442,368 RAM bits are useful for packet buffering, command queues, and width conversion. Engineers can place the FPGA between a communications processor and external transceivers, then constrain the relevant clock domains and verify timing for the highest-throughput operating mode. The device is especially valuable when multiple interface variants share one PCB, because the logical function can be changed through configuration while preserving the physical design.
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Test and Measurement Equipment
The AMD XC3S1000-5FG676C can serve as the programmable control and data-capture fabric in test and measurement equipment. Its 17,280 logic cells support timing generation, sequencers, acquisition pipelines, and result processing, while 391 I/Os provide connections to converters, memory, display controllers, and communication ports. The 442,368 RAM bits can hold captured samples or instrument state between transactions, reducing pressure on an external processor. For a bench instrument, the FPGA can execute acquisition sequences and format results while a microcontroller handles user commands and calibration storage. Because the 676-ball FBGA requires multilayer escape routing, the design should separate high-speed and sensitive routing paths and provide continuous power and ground planes around the device.
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Embedded Signal Processing
The AMD XC3S1000-5FG676C fits embedded signal-processing blocks that require configurable parallel datapaths and moderate local memory. Its 17,280 logic cells can implement filters, correlation, digital conversion, waveform generation, and timing control, while the 442,368 RAM bits support sample buffers and multiport storage. The FPGA is particularly useful when a fixed digital signal processor would be too inflexible or when an algorithm must be updated for different sensor or channel configurations. Place the device adjacent to the analog front end so converted samples enter the programmable fabric through controlled parallel interfaces. Designers must use timing constraints to define the sampling, processing, and output clock relationships, and they should check memory inference carefully because the available RAM implementation depends on the selected clocking and I/O structure.
Recommandé
Data Acquisition and Control
The AMD XC3S1000-5FG676C is appropriate for multichannel data-acquisition systems where parallel sensor inputs, digital control outputs, and local buffering must operate together. The 391 user I/Os can accommodate parallel converter data buses, digital sensors, triggers, and actuator commands, while 17,280 logic cells support channel multiplexing, acquisition sequencing, and preprocessing. Its 442,368 RAM bits allow captured records to remain on-chip for transfer to a host processor or storage device. A practical implementation places the FPGA between converters and a communications interface, with separate clocking and controlled routing for each data path. Validation should include worst-case acquisition timing, output skew, clock-jitter effects, and the transition behavior required when the commercial-grade device operates across its published 0°C to 85°C range.
Recommandé
Programmable Logic Platforms
The AMD XC3S1000-5FG676C works well in educational, prototype, and configurable logic platforms where designers need a large number of user I/Os and moderate embedded memory. Its 17,280 logic cells allow multiple experiments, soft cores, or peripheral functions to share one FPGA, while 391 I/Os provide access to expansion connectors, memories, displays, and external converters. The 442,368 RAM bits are useful for FIFO, waveform, and buffer demonstrations. Designers can keep the board interface generic while changing the downloadable bitstream to implement counters, processors, protocol analyzers, or control algorithms. The principal limitation is the complexity of the 676-ball FBGA footprint, so carrier-board work should begin with a validated escape-routing layout and a multilayer stackup rather than treating the package like a leaded or coarse-pitch device.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S1000-5FG676C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S1000-4FG676C | XC3S1000-4FGG676C | XC3S1000-5FGG676C | XC3S1000-4FG676I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA |
| Series | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Speed Grade | -5 | -4 | -4 | -5 | -4 |
Principaux différenciateurs
- Higher same-family speed grade (vs XC3S1000-4FG676C)
- Commercial-grade alternative offers broader operating temperature capability (vs XC3S1000-4FG676I)
- Dense mixed logic, RAM, and I/O integration (vs XC3S1000-4FGG456C)
Notes de conception
The 676-ball FBGA requires a multilayer PCB with a validated escape-routing strategy. Follow the manufacturer's package drawing for ball assignments, power and ground distribution, and recommended via geometry. Preserve uninterrupted reference planes beneath the device, place decoupling connections at the corresponding supply balls, and avoid long stubs that can degrade high-speed signal integrity. A completed route should be checked against the manufacturer's package-specific design rules before fabrication.
Separate the FPGA's core and I/O supply requirements in the power architecture, and verify the selected regulator's startup, current limit, sequencing, and tolerance against the AMD device specifications. Place bulk and high-frequency decoupling according to the recommended schematic and layout guidance rather than applying a generic capacitor arrangement. Confirm that all power balls receive continuous planes and that ground-return paths remain low-impedance across layer transitions.
Constrain every clock and data interface with realistic board-level timing assumptions, including clock uncertainty, skew, I/O delay, and external-device timing. The -5 speed designation should be selected in the implementation constraints so the tool reports timing against the correct device grade. After any substitution to a -4 part, rerun static timing analysis and verify that setup, hold, and external interface requirements remain satisfied.
Do not infer pin compatibility from the ball count alone. Spartan-3 orderable parts can differ in speed grade, temperature grade, package details, and suffix coding while retaining a 676-ball outline. Obtain the exact package pin table for each candidate, confirm configuration and dedicated-ball functions, and validate the PCB footprint against its mechanical drawing. A four-layer or multilayer stackup should also be checked for escape-routing capacity during schematic release.
Informations de conformité
The product listing identifies the XC3S1000-5FG676C as lead free. RoHS, REACH, halogen-free, and conflict-minerals status were not stated in the cited product information.
