XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD
Référence : XC3S50-4CPG132I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
XC3S50-4CPG132I Présentation
A field-programmable gate array is a semiconductor device whose digital logic and interconnect structures are configured after manufacture. An FPGA sits above programmable logic within the broader semiconductor hierarchy and differs from a fixed-function application-specific integrated circuit because one package can implement many control, interface, datapath, or communication designs. This configurability is useful when product requirements evolve, production volumes warrant custom logic, or a system needs parallel processing beyond a simple microcontroller.
The verified device data identifies 192 LABs or CLBs, 89 I/O, and 73,728 RAM bits. These resources support parallel state machines, control logic, data acquisition, communications, and embedded control functions. The Spartan-3 architecture is specifically associated with a 1.2 V-class supply in the supplied results, but individual bank requirements, configuration interfaces, AC/DC limits, and timing values must be checked in the official family documentation before implementation.
Typical uses include industrial controllers, data-acquisition systems, communication peripherals, instrumentation, embedded processors, and compact control platforms. Its 89 available I/O provide external interfaces for clocks, serial links, digital buses, status indicators, and actuator controls. Designers should account for the 132-ball package when planning fanout and PCB escape routing, and must preserve the exact ball assignments used by the selected board design.
For a new board, XC3S50-4CPG132I is appropriate when its 1,728 cells and 73,728 RAM bits satisfy the design and when an industrial-temperature, 1.2 V-class FPGA is required. For a direct replacement, compatibility must include the 132-ball footprint, exact ball map, supply rails, I/O standards, configuration interface, timing margin, and bitstream support rather than package count alone.
This product record combines verified source specifications, procurement context, and engineering checks that should precede substitution. It distinguishes confirmed values such as cell count, RAM, I/O, voltage, package, and temperature from data that still requires the official pinout, price, lifecycle, and electrical-characteristic tables.
Alternatives de remplacement direct pour XC3S50-4CPG132I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S50-4CPG132I (même facteur de forme et même empreinte) — différant par Mounting Type, Package, RoHS Status, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3S50-4CPG132C0974
✅ Remplacement direct✓ En stock
$25.1 / unité
Voir la fiche technique →XC3S50-5CPG132C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S50-4CPG132I Valeurs maximales et caractéristiques électriques
| Product Type | Spartan-3 field-programmable gate array (FPGA) |
| Logic Elements / Cells | 1,728 cells |
| Logic Array Blocks / Configurable Logic Blocks | 192 LABs/CLBs |
| Total RAM | 73,728 bits |
| User I/O | 89 I/O |
| Tension d'alimentation de fonctionnement | 1.14 V to 1.26 V |
| Junction Temperature Range | -40°C to 100°C |
| Boîtier | 132-TFBGA, CSPBGA |
| Package Pin or Ball Count | 132 balls |
| Type de montage | Surface mount |
| Device Technology | 90 nm CMOS |
| Performance Grade | -4 |
| Temperature Grade | Industrial |
| Product Series | Spartan-3 |
| Core Operating Voltage | 1.2 V nominal |
| Statut RoHS | unknown |
| REACH Status | unknown |
| Lead-Free Status | unknown |
Guide de configuration des broches du XC3S50-4CPG132I 132 balls
Configuration des broches du XC3S50-4CPG132I (boîtier 132 balls). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S50-4CPG132I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S50-4CPG132I convient pour 6 applications: Industrial Digital Control, Data Acquisition and Instrumentation, Communication Interface Controller, Data-Logging and Storage Controller, Embedded Control Platform, Timing-Critical Test and Measurement.
Industrial Digital Control
The AMD XC3S50-4CPG132I fits compact industrial control logic because its 1,728 logic cells can implement parallel state machines, interlocks, counters, and sequencing functions, while 89 user I/O provide connections to sensors, relays, and digital actuators. The -4 performance grade and -40°C to 100°C junction-temperature specification make it a candidate for industrial equipment, although the final design must verify transient immunity, grounding, and power regulation. A 1.14 V to 1.26 V core supply simplifies integration with compatible FPGA power rails. The exact timing, I/O standards, and package ball map must be checked in the official Spartan-3 documentation before release.
Recommandé
Data Acquisition and Instrumentation
The AMD XC3S50-4CPG132I can implement parallel acquisition control, sample sequencing, filtering, and instrument-interface logic where a fixed-function microcontroller would require more software coordination. Its 89 user I/O provide ample external channels for counters, trigger signals, digital sensors, and status reporting, while 73,728 RAM bits can support small working buffers. The 132-ball CSPBGA package keeps the device compact but requires careful escape routing and decoupling. Designers should define clocking, input thresholds, acquisition timing, and output drive requirements against the exact Spartan-3 electrical tables before using the FPGA as a measurement controller.
Recommandé
Communication Interface Controller
The AMD XC3S50-4CPG132I is suitable for small communication adapters and protocol controllers because programmable logic can implement parallel transmit and receive paths alongside fixed timing and framing logic. Its 89 user I/O can support clocks, data buses, flow control, status signals, and chip selects, while the 73,728 RAM bits can support packet staging or small FIFO structures. The -4 ordering grade and 1.2 V-class supply fit designs that already target Spartan-3 power architecture. Actual protocol operation depends on supported I/O standards, clocking resources, timing margins, and configuration constraints, which must be verified in the official device documentation.
Recommandé
Data-Logging and Storage Controller
The AMD XC3S50-4CPG132I can be used to organize data between an embedded processor and external memory or storage peripherals through address decoding, timing control, buffers, and fault handling. Its programmable architecture allows multiple bus widths and control sequences to be implemented in one device, while 73,728 RAM bits provide local storage for small queues or double buffers. The 89 user I/O are useful for data buses, chip selects, clocks, and status signals. Before selecting the FPGA, verify memory-interface timing, supported I/O standards, package routing, and whether the selected bitstream and toolchain support the intended memory device.
Recommandé
Embedded Control Platform
The AMD XC3S50-4CPG132I works as a programmable logic companion to a microcontroller in embedded systems that benefit from hardware timing, parallel peripherals, or deterministic control functions. The FPGA can implement motor-step sequencing, display timing, keypad scanning, or custom peripheral bridges while the processor handles higher-level software. Its 89 user I/O and 1,728 logic cells provide a meaningful resource base for compact controllers, while the 132-ball package supports integration on a multilayer PCB. The design must include reviewed decoupling, clock routing, I/O voltage compatibility, and a documented fallback for unused balls or power sequencing.
Recommandé
Timing-Critical Test and Measurement
The AMD XC3S50-4CPG132I can support programmable counters, trigger logic, sequencing, and digital measurement functions in compact test equipment. Hardware parallelism allows multiple channels or timing events to be handled concurrently, reducing reliance on general-purpose software for time-critical paths. The device's 89 user I/O are relevant to probe interfaces, trigger inputs, status LEDs, and control signals, while its 73,728 RAM bits can support acquisition windows or event history. The -4 grade should be selected only after timing analysis confirms the required clock and I/O constraints. Probe loading, clock jitter, input thresholds, and calibration paths also require system-level verification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S50-4CPG132I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S50-4CPG132C | XC3S50-5CPG132C |
|---|---|---|---|
| Brand | AMD | AMD | AMD |
| Package | 132-TFBGA, CSPBGA | 132-CSPBGA | 132-CSPBGA |
| User I/O | 89 I/O | 89 I/O | 89 I/O |
| Performance Grade | -4 | -4 ordering-code comparison lead | -5 ordering-code comparison lead |
Principaux différenciateurs
- Confirmed resource density for compact programmable logic (vs XC3S50-4CPG132C)
- Industrial junction-temperature specification (vs XC3S50-5CPG132C)
- 132-ball surface-mount integration (vs XC3S50-4CPG132C)
- Selection-grade resource baseline (vs XC3S50-5CPG132C)
Notes de conception
Treat the 132-TFBGA/CSPBGA footprint as a verified mechanical and electrical constraint. Confirm every ball assignment, exposed power and ground connection, land pattern, paste mask, and assembly clearance against the official package drawing. The supplied sources confirm 132 balls and 89 user I/O but do not provide the full ball map, so do not build a footprint from a generic CSPBGA library entry.
Design the power tree for the documented 1.14 V to 1.26 V operating range and separate any required I/O or auxiliary rails according to the official electrical tables. Place regulator output, local bypass, and ground-return structures using the manufacturer's recommended layout, then verify startup sequencing and load current with the final tool and board. The supplied data does not include regulator current, decoupling values, or sequencing limits.
Route clocks, configuration signals, and high-speed interfaces with controlled impedance and short return paths. Keep sensitive analog or measurement paths away from noisy switching returns, and account for package escape-routing delay when the FPGA performs synchronous acquisition. Because the verified data does not specify I/O standards or timing limits, confirm edge rates, drive strength, loading, and timing closure from the official family documentation before release.
Informations de conformité
The supplied web results do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations for XC3S50-4CPG132I. The industrial temperature grade is not an automotive qualification statement.
