XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD
Référence : XC3S50-4TQ144I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.0594 | $9,06 |
| 10 | $90.3 | $903,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
XC3S50-4TQ144I Présentation
An FPGA is a programmable digital semiconductor whose configurable logic blocks, digital I/O, block RAM, and dedicated resources can be interconnected to implement custom circuits. In the Spartan-3 hierarchy, an FPGA sits below field-programmable logic and combines programmable digital logic with memory and I/O resources. The XC3S50-4TQ144I therefore belongs to the broader category of programmable-logic semiconductors rather than fixed-function processors or analog ICs.
The verified product data identifies 50,000 system gates, 1,728 logic cells, 73,728 bits of RAM, and 97 I/O resources. The part is offered in a surface-mount 144-pin LQFP package and uses a 1.2 V FPGA supply as identified by distributor data. Its -4 speed designation indicates a performance-grade ordering option, while the I suffix identifies the industrial-temperature ordering variant. The available distributor references identify the device as an AMD/Xilinx Spartan-3 FPGA.
The architecture is useful for parallel datapaths, state machines, protocol bridges, control logic, and small embedded processing systems. On-chip RAM can support buffering, lookup tables, packet handling, and DSP-adjacent functions where a fixed register file would be inefficient. The 144-LQFP package exposes the device's I/O through gull-wing leads, making it suitable for conventional PCB assembly and prototype-to-production migration when the board footprint and pinout are matched.
Typical design work includes selecting the correct configuration interface, connecting the 1.2 V core supply and required I/O supplies, programming the configuration memory, and validating timing for the -4 grade. Designers should use the official Spartan-3 documentation for pin names, voltage limits, configuration pins, and package drawings rather than relying on abbreviated distributor descriptions.
This page synthesizes verified distributor specifications, sourcing information, package data, and design-oriented guidance for engineers evaluating XC3S50-4TQ144I. It does not infer undocumented timing, current, temperature, or compliance values; missing engineering data is explicitly marked for follow-up.
Alternatives de remplacement direct pour XC3S50-4TQ144I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S50-4TQ144I (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Package, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3S50-4TQG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S50AN-4TQ144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S50-4TQ144C
✅ Remplacement direct✓ En stock
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Voir la fiche technique →XC3S50-4TQG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S50-4TQ144I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 50,000 gates |
| Logic Cells | 1,728 cells |
| Block RAM | 73,728 bits |
| I/O Resources | 97 I/O |
| Tension d'alimentation | 1.2 V |
| Technology | 90 nm CMOS |
| Boîtier | 144-LQFP, 20 x 20 mm |
| Type de montage | Surface mount |
| Package Lead Type | Gull-wing |
| Température de fonctionnement | -40 °C to +100 °C junction temperature |
| Speed Grade | -4 |
| Temperature Grade | Industrial |
| Configuration | FPGA configuration required |
| FPGA Family | Spartan-3 |
| Terminal Count | 144 terminals |
| Product Status | Active distributor listings observed; lifecycle status not explicitly provided |
Guide de configuration des broches du XC3S50-4TQ144I gull-wing
Configuration des broches du XC3S50-4TQ144I (boîtier gull-wing). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S50-4TQ144I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S50-4TQ144I convient pour 6 applications: Embedded Control Logic, Industrial Data Acquisition, Communication Interface, Signal Processing, Motor and Power-System Control, Instrumentation and Test Logic.
Embedded Control Logic
The XC3S50-4TQ144I fits compact control systems that require programmable state machines, parallel logic, and deterministic external interfaces. Its 1,728 logic cells provide a practical resource budget for sequencing motors, reading sensors, coordinating actuators, and managing system interlocks, while 97 I/O resources support external connections in a 144-LQFP footprint. The 1.2 V core supply and 90 nm CMOS implementation identify it as a conventional Spartan-3 design target. Configuration storage, pin standards, timing closure, and unused-pin treatment must be verified from the official AMD documentation before production release.
Recommandé
Industrial Data Acquisition
The FPGA is suitable for collecting and conditioning multiple digital signals in industrial equipment because its 1,728 logic cells can implement parallel sampling logic, filtering, thresholding, and data framing. The 73,728 bits of RAM can buffer short acquisition windows or implement protocol and control storage, while 97 I/O resources provide a broad interface budget. The industrial I ordering designation and the verified -40 °C to +100 °C junction-temperature listing make it a candidate for industrial environments. Final signal conditioning, isolation, grounding, and timing margins require application-specific engineering.
Recommandé
Communication Interface
XC3S50-4TQ144I can implement low- to moderate-complexity serial interfaces, parallel protocol converters, and test logic because programmable logic allows data-path widths and state machines to be matched to the system. Its block RAM can support packet buffering or descriptor storage, while the I/O resources can be assigned according to the selected electrical standards. The part is useful when deterministic parallel hardware is preferable to relying only on a microcontroller. Engineers must verify supported I/O standards, timing, configuration pins, and board-level signal integrity because those details are not fully shown in the supplied distributor snippets.
Recommandé
Signal Processing
The Spartan-3 FPGA can implement parallel filters, counters, correlation functions, timing generators, and other digital signal-processing blocks when the required arithmetic fits within its available logic and memory. The 1,728 logic cells and 73,728 bits of RAM give designers a defined resource envelope for small DSP pipelines rather than unrestricted custom ASIC capacity. Parallel datapaths can improve throughput compared with a sequential microcontroller, but clocking, timing closure, and I/O timing must be planned carefully. Use the official toolchain and device documentation to obtain exact timing and resource estimates.
Recommandé
Motor and Power-System Control
The XC3S50-4TQ144I can coordinate multiple digital control functions, generate timing signals, monitor interlocks, and implement supervisory sequences for motors or power-conversion systems. Its programmable architecture is useful when several control blocks must operate in parallel and when field updates are valuable. The 144-LQFP package provides a conventional surface-mount assembly option, but power-stage isolation, gate-driver timing, fault handling, and fail-safe behavior must be designed outside the FPGA where appropriate. Do not infer safety certification from the industrial temperature designation.
Recommandé
Instrumentation and Test Logic
The FPGA is appropriate for instrumentation front ends that require programmable timing, pattern generation, measurement control, and data capture. Its parallel logic resources can create deterministic stimulus and sampling sequences, while the available RAM can hold short test vectors or captured results. The -4 ordering grade and 144-LQFP package support prototype boards and compact production assemblies, subject to official timing and thermal verification. Designers should plan clock distribution, termination, calibration, and test-point access at the board level; those requirements are not specified by the supplied product snippets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S50-4TQ144I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S50-4TQG144I | XC3S50AN-4TQ144I | XC3S50-4TQ144C | XC3S50-4TQG144I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | Xilinx |
| Package | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3AN | Spartan-3 | Spartan-3 |
| Speed Suffix | -4 | -4 | -4 | -4 | -4 |
Principaux différenciateurs
- Industrial ordering designation (vs XC3S50-4TQ144C)
- Spartan-3 resource baseline (vs XC3S50AN-4TQ144I)
- Package continuity for redesigns (vs XC3S50-4TQG144I)
Notes de conception
Design the power tree around the verified 1.2 V FPGA core requirement, but do not assume that 1.2 V is the only rail required. Confirm the device-specific core, auxiliary, and I/O supply requirements from the official Spartan-3 documentation. Use local decoupling close to the supply pins, define sequencing requirements before connecting external circuits, and include measurement points for startup, ripple, and load transients.
Treat the 144-LQFP footprint as a device-specific PCB constraint. Verify the official package drawing, lead pitch, pad dimensions, pin numbering, exposed thermal features if any, and assembly tolerances before releasing Gerber data. The supplied distributor data confirms gull-wing leads and a 20 x 20 mm package, but it does not provide the complete mechanical drawing or land pattern.
Do not treat the TQG, AN, or C suffixes as interchangeable without checking the ordering table. The TQG variant may differ in ordering or lead-finish details, XC3S50AN-4TQ144I belongs to the Spartan-3AN family with a different resource table, and XC3S50-4TQ144C is a commercial-temperature variant. Confirm device family, pinout, configuration interface, and temperature requirements before substitution.
Reserve configuration resources early in the PCB layout because the FPGA configuration interface can constrain boot-mode, startup, and debug connections. Route clocks and high-speed or sensitive interfaces with controlled return paths, keep configuration and programming nets away from noisy analog or power-conversion areas, and follow the manufacturer’s recommended decoupling and pin-placement guidance. Exact guidance requires the official device documentation.
Informations de conformité
The supplied distributor snippets identify lead-free language for one related datasheet listing but do not provide an authoritative compliance statement for XC3S50-4TQ144I. RoHS, REACH, halogen-free, conflict-minerals, and other certifications must be confirmed from the current AMD product documentation or supplier certificates.
