XC3S500E-4PQG208C - 500K Gate Spartan-3E FPGA | AMD
Référence : XC3S500E-4PQG208C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $23.7985 | $23,80 |
| 10 | $23.7985 | $237,99 |
| 100 | $23.7985 | $2 379,85 |
| 500 | $23.7985 | $11 899,25 |
| 1 000 | $23.7985 | $23 798,50 |
| 3 000 | $23.7985 | $71 395,50 |
XC3S500E-4PQG208C Présentation
A field-programmable gate array, or FPGA, is a programmable digital logic device whose configurable logic and interconnect resources can be programmed after manufacture. FPGAs sit above fixed-function logic devices and programmable gate arrays in the digital-semiconductor hierarchy: a design can use programmable logic to implement counters, state machines, ALUs, control logic, and interface circuits without requiring a custom ASIC. Spartan-3E devices provide a practical balance between logic capacity, device cost, and design flexibility for embedded systems.
The verified specifications identify the XC3S500E-4PQG208C as a 500K-gate Spartan-3E FPGA with 10,476 logic cells, 1,164 CLBs, 158 inputs, and a maximum clock frequency of 572 MHz. The 208-PQFP package provides a leaded, inspectable footprint for conventional surface-mount assembly. The C suffix and the verified distributor listings identify the exact commercial ordering code; the supplied sources do not provide a complete temperature-grade or lifecycle classification.
This FPGA is suitable for control and sequencing logic where multiple parallel channels, counters, timers, and state machines must be implemented in one device. Its logic capacity can also support moderate data paths and protocol interfaces. The 572 MHz maximum clock figure should be treated as a device-level headline value; actual achievable clock rates depend on the selected I/O standard, timing constraints, routing, logic depth, and the external memory or transceiver interface.
Typical applications include industrial automation, test-and-measurement front ends, communications adapters, embedded control systems, and signal-processing support. The package is particularly useful where a leaded package is preferred over a fine-pitch BGA and where the design requires a moderate number of I/O connections. Designers should verify board pinout, configuration requirements, power sequencing, I/O standards, and signal-integrity margins against the manufacturer datasheet before layout release.
The principal design consideration is package-related routing and signal integrity. A 208-pin PQFP requires adequate copper clearances and controlled escape routing, especially for high-speed clock and interface nets. Configuration storage, bank supply voltages, decoupling, and pinout details must be implemented exactly as specified in the AMD Spartan-3E documentation.
This page combines verified distributor and AMD documentation references with application guidance, lifecycle caveats, package-specific design notes, and explicitly qualified replacement analysis for engineers evaluating the XC3S500E-4PQG208C.
Alternatives de remplacement direct pour XC3S500E-4PQG208C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3S500E-4PQ208C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S500E-4PQG208I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S500E-5PQ208C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S500E-4PQG208
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S500E-4PQG208E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S500E-4PQG208I-T
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S500E-4PQG208C Valeurs maximales et caractéristiques électriques
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3E |
| Equivalent System Gates | 500000 gates |
| Logic Cells | 10476 cells |
| Configurable Logic Blocks | 1164 CLBs |
| Fréquence d'horloge maximale | 572 MHz |
| Input Count | 158 inputs |
| Output Count | 126 outputs |
| Tension d'alimentation | 1.2 V |
| Process Technology | 90 nm CMOS |
| Boîtier | 208-pin PQFP |
| Package Dimensions | 30.5 mm x 30.5 mm |
| Package Height | 4.1 mm |
| Package Pitch | 0.5 mm |
| Package Material | Plastic, lead-free |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to 85 C |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC3S500E-4PQG208C plastic, lead-free
Configuration des broches du XC3S500E-4PQG208C (boîtier plastic, lead-free). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S500E-4PQG208C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S500E-4PQG208C convient pour 6 applications: Industrial Automation Controller, Test and Measurement Front End, Communication Protocol Adapter, Embedded Data Acquisition, Motor and Motion Control, Industrial Networking Interface.
Industrial Automation Controller
The AMD XC3S500E-4PQG208C fits industrial automation control when a design needs parallel I/O, multiple state machines, timers, counters, and sequencing logic in a leaded package. Its verified 10,476 logic cells, 1,164 CLBs, 158 inputs, and 126 outputs provide substantial programmable capacity for coordinating sensors, actuators, interlocks, and operator interfaces. The 208-pin PQFP is useful when inspection, rework, or a conventional leaded assembly process is preferred. The 572 MHz maximum clock is a device headline value, so designers should constrain the actual control paths to the timing requirements of the industrial system and verify the supported I/O standards, bank power requirements, and configuration method in the AMD documentation.
Recommandé
Test and Measurement Front End
The XC3S500E-4PQG208C can implement digital sequencing, acquisition control, trigger logic, counters, and data-format conversion around an analog or mixed-signal test system. Its 500,000 equivalent gates and 158 inputs provide enough parallel resources for coordinating multiple channels, while the 126 outputs support instrument control signals and status indicators. The leaded 208-pin package makes the device accessible to prototype and laboratory assembly processes. The design must still account for bank-specific voltage requirements, input tolerances, output drive, clock jitter, and timing closure. Use the AMD Spartan-3E documentation and timing constraints to confirm that the selected pins support the instrument’s logic levels and that the 572 MHz device capability is not interpreted as a guaranteed system clock.
Recommandé
Communication Protocol Adapter
XC3S500E-4PQG208C is suitable for protocol adapters that need parallel-to-serial conversion, framing, CRC generation, command decoding, and configurable I/O mapping. The verified 10,476 logic cells and 1,164 CLBs allow multiple finite-state machines and datapaths to share one programmable device, while 158 inputs and 126 outputs provide broad board-level connectivity. A 208-pin PQFP supports designs that need a moderate pin count and avoid a fine-pitch BGA assembly. The key engineering checks are the selected I/O standard, clock-domain relationship, pin multiplexing, and timing margin. The 572 MHz maximum clock should be treated as a device capability rather than a guaranteed communication baud rate; actual throughput depends on the implemented logic and external transceiver characteristics.
Recommandé
Embedded Data Acquisition
The XC3S500E-4PQG208C can act as a digital acquisition and buffering controller between sensors, converters, memory, and a host processor. Its programmable logic can implement channel selection, sample sequencing, trigger delay counters, data packing, and interrupt generation without relying on a dedicated fixed-function controller. The 500,000-gate class and 126 outputs are useful for coordinating converters and downstream digital devices, while the 208-pin package provides accessible assembly. Designers should use the verified I/O count as a board-planning aid, then confirm every assigned signal against the manufacturer pinout and bank voltage. The device’s 572 MHz maximum clock can simplify synchronous logic architectures, but acquisition timing, source latency, and external memory interface timing remain design-specific.
Recommandé
Motor and Motion Control
The XC3S500E-4PQG208C can support motion-control sequencing, encoder decoding, pulse counting, direction control, and safety interlocks when paired with external power drivers. Its 10,476 logic cells and 1,164 CLBs allow parallel control channels and diagnostic logic, and its 158 inputs are useful for receiving position, limit, and feedback signals. The 208-pin PQFP is practical for industrial prototypes and leaded production processes. The FPGA does not directly replace a motor-driver IC; it should operate at logic levels compatible with the selected gate drivers and isolated interfaces. Verify the operating-temperature listing of 0 C to 85 C against the actual grade and mechanical environment. Clocking, isolation, grounding, and protection must be designed according to the motor-drive power stage and applicable system safety requirements.
Recommandé
Industrial Networking Interface
XC3S500E-4PQG208C can implement deterministic digital interfaces, packet framing, filtering, and protocol conversion for industrial networking equipment. The programmable logic resource supports multiple parallel channels and custom control paths, while the leaded PQFP package provides a practical option for designs with moderate I/O density. A network interface still requires external PHY or transceiver circuits, isolation, clock recovery, and carefully controlled impedance routing. The 572 MHz figure should be used for architecture planning only; packet throughput, latency, and maximum clock rate depend on the selected pins, I/O standards, routing congestion, and external PHY characteristics. Before release, verify the exact pinout, bank supplies, configuration interface, and timing constraints in the AMD Spartan-3E documentation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S500E-4PQG208C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S500E-4PQ208C | XC3S500E-4PQG208I | XC3S500E-5PQ208C | XC3S500E-4PQG208 |
|---|---|---|---|---|---|
| Package | 208-pin PQFP | 208-pin PQFP | 208-pin PQFP | 208-pin PQFP | 208-pin PQFP |
| Brand | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-3E | Spartan-3E | Spartan-3E | Spartan-3E | Spartan-3E |
| Speed Designation | -4 | -4 | -4 | -5 | -4 |
Principaux différenciateurs
- Identified package and logic-capacity identity (vs XC3S500E-4PQG208I)
- Explicit 572 MHz maximum clock specification (vs XC3S500E-4PQ208C)
- Verified lead-free PQFP identification (vs XC3S500E-5PQ208C)
- Documented commercial availability signal (vs XC3S500E-4PQG208)
Notes de conception
Route the 208-pin PQFP footprint with the exact manufacturer land pattern, including the 0.5 mm pitch, package body dimensions, and lead geometry. Keep adequate copper and mask clearance beneath the leads, route clock and configuration signals away from noisy switching nodes, and validate the assembly process for a fine-pitch leaded package. Do not use a generic QFP-208 footprint without checking the AMD package drawing.
Design the 1.2 V core supply and all required I/O-bank supplies as separate, well-decoupled rails. Place bulk and high-frequency decoupling close to the relevant power pins, verify allowable sequencing and voltage limits in the AMD datasheet, and account for configuration or system startup current in the supply design. The verified sources provide the 1.2 V supply value but do not provide complete current-limit or sequencing data.
Treat the 572 MHz maximum clock as a device capability, not a guaranteed operating frequency. Add timing constraints for every clock domain, validate routing delays and I/O timing, and check the selected speed grade against external memory, interface, and clock-jitter requirements. The -4 and -5 related parts should not be treated as timing-equivalent without reviewing the manufacturer timing tables.
Avoid relying on conflicting third-party package snippets. One supplied database result incorrectly describes the device as FBGA-320, while distributor and comparison references identify the target as PQFP-208. Confirm the top-marking, package drawing, pin count, pin names, configuration pins, and I/O bank assignments directly from the AMD Spartan-3E documentation before releasing PCB artwork or a purchase order.
Separate clocks, high-speed buses, and sensitive configuration or control signals from switching power and motor-drive return currents. Use a defined ground strategy, minimize loop areas, and apply controlled-length routing where interface timing requires it. For external transceivers and converters, keep the FPGA-side return paths short and ensure the selected bank voltage matches the neighboring device interface.
Informations de conformité
The supplied LCSC datasheet result explicitly marks the part as RoHS compliant, and the package is described as lead-free. No verified REACH, AEC-Q100, halogen-free, or conflict-minerals declaration was provided.
