XC3S50A-4FT256C - 50K Spartan-3A FPGA | AMD | 256-FTBGA
Référence : XC3S50A-4FT256C ⚠ Dernier achatXC3S50A-4FT256C Présentation
A field-programmable gate array is a semiconductor whose digital logic, interconnect, and input/output functions are configured after manufacture. Within the FPGA hierarchy, the Spartan-3A family belongs to the low-to-medium-density programmable-logic segment. The XC3S50A combines approximately 50,000 gates, 144 I/O, and a 256-ball FTBGA package in a surface-mount device suitable for compact embedded control, interface, data-capture, and industrial automation equipment.
The available specifications identify 144 user I/O, a 1.14 V to 1.26 V core-voltage range, and an approximate gate count of 50,000. These resources support parallel control logic, protocol interfaces, glue logic, and modest embedded processing systems. The C suffix identifies the commercial product variant, while the -4 portion denotes the device speed grade. Detailed RAM, clock, configuration, and I/O standards were not present in the supplied verified data and must be confirmed from the AMD Spartan-3A family datasheet before design release.
The XC3S50A-4FT256C is supplied in tray packaging according to the available product listing. Its 256-pin fine-pitch BGA format creates a compact land pattern but requires careful PCB layout, via-in-pad or via-under-bump considerations, and assembly processes capable of handling closely spaced balls. Signal-integrity, power-delivery, thermal, and exact package-dimension guidance should be taken directly from the AMD DS529 family document and the device pinout information.
Typical uses include industrial automation controllers, instrumentation, embedded communications, consumer interfaces, and cost-sensitive control systems. Because the part is listed as last time buy, new production should include lifecycle review, planned end-of-life inventory, and a qualified second source. Lead time is listed as 12 weeks, making procurement planning essential for designs that cannot tolerate a supply interruption.
Design engineers should verify the exact pinout, supported I/O standards, configuration interface, memory resources, and power requirements in the AMD Spartan-3A family datasheet before layout release. This page consolidates the supplied distributor data, lifecycle information, pricing references, drop-in family variants, and practical implementation considerations to support engineering selection.
Alternatives de remplacement direct pour XC3S50A-4FT256C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S50A-4FT256C (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Package, Speed Grade.
XC3S50A-5FT256C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S50A-3FT256C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S50A-4FT256I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC3S50A-5FT256I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S50A-3FT256I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S50A-4FT256C Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3A |
| Approximate Number of Logic Gates | 50,000 gates |
| Logic Cells | 55,296 cells |
| Number of User I/O | 144 I/O |
| Core Voltage Range | 1.14 V to 1.26 V |
| Speed Grade | -4 |
| Temperature-Grade Suffix | C (commercial) |
| Boîtier | 256-pin FTBGA |
| Package Type | Fine-Pitch Ball Grid Array (FTBGA) |
| Number of Terminals | 256 balls |
| Type de montage | Surface Mount |
| Manufacturer Lead Time | 12 weeks |
| Product Status | Last Time Buy |
| Packaging | Tray |
| Statut RoHS | Non-compliant |
| Lead-Free Status | Contains lead |
Guide de configuration des broches du XC3S50A-4FT256C fine-pitch ball grid array (ftbga)
Configuration des broches du XC3S50A-4FT256C (boîtier fine-pitch ball grid array (ftbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S50A-4FT256C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S50A-4FT256C convient pour 6 applications: Industrial Automation Controllers, Data Acquisition and Signal Conditioning, Embedded Communications Interface, Consumer and Instrumentation Interfaces, Programmable Control and Glue Logic, Aerospace and Defense Test Equipment.
Industrial Automation Controllers
XC3S50A-4FT256C fits compact industrial automation controllers that require deterministic programmable logic, 144 user I/O, and approximately 50,000 gates in a 256-pin FTBGA package. The 4 speed grade can support control, sequencing, and interface logic when the design meets its timing constraints. The commercial C designation and unspecified operating-temperature limits mean the exact device suffix should be verified for harsh industrial environments. A production design should also plan for Last Time Buy availability rather than assuming indefinite supply.
Recommandé
Data Acquisition and Signal Conditioning
XC3S50A-4FT256C can implement parallel data acquisition, filtering, and sensor-interface control where 144 I/O and approximately 50,000 logic gates are sufficient. The 256-ball FTBGA package supports compact integration, but high-speed analog-to-digital interfaces must remain within the I/O and timing capabilities documented in AMD DS529. Place sensitive analog circuitry separately from the FPGA and use controlled return paths for digital interfaces. Because the provided data does not specify supported I/O standards or maximum data rates, both must be confirmed before architecture selection.
Recommandé
Embedded Communications Interface
XC3S50A-4FT256C is suitable for communication bridges, protocol converters, and embedded interface modules whose data paths fit within 144 I/O and the available logic budget. A compact 256-pin FTBGA allows the programmable interface to coexist with processors and transceivers on a multilayer PCB. Implementation should use short, impedance-controlled routes for high-speed interfaces and isolate clocks from sensitive signals. The exact supported I/O standards, clocking limits, and timing performance were not supplied and must be established from the AMD family datasheet.
Recommandé
Consumer and Instrumentation Interfaces
XC3S50A-4FT256C can consolidate display controls, key scanning, status logic, and peripheral interfaces in consumer products or portable instruments. Its approximately 50,000-gate capacity and 144 I/O make it most appropriate for control-plane logic rather than computationally intensive processing. The 256-pin FTBGA footprint requires assembly-capable PCB design and careful ball-escape routing. Product teams should verify operating-temperature requirements, since the supplied information identifies the target as a commercial C-grade Last Time Buy device without providing the full temperature range.
Recommandé
Programmable Control and Glue Logic
XC3S50A-4FT256C is appropriate for programmable glue logic that coordinates processors, memories, sensors, and actuators in a compact embedded system. Its 144 I/O and approximately 50,000 gates offer meaningful integration density while preserving the flexibility of FPGA configuration. The -4 speed grade should be checked against every timing path using the intended tool version and device model. Because the component is a Last Time Buy part with a listed 12-week lead time, teams should secure inventory and document a migration plan before committing new production volumes.
Recommandé
Aerospace and Defense Test Equipment
XC3S50A-4FT256C may be evaluated for programmable test and instrumentation systems where 50,000 gates, 144 I/O, and a compact BGA package meet functional requirements. Qualification, temperature range, radiation exposure, and long-term supply must be established separately; none of those claims can be inferred from the commercial C suffix. The 12-week listed lead time and Last Time Buy status make this unsuitable for programs that assume broad lifecycle continuity without a controlled procurement strategy. AMD DS529 and the applicable program requirements remain controlling sources.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S50A-4FT256C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S50A-5FT256C | XC3S50A-3FT256C | XC3S50A-4FT256I | XC3S50A-5FT256I | XC3S50A-3FT256I |
|---|---|---|---|---|---|---|
| Package | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA | 256-pin FTBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -4 | -5 | -3 | -4 | -5 | -3 |
| Temperature-Grade Suffix | C (commercial) | C (commercial) | C (commercial) | I (industrial) | I (industrial) | I (industrial) |
| Approximate Logic Gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates |
| User I/O | 144 I/O | 144 I/O | 144 I/O | 144 I/O | 144 I/O | 144 I/O |
Principaux différenciateurs
- Original commercial -4 performance positioning (vs XC3S50A-5FT256C)
- Commercial suffix for controlled embedded designs (vs XC3S50A-4FT256I)
- Documented commercial starting-price reference (vs XC3S50A-3FT256C)
Notes de conception
Base the land pattern and escape-routing strategy on the exact 256-pin FTBGA drawing in AMD DS529. Do not substitute a generic 256-ball BGA footprint because ball pitch, ball-map orientation, and pad-definition details must match the selected device. Preserve the manufacturer-defined power and ground ball assignments, verify assembly-process compatibility, and conduct signal-integrity simulations on exposed high-speed nets.
Validate the power architecture against the exact device pin table and configuration requirements in AMD DS529. The verified core-voltage range is 1.14 V to 1.26 V, but separate I/O and auxiliary supply requirements were not supplied. Use local bulk and high-frequency decoupling, provide clean return paths, and avoid sharing high-current return paths with sensitive interface references.
Do not treat a same-package ordering-code change as automatically equivalent. Speed grades can change timing and power behavior, while commercial and industrial suffixes can change temperature coverage. Before substitution, update the project device model, recompile and rerun timing analysis, review I/O constraints, confirm lifecycle status, and obtain manufacturer documentation for the selected alternative.
Plan configuration and startup behavior before signal routing because configuration pins and dedicated pins cannot be treated as ordinary user I/O. Keep sensitive interfaces away from power-conversion loops and noisy clock sources, route clocks over continuous reference planes, and account for package escape-routing parasitics. Complete signal-integrity and timing sign-off using the exact -4 device speed model.
Informations de conformité
The supplied digchips listing identifies the device as RoHS non-compliant and containing lead. No verified REACH, halogen-free, conflict-minerals, or AEC-Q100 information was provided. AEC-Q100 is marked not applicable because no automotive qualification evidence was supplied.
