XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD
Référence : XC6SLX16-3CPG196C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.5 | $12 250,00 |
| 1 000 | $21.8 | $21 800,00 |
XC6SLX16-3CPG196C Présentation
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock managers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the digital-logic hierarchy: they deliver ASIC-level performance and parallelism while remaining reprogrammable in the field. The Spartan-6 family specifically targets cost-sensitive, high-volume applications where power consumption, density, and price-per-logic-cell are critical.
Key features of the XC6SLX16-3CPG196C include 14,579 logic cells, 1,451 Kbits of block RAM (576 Kbits dual-port), 32 DSP48A1 slices, 2 clock management tiles (CMTs), and 2 PCIe hard IP blocks. The 106 available user I/Os support multiple I/O standards including LVCMOS, LVDS, and LVTTL at programmable slew rates and strengths. The CSBGA-196 package (8x8 mm body, 0.5 mm ball pitch) suits compact, high-density PCB layouts.
The Spartan-6 LX architecture is built on a 45 nm CMOS process and provides lower static and dynamic power than the prior Spartan-3A generation. The device integrates a hard PCIe endpoint block (1-lane Gen1), hard memory controllers for DDR/DDR2/DDR3/LPDDR, and a high-speed GTP serial transceiver-free design (the LX family omits transceivers, unlike the LXT). The -3 speed grade delivers the highest Fmax in the family.
Typical applications include industrial motor and motion control, video surveillance and image processing, low-cost PCIe endpoint cards, consumer display controllers, and embedded DSP systems. The CSBGA-196 footprint is particularly suitable for space-constrained designs such as portable test equipment and 4-layer FR4 carrier boards. The 45 nm process and 1.2 V core reduce thermal dissipation compared to older 90 nm and 65 nm FPGA families.
When designing with this device, allocate sufficient decoupling capacitance (typically 100 nF and 4.7 uF combinations) at each supply pin and follow AMD's Spartan-6 PCB Design Guide for controlled-impedance routing. The 0.5 mm pitch CSBGA requires via-in-pad or laser-drilled microvia technology on standard 4-layer boards; ensure your PCB fabrication process supports the pitch before committing to layout.
Alternatives de remplacement direct pour XC6SLX16-3CPG196C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX16-3CPG196C (même facteur de forme et même empreinte) — différant par Block RAM, Core Voltage, Operating Temperature, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC6SLX16-3CPG196I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX16-2CPG196C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX16-2CPG196I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$95.1563 / unité
Voir la fiche technique →XC6SLX9-3CPG196C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX25-3CPG196C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC6SLX16-3CPG196C Valeurs maximales et caractéristiques électriques
| Family | Spartan-6 LX |
| Device Logic Cells | 14,579 |
| Slices | 2,278 |
| Block RAM | 576 Kbits (1,451 Kbits total) |
| DSP48A1 Slices | 32 |
| User I/O Count | 106 |
| Maximum Internal Frequency | 667 MHz |
| Number of CLBs | 1,139 |
| Speed Grade | -3 (highest performance) |
| Température de fonctionnement | 0 C to 85 C (Commercial) |
| Core Voltage | 1.2 V |
| Process Technology | 45 nm CMOS |
| Boîtier | 196-ball CSBGA (0.5 mm pitch, 8x8 mm) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | RoHS Compliant (Lead Free) |
| Clock Management Tiles | 2 CMTs (PLL + DCM each) |
| Hard PCIe Blocks | 1-lane PCIe Gen1 endpoint |
| Hard Memory Controller | Yes (DDR/DDR2/DDR3/LPDDR) |
Configuration des broches de XC6SLX16-3CPG196C
| Broche A1 | GND — Ground reference |
| Broche A2 | IO_L1P_3 — Bank 3 user I/O (LVCMOS/LVDS pair positive) |
| Broche A3 | IO_L1N_3 — Bank 3 user I/O (LVCMOS/LVDS pair negative) |
| Broche A4 | VCCO_3 — Bank 3 I/O supply voltage |
| Broche B1 | IO_L2P_3 — Bank 3 user I/O positive |
| Broche B2 | IO_L2N_3 — Bank 3 user I/O negative |
| Broche B3 | GND — Ground |
| Broche B4 | VCCAUX — Auxiliary analog supply (2.5 V) |
| Broche C1 | IO_L3P_3 — Bank 3 user I/O positive |
| Broche C2 | IO_L3N_3 — Bank 3 user I/O negative |
| Broche C3 | VCCO_3 — Bank 3 I/O supply |
| Broche C4 | IO_L4P_3 — Bank 3 user I/O positive |
| Broche D1 | VCCINT — Internal core supply (1.2 V) |
| Broche D2 | GND — Ground |
| Broche D3 | IO_L5P_3 — Bank 3 user I/O positive |
| Broche D4 | IO_L5N_3 — Bank 3 user I/O negative |
| Broche E1 | VCCINT — Internal core supply (1.2 V) |
| Broche E2 | VCCO_0 — Bank 0 I/O supply |
| Broche E3 | GND — Ground |
| Broche E4 | CONFIG — Configuration mode select |
Applications typiques
XC6SLX16-3CPG196C convient pour 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Low-Cost PCIe Endpoint Cards, Consumer Display Controllers, Embedded DSP Signal Processing, Portable Test and Measurement.
Industrial Motor Control
The XC6SLX16-3CPG196C fits industrial motor control because its 32 DSP48A1 slices deliver the multiply-accumulate throughput needed for field-oriented control (FOC) algorithms on 3-phase motor drives. The 1,451 Kbits of block RAM handles encoder position tables and reference ramps without external memory pressure, while the 1.2 V core voltage reduces inverter switching power dissipation. With 106 user I/Os the LX16 can directly interface 6-step or sinusoidal commutation PWM outputs, Hall-effect or quadrature encoder inputs, and isolated SPI gate-driver paths. AMD's Motor Control reference design library uses this exact density tier as the recommended baseline for sub-1 kW PMSM and induction motor drives, and the 0.5 mm CSBGA-196 footprint allows the FPGA to fit directly next to power-stage gate drivers on a 4-layer FR4 carrier board.
Recommandé
Video Surveillance and Image Processing
For IP camera and DVR/motion-detection pipelines, the XC6SLX16-3CPG196C provides 32 DSP48A1 slices and 1,451 Kbits block RAM sufficient for 720p H.264 baseline encode pre-processing at 30 fps. The hard memory controller interfaces DDR2/DDR3 frame buffers directly, freeing soft logic for image-signal-processing (ISP) chains including demosaic, white balance, and edge detection. With 106 I/Os the FPGA can ingest parallel ITU-R BT.656 video from multiple CMOS image sensors while also driving a local LCD preview display. The -3 speed grade enables 150 MHz pixel-clock processing paths within the ISP pipeline, satisfying real-time motion-detection latency budgets for security applications.
Recommandé
Low-Cost PCIe Endpoint Cards
The XC6SLX16-3CPG196C integrates a hard PCIe Gen1 1-lane endpoint block, enabling low-cost half-height PCIe cards without external PHY ICs. This hard block plus 14,579 logic cells makes the LX16 ideal for protocol-bridging cards (e.g., PCIe-to-GPIO, PCIe-to-I2C/SPI, PCIe-to-UART), data-acquisition endpoints, and software-defined radio front-end digitizers. The 1,451 Kbits of block RAM supports scatter-gather DMA descriptor tables and small packet buffers, while the 106 I/Os provide board-edge connectivity for external sensors. Cost-sensitive industrial and instrumentation PCIe cards frequently use this exact LX16 density as the sweet spot between logic capacity and unit price.
Recommandé
Consumer Display Controllers
The XC6SLX16-3CPG196C serves as a flexible display controller bridging LVDS, RGB, MIPI DPI, and HDMI source interfaces in low-to-mid-resolution LCD and OLED panels. Its 106 user I/Os accommodate 24-bit parallel RGB at up to 150 MHz pixel clock, while the CMTs handle pixel-clock generation and frame-rate conversion. The DSP48A1 slices accelerate on-the-fly color-space conversion (RGB to YCbCr, gamma correction). Consumer TV, monitor, and digital-signage applications benefit from the LX16's reprogrammability to support multiple panel timing standards with a single hardware platform.
Recommandé
Embedded DSP Signal Processing
For embedded audio, vibration, and biomedical signal-processing systems, the XC6SLX16-3CPG196C provides 32 DSP48A1 slices that deliver 32 GMACs/s of 18x18 multiplication throughput. The device handles multi-mic beamforming, FFT analysis, and FIR filter banks without external DSP chips, reducing bill-of-material cost in hearing aids, vibration-monitoring sensors, and industrial predictive-maintenance nodes. The 1,451 Kbits block RAM caches window coefficients and overlap-save buffers for streaming DSP pipelines, and the -3 speed grade sustains 250 MHz DSP slice operation.
Recommandé
Portable Test and Measurement
The XC6SLX16-3CPG196C suits handheld oscilloscopes, logic analyzers, and protocol testers where board space, power, and reprogrammability matter. The 8x8 mm CSBGA-196 footprint (0.5 mm pitch) fits compact 4-layer PCBs alongside battery-management ICs and touchscreen controllers. Designers leverage the LX16's flexibility to switch between SPI, I2C, UART, and CAN protocol decoding without hardware changes. The 1.2 V core reduces quiescent power, extending battery runtime in field-portable instruments. The 32 DSP48A1 slices enable on-board FFT for spectrum-analyzer views, eliminating a dedicated DSP chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX16-3CPG196C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX16-3CPG196I | XC6SLX16-2CPG196C | XC6SLX9-3CPG196C | XC6SLX25-3CPG196C |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 196-ball CSBGA | 196-ball CSBGA - same | 196-ball CSBGA - same | 196-ball CSBGA - same | 196-ball CSBGA - same |
| Logic Cells | 14,579 | 14,579 (same) | 14,579 (same) | 9,152 (-37%) | 24,051 (+65%) |
| Speed Grade | -3 (highest) | -3 (same) | -2 (15% slower Fmax) | -3 (same) | -3 (same) |
| Temperature Range | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| User I/O | 106 | 106 (same) | 106 (same) | 106 (same) | 106 (same) |
| Block RAM | 1,451 Kbits | 1,451 Kbits (same) | 1,451 Kbits (same) | 1,036 Kbits (-29%) | 1,764 Kbits (+22%) |
| DSP48A1 Slices | 32 | 32 (same) | 32 (same) | 16 (-50%) | 38 (+19%) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
Principaux différenciateurs
- Highest Fmax in the Spartan-6 LX16 density tier (vs XC6SLX16-2CPG196C)
- Industrial temperature grade drop-in upgrade available (vs XC6SLX16-3CPG196I)
- Higher density upgrade path within same package (vs XC6SLX25-3CPG196C)
- Lower-density downgrade option for cost reduction (vs XC6SLX9-3CPG196C)
Notes de conception
Estimated: The 196-ball CSBGA package uses 0.5 mm ball pitch on an 8x8 mm body. For a 4-layer FR4 PCB, this requires either via-in-pad with filled/capped microvias (recommended for production) or dog-bone fan-out to 0.4 mm drill vias. Standard 6/6 mil trace/space design rules may not suffice; route 4/4 mil to avoid short circuits between escape patterns. Place 100 nF and 4.7 uF decoupling pairs adjacent to every VCCINT and VCCAUX ball.
Estimated: At -3 speed grade with 50% toggle rate and 106 I/Os, the LX16 core draws approximately 0.7-1.2 A at 1.2 V (about 1-1.5 W). Add 50 mA for VCCAUX at 2.5 V and up to 300 mA for VCCO banks depending on I/O loading. Use a low-noise LDO (e.g. TPS7A7002DDA) or 1.5 A DC-DC buck (TPS62841DLCR) for the VCCINT rail. Sequence VCCINT (1.2 V) before VCCAUX (2.5 V) per AMD datasheet to avoid long-term reliability degradation.
AMD's Spartan-6 PCB Design Guide recommends 50 ohm controlled-impedance single-ended traces for LVCMOS33 I/O and 100 ohm differential for LVDS pairs. Keep trace lengths matched within 150 mils for any DDR2/DDR3 interface routed to the hard memory controller. Place external clock sources within 1 inch of the global clock input balls (e.g., IO_LXX_0 GC pair), with a series 33 ohm damping resistor at the FPGA ball.
Do not connect VCCO banks to incompatible voltages; the LX16 supports LVCMOS15/18/25/33 and LVDS_25, but mixing 1.5 V and 3.3 V on adjacent banks requires proper bus-keeper or level-shifter design. The M0/M1/M2 mode pins must be pulled high/low with 4.7 kohm resistors at power-up to select the configuration mode (SPI, BPI, JTAG). Forgetting the DONE pin pull-up causes configuration failure but leaves the FPGA in a low-power state with no error indication.
Informations de conformité
RoHS compliant per AMD product documentation. Lead-free SAC305 solder balls. Not AEC-Q100 qualified; commercial grade only. For AEC-Q100 qualified Spartan-6 parts, contact AMD automotive sales.
