XC6SLX75-3FGG676I - 74,637-Cell Spartan-6 LX FPGA | AMD
Référence : XC6SLX75-3FGG676I ✓ ActifXC6SLX75-3FGG676I Présentation
A field-programmable gate array is a digital semiconductor whose interconnect and logic functions are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA and programmable-logic hierarchy, providing more integration and parallel processing capability than a fixed-function logic device. It is designed for cost-sensitive embedded systems that require adaptable hardware, deterministic control, high-speed interfaces, and substantial I/O density without designing a custom ASIC.
The XC6SLX75-3FGG676I provides 74,637 logic cells and 408 I/O, making it suitable for control, interface, image-processing, and communication designs requiring hundreds of external connections. Its -3 performance grade is intended for designs that prioritize operating speed over the lower-cost -2 grade. The FPGA also supports configurable I/O standards, allowing board designers to connect the device to multiple logic families when voltage, slew, and timing requirements are satisfied.
Spartan-6 LX devices integrate dedicated memory and DSP resources alongside configurable logic. This permits parallel algorithms, packet handling, signal conditioning, and control functions to share one device. Because the available product data does not enumerate RAM, DSP, transceiver, and power specifications, designers should consult the Spartan-6 family documentation and device-specific tables for exact resource counts, voltage requirements, banking rules, and speed characteristics before finalizing a board.
Typical uses include industrial automation, machine vision, motor control, test and measurement, embedded signal processing, and communications infrastructure. The 676-ball package provides a high pin count but demands careful PCB layout, including dense escape routing, controlled power distribution, and comprehensive BGA assembly verification.
For a new design, verify the selected XC6SLX75 speed grade, industrial-temperature requirement, package drawing, pin assignments, power sequencing, and I/O voltage plan against the official device documentation. The -3 grade and I suffix define the performance and temperature order code, so substitutions must match both the FBGA-676 footprint and the intended operating requirements.
This product page consolidates the identified device specifications, verified source links, application guidance, and same-footprint alternatives into an engineering-focused reference for FPGA selection and PCB planning.
Alternatives de remplacement direct pour XC6SLX75-3FGG676I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX75-3FGG676I (même facteur de forme et même empreinte) — différant par Device Type, Operating Temperature, Speed Grade, Logic Cells, Internal Frequency.
XC6SLX75-2FGG676I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX75-3FGG676C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX75-N3FGG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75-2FG676I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX75T-2FGG676C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75-3FGG676I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-6 LX Field-Programmable Gate Array (FPGA) |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Internal Frequency | 667 MHz |
| I/O Count | 408 I/O |
| Boîtier | 676-ball FBGA, 27 mm x 27 mm, 1.0 mm pitch |
| Type de montage | Surface Mount |
| Speed Grade | -3 performance grade |
| Industrial Temperature Range | -40°C to +100°C |
| Process Technology | 45 nm CMOS |
| Statut RoHS | Compliant |
| Lead-Free Status | Lead Free |
Guide de configuration des broches du XC6SLX75-3FGG676I 676-ball fbga, 27 mm x 27 mm, 1.0 mm pitch
Configuration des broches du XC6SLX75-3FGG676I (boîtier 676-ball fbga, 27 mm x 27 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX75-3FGG676I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX75-3FGG676I convient pour 6 applications: Industrial Automation Control, Machine Vision Processing, Precision Motor Control, Test and Measurement Instrumentation, Communications and Protocol Bridging, Embedded Signal Processing.
Industrial Automation Control
The XC6SLX75-3FGG676I is well suited to industrial automation controllers because its 74,637 logic cells and 408 I/O support parallel sequencing, machine control, and multiple peripheral interfaces. The -3 speed grade can improve timing margin in control loops, while the -40°C to +100°C industrial rating supports temperature-variable factory environments. Designers can use the programmable fabric for motion sequencing, interlocks, event logging, and communication protocols while using dedicated I/O banks for sensors and actuators.
Recommandé
Machine Vision Processing
The XC6SLX75-3FGG676I can implement parallel pixel pipelines, feature detection, thresholding, and frame-format conversion because the device provides 74,637 programmable logic cells and a high-performance -3 grade. Its 408 I/O give an image system considerable flexibility for camera interfaces, trigger signals, and external memory. Dedicated memory and DSP resources should be mapped explicitly so high-throughput operations do not consume routing needed for control logic.
Recommandé
Precision Motor Control
The XC6SLX75-3FGG676I supports deterministic digital motor-control functions such as encoder decoding, current-command calculation, PWM generation, and fault sequencing. Its 5,831 CLBs provide substantial room for parallel control channels, while 408 I/O accommodate position sensors, communication buses, and gate-driver interfaces. The industrial temperature rating is useful in factory equipment, although isolation, grounding, protection, and functional-safety requirements remain outside the FPGA's basic specifications.
Recommandé
Test and Measurement Instrumentation
A configurable Spartan-6 LX fabric is useful in test and measurement equipment for sequencing stimuli, collecting parallel responses, performing protocol conversion, and implementing real-time analysis. The XC6SLX75-3FGG676I offers 74,637 logic cells for complex timing and control logic plus 408 I/O for instruments, triggers, and communication channels. The -3 grade favors short critical paths, while the large package allows multiple voltage domains to be considered during bank planning.
Recommandé
Communications and Protocol Bridging
The XC6SLX75-3FGG676I can bridge multiple interface formats through programmable logic, allowing packet buffering, width conversion, clock-domain handling, and protocol checks to share one device. Its 408 I/O and high logic density suit multi-lane control or network-adapter designs where fixed-function bridge ICs are too restrictive. Clock-management, I/O standards, and timing constraints must be assigned before pinout, and external transceivers remain necessary for physical-layer signaling.
Recommandé
Embedded Signal Processing
The Spartan-6 LX architecture gives the XC6SLX75-3FGG676I enough programmable resources for fixed-point filters, correlation, waveform generation, and sensor-fusion front ends. The -3 grade is appropriate when parallel datapaths require short timing paths, and 408 I/O permit concurrent access to converters, memories, and control peripherals. Dedicated DSP and RAM blocks should be used for arithmetic-heavy stages, with general logic reserved for sequencing and system-level control.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX75-3FGG676I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX75-2FGG676I | XC6SLX75-3FGG676C | XC6SLX75-N3FGG676I | XC6SLX75-2FG676I | XC6SLX75T-2FGG676C |
|---|---|---|---|---|---|---|
| Package | 676-ball FBGA, 27 mm x 27 mm, 1.0 mm pitch | 676-ball FBGA, same footprint | 676-ball FBGA, same footprint | 676-ball FBGA, same footprint | 676-ball FBGA, same footprint | 676-ball FBGA, same footprint |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 T variant |
| Speed Designation | -3 | -2 | -3 | N3 | -2 | -2 |
| Temperature Suffix | I, industrial | I, industrial | C | I, industrial | I, industrial | C |
Principaux différenciateurs
- Highest -3 Spartan-6 LX performance designation in the compared set (vs XC6SLX75-2FGG676I)
- Industrial-temperature ordering option (vs XC6SLX75-3FGG676C)
- High-density logic and I/O integration (vs XC6SLX75-2FG676I)
Notes de conception
Design the 676-ball FBGA layout from the official package drawing and pinout rather than from a generic BGA template. Confirm ball locations, exposed or omitted balls, pad stack, solder-mask definition, and assembly process with the PCB fabricator. A 1.0 mm pitch also increases sensitivity to registration and via-in-pad requirements, so stackup, escape-routing layers, and X-ray inspection criteria should be settled before schematic capture is released.
Plan every supply rail and I/O bank against the device's recommended operating conditions before assigning pins. The verified product data does not identify the core and I/O voltages, decoupling values, or power-up sequence, so use the official Spartan-6 LX documentation for those values. Provide local bulk and high-frequency decoupling, isolate noisy power conversion, and verify sequencing at both the device and board level before power application.
Map high-speed interfaces to appropriate I/O banks and preserve the device's documented standards, slew, drive-strength, and timing constraints. Pay particular attention to clock routing, memory interfaces, differential pairs, and simultaneous-switching outputs. Because exact supported I/O standards and pin assignments are not reproduced on this page, use the manufacturer pinout and AC timing tables during floorplanning and repeat static timing analysis after routing.
Do not treat every 676-ball Spartan-6 device as an automatic substitute. The -3 and N3 speed designations, T-family code, and I or C temperature suffix can change timing, qualification, or operating limits. Before releasing an alternative, compare its pinout, configuration requirements, supported I/O, power plan, lifecycle status, and timing tables. Re-run synthesis, implementation, bitstream generation, timing analysis, and hardware validation for the exact replacement MPN.
Informations de conformité
The component listing identifies the device as lead free, and the comparison data identifies RoHS compliance. No verified automotive, halogen-free, REACH, or conflict-minerals qualification was identified.
