XC7A35T-1CS324I - Artix-7 FPGA, 33K Logic Cells, 210 I/O, 324-BGA | AMD
Référence : XC7A35T-1CS324I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $198 | $1 980,00 |
| 100 | $178 | $17 800,00 |
| 500 | $162 | $81 000,00 |
| 1 000 | $148 | $148 000,00 |
XC7A35T-1CS324I Présentation
An Artix-7 FPGA is a programmable logic device that sits within the broader category of programmable logic ICs, alongside CPLDs and FPGAs from other families. FPGAs sit hierarchically below programmable logic, below semiconductor ICs, and below integrated circuits. Artix-7 specifically targets the industry's best performance-per-watt for cost-sensitive applications, balancing high-throughput DSP, high-speed serial connectivity, and low static power consumption in a low-cost package family.
Key differentiating specifications include 33,280 logic cells (5,200 logic slices, 4 clock-management tiles), 1,843,200 bits of on-chip block RAM, 240 Kbits distributed RAM, 90 dedicated DSP48E1 slices running at up to 628 GigaMACs/s, and 4 GTP multi-gigabit transceivers supporting up to 6.6 Gb/s. The device supports up to 210 user I/Os across multiple voltage standards (LVCMOS, LVDS, SSTL) and a 12-bit 1 Msps XADC analog front end.
Architecturally the chip is built around 28nm HKMG CMOS logic, configurable logic blocks (CLBs), 36 Kb dual-port BRAM blocks, and hard PCIe Gen2 endpoint blocks. Compared with prior Spartan-6 generations, Artix-7 delivers roughly 2x performance per watt and roughly 35% lower total power, enabling battery, fan-less, or thermally constrained designs without sacrificing DSP or serial bandwidth.
Typical applications span cost-sensitive digital signal processing, motor control, industrial camera and machine-vision pipelines, software-defined radio front ends, low-cost PCIe endpoint cards, and low-power embedded video processing. The 4 GTP lanes and 90 DSP slices make this device especially attractive for thin client video transcoding, portable ultrasound, and IoT edge nodes.
When designing with this part, plan for a 1.0V core, 1.8V/2.5V/3.3V auxiliary supplies, and configure the GTP reference clocks using the dedicated MGTREFCLK pins; do not remap them to GPIO at the schematic stage. JTAG and the SPI configuration interface both support multi-device daisy chains for board-level debugging.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the bare manufacturer product page.
Alternatives de remplacement direct pour XC7A35T-1CS324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A35T-1CS324I (même facteur de forme et même empreinte) — différant par Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A35T-2CS324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A35T-1CSG324I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XA7A35T-2CSG324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A75T-2CSG324I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A35T-1FGG484I
✅ Remplacement direct✓ En stock
$15.1 / unité
Voir la fiche technique →XC7A35T-1CS324I Valeurs maximales et caractéristiques électriques
| Family | Artix-7 |
| Series | XC7A35T |
| Logic Cells | 33,280 |
| Logic Slices | 5,200 |
| Logic Blocks (CLBs / LABs) | 2,600 |
| Block RAM (BRAM) | 1,843,200 bits (50 x 36 Kb) |
| DSP Slices (DSP48E1) | 90 |
| GTP Transceivers | 4 (up to 6.6 Gb/s) |
| User I/O | 210 |
| Speed Grade | -1 |
| Temperature Grade | Industrial (-40C to +100C) |
| Process Technology | 28nm HKMG |
| Boîtier | 324-ball CSBGA (CSG324) 15x15 mm 0.8 mm pitch |
| Core Voltage | 1.0 V (nominal) |
| Configuration Interface | JTAG, SPI x1/x2/x4, BPI x8/x16 |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC7A35T-1CS324I 324-ball csbga (csg324) 15x15 mm 0.8 mm pitch
Configuration des broches du XC7A35T-1CS324I (boîtier 324-ball csbga (csg324) 15x15 mm 0.8 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A35T-1CS324I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A35T-1CS324I convient pour 6 applications: Cost-Sensitive Digital Signal Processing, Industrial Camera and Machine Vision, Software Defined Radio Front End, Low-Cost PCIe Endpoint Card, Portable Ultrasound Imaging, Industrial Motor Control and IoT Edge Nodes.
Cost-Sensitive Digital Signal Processing
The XC7A35T-1CS324I's 90 DSP48E1 slices deliver up to 628 GigaMACs/s, making it an excellent match for cost-sensitive DSP designs such as digital pre-distortion, FIR filters, and FFT pipelines. The 28nm HKMG process keeps dynamic power low even when all 90 slices run concurrently at the -1 speed grade. Pair the DSP slice datapath with 1,843,200 bits of block RAM to hold coefficients and data windows without external memory pressure. Designers can drop the same RTL onto the -2 speed grade (XC7A35T-2CS324I) if higher Fmax is required.
Recommandé
Industrial Camera and Machine Vision
The 210 user I/Os in the 324-ball CSBGA package expose ample LVDS pairs for MIPI-CSI/SubLVDS image sensor connection, while the GTP transceivers support CoaXPress or GigE Vision uplinks. The 1,843,200 bits of block RAM acts as multi-line video buffers without external SRAM. Industrial temperature grade (-40C to +100C) ensures reliable operation in factory environments. The Vivado Video In to AXIS IP pipeline paired with FPGA-based pre-processing makes this device well-suited to high-throughput line-scan camera processing.
Recommandé
Software Defined Radio Front End
Four GTP transceivers combined with 90 DSP slices and 33,280 logic cells create an ideal SDR front end. The XDAC and onboard XADC simplify analog monitoring of bias references. The industrial temperature grade supports outdoor and vehicular SDR deployments. The 28nm process keeps Quiescent power low enough for battery-powered tactical radios. Designers can leverage the Vivado IP catalog for fast-Fourier-transform cores alongside DDC/DUC implementations for end-to-end pipeline coverage.
Recommandé
Low-Cost PCIe Endpoint Card
The integrated PCIe Gen2 hard endpoint block supports x1, x2, and x4 lanes through the GTP transceivers, enabling low-cost PCIe cards without an external bridge chip. The 5,200 logic slices provide ample resources for DMA engines, custom drivers, and user logic. The 324-ball CSBGA and industrial grade fit easily into half-height PCIe form factors with airflow from the system. Designers should leverage the Vivado 7-Series Integrated PCIe IP for predictable Gen2 timing.
Recommandé
Portable Ultrasound Imaging
The XC7A35T-1CS324I's 90 DSP48E1 slices and 33,280 logic cells support beamforming, Hilbert transform, and envelope detection pipelines needed in portable ultrasound. Block RAM holds multi-element receive channel data, while the high PSRR of the ARTIX core voltage reduces noise coupling into sensitive analog paths. Low static power keeps battery-operated handheld probes feasible. The -1 speed grade typically meets portable ultrasound sample rates; choose the -2 grade for premium imaging systems.
Recommandé
Industrial Motor Control and IoT Edge Nodes
Field-oriented control (FOC), PWM generation, and encoder feedback processing fit comfortably within the 33,280 logic cells and 90 DSP slices of the XC7A35T-1CS324I. The 210 user I/Os connect to resolver feedback, encoder quadrature inputs, and opto-isolated control signals. Industrial temperature grade suits factory floor deployments with ambient thermal stress. Combined with low-cost serial transceivers and external ADCs, the device forms a compact IoT edge controller for predictive maintenance, providing motor control plus Ethernet/IP connectivity in a single chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A35T-1CS324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A35T-2CS324I | XC7A35T-1CSG324I | XA7A35T-2CSG324I | XC7A75T-2CSG324I | XC7A35T-1FGG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | CSG324 (324-ball CSBGA) | CSG324 (324-ball CSBGA) - same | CSG324 (324-ball CSBGA) - same | CSG324 (324-ball CSBGA) - same | CSG324 (324-ball CSBGA) - same | CSG324 (324-ball CSBGA) - same |
| Logic Cells | 33,280 | 33,280 | 33,280 | 33,280 | 47,600 (density migration) | 33,280 |
| Speed Grade | -1 | -2 (faster Fmax) | -1 | -2 | -2 | -1 |
| Automotive AEC-Q100 | No (industrial) | No (industrial) | No (industrial) | Yes (AEC-Q100) | No (industrial) | No (industrial) |
| Block RAM (bits) | 1,843,200 | 1,843,200 | 1,843,200 | 1,843,200 | 2,808,000 (more BRAM) | 1,843,200 |
| DSP48E1 Slices | 90 | 90 | 90 | 90 | 120 (more DSP) | 90 |
| GTP Transceivers | 4 (up to 6.6 Gb/s) | 4 (up to 6.6 Gb/s) | 4 (up to 6.6 Gb/s) | 4 (up to 6.6 Gb/s) | 4 (up to 6.6 Gb/s) | 4 (up to 6.6 Gb/s) |
Principaux différenciateurs
- Balanced cost/performance with 90 DSP slices and 4 GTP transceivers (vs Spartan-6 XC6SLX45)
- Industrial temperature grade in a 0.8 mm pitch 324-ball CSBGA (vs XC7A35T-1FTG256I)
- -1 speed grade for power-efficient designs (vs XC7A35T-2CS324I)
- Drop-in 324-ball CSBGA package allows PCB reuse across -1/-2 speed grades and Artix-7 densities (vs XC7A100T-CPG236C)
Notes de conception
Provide a clean 1.0V VCCINT supply with peak current up to approximately 2A and a separate 1.8V VCCAUX/VCCO_MGT rail for the GTP transceivers. Decoupling must include 100 nF X7R capacitors within a 5 mm loop to every VCCINT/VCCAUX ball, plus bulk 4.7 uF X5R at each supply island. Estimating: 1.0V * 2A = 2W budget for moderate workloads; commercial Vivado power reports give an exact number before tape-out.
Even at industrial temperature grade, board thermal design must keep the junction below 100C. A 15x15 mm CSG324 PCB land area combined with an inner copper ground pour gives theta_JA close to 20 C/W when using 2 oz copper with thermal vias to inner planes. For sealed enclosures or fanless applications, drop the operating frequency or migrate to the -1 speed grade to lower dynamic power.
Route GTP differential pairs to MGTREFCLK, MGTPRXB/P, and MGTPTXB/P with 100 ohm differential impedance. Match within 25 mil across each pair and keep series AC-coupling caps within 200 mil of the GTX receiver balls. Reference the AMD UltraScale/7-Series Transceiver User Guide (UG482) and Artix-7 Package Pinout File CSG324 before locking the schematic.
Do not reuse MGTREFCLK pins as GPIO; they are hard-wired to the GTP block. Avoid placing JTAG TCK/TDO next to GTP TX/RX lanes due to crosstalk. Use the Vivado hardware manager to verify the configured bitstream is the same speed-grade file (XC7A35T-1 vs -2) before board bring-up. Confirm that VCCBAT is supplied by a coin cell or supervisory circuit if the design uses the encryption key.
For high-speed LVDS to GPIO banks use 1.8V or 2.5V VCCO levels with 100-ohm differential impedance at the FPGA edge. Always include PI2DBS212ZHEX or similar level-shifters for 5V legacy buses to avoid damaging the FPGA HR/HP I/O. For multi-protocol applications run separate VCCO rails per bank to avoid mixing SSTL and LVDS standards.
Informations de conformité
RoHS and lead-free per AMD product page. Not AEC-Q100; for automotive use choose XA7A35T-2CSG324I which is on the XAIPART Site MPN list.
