XC7A35T-1CSG324C - Artix-7 FPGA, 33k Logic Cells, 324-BGA | AMD
Référence : XC7A35T-1CSG324C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $62.8 | $6 280,00 |
| 500 | $55.4 | $27 700,00 |
| 1 000 | $49.2 | $49 200,00 |
XC7A35T-1CSG324C Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device that contains configurable logic blocks, programmable interconnect, and I/O cells, allowing engineers to implement custom digital circuits, parallel processing pipelines, and hardware accelerators. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors. The Artix-7 family targets cost-sensitive, high-volume applications requiring moderate logic density combined with low power consumption.
Key features include 90 DSP48E1 slices for high-throughput fixed-point signal processing, 2.1 Mb of block RAM, 5 clock management tiles (CMTs) each containing one mixed-mode clock manager (MMCM) and one phase-locked loop (PLL), and integrated configuration logic supporting multi-boot and bitstream encryption. The Artix-7 architecture delivers up to 240 DSP GMACs at sub-watt power levels, making it well suited for power-constrained DSP and signal chain designs.
The XC7A35T-1CSG324C features AMD Xilinx's proven 7-series transceiver-less fabric, where "35T" indicates the Artix-7 family with 33k logic cells, the "-1" speed grade reflects timing characteristics for industrial-grade applications, "CSG324" specifies the 324-ball FBGA lid package, and "C" denotes commercial temperature grade. The device exposes GTPs are absent from this device, but offers extensive SelectIO high-performance I/O supporting LVCMOS, LVTTL, SSTL, and HSTL standards up to 1.6 Gbps in some configurations.
Typical applications include industrial motor control, medical imaging front-ends, software-defined radio (SDR) receivers, low-cost video processing pipelines, and portable test and measurement equipment. Designers favor the Artix-7 family for its balance of cost, density, and DSP capability in mid-range embedded designs.
When migrating between Artix-7 densities, verify pinmap and clock routing using AMD's Pinout Files resource - higher-density parts like the XC7A50T and XC7A75T in the same CSG324 package are footprint-compatible. The XC7A35T's GTP transceivers are NOT available; for high-speed serial links consider migrating to Kintex-7 or Spartan-6 with GTP/GTX support.
This page synthesizes distributor pricing, drop-in alternatives within the same CSG324 footprint, and practical design notes that extend beyond the manufacturer datasheet to support engineering decisions.
Alternatives de remplacement direct pour XC7A35T-1CSG324C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A35T-2CSG324C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A50T-1CSG324C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A75T-1CSG324C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A50T-2CSG324C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A35T-1CSG324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A35T-1CSG324C Valeurs maximales et caractéristiques électriques
| Family | Artix-7 |
| Logic Cells | 33280 |
| System Gates | 1843200 |
| DSP48E1 Slices | 90 |
| Block RAM | 2.1 Mb (1620 Kb) |
| Logic Slices | 5210 |
| Maximum User I/Os | 210 |
| Clock Management Tiles (CMTs) | 5 (5 MMCM + 5 PLL) |
| Process Technology | 28 nm HPL (High-Performance Low-power) |
| Core Voltage | 1.0 V (nominal) |
| Speed Grade | -1 |
| Temperature Grade | Commercial (0 C to +85 C) |
| Boîtier | 324-ball LFBGA (CSG324), 15x15 mm, 0.8 mm pitch |
| GTP/GTX Transceivers | None |
| Configuration Memory | MultiBoot, AES bitstream encryption |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | Level 3 (per JEDEC J-STD-020) |
Configuration des broches de XC7A35T-1CSG324C
| Broche D4 | VCCINT_1 — Core supply 1.0V, bank 0 |
| Broche H7 | VCCAUX_1 — Auxiliary supply 1.8V, bank 0 |
| Broche M11 | GND — Common ground, multiple balls |
| Broche B6 | IO_L1P_T0_34 — Bank 34 HR I/O, diff pair positive |
| Broche C5 | IO_L1N_T0_34 — Bank 34 HR I/O, diff pair negative |
| Broche F12 | CCLK — Configuration clock for serial SPI/BPI modes |
| Broche G11 | DONE — Configuration complete indicator, open-drain |
| Broche G12 | INIT_B — Configuration initialization (low during config) |
| Broche H10 | PROG_B — Program/reset (active low) |
| Broche J11 | TDI — JTAG test data in |
| Broche J12 | TDO — JTAG test data out |
| Broche K10 | TMS — JTAG test mode select |
| Broche K11 | TCK — JTAG test clock |
| Broche B11 | MRCC_P_50 — Multi-region clock, bank 50, positive |
| Broche C10 | MRCC_N_50 — Multi-region clock, bank 50, negative |
| Broche L6 | IO_L6P_T0_FCS_B_35 — Bank 35 HR I/O with FCS_B configuration role |
| Broche M5 | IO_L6N_T0_FCS_B_35 — Bank 35 HR I/O complementary |
| Broche A4 | MGTAVCC — Not used on XC7A35T (transceiver power, GND) |
| Broche E11 | VREF_15 — I/O bank 15 reference voltage |
| Broche F9 | IO_L13P_T2_MRCC_14 — Bank 14 HR I/O with MRCC clock capability |
Applications typiques
XC7A35T-1CSG324C convient pour 6 applications: Industrial Motor Control and Drives, Portable Medical Imaging and Ultrasound Front-Ends, Software-Defined Radio Receivers, Low-Cost Video Processing Pipelines, Portable Test and Measurement Equipment, Automotive ADAS Pre-Processing and Sensor Fusion.
Industrial Motor Control and Drives
The AMD XC7A35T-1CSG324C suits industrial motor control where deterministic logic, DSP throughput, and robust I/O are essential. Its 90 DSP48E1 slices execute FOC (Field-Oriented Control) algorithms at sub-microsecond rates - sufficient for 100 kHz PWM switching with torque-ripple compensation. The 5 CMTs provide 5 PLL/MMCM pairs to phase-lock the switching frequency to resolver feedback; the 210 SelectIO deliver 5V-tolerant LVTTL signals for legacy inverter bridges. Versus Spartan-6 LX35T, the Artix-7 reduces dynamic power roughly 50% on equivalent PWM code, enabling fan-less controller assemblies. Place the FPGA with a CSG324 footprint with 1.0V core and 1.8V aux supplies, decoupling per AMD reference design.
Recommandé
Portable Medical Imaging and Ultrasound Front-Ends
The XC7A35T-1CSG324C fits portable ultrasound beamforming and imaging pipelines because its 90 DSP48E1 slices deliver the multiply-accumulate density required for beam summation, I/Q demodulation, and Hilbert transform stages. The 2.1 Mb block RAM stores line buffers and coefficient banks with single-cycle access at 200+ MHz. Compared to Spartan-6 LX35T, the 28 nm Artix-7 process reduces core power ~40%, critical when battery life is bounded by signal-processing workloads. The CSG324 package ball pitch (0.8 mm) supports compact 4-layer PCBs common in handheld probes; MMCMs derive precise transducer frequencies from a single low-cost crystal reference.
Recommandé
Software-Defined Radio Receivers
For cost-sensitive software-defined radio receivers, the XC7A35T-1CSG324C delivers parallelism that DSP processors cannot match. Its 90 DSP48E1 slices run polyphase channelizers, FIR filtering, and FFT cores at the 200-300 MHz fMAX of the -1 speed grade. With 2.1 Mb block RAM for sample buffering and 5 CMTs to generate the digital-LO frequencies, the device covers HF-to-L-band basebands. The 210 SelectIO comfortably accommodate 16-bit ADC data buses. Note that the Artix-7 part has NO GTP/GTX transceivers - for tuner ADCs with JESD204B serializer outputs, choose a Kintex-7 or Spartan-6 with GTP/GTX lanes.
Recommandé
Low-Cost Video Processing Pipelines
The XC7A35T-1CSG324C targets video pre-processing, dual-camera stitching, and lightweight encoding pipes where 4K is not required. Its DSP resources perform pixel-by-pixel lens correction and color space conversion at 1080p60 resolution, while the 1843200 system gates support DMA-driven SDRAM controllers for line-store buffering. Switching to the higher-density XC7A50T or XC7A75T in the same CSG324 footprint enables H.264 encoding tasks. The 1.0V core supply keeps board power well below 1.5 W on typical vision loads, enabling fan-less panel-mount designs.
Recommandé
Portable Test and Measurement Equipment
The XC7A35T-1CSG324C is ideal for handheld oscilloscopes, logic analyzers, and signal-level meters that need DSP-rich on-device analysis. Its 90 DSP slices run FFT analysis, true-RMS calculation, and trigger algorithms. With 5 MMCM/PLL pairs the part retimes acquisitions to the input signal, while 2.1 Mb block RAM serves as deep sample history. Compared to DSP processor implementations, the FPGA delivers ~10x throughput with deterministic latency, critical for glitch detection. The CSG324 BGA accommodates mixed-signal ADCs with double-buffered LVDS sampling on the 210 I/O pins.
Recommandé
Automotive ADAS Pre-Processing and Sensor Fusion
The XC7A35T-1CSG324C (-I industrial variant) addresses pre-processing in front-camera and radar fusion ECUs. Its DSP48E1 slices implement Sobel and edge-detection kernels for lane-marking analysis at 30 fps, while SelectIO interfaces directly to MIPI-CSI2 raw camera streams up to 800 Mbps in DDR mode. The 5 CMTs phase-lock LVDS camera lines to automotive CAN bus timing. Compared to dedicated camera processors, the FPGA's reconfigurability supports rapid algorithm development. Note that AEC-Q100 qualification requires the XA7A35T or XC7A35T-Q variants - the standard -C grade is suitable for off-road and industrial automation only.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A35T-1CSG324C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A35T-2CSG324C | XC7A50T-1CSG324C | XC7A75T-1CSG324C | XC7A50T-2CSG324C | XC7A35T-1CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball LFBGA (CSG324) | 324-ball LFBGA (CSG324) - same | 324-ball LFBGA (CSG324) - same | 324-ball LFBGA (CSG324) - same | 324-ball LFBGA (CSG324) - same | 324-ball LFBGA (CSG324) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 33280 | 33280 (same) | 52160 (+57%) | 75520 (+127%) | 52160 (+57%) | 33280 (same) |
| DSP48E1 Slices | 90 | 90 (same) | 120 (+33%) | 180 (+100%) | 120 (+33%) | 90 (same) |
| Block RAM | 2.1 Mb | 2.1 Mb (same) | 2.7 Mb | 3.6 Mb | 2.7 Mb | 2.1 Mb (same) |
| Speed Grade | -1 | -2 | -1 | -1 | -2 | -1 |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial (same) | Commercial | Commercial | Commercial | Industrial (-40 C to +100 C) |
| Transceivers (GTP/GTX) | None | None | None | None | None | None |
| User I/Os | 210 | 210 (same) | 210 | 210 | 210 | 210 (same) |
Principaux différenciateurs
- Industry-standard Artix-7 mid-density sweet spot (vs Spartan-6 LX35T)
- Exact CSG324 footprint compatibility within Artix-7 family (vs XC7A50T-1CSG324C)
- 5 CMTs with 5 MMCM + 5 PLL - the highest in mid-density FPGAs (vs XC7A35T-1CSG324I)
Notes de conception
Decouple each VCCINT ball with one 100 nF ceramic capacitor placed within 5 mm trace length; add one 220 uF bulk polymer capacitor per FPGA per AMD's recommended layout. The 1.0 V core and 1.8 V aux rails must ramp within 50 ms of each other per the AMD 7-series power-on sequencing requirement; use a common enable line from a power-good supervisor. Estimated: at 80 percent resource utilization with all 90 DSP48E1 at 200 MHz, expect 0.95 W core consumption. Static current alone typically measures 90 mA on VCCINT at room temperature.
At full DSP utilization (90 DSPs at 250 MHz) the CSG324 package dissipates approximately 1.5 W. In a 4-layer PCB with 20 cm^2 inner power plane, the resulting theta_JA of 28 C/W yields a 42 C junction rise above 25 C ambient - safely below the 85 C commercial limit. For sealed enclosure designs reducing airflow, de-rate the operating frequency or reduce utilization below 60 percent. Always connect the CSG324 thermal pad balls to the GND plane via thermal vias, 6+ vias of 0.3 mm diameter arranged in a 1.0 mm grid.
Route all 5 CMT clock inputs (MRCC_P/N pairs) with controlled-impedance 50 ohm microstrip and length-match within 100 mils of any CMT to avoid drift in the MMCM/PLL. CSG324 balls have 0.8 mm pitch, requiring a 4-layer HDI stack-up (microvia in pad is recommended). Keep SelectIO signals separated by one ground via between every other signal via to minimize crosstalk at LVDS speeds. AMD's IBIS models and pinout files (CSG324 ASCII) drive the recommended escape routing.
Common pitfalls include: (1) routing MGT power balls when the application uses NO GTP/GTX transceivers - these balls should be tied to GND, not floated; (2) leaving CFGBVS unconnected; (3) failing to hold PROGRAM_B asserted during power-up - it must release cleanly after VCCINT+1 ms delay; (4) ignoring FT3 Ref No 27 specifying external series resistors on high-speed SelectIO. Configure the Vref via dedicated pins from each bank, NEVER from internal bias to ensure hot-swap-safe operation.
Informations de conformité
Per AMD product specifications the Artix-7 family is RoHS-compliant, lead-free, and halogen-free. AEC-Q100 automotive qualification requires the XA7A35T automotive grade variant, NOT the standard XC7A35T-C commercial part.
