XC7A50T-2CSG325I - Artix-7 FPGA 150 I/O | AMD
Référence : XC7A50T-2CSG325I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.2 | $382,00 |
| 100 | $34.1 | $3 410,00 |
| 500 | $30.8 | $15 400,00 |
| 1 000 | $28.4 | $28 400,00 |
XC7A50T-2CSG325I Présentation
An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the same chip to implement different digital logic functions. FPGAs sit between microcontrollers and ASICs in the design spectrum, offering the flexibility of software with the parallelism of hardware. They are essential in applications where rapid prototyping, hardware acceleration, or in-field updates are required.
Key features of the XC7A50T-2CSG325I include 150 user I/Os, 52,160 logic cells, and 2,764,800 bits of block RAM. The device also integrates an XADC block with an on-chip reference circuit (±1%), enabling on-chip monitoring of temperature and power supply rails without external active components. The -2 speed grade provides a balanced performance point for logic and I/O, while the industrial temperature grade (-I) ensures operation from -40°C to +100°C.
Technically, the Artix-7 family is built on a 28nm high-k metal gate (HKMG) process, delivering the lowest power and cost at this node. The device supports various I/O standards, including LVCMOS, LVDS, and HSTL, and includes clock management tiles (CMTs) with MMCM and PLL blocks for robust clock generation. The XADC provides a 12-bit, 1 MSPS analog-to-digital converter, useful for system monitoring and control.
Typical applications include motor control, industrial networking, software-defined radio, and video processing. The 150 I/Os and 324-ball package make it ideal for mid-density designs where board space is limited. The low power consumption of the Artix-7 family is particularly beneficial in battery-powered or thermally constrained systems.
When designing with this device, ensure proper decoupling of the 1V core supply and follow AMD's power-on sequencing guidelines. The configuration bitstream can be stored in external SPI flash or loaded via JTAG, providing flexibility in system design.
Alternatives de remplacement direct pour XC7A50T-2CSG325I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A50T-2CSG325C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A50T-1CSG325I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A75T-2CSG325I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XA7A50T-2CSG325I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A50T-2CSG325I Valeurs maximales et caractéristiques électriques
| Family | Artix-7 |
| Logic Cells | 52,160 |
| Block RAM | 2,764,800 bits |
| User I/Os | 150 |
| Boîtier | 324-LFBGA, CSPBGA (CSG325) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-I) |
| Core Voltage | 1V |
| Technology | 28nm |
| XADC | 12-bit, 1 MSPS, on-chip reference (±1%) |
| Clock Management | MMCM, PLL |
| Configuration | SPI flash, JTAG |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40°C to +100°C |
Configuration des broches de XC7A50T-2CSG325I
| Broche A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Broche A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Broche B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Broche B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Broche C1 | VCCINT — Core logic power supply (1V) |
| Broche C2 | GND — Ground |
| Broche D1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Broche D2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Broche E1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| Broche E2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
| Broche F1 | VCCAUX — Auxiliary power supply (1.8V) |
| Broche F2 | GND — Ground |
Applications typiques
XC7A50T-2CSG325I convient pour 6 applications: Motor Control, Industrial Networking, Software-Defined Radio, Video Processing, Test and Measurement, Aerospace and Defense.
Motor Control
The XC7A50T-2CSG325I is ideal for motor control applications due to its 150 user I/Os, which can interface with multiple encoders, Hall sensors, and PWM signals. The 52,160 logic cells handle complex field-oriented control (FOC) algorithms, while the integrated XADC monitors phase currents and DC bus voltage for protection. The -2 speed grade ensures fast loop closure, and the industrial temperature range supports harsh environments. Compared to a microcontroller, the FPGA provides deterministic, parallel processing of multiple motor axes, reducing CPU load and improving response time.
Recommandé
Industrial Networking
In industrial networking, the XC7A50T-2CSG325I provides 150 I/Os for interfacing with Ethernet PHYs, UARTs, and fieldbus transceivers. The 2,764,800 bits of block RAM support packet buffering and protocol processing, while the MMCM/PLL blocks generate multiple clock domains for different protocols. The low power consumption of the Artix-7 family is beneficial in DIN-rail mounted systems with limited cooling. The XADC can monitor supply rails and board temperature, enabling predictive maintenance. This FPGA is well-suited for implementing PROFINET, EtherCAT, or Modbus TCP bridges with custom logic.
Recommandé
Software-Defined Radio
The XC7A50T-2CSG325I is well-suited for software-defined radio (SDR) applications, offering 52,160 logic cells for digital down/up conversion, filtering, and modulation. The 150 I/Os can connect to high-speed ADCs and DACs, while the block RAM supports FIFO buffers for data streaming. The -2 speed grade enables sample rates up to 100+ MSPS for IF processing. The XADC can monitor signal levels and temperature, aiding in automatic gain control. Compared to a DSP, the FPGA provides parallel processing of multiple channels, making it ideal for multi-channel SDR systems.
Recommandé
Video Processing
For video processing, the XC7A50T-2CSG325I provides 150 I/Os for interfacing with HDMI, MIPI, or LVDS receivers and transmitters. The 2,764,800 bits of block RAM can store multiple lines of video data for filtering and scaling, while the logic cells implement color space conversion and frame rate control. The MMCM/PLL blocks generate pixel clocks and timing signals. The low power consumption is advantageous in portable or embedded vision systems. The XADC can monitor temperature to prevent thermal throttling in compact enclosures.
Recommandé
Test and Measurement
In test and measurement equipment, the XC7A50T-2CSG325I offers 150 I/Os for connecting to high-speed comparators, DACs, and trigger circuits. The 52,160 logic cells implement custom triggering, data acquisition, and signal analysis algorithms. The XADC provides a 12-bit, 1 MSPS ADC for low-speed analog measurements, while the block RAM buffers captured data. The -2 speed grade supports high-speed digital interfaces like SPI and parallel buses. The industrial temperature range ensures reliable operation in benchtop and field instruments.
Recommandé
Aerospace and Defense
The XC7A50T-2CSG325I is suitable for aerospace and defense applications requiring rugged, reliable FPGAs. The industrial temperature range (-40°C to +100°C) and 28nm process ensure operation in harsh environments. The 150 I/Os interface with sensors, actuators, and communication links, while the logic cells implement encryption, filtering, and control algorithms. The XADC monitors power supply integrity, critical for safety-critical systems. The small 324-ball package saves board space in avionics and UAV payloads.
Recommandé
Données de référence d'ingénierie pour XC7A50T-2CSG325I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A50T-2CSG325C | XC7A50T-1CSG325I | XC7A75T-2CSG325I | XA7A50T-2CSG325I |
|---|---|---|---|---|---|
| Package | 324-CSPBGA | 324-CSPBGA | 324-CSPBGA | 324-CSPBGA | 324-CSPBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 52,160 | 52,160 | 52,160 | 75,520 | 52,160 |
| User I/Os | 150 | 150 | 150 | 150 | 150 |
| Block RAM | 2,764,800 bits | 2,764,800 bits | 2,764,800 bits | 3,784,320 bits | 2,764,800 bits |
| Speed Grade | -2 | -2 | -1 | -2 | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Automotive (-40°C to +125°C) |
| Core Voltage | 1V | 1V | 1V | 1V | 1V |
Principaux différenciateurs
- Industrial temperature grade (vs XC7A50T-2CSG325C)
- Higher speed grade (vs XC7A50T-1CSG325I)
- Automotive-grade option (vs XA7A50T-2CSG325I)
Notes de conception
The XC7A50T-2CSG325I requires a 1V core supply (VCCINT) and 1.8V auxiliary supply (VCCAUX). Use low-ESR ceramic capacitors (100nF and 10uF) placed close to each power pin. Follow AMD's power-on sequencing: VCCINT, then VCCAUX, then VCCO. Refer to UG475 for detailed decoupling guidelines.
The 324-ball CSBGA package requires a multi-layer PCB with at least 4 layers for proper routing and power distribution. Use via-in-pad or microvias for dense designs. Ensure the thermal pad is connected to a solid ground plane for heat dissipation. Follow AMD's layout guidelines in UG475 for signal integrity.
Do not leave unused I/O pins unconnected; configure them as inputs with pull-ups or drive them to a defined state to avoid floating inputs. Ensure the configuration mode pins (M[2:0]) are set correctly for the desired boot source. The XADC requires a dedicated analog supply (VCCADC) and reference decoupling for accurate measurements.
Informations de conformité
RoHS compliant per distributor listings. AEC-Q100 not applicable for standard grade; use XA7A50T-2CSG325I for automotive.
