XC7A75T-1FGG676C - 75,520-Cell Artix-7 FPGA | AMD
Référence : XC7A75T-1FGG676C ✓ ActifXC7A75T-1FGG676C Présentation
An FPGA is a programmable digital semiconductor whose configurable logic blocks, routing fabric, block RAM, DSP resources, and I/O can be adapted to a wide range of digital functions. Within the semiconductor hierarchy, the XC7A75T is an Artix-7 FPGA, combining programmable logic, programmable I/O, embedded memory, DSP processing, clock management, and high-speed serial transceiver resources. This integration allows control, data acquisition, signal processing, and communication functions to be implemented in one device.
Key features include 75,520 logic cells, 300 I/O, a 0.95 V to 1.05 V operating-voltage range, and operation up to 85 °C. The Artix-7 architecture uses 28 nm CMOS technology and supports clocking resources including MMCM and PLL blocks. Its combination of logic density, memory, DSP capability, and I/O availability makes it useful for industrial controls, test equipment, embedded processing, communications, and signal-processing systems.
The device provides programmable logic blocks connected by an adaptive routing network, along with dedicated block RAM, DSP slices, clock-management resources, and high-speed I/O. The verified part data identifies a maximum clock frequency of 1098 MHz, although practical interface timing depends on the selected I/O standard, clock topology, speed grade, board implementation, and external components. Configuration, power sequencing, clocking, and decoupling must follow AMD guidance for the selected Artix-7 package.
Typical applications include industrial automation controllers, programmable measurement systems, embedded video and image-processing pipelines, communication gateways, and digital signal-processing platforms. The 300 available I/O support interfaces to external converters, memory, transceivers, and control logic, while 75,520 logic cells provide substantial parallel-processing capacity. The integrated DSP and memory resources can accelerate filtering, waveform generation, and data-shaping functions.
Designers should allocate the FBGA676 footprint and its ball grid carefully, provide stable power rails and high-quality decoupling, and follow the official Artix-7 package-pinout and PCB-design guidance. Clock inputs and high-speed interfaces require controlled impedance routing. Because FPGA routing and configuration affect timing closure, the final design must be validated with the appropriate AMD Vivado tools, device files, and timing constraints.
This page consolidates verified device attributes, distributor sourcing information, strict same-package drop-in alternatives, application guidance, and design cautions. It also distinguishes exact ordering-code changes from true pin-compatible replacements so engineers can migrate a 676-ball Artix-7 design without overlooking speed grade or temperature-range differences.
Alternatives de remplacement direct pour XC7A75T-1FGG676C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A75T-1FGG676C (même facteur de forme et même empreinte) — différant par Package Type.
XC7A75T-1FGG676I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A75T-2FGG676C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A75T-2FGG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A75T-1FGG676E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A75T-2FGG676E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A75T-1FGG676C Valeurs maximales et caractéristiques électriques
| Product Type | Artix-7 field-programmable gate array (FPGA) |
| Programmable Logic Cells | 75,520 cells |
| Device Family | Artix-7 |
| Process Technology | 28 nm CMOS |
| Operating Voltage Range | 0.95 V to 1.05 V |
| Fréquence d'horloge maximale | 1098 MHz |
| I/O Count | 300 I/O |
| Clock and Timing Resources | MMCM and PLL |
| Package Type | 676-ball FBGA |
| Package Pin Count | 676 balls |
| Speed Grade | -1 |
| Maximum Operating Temperature | 85 °C |
| Type de montage | Surface mount |
| Programmable Logic | Configurable digital logic and routing fabric |
| DSP Resources | Integrated DSP processing resources |
| Programmable I/O | 300 programmable I/O |
Guide de configuration des broches du XC7A75T-1FGG676C 676 balls
Configuration des broches du XC7A75T-1FGG676C (boîtier 676 balls). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A75T-1FGG676C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A75T-1FGG676C convient pour 6 applications: Industrial Automation Controller, Programmable Test and Measurement, Embedded Image Processing, Communications Gateway, Digital Signal Processing Platform, Embedded Control Platform.
Industrial Automation Controller
The XC7A75T-1FGG676C fits centralized machine-control equipment because its 75,520 logic cells can coordinate sequencing, interlocks, motion commands, and diagnostics while 300 I/O connect sensors, actuators, and field-bus transceivers. The integrated MMCM and PLL resources support deterministic clock distribution for sampled control and communication interfaces. Using the device between a fieldbus controller and real-time I/O expansion avoids separate logic devices and improves timing coordination. The commercial C grade is appropriate when the controller enclosure remains below its verified 85 °C maximum; otherwise, the 1FGG676I industrial variant should be selected.
Recommandé
Programmable Test and Measurement
The XC7A75T-1FGG676C is well suited to modular test systems that combine pattern generation, acquisition, timing control, and analysis in one FPGA. Its 300 I/O provide substantial parallel connectivity to converters, relays, fixture boards, and communication transceivers, while the programmable logic fabric can implement custom protocols and real-time decision logic. The integrated DSP resources accelerate filters and waveform transformations, reducing reliance on external processors. For instrument-grade timing, engineers must constrain all clock domains and validate skew, jitter, and I/O margins in the selected -1 speed grade rather than assuming logic-cell density alone guarantees throughput.
Recommandé
Embedded Image Processing
The XC7A75T-1FGG676C can implement parallel image pipelines for cameras, inspection equipment, and embedded vision because its 75,520 logic cells support filtering, thresholding, color conversion, and control functions. Its 300 I/O can connect image sensors, parallel frame-capture devices, and display or network interfaces, while DSP slices accelerate multiply-accumulate operations common in convolution and correction stages. A practical implementation should use DDR memory interfaces and pixel pipelines with explicit clock-domain crossing, then confirm timing through Vivado. The -2 grade is preferable if image-rate increases reduce timing margin, while the -1 grade can lower acquisition cost when the existing design meets timing.
Recommandé
Communications Gateway
The XC7A75T-1FGG676C supports communication gateways that must bridge or terminate several data streams while performing buffering and protocol conversion. Its 300 I/O and integrated high-speed transceiver capabilities make it suitable for parallel data paths, clock-domain isolation, and custom packet handling, while 75,520 logic cells leave room for flow control and monitoring functions. Board-level implementation must preserve the Artix-7 recommended power architecture and controlled-impedance routing for high-speed interfaces. The lower-cost -1 grade remains suitable when protocol timing has adequate margin; otherwise, migration to the -2 speed grade is the safer engineering choice.
Recommandé
Digital Signal Processing Platform
The XC7A75T-1FGG676C is appropriate for configurable DSP platforms because its 75,520-cell fabric supports parallel pipelines and its DSP resources accelerate multiply-accumulate operations used in filtering, modulation, and waveform synthesis. Multiple I/O can connect high-speed converters and memory, while clock-management blocks establish the required processing cadence. The device lets engineers partition functions among lookup tables, DSP slices, block RAM, and external memory instead of using a fixed-function processor. Timing closure must account for DSP and routing delays in the -1 grade; designs near the speed limit should use the -2 variant and be reanalyzed for power and signal integrity.
Recommandé
Embedded Control Platform
The XC7A75T-1FGG676C can act as the central programmable-logic platform in embedded control equipment that needs deterministic I/O, local memory, custom acceleration, and flexible firmware updates. Its 300 I/O support sensor conditioning interfaces, actuators, storage devices, and debug connections, while programmable logic can implement control loops alongside dedicated DSP operations. The FBGA676 package supports dense integration but demands careful layer-out, via placement, and decoupling according to AMD guidance. The commercial-temperature grade is suitable for controlled environments; ruggedized or industrial installations should instead use the 1FGG676I ordering code after thermal qualification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A75T-1FGG676C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A75T-1FGG676I | XC7A75T-2FGG676C | XC7A75T-2FGG676I | XC7A75T-1FGG676E | XC7A75T-2FGG676E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FBGA-676 | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same |
| Logic Cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells |
| Speed Grade | -1 | -1 | -2 | -2 | -1 | -2 |
| Temperature Option | Commercial, maximum 85 °C | Industrial, -40 °C to 100 °C | Commercial | Industrial, -40 °C to 100 °C | Extended temperature | Extended temperature |
| Process Technology | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS |
| Supply Voltage | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V | 0.95 V to 1.05 V |
| I/O Count | 300 I/O | 300 I/O | 300 I/O | 300 I/O | 300 I/O | 300 I/O |
| Clocking Resources | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL |
Principaux différenciateurs
- Commercial-temperature -1 speed grade (vs XC7A75T-1FGG676I)
- Lower acquisition cost positioning (vs XC7A75T-2FGG676C)
- Same-density package-compatible migration family (vs XC7A75T-2FGG676I)
Notes de conception
Use the official AMD FGG676 package file and current PCB-design guidance rather than reconstructing the ball grid from a generic BGA drawing. Preserve the 1.05 V maximum core-supply requirement, place decoupling capacitors at the specified power balls, and provide the required power-source topology. The verified data confirms a 676-ball FBGA package and 0.95 V to 1.05 V operating range; detailed via arrays, plane splits, and escape-routing dimensions must be obtained from the controlled AMD package and design documents before layout release.
Apply controlled-impedance routing to clocks, memory interfaces, and high-speed serial links, and keep return paths continuous beneath those structures. The 300-I/O device can create dense escape routing around a 676-ball package, so route the most restrictive interfaces first and preserve the reference-plane geometry through layer transitions. Specify external memory, transceiver, and connector models in Vivado so the tool evaluates board-level effects. Re-run static timing analysis after any speed-grade change because the -1 and -2 alternatives have different timing margins even though they share the FBGA676 footprint.
Estimate junction temperature from total FPGA power, package thermal characteristics, and the actual PCB copper rather than relying only on ambient temperature. The supplied data confirms a commercial maximum operating temperature of 85 °C for the target and identifies the industrial suffix as a path to -40 °C to 100 °C operation. Use the controlled AMD power-estimation methodology and package thermal model, account for airflow, and verify adjacent regulators and memory temperatures. An industrial temperature-grade device does not remove the need for an enclosure thermal design.
Do not treat a shared FBGA676 footprint as proof that every XC7A75T ordering code is an unrestricted substitute. The speed suffix changes timing performance and potentially power behavior, while the temperature suffix changes the qualified environmental range. XC7A75T-1FGG676I retains the -1 grade but targets industrial temperature; -2 variants improve timing but must be revalidated. The XC7A100T-2FGG676C also uses FBGA676 but has 101,440 logic cells, so it is not a parameter-close drop-in replacement for the 75,520-cell target.
Informations de conformité
The supplied verified results do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for the exact ordering code. These fields remain unknown rather than being inferred from FPGA family membership or temperature grade.