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מוצרים (38,000+)

XC7VX415T-2FF1158I - Virtex-7 XT FPGA 412K Logic | AMD
XC7VX415T-2FF1158I

XC7VX415T-2FF1158I - Virtex-7 XT FPGA 412K Logic | AMD

The AMD XC7VX415T-2FF1158I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7-series family, designed for demanding applications requiring high logic density, DSP throughput, and serial bandwidth. It is housed in a 1156-ball FCBGA package (FF1158) and operates over the industrial temperature range of -40°C to +100°C. The device delivers 412,160 logic cells, 32,440,320 RAM bits, and 350 user I/O pins, making it suitable for complex digital designs. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of configurable logic blocks (CLBs) connected via programmable interconnects, allowing them to implement arbitrary digital logic functions. They sit between ASICs (application-specific) and microprocessors (software-programmable) in the design hierarchy, offering hardware-level parallelism and reconfigurability. The Virtex-7 XT family is optimized for high-bandwidth, high-capacity applications. Key features of the XC7VX415T-2FF1158I include 412,160 logic cells, 32,200 CLBs, and 32,440,320 total RAM bits for data buffering. It provides 350 user I/O pins supporting high-bandwidth interfaces, and the -2 speed grade offers a balance of performance and power. The device also includes integrated DSP slices and high-speed transceivers, though specific transceiver counts require datasheet confirmation. The 1156-ball FCBGA package with 1.00 mm pitch enables dense PCB routing. Technically, the Virtex-7 XT architecture uses a 28nm high-k metal gate (HKMG) process, delivering high performance with lower power compared to older generations. The FPGA supports partial reconfiguration, advanced clock management, and a rich set of hard IP blocks. The -2 speed grade indicates a mid-range performance tier, suitable for designs that need high throughput without the power penalty of the fastest grade. Typical applications include wired and wireless communications infrastructure, data center acceleration, aerospace and defense signal processing, and high-performance computing. The high logic density and I/O count make it ideal for protocol bridging, packet processing, and beamforming. The industrial temperature range supports deployment in harsh environments. When designing with this FPGA, ensure adequate power supply decoupling and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Refer to the AMD Virtex-7 datasheet for detailed power and thermal specifications.

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XC7VX415T-2FFG1158I - Virtex-7 XT FPGA 412K Logic Cells | AMD
XC7VX415T-2FFG1158I

XC7VX415T-2FFG1158I - Virtex-7 XT FPGA 412K Logic Cells | AMD

The AMD XC7VX415T-2FFG1158I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) built on a 28 nm HKMG, high-performance low-power process. It delivers up to 412,160 logic cells, 350 user I/Os, and 32,440,320 block RAM bits, packaged in a 1156-ball FCBGA (FFG1158) package. This device is designed for demanding applications requiring high bandwidth, low latency, and efficient system integration. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement complex digital logic functions. They are a key category within programmable logic devices (PLDs), which also include CPLDs. FPGAs sit between ASICs (application-specific integrated circuits) and general-purpose processors in the semiconductor hierarchy, offering a balance of performance, flexibility, and time-to-market. Key features of the XC7VX415T-2FFG1158I include 48 GTH transceivers, an integrated PCIe Gen3 x8 block, and support for DDR3/DDR4 memory interfaces. The device operates at a core voltage of 1V and supports a wide range of I/O standards. The -2 speed grade indicates a high-performance variant, while the 'I' suffix denotes an industrial temperature range of -40°C to +100°C (Tj). Architecturally, the Virtex-7 XT family is optimized for high-bandwidth applications, with a balanced ratio of logic, DSP slices, and block RAM. The 28 nm process technology enables high logic density and low power consumption. The integrated PCIe block and high-speed transceivers reduce the need for external PHY components, simplifying board design and reducing BOM cost. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and test and measurement equipment. The device's high logic capacity and transceiver count make it suitable for protocol processing, beamforming, and radar signal processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a robust PCB layout with adequate vias for thermal dissipation. The device's configuration via JTAG or SPI flash should be planned early in the design cycle.

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XC7VX485T-1FFG1157C - Virtex-7 XT FPGA 485K Logic Cells | AMD
XC7VX485T-1FFG1157C

XC7VX485T-1FFG1157C - Virtex-7 XT FPGA 485K Logic Cells | AMD

The AMD XC7VX485T-1FFG1157C is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7 series family, designed for ultra high-end connectivity bandwidth, logic capacity, and signal processing capability. It features 485,760 logic cells, 37,969,920 block RAM bits, and 600 user I/Os, all housed in a 1156-ball FCBGA package (1157 pins including the thermal pad). The device operates with a core supply voltage of 1.0V (range 0.97V to 1.03V) and is built on 28nm technology. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the hierarchy of programmable logic devices (PLDs) and are used as an alternative to ASICs for applications requiring flexibility, rapid prototyping, or reconfigurable computing. The Virtex-7 XT family is optimized for high-bandwidth connectivity and DSP-intensive applications, offering a balance of logic density, serial transceivers, and memory resources. Key features of the XC7VX485T-1FFG1157C include 600 user I/Os, 37,969,920 bits of block RAM, and support for multiple clock management tiles (CMTs) with MMCM and PLL. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and backplane communication. The 1156-ball FCBGA package provides excellent thermal and electrical performance for high-power, high-speed designs. Technically, the Virtex-7 XT family leverages AMD's advanced 28nm HPL (High-Performance, Low-Power) process technology, balancing performance with power efficiency. The architecture includes configurable logic blocks (CLBs), DSP48E1 slices for high-speed arithmetic, and hardened memory controllers. The device supports partial reconfiguration and is supported by the Vivado Design Suite for synthesis, implementation, and bitstream generation. Typical applications include wired and wireless communications infrastructure, data center acceleration, aerospace and defense systems, and high-performance computing. The 600 I/Os and large logic capacity make it suitable for complex digital signal processing, protocol bridging, and custom compute acceleration. When designing with this device, ensure adequate power supply decoupling on the 1.0V core rail and follow AMD's PCB layout guidelines for the FCBGA package to manage signal integrity and thermal dissipation. The device requires configuration from an external memory device or via JTAG at power-up.

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XC7VX485T-2FF1927I - Virtex-7 XT FPGA 485K Cells | AMD Xilinx
XC7VX485T-2FF1927I

XC7VX485T-2FF1927I - Virtex-7 XT FPGA 485K Cells | AMD Xilinx

The AMD Xilinx XC7VX485T-2FF1927I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from the Virtex-7 XT family. It integrates 485,760 logic cells, 37,968 Kb of block RAM, and 600 user I/Os in a 1927-pin FCBGA package. Built on 28nm HKMG process technology, it operates at a core voltage of 1.0V and supports a wide range of high-speed serial transceivers and memory interfaces. An FPGA is a semiconductor device containing programmable logic blocks and programmable interconnects that can be configured after manufacturing to implement any digital circuit. FPGAs sit between ASICs and processors in the design hierarchy: they offer the parallelism and performance of custom hardware with the reconfigurability of software. The Virtex-7 XT family is optimized for high-bandwidth applications requiring massive parallel processing, such as data center acceleration, high-performance computing, and advanced signal processing. Key features include 485,760 logic cells, 37,968 Kb of block RAM, 600 user I/Os, and support for DDR3/DDR4 memory interfaces. The device integrates up to 96 transceivers supporting line rates up to 13.1 Gbps, enabling high-speed serial connectivity. The -2 speed grade provides a balanced performance-power trade-off, while the industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments. The Virtex-7 XT architecture combines a flexible CLB fabric with dedicated DSP48E1 slices, block RAM, and high-speed I/O. The 28nm HKMG process delivers high logic density with low power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include data center acceleration, high-performance computing, aerospace and defense signal processing, and advanced driver assistance systems (ADAS). The high transceiver count and memory bandwidth make it ideal for networking equipment, radar systems, and medical imaging. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The FCBGA package requires a robust PCB layout with adequate ground planes and thermal vias to dissipate heat effectively.

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XC7VX485T-2FFG1157I - Virtex-7 XT FPGA, 485K Logic Cells | AMD
XC7VX485T-2FFG1157I

XC7VX485T-2FFG1157I - Virtex-7 XT FPGA, 485K Logic Cells | AMD

The AMD XC7VX485T-2FFG1157I is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 XT family, built on 28nm technology. It delivers 485,760 logic cells, 600 user I/Os, and 37,969,920 block RAM bits, packaged in a 1156-ball FCBGA (FFG1157) with a 1V core voltage. This industrial-grade device is designed for demanding applications requiring maximum logic density, DSP throughput, and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit at the top of the programmable logic hierarchy, offering reconfigurable hardware acceleration that bridges the gap between fixed-function ASICs and general-purpose processors. The Virtex-7 XT family is AMD's flagship high-end FPGA series, optimized for ultra-high bandwidth, signal processing, and protocol-intensive applications. Key features include 600 I/O pins supporting multiple I/O standards, 37,969,920 bits of block RAM for on-chip data storage, and 485,760 logic cells for complex digital designs. The device operates from a 1V core supply, reducing power consumption while maintaining high performance. The FFG1157 package provides excellent thermal and electrical characteristics for high-density PCB integration. Technically, the Virtex-7 XT architecture integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed transceivers, and hardened IP blocks for PCIe, Ethernet, and DDR3/DDR4 memory interfaces. The 28nm HPL (High-Performance Low-Power) process technology balances speed and power efficiency, enabling sustained operation in thermally constrained environments. Typical applications include 10G-100G networking equipment, defense-grade signal processing, high-performance computing, and industrial automation. The device's massive logic capacity and I/O bandwidth make it ideal for protocol bridging, packet processing, and real-time data acquisition systems. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1V core rail requires a robust power delivery network with multiple decoupling capacitors to maintain signal integrity at high switching frequencies.

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XC7VX690T-1FFG1157C - Virtex-7 XT FPGA 693K Cells | AMD
XC7VX690T-1FFG1157C

XC7VX690T-1FFG1157C - Virtex-7 XT FPGA 693K Cells | AMD

The AMD XC7VX690T-1FFG1157C is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 XT family, built on 28nm technology. It features 693,120 logic cells, 600 user I/O pins, and 54,190,080 bits of block RAM, all housed in a 1157-pin FC-BGA package. This device is designed for demanding applications requiring high logic density, advanced DSP capabilities, and high-speed serial transceivers. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. FPGAs sit within the broader category of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for prototyping, low-volume production, and applications requiring hardware reconfigurability. Key features of the XC7VX690T-1FFG1157C include its 693K logic cells, 600 user I/Os, and 54.19 Mb of block RAM. The device operates at a core voltage of 1V and supports a wide range of I/O standards. It includes 80 DSP48E1 slices for high-performance digital signal processing, and up to 80 GTX transceivers for high-speed serial communication. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications. Technically, the Virtex-7 XT family is optimized for high-bandwidth and high-capacity applications. The 28nm HPL (High-Performance, Low-Power) process technology provides a good balance between performance and power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the FPGA. It also features advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation and distribution. Typical applications include high-performance computing, data center acceleration, wired and wireless communications, aerospace and defense systems, and medical imaging. The high logic density and transceiver count make it ideal for implementing complex algorithms, protocol processing, and high-throughput data paths. The 600 I/Os provide ample connectivity for external memory interfaces, high-speed ADCs/DACs, and other peripherals. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing and filtering. A robust PCB layout with adequate ground planes and decoupling capacitors is essential for reliable operation at high speeds. The FC-BGA package requires a reflow profile compatible with lead-free soldering.

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XC7VX690T-2FFG1157I - Virtex-7 XT FPGA 693K Logic Cells | AMD
XC7VX690T-2FFG1157I

XC7VX690T-2FFG1157I - Virtex-7 XT FPGA 693K Logic Cells | AMD

The AMD XC7VX690T-2FFG1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7 series family, fabricated on a 28nm process technology. It delivers 693,120 logic cells, 54,190,080 block RAM bits, and 600 user I/Os in a 1156-ball FCBGA (FFG1157) package. This device is engineered for ultra high-end connectivity bandwidth, logic capacity, and signal processing capability, addressing the most demanding high-performance applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used in electronic systems. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates, making them essential in aerospace, defense, automotive, industrial, and data center applications. Key features of the XC7VX690T-2FFG1157I include 600 user I/Os, 54,190,080 bits of block RAM, and 693,120 logic cells. The device operates at a core voltage of 1V and supports a wide range of I/O standards. The -2 speed grade provides a balanced performance-power trade-off, while the industrial temperature grade (I suffix) ensures operation from -40°C to +100°C, making it suitable for harsh environments. Technically, the Virtex-7 XT family integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened IP blocks for PCIe, Ethernet, and DDR3/DDR4 memory interfaces. The 28nm High-K Metal Gate (HKMG) process technology delivers high logic density and low power consumption. The device supports partial reconfiguration, enabling dynamic updates to specific logic regions without disrupting the entire design. Typical applications include high-performance computing, radar and signal intelligence systems, medical imaging, broadcast video processing, and wired/wireless communications infrastructure. The 600 I/Os and high logic capacity make it ideal for complex digital signal processing (DSP) and protocol bridging. When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and configuration bitstream security. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a reliable configuration source, such as an SPI flash or JTAG interface.

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XC7VX690T-2FFG1761I - Virtex-7 XT FPGA 693K Logic Cells | AMD
XC7VX690T-2FFG1761I

XC7VX690T-2FFG1761I - Virtex-7 XT FPGA 693K Logic Cells | AMD

The AMD XC7VX690T-2FFG1761I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 693,120 logic cells, 850 user I/Os, and 54,190,080 bits of block RAM, making it one of the most capable devices in the Virtex-7 family. The device is housed in a 1760-ball FCBGA (FFG1761) package and operates from a 1V core supply. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and general-purpose processors in the semiconductor hierarchy. They are used to implement custom digital logic, signal processing, and high-speed connectivity functions that would otherwise require dedicated silicon. Key features of the XC7VX690T-2FFG1761I include 850 user I/O pins, 54,190,080 bits of block RAM, and support for high-speed serial transceivers. The Virtex-7 XT family is optimized for high-bandwidth applications, offering up to 2.8 Tb/s of aggregate serial bandwidth. The device also includes hardened memory controllers, DSP slices, and clock management tiles (MMCM and PLL) for robust timing control. From a technical perspective, the Virtex-7 XT architecture combines a large programmable fabric with dedicated hard IP blocks. The 28nm HKMG (High-K Metal Gate) process enables high logic density and low power consumption relative to older nodes. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include data center acceleration, high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The high transceiver count and logic capacity make it suitable for protocol bridging, packet processing, and real-time signal processing workloads. When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and configuration bitstream security. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a reliable configuration source, such as a SPI flash or JTAG interface.

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XC7VX690T-2FFG1927I - Virtex-7 XT FPGA 693K Logic Cells | AMD
XC7VX690T-2FFG1927I

XC7VX690T-2FFG1927I - Virtex-7 XT FPGA 693K Logic Cells | AMD

The AMD XC7VX690T-2FFG1927I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7 series family, designed for ultra high-end connectivity bandwidth, logic capacity, and signal processing capability. It features 693,120 logic cells, 54,190,080 block RAM bits, and 600 user I/Os, packaged in a 1924-ball FCBGA (FFG1927) with an industrial temperature range (-40°C to +100°C). The device operates with a core supply voltage of 1.0V and supports high-speed serial transceivers, making it ideal for demanding applications such as data center acceleration, aerospace and defense, and high-performance computing. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs consist of programmable logic blocks, configurable interconnects, and I/O blocks, allowing designers to create custom hardware accelerators, protocol bridges, and complex digital systems. The Virtex-7 XT family is the highest-performance segment of the 7 series, offering the largest logic density and the most advanced features, including integrated DSP slices, block RAM, and high-speed transceivers. Key features of the XC7VX690T-2FFG1927I include 3,600 DSP slices for high-throughput signal processing, 54,190,080 bits of block RAM for on-chip data storage, and 600 user I/Os supporting various I/O standards. The device also includes 80 GTX transceivers capable of up to 12.5 Gbps, providing high-speed serial connectivity for PCIe, Ethernet, and other protocols. The -2 speed grade offers a balance between performance and power consumption, while the industrial temperature grade ensures reliable operation in harsh environments. Architecturally, the Virtex-7 XT FPGA is built on a 28nm high-k metal gate (HKMG) process technology, delivering high performance with lower power compared to previous generations. The device includes advanced clock management tiles (CMTs) with MMCM and PLL for precise clock generation, and supports partial reconfiguration for dynamic logic updates. The configurable logic blocks (CLBs) provide flexible logic implementation, and the integrated block RAM can be configured in various aspect ratios for efficient data storage. Typical applications include high-performance computing acceleration, radar and signal intelligence systems, medical imaging, and wired communications infrastructure. The high transceiver count and logic density make it suitable for implementing complex algorithms and high-bandwidth data paths. The industrial temperature range allows deployment in outdoor and automotive environments where temperature extremes are common. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the high power dissipation necessitates a heatsink or active cooling for sustained operation. Refer to the Virtex-7 FPGA data sheet and PCB design guidelines for detailed recommendations.

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XC7VX690T-2FFG1930I - Virtex-7 XT FPGA 693K Logic Cells | AMD
XC7VX690T-2FFG1930I

XC7VX690T-2FFG1930I - Virtex-7 XT FPGA 693K Logic Cells | AMD

The AMD XC7VX690T-2FFG1930I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 693,120 logic cells, 1,000 user I/O pins, and 54,190,080 block RAM bits, all housed in a 1924-ball FCBGA (FFG1930) package. This device is engineered for demanding applications requiring massive parallel processing, high-speed serial transceivers, and extensive logic resources. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Virtex-7 XT family sits at the high end of AMD's 7-series FPGA portfolio, positioned above the Artix and Kintex families, offering the highest logic density and transceiver count for system-level integration. Key features of the XC7VX690T-2FFG1930I include 693,120 logic cells, 1,000 user I/O pins, 54,190,080 bits of block RAM, and 80 GTX transceivers supporting data rates up to 12.5 Gbps. The -2 speed grade provides a balanced performance point, while the industrial temperature grade (-I) supports operation from -40°C to +100°C. The device operates from a 1.0V core voltage and is available in a 1924-ball FCBGA package with 1.0mm ball pitch. Architecturally, the Virtex-7 XT integrates advanced clock management tiles (CMTs), DSP48E1 slices for high-throughput digital signal processing, and PCIe hard blocks for system connectivity. The 28nm HPL (High-Performance Low-Power) process technology balances speed and power efficiency, making it suitable for both compute-intensive and power-sensitive designs. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include high-end wired communications (100G/400G line cards), data center acceleration, radar and electronic warfare systems, medical imaging, and broadcast video processing. The combination of high logic density, transceiver count, and I/O flexibility makes it ideal for ASIC prototyping and complex system-on-chip designs. When designing with this device, careful attention must be paid to power supply decoupling, with multiple 1.0V core rails and 1.8V auxiliary rails requiring proper filtering. The FCBGA package demands a multi-layer PCB with controlled impedance routing for high-speed transceivers and adequate thermal management for high-power operation.

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XC7Z010-1CL225I - 667MHz Dual Cortex-A9 SoC | AMD
XC7Z010-1CL225I

XC7Z010-1CL225I - 667MHz Dual Cortex-A9 SoC | AMD

The AMD XC7Z010-1CL225I is a Zynq-7000 adaptive SoC combining a dual-core ARM Cortex-A9 MPCore processor with an Artix-7 FPGA fabric in a 225-CSPBGA package. The device provides 28,000 logic cells, a stated operating frequency of 667 MHz, and an industrial temperature range of -40°C to +100°C. Its programmable logic and integrated processing system make it suitable for embedded control, industrial automation, communications, image processing, and compact edge systems. A Zynq-7000 SoC is a heterogeneous system-on-chip, combining an ARM microprocessor subsystem and programmable FPGA logic in one package. This integration reduces component count and allows software running on the Cortex-A9 processors to exchange data directly with hardware implemented in the FPGA fabric. The result is a flexible platform for systems that need deterministic parallel processing alongside a conventional embedded software environment. The XC7Z010-1CL225I provides two ARM Cortex-A9 cores, 28K FPGA logic cells, and a 667 MHz processor frequency. Its 225-CSPBGA package measures 13 mm by 13 mm according to distributor product data. The device operates from a nominal 1 V supply, with a stated minimum of 0.95 V and maximum of 1.05 V, and is identified as RoHS compliant. These characteristics position it as an entry-level Zynq device for designs requiring more parallelism than a conventional microcontroller provides. The architecture allows designers to partition a design between software and programmable logic. Software can manage operating-system tasks, control flow, and external interfaces, while the FPGA fabric can implement parallel data paths, custom interfaces, signal processing, or timing-critical functions. The available data identifies this device as a Zynq-7000 SoC with an Artix-7 FPGA fabric, but detailed block counts, memory interfaces, I/O counts, and power characteristics require confirmation from the AMD device documentation. Typical applications include industrial automation controllers, networked embedded gateways, motor and motion-control systems, communications equipment, sensor-processing platforms, and cost-sensitive FPGA-assisted processors. The dual Cortex-A9 configuration supports concurrent software workloads, while the FPGA fabric can accelerate operations that would otherwise burden the processor or require separate programmable logic. When designing a board around the XC7Z010-1CL225I, engineers must follow the AMD Zynq-7000 package pinout and power-sequencing guidance. The BGA footprint requires appropriate PCB layout, thermal analysis, and assembly process controls. Because the available distributor snippet provides limited electrical detail, final power budgeting, decoupling, DDR memory connectivity, and I/O standards must be verified against the official manufacturer documentation before release.

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XC7Z010-1CLG225I - Zynq-7000 SoC, 667MHz, 28K Logic Cells | AMD
XC7Z010-1CLG225I

XC7Z010-1CLG225I - Zynq-7000 SoC, 667MHz, 28K Logic Cells | AMD

The AMD XC7Z010-1CLG225I is a Zynq-7000 SoC integrating a dual-core ARM Cortex-A9 MPCore processor with an Artix-7 FPGA fabric in a 225-ball CSPBGA (13x13 mm) package. It operates at a maximum processor frequency of 667 MHz and provides 28K logic cells, making it a versatile platform for embedded systems requiring both software programmability and hardware acceleration. A System-on-Chip (SoC) combines a processor (CPU) with other system components such as memory controllers, peripherals, and programmable logic on a single die. The Zynq-7000 family specifically merges a hard ARM processing system (PS) with a programmable FPGA fabric (PL), enabling designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microcontrollers and FPGAs, offering the flexibility of programmable logic with the ease of software development. Key features include dual ARM Cortex-A9 cores with NEON and CoreSight debug, 28K Artix-7 logic cells, 667 MHz maximum frequency, and industrial temperature range (-40°C to +100°C). The device supports a nominal supply voltage of 1.0V (0.95V to 1.05V) and includes integrated memory controllers, DMA, and a rich set of peripherals. The CLG225 package provides a compact footprint suitable for space-constrained designs. The Zynq-7000 architecture separates the PS and PL, allowing independent clocking and power management. The PS includes a DDR3/DDR3L memory controller, Gigabit Ethernet, USB 2.0, and SDIO interfaces, while the PL provides configurable logic, DSP slices, and block RAM. This separation enables optimized performance and power efficiency for heterogeneous workloads. Typical applications include industrial motor control, software-defined radio, medical imaging, and automotive driver assistance systems. The combination of ARM processing and FPGA fabric makes it ideal for real-time control, signal processing, and protocol bridging. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO) require proper filtering and sequencing to ensure reliable startup and operation. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.

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XC7Z010-1CLG400C - 667MHz Zynq SoC, 28K Logic | AMD
XC7Z010-1CLG400C

XC7Z010-1CLG400C - 667MHz Zynq SoC, 28K Logic | AMD

The AMD XC7Z010-1CLG400C is a Zynq-7000 All Programmable System on Chip integrating a dual-core Arm Cortex-A9 processor, 667 MHz processor operation, and 28,000 FPGA logic cells in a 400-CSBGA package measuring 17 mm by 17 mm. It combines programmable hardware with software-controlled processing for embedded systems, industrial control, communications, image processing, and hardware-accelerated applications. The device also provides 35,200 registers, 240 Kbit of block RAM, 80 multipliers, 60 block RAM resources, 80 dedicated DSP slices, and up to 128 user I/Os, according to the supplied technical data. What is a Zynq-7000 All Programmable SoC? A system on chip, or SoC, combines multiple functional subsystems into one integrated semiconductor. In this case, the XC7Z010-1CLG400C integrates an Arm Cortex-A9 MPCore processing system with CoreSight debug support and Artix-7 FPGA logic. This hierarchical relationship places the device between a conventional microprocessor and a programmable-logic accelerator, allowing software tasks and parallel hardware pipelines to share one package. The principal features are the dual Arm Cortex-A9 cores, 667 MHz operation, and 28K programmable logic cells. The supplied data also identifies 240 Kbit of RAM, 80 multipliers, 60 block RAMs, 80 dedicated DSP slices, two Ethernet MACs, and support for differential I/O standards including LVDS, SSTL, and HSTL. These resources make the device suitable for systems that need deterministic hardware pipelines alongside general-purpose software. The FPGA fabric provides programmable parallel logic for acquisition, filtering, protocol conversion, video processing, and cryptographic workloads. The processor subsystem supports software applications and operating-system-based control, while the DSP, block RAM, and Ethernet resources can accelerate data-intensive operations without requiring separate programmable-logic devices. The 400-CSBGA package exposes up to 128 user I/Os for board-level connectivity. Typical uses include industrial factory controllers, networked embedded gateways, camera and image-processing systems, communications equipment, data-acquisition platforms, and compact control systems. The integrated architecture can reduce the number of external chips when software control and FPGA acceleration are both required. The 667 MHz processor and parallel fabric provide a flexible split between sequential software processing and hardware pipelines. Designers should verify power sequencing, signal-integrity requirements, differential I/O implementation, thermal conditions, and the complete pinout against the AMD documentation. The supplied data does not provide a manufacturer datasheet URL, exact voltage limits, operating-temperature range, or detailed package dimensions, so those values are not inferred here. This product data consolidates verified distributor and comparison information with practical selection context, package identity, core architecture, programmable resources, and application guidance for engineers evaluating the XC7Z010-1CLG400C.

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XC7Z015-1CL485I - 74K Zynq SoC FPGA 667MHz | AMD
XC7Z015-1CL485I

XC7Z015-1CL485I - 74K Zynq SoC FPGA 667MHz | AMD

The AMD XC7Z015-1CL485I is a Zynq-7000 system-on-chip FPGA combining a dual-core Arm Cortex-A9 processor with 74K Artix-7 FPGA logic cells in a 484-CSPBGA package operating at 667 MHz. It integrates programmable logic, dual-core Arm processing, memory interfaces, and high-speed connectivity for embedded control, industrial automation, communications, and edge-processing systems. The verified distributor description identifies the device as a system-on-chip with dual Arm Cortex-A9 MPCore and CoreSight technology. A Zynq-7000 SoC FPGA is more than a conventional FPGA: it combines a hard processor subsystem with programmable logic in one device. This heterogeneous architecture allows software tasks to run on the Arm processor while dedicated hardware accelerates parallel logic, interface, signal-processing, or control functions. The XC7Z015-1CL485I belongs to the Zynq-7000 family and is identified by the 74K logic-cell configuration. Key verified characteristics include dual Arm Cortex-A9 MPCore processing, CoreSight debug support, 74K FPGA logic cells, 667 MHz operation, and a 484-CSPBGA package measuring 19 x 19 mm. These attributes make the part suitable for embedded systems that need both sequential software execution and programmable hardware. Its integrated architecture can reduce external component count compared with separate processor and FPGA implementations. The device is supplied under the exact ordering code XC7Z015-1CL485I. The verified distributor records show product availability, pricing, inventory, and SoC FPGA descriptions, while the exact electrical limits, temperature ratings, memory interfaces, I/O standards, and power characteristics are not provided in the supplied data. Engineers should therefore verify the complete manufacturer datasheet and package pinout before finalizing a design. Typical applications include industrial factory control, network-connected embedded systems, camera and image-processing front ends, robotics, communications equipment, and low-power edge computing. The processor subsystem is suitable for control software, networking stacks, and operating-system support, while the programmable fabric handles parallel datapaths, interfaces, or accelerators. A critical design consideration is the dense BGA package and its many power, ground, and high-speed pins. PCB layout, decoupling, bank voltage planning, signal integrity, and thermal management must be developed against the official package information. This page summarizes verified distributor information and identifies parameters requiring manufacturer-data confirmation before release to fabrication. This page combines exact distributor metadata, application guidance, package considerations, and sourcing information intended to help engineers evaluate XC7Z015-1CL485I efficiently while avoiding unsupported technical assumptions.

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XC7Z015-2CL485I - Zynq-7000 SoC, Dual Cortex-A9, 74K Logic Cells | AMD
XC7Z015-2CL485I

XC7Z015-2CL485I - Zynq-7000 SoC, Dual Cortex-A9, 74K Logic Cells | AMD

The AMD XC7Z015-2CL485I is a Zynq-7000 All Programmable SoC integrating a dual-core ARM Cortex-A9 MPCore processing system with CoreSight debug and 74K Artix-7 FPGA logic cells, housed in a 484-pin CSPBGA (19x19 mm) package. According to AMD/Xilinx product pages, the device runs at up to 766 MHz on the application processor side and combines hard-core peripherals (DDR controller, USB, Gigabit Ethernet, SD/SDIO, CAN, SPI, I2C, UART) with 74K logic cells, 46,200 LUTs and ~3.5 Mb of block RAM in the programmable logic. The XC7Z015-2CL485I is part of the Z-7015 speed/temperature family (industrial, 766 MHz). It targets embedded designs that need deterministic ARM processing alongside custom RTL acceleration, without external CPU + FPGA partitioning. An SoC (System on Chip) is an integrated circuit that consolidates a microprocessor, memory, peripherals, and often programmable logic into a single die. In the Zynq-7000 family the terminology hierarchy is: SoC > All-Programmable SoC > ARM + FPGA heterogeneous device > Zynq-7000 series > Zynq-7015 sub-family. The 7000S class in the same generation uses a single-core Cortex-A9, whereas Z-7015/7030/7045/7100 parts are dual-core; the XC7Z015 sits at the low end of the dual-core Zynq-7000 family with 74K logic cells, while the XC7Z030/045/100 scale up to 125K-444K cells. Key features include a hard DDR3/DDR3L memory controller with ECC support, two ARM Cortex-A9 cores with NEON extensions and Floating Point Unit, and 95 user I/O pins (the constraint in the 484-CSPBGA package). Programmable logic resources include 74K logic cells (Artix-7 fabric), ~3.5 Mb of block RAM, and 220 DSP slices. Built-in peripherals include two Gigabit Ethernet MACs, two USB 2.0 OTG ports, two CAN 2.0B controllers, two I2C, two SPI, two UART, two SD/SDIO, and GPIO. The 484-CSPBGA (19x19 mm) industrial-grade package supports operation from -40C to +100C and uses a Cavity-Lead BGA construction with flip-chip silicon for improved thermal performance. A common design pitfall is the chip-density distinction: -2 is the standard speed grade while -3 is the high-performance grade. Both share identical pinout and may co-exist on the same PCB; some logic timing paths fail closure at -2 that succeed at -3, so designs targeting the Zynq PS at 766 MHz must be validated against the -2 timing model. Power architecture typically uses a TPS6508640 or similar PMIC and decoupling must follow UG585/Z-7015 placement diagrams. Typical applications include industrial motor control (Bldc/FOC with ARM and DSP slices), machine vision smart cameras (Cortex-A9 + image pipeline in fabric), IoT edge gateways with deterministic ARM software + custom interfaces, Software Defined Radio (data pipes to RF ADCs/DACs), automotive driver assistance, and avionics/industrial control. The wide temperature range plus integrated PCIe Gen2 makes it ideal for ruggedized designs. When designing with this SoC, allocate PS peripherals carefully because the 7015 has fewer PL-side HP/HR ports than larger Zynq parts; the 484-CSPBGA constrains MIO/EMIO usage. Verify fabric timing against your synthesis results at the -2 speed grade even if a -1 (which the 7015 does not offer) prototype is treated as the target. Plan thermal dissipation: industrial -40C to +100C operation requires the CSPBGA thermal pad to be soldered to a PCB thermal via array per AMD application notes. This page synthesizes distributor pricing (LCSC, DigiKey, Avnet), drop-in alternatives from the same Xilinx Z-7015 family (so designers can pick the right speed/temperature bin), and practical design guidance that goes beyond the manufacturer's datasheet summary.

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XC7Z020-1CLG484I - Zynq-7000 SoC 667MHz Dual ARM Cortex-A9 | AMD/Xilinx
XC7Z020-1CLG484I

XC7Z020-1CLG484I - Zynq-7000 SoC 667MHz Dual ARM Cortex-A9 | AMD/Xilinx

The AMD/Xilinx XC7Z020-1CLG484I is a Zynq-7000 All Programmable System-on-Chip (AP SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with 667MHz core clock, together with Artix-7 programmable logic of 85K logic cells, all housed in a 484-ball CSBGA (CLG484) package measuring 19x19 mm. It is the -1 speed grade, industrial temperature range variant of the XC7Z020 family. A SoC FPGA such as the Zynq-7000 is a single silicon device that fuses a hard processor subsystem (HSS) and a soft FPGA fabric. The processor subsystem runs software (Linux, RTOS, bare-metal), while the programmable logic provides hardware acceleration, custom I/O, and parallel data-path extensions. Zynq-7000 devices sit within the broader taxonomy of heterogeneous compute devices, alongside MPSoC and Versal Adaptive SoC families from AMD/Xilinx. This hybrid architecture is ideal for embedded systems that require both deterministic real-time control and high-throughput data processing. Key features include dual ARM Cortex-A9 cores with NEON SIMD and single/double precision FPU, on-chip L1 caches (32 KB I-cache, 32 KB D-cache per core) and 512 KB L2 cache, integrated Memory Controller for DDR3/DDR3L/LPDDR2, dual USB 2.0 OTG, dual Gigabit Ethernet MACs, dual SD/SDIO controllers, and 2x UART, 2x SPI, 2x I2C peripheral interfaces. The integrated Artix-7 FPGA fabric includes 85K logic cells, 4.9 Mb block RAM, and 220 DSP slices. The Zynq-7000 architecture uses a tightly coupled AXI interconnect between the PS and PL, allowing hardware-accelerated peripherals to communicate with the processor at high bandwidth with predictable latency. The CLG484 package exposes multiple high-performance (HP) and high-range (HR) I/O banks for DDR interfacing and general-purpose I/O. Typical applications include industrial motor drives, machine vision, software-defined radio, ADAS driver assistance systems, medical imaging, and embedded vision. The wide temperature range and -1 speed grade make the XC7Z020-1CLG484I well suited for industrial control and factory automation. When designing with this device, careful attention must be paid to PCB layout, power-rail sequencing, and DDR signal integrity. Use Vivado Design Suite and Vitis for hardware/software co-design, and refer to the official Zynq-7000 datasheet (DS187) and PCB design guide (UG933). This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $45.94 במלאי
XC7Z020-2CLG484I - Zynq-7000 SoC 85K Logic Cells | AMD
XC7Z020-2CLG484I

XC7Z020-2CLG484I - Zynq-7000 SoC 85K Logic Cells | AMD

The AMD XC7Z020-2CLG484I is a Zynq-7000 All Programmable SoC (AP SoC) integrating a dual-core ARM Cortex-A9 MPCore processor with an Artix-7 class FPGA fabric in a single 484-ball CSPBGA (19x19 mm) package. The processor subsystem runs at up to 766 MHz with CoreSight debug, while the programmable logic provides 85,000 logic cells, 53,200 LUTs, 106,400 flip-flops, 220 DSP slices, and 4.9 Mb of block RAM. A System on Chip (SoC) is an integrated circuit that consolidates processor, memory controllers, peripherals, and programmable hardware on a single substrate. The Zynq-7000 family pairs an ARM-based processing system (PS) with programmable logic (PL) over high-bandwidth AXI interfaces, reducing board space, power, and system complexity versus discrete processor-plus-FPGA solutions. Key features include a DDR3/DDR3L memory controller with ECC, USB 2.0, Gigabit Ethernet, and support for I/O voltages of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. The -2 speed grade supports up to 766 MHz PS operation and 200 MHz+ fabric clocking. The industrial temperature grade (-40C to +100C) targets harsh environments. Architecturally, the PS and PL are independent power domains with defined sequencing requirements (VCCINT, VCCAUX, VCCBRAM, VCCO). The device supports partial reconfiguration, allowing dynamic PL updates while the PS continues running. The memory controller delivers robust DDR3/DDR3L with ECC for industrial and automotive-class designs. Typical applications include motor control, industrial automation, software-defined radio, video processing, and embedded vision. The device suits real-time processing with hardware acceleration, such as machine vision and high-speed data acquisition. Design consideration: ensure correct power-rail sequencing and provide a configuration source (QSPI flash) and PS clock; refer to the Zynq-7000 TRM (UG585) for detailed guidance. Pricing from $60.07 (LCSC, as of 2026-08-29).

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XC7Z030-1FB484I - 667MHz Zynq SoC | AMD | Industrial FPGA
XC7Z030-1FB484I

XC7Z030-1FB484I - 667MHz Zynq SoC | AMD | Industrial FPGA

The AMD XC7Z030-1FB484I is a Zynq-7000 Kintex-7 system-on-chip FPGA with 125K logic cells, dual ARM Cortex-A9 MPCore processors operating at 667 MHz, and CoreSight debug support, housed in a 484-FCBGA package measuring 23 x 23 mm. It combines programmable FPGA logic and a hard processor subsystem in one device, making it suitable for embedded control, industrial automation, networking, signal processing, and connected systems. A Zynq-7000 SoC FPGA integrates a programmable logic section with one or more ARM Cortex-A9 processors. The processor subsystem executes software, while the FPGA fabric implements parallel datapaths, custom interfaces, protocol engines, and control logic. This combination allows designers to place software-controlled functions and hardware-accelerated operations in one package instead of using a separate processor and FPGA. The XC7Z030-1FB484I provides 125K logic cells and a 667 MHz processor frequency according to the verified distributor listing. The part is identified as a speed-grade-1, industrial-temperature device by the verified FPGA Market listing. Its 484-FCBGA package provides 484 terminals in a 23 x 23 mm surface-mount format. Exact pin names, electrical limits, I/O standards, memory configuration, and power requirements were not included in the supplied source data and must be confirmed in the manufacturer datasheet. Typical designs use the programmable fabric for high-throughput parallel processing and the Cortex-A9 subsystem for operating-system support, networking, control loops, or application workloads. The integrated architecture can simplify a board-level partition when software and programmable logic must exchange data frequently. Engineers should still budget for external memory, clocking, power regulation, signal conditioning, and thermal management where the selected design requires them. The most important layout consideration is package escape routing. A 484-ball BGA device requires a substrate or PCB with compatible ball geometry, via-in-pad or fanout strategy, controlled impedance, and an assembly process capable of handling the package pitch. Verify the exact pinout and I/O assignments against AMD package documentation before schematic capture or PCB release. This page consolidates verified distributor and cross-reference results, separates confirmed specifications from missing parameters, and provides engineering guidance for evaluating this industrial Zynq SoC FPGA. It does not infer a drop-in replacement unless a manufacturer or distributor explicitly verifies the same package and pin compatibility.

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XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
XC7Z030-1FBG484I

XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD

The AMD XC7Z030-1FBG484I is a Zynq-7000 SoC integrating a dual-core ARM Cortex-A9 MPCore processor with a Kintex-7 FPGA fabric. It features 125K logic cells, 667MHz maximum processor frequency, and comes in a 484-pin FCBGA package (23x23mm). This SoC combines the programmability of an FPGA with the performance of an embedded processor, enabling flexible system design for a wide range of applications. A System-on-Chip (SoC) integrates a processor, memory, and peripherals onto a single die, reducing board space and power consumption while improving reliability. The Zynq-7000 family specifically combines a hard ARM processor subsystem with programmable logic, allowing hardware acceleration and custom I/O. This hybrid architecture is ideal for applications requiring both high-level operating system support and real-time, low-latency processing. Key features include 125K logic cells, 667MHz dual-core ARM Cortex-A9, 256KB on-chip memory, and support for DDR3/DDR3L memory interfaces. The device also offers high-speed transceivers, PCIe Gen2, and multiple I/O standards. The -1 speed grade indicates a base performance level, while the I suffix denotes industrial temperature range (-40°C to +100°C). The Zynq-7000 architecture separates the processing system (PS) from the programmable logic (PL), connected via high-bandwidth AXI interfaces. This allows designers to optimize software and hardware independently. The PS includes a memory management unit, DMA controllers, and a rich set of peripherals, while the PL provides flexible logic resources for custom accelerators and interfaces. Typical applications include software-defined radio, industrial motor control, automotive driver assistance, and high-performance embedded computing. The combination of ARM processing and FPGA fabric makes it suitable for edge computing, where low latency and high throughput are critical. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and proper power-on sequencing to avoid latch-up. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.

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XC7Z030-1FF676I - Dual-Core ARM Zynq SoC | AMD | 676-FCBGA
XC7Z030-1FF676I

XC7Z030-1FF676I - Dual-Core ARM Zynq SoC | AMD | 676-FCBGA

The AMD XC7Z030-1FF676I is a Zynq-7000 Kintex-7 system-on-chip combining a dual-core ARM Cortex-A9 MPCore processor with programmable Kintex-7 FPGA logic, 125K logic cells, a 667 MHz processor clock, and a 676-ball FCBGA package measuring 27 mm by 27 mm. The matched industrial-ordering designation XC7Z030-1FFG676I is listed by DigiKey with the same 125K logic-cell and 667 MHz configuration in the 676-FCBGA package. A Zynq system-on-chip is an FPGA SoC that integrates a hard microcontroller subsystem with programmable FPGA fabric. In the product hierarchy, it is a programmable-logic device, FPGA and CPLD, and heterogeneous SoC combining an ARM processor with Kintex-7 FPGA resources. This integration allows software-controlled functions and hardware data paths to operate in one device while reducing the number of external devices required in an embedded system. The verified device listing identifies two ARM Cortex-A9 MPCore processors, CoreSight debug support, Kintex-7 FPGA logic, 125K logic cells, and a 667 MHz clock. The 676-FCBGA package provides a high-pin-count interconnect for programmable logic I/O, memory interfaces, high-speed serial links, and processor peripherals. Because the target is a high-density BGA, its footprint, ball map, power distribution, and escape routing must be controlled during PCB layout. The exact Xilinx ordering code carries meaningful configuration information, but the supplied web records do not expose the complete electrical tables, memory-map details, transceiver characterization, or power-sequencing requirements. Engineers should therefore obtain the official manufacturer datasheet and device-specific design documentation before finalizing voltage rails, decoupling, clocking, PCB stack-up, and signal-integrity simulations. The visible distributor records also contain a naming difference between the requested XC7Z030-1FF676I and the commonly indexed XC7Z030-1FFG676I, which should be reconciled against the manufacturer ordering guide. Typical Zynq-7000 applications include industrial control and automation, communications equipment, embedded vision, data acquisition, networking appliances, and test systems that benefit from combining an ARM operating environment with parallel programmable logic. In such systems, the processor can manage control software and external interfaces while FPGA fabric implements time-critical data paths, protocol acceleration, signal conditioning, or custom interfaces. PCB design is the principal implementation consideration for this 676-ball device. Use the manufacturer-defined ball map and escape-routing methodology, provide continuous power and ground planes, and place decoupling capacitors close to the relevant supply balls. Do not infer pin compatibility from package dimensions alone: the AMD support result specifically raises uncertainty between closely related Zynq ordering codes, so ball assignment, voltage levels, and device configuration must be checked before substitution. This page consolidates verified distributor specifications, documented ordering variants, package information, pricing, and replacement constraints into a design-oriented summary. It also distinguishes verified drop-in candidates from broader functional alternatives and avoids assigning unpublished electrical specifications or an unverified 676-ball pin map.

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XC7Z030-1SB485I - 667MHz Zynq SoC | AMD | Industrial Control
XC7Z030-1SB485I

XC7Z030-1SB485I - 667MHz Zynq SoC | AMD | Industrial Control

The AMD XC7Z030-1SB485I is a Zynq-7000 Kintex-7 system-on-chip with dual ARM Cortex-A9 MPCore processors operating at 667 MHz, 125,000 FPGA logic cells, and a 484-FCBGA package measuring 19 x 19 mm. The device combines programmable FPGA logic, ARM processing, memory interfaces, and connectivity in one high-integration package. A Zynq SoC is a heterogeneous embedded-processing device: the hard processor system executes operating-system and application software, while the Kintex-7 FPGA fabric implements parallel hardware, custom interfaces, accelerators, and real-time logic. This combination allows control software and hardware data paths to operate within one device, reducing board-level component count compared with separate FPGA and processor solutions. Key verified features include two ARM Cortex-A9 MPCore processors, CoreSight debug support, a 667 MHz processor clock, and approximately 125K Kintex-7 logic cells. The supplied distributor records identify the package as 484-FCBGA in a 19 x 19 mm body. Additional device details such as I/O count, memory-interface ratings, power rails, and automotive qualification are not supplied in the verified data and must be confirmed in the manufacturer documentation before schematic release. The FPGA fabric is suitable for parallel image-processing stages, protocol conversion, data acquisition, control logic, and hardware acceleration. The ARM subsystem supports embedded Linux, real-time operating systems, control loops, networking stacks, and supervisory software. Designers can partition functions between software and programmable logic according to latency, parallelism, and update requirements rather than forcing every operation into either domain. Typical implementations include industrial controllers, machine vision, test and measurement systems, embedded networking equipment, communications infrastructure, and high-performance embedded appliances. Programmable FPGA logic can accelerate filtering, protocol framing, or interface conversion, while the ARM subsystem manages configuration, telemetry, control, and application services. A new design should begin with the exact AMD device documentation and pin-level package information. The BGA footprint requires dense escape routing, many decoupling connections, careful power planning, and manufacturing controls capable of handling the 484-contact package. Because those electrical and layout requirements are not present in the supplied snippets, engineers must obtain the official datasheet, package files, schematic guidance, and board-design requirements before layout. This page combines verified distributor specifications and sourcing information with structured engineering guidance. It distinguishes confirmed facts from unavailable parameters, avoiding invented memory, power, I/O, and compliance claims while identifying the exact resources needed to qualify a production design.

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XC7Z030-2FB484I - Zynq-7000 SoC 800MHz Kintex-7 FPGA 484-FCBGA | AMD
XC7Z030-2FB484I

XC7Z030-2FB484I - Zynq-7000 SoC 800MHz Kintex-7 FPGA 484-FCBGA | AMD

The AMD Xilinx XC7Z030-2FB484I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with Kintex-7 based programmable logic on a single 28nm device, packaged in a 484-ball FCBGA (23x23 mm) and rated for the industrial -40C to +100C temperature range. The SoC combines a hardened processing subsystem (PS) running up to 800 MHz with a Kintex-7 fabric delivering 125K logic cells, making it a heterogeneous compute device for embedded vision, industrial control, and software-defined radio applications. The 'I' suffix indicates industrial temperature grade and the '2' speed grade denotes a mid-tier performance bin, balancing static timing margin against power consumption. What is a Zynq SoC? A Zynq-7000 System-on-Chip is a heterogeneous device that pairs ARM Cortex-A9 application processor cores with Xilinx Kintex-7 (or Artix-7) FPGA fabric through high-bandwidth AXI interconnects. Unlike a pure FPGA, the Zynq boots and runs C/C++ code natively while exposing programmable logic for hardware acceleration, custom peripherals, and parallel DSP pipelines. It sits in the hierarchy: Zynq-7000 -> SoC -> embedded processor + FPGA hybrid -> semiconductor device, and is widely used in embedded computing platforms including ZC702 evaluation boards and custom carrier cards. Key architectural features include dual Cortex-A9 cores with NEON SIMD and single/double precision floating point, ARM CoreSight debug, hardware block RAM (BRAM), DSP48E1 slices, multiplexed I/O (MIO) and extended MIO (EMIO), and integrated memory controllers supporting DDR3/DDR3L/LPDDR2. The Kintex-7 fabric provides 125K logic cells, approximately 9.4 Mb of block RAM, and DSP48E1 slices suitable for FIR filters, FFT engines, and high-throughput signal processing. The part integrates GTX (Gigabit Transceiver) hard IP for multi-gigabit serial links in the higher-density Zynq-7000 family variants. Typical applications include machine vision and video pipelines, software-defined radio (SDR) baseband, industrial motor control with EtherCAT, ADAS prototyping, medical imaging front-ends, and custom embedded compute platforms where Linux or RTOS runs on the Cortex-A9 while the FPGA fabric accelerates PCIe, custom I/O, or DSP functions. The 800 MHz Cortex-A9 frequency enables real-time control loops and multimedia workloads. Power-supply decoupling follows Xilinx ug583, and PCB signal-integrity routing follows ug583/ug587 guidance for the MIO/EMIO DDR interfaces. When designing with this part, ensure your Vivado Design Suite and Vitis IDE versions match the silicon revision listed in the device DNA register. Pin-compatible same-package Zynq-7000 variants allow migration up or down the family (Z-7010/Z-7015/Z-7020/Z-7030/Z-7035/Z-7045/Z-7100) on the same 484-ball FCBGA footprint, enabling platform reuse across SKUs. This page synthesizes drop-in package-compatible alternatives, parametric comparison data, and practical PCB design notes specific to the XC7Z030-2FB484I - context not assembled on any single distributor product page.

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XC7Z030-2FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
XC7Z030-2FBG484I

XC7Z030-2FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD

The AMD XC7Z030-2FBG484I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including software-defined radio, industrial automation, and automotive driver assistance systems. The device is housed in a 484-pin FCBGA package (23x23 mm) and operates over the industrial temperature range of -40°C to +100°C. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically combines a hard processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microprocessors and FPGAs, enabling high-performance, low-latency processing for demanding embedded applications. Key features of the XC7Z030-2FBG484I include 125,000 logic cells, a dual-core ARM Cortex-A9 processor running at up to 800 MHz, and support for 1.2V to 3.3V I/O standards. The device also includes 256 KB of on-chip memory, integrated PCIe, and multiple high-speed transceivers. These features provide a powerful and flexible platform for implementing complex digital systems. From a technical perspective, the XC7Z030-2FBG484I is fabricated using a 28nm process technology, which balances performance and power efficiency. The processing system includes a memory management unit, L1 and L2 caches, and a wide range of peripherals, while the programmable logic is based on the Kintex-7 architecture, offering high logic density and DSP capabilities. This combination allows for the implementation of sophisticated algorithms and interfaces. Typical applications for the XC7Z030-2FBG484I include software-defined radio, where the programmable logic handles baseband processing and the ARM cores run protocol stacks; industrial motor control, where the FPGA implements high-speed PWM and the processor handles communication; and medical imaging, where the device accelerates image processing algorithms. The device's high-speed transceivers also make it suitable for video and network processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 484-pin FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power consumption can be significant, so a proper heatsink or active cooling solution may be necessary for high-performance applications.

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XC7Z030-2FF676I - Dual Cortex-A9 Zynq-7000 SoC | AMD
XC7Z030-2FF676I

XC7Z030-2FF676I - Dual Cortex-A9 Zynq-7000 SoC | AMD

AMD XC7Z030-2FF676I is a Zynq-7000 system-on-chip combining dual Arm Cortex-A9 MPCore processors with Kintex-7 FPGA logic in a 676-FCBGA package. The supplied distributor data identifies 125K logic cells, an 800 MHz processor operating frequency, and a 27 x 27 mm package, making the device suitable for embedded control, programmable logic, video processing, industrial automation, and communications systems. The FPGA fabric and hard processor operate within one package and share memory and programmable interfaces. A system-on-chip is an integrated semiconductor that combines a programmable logic device with one or more hard processors. In the Zynq-7000 hierarchy, the FPGA fabric belongs to the Kintex-7 family, while the processor subsystem uses dual Arm Cortex-A9 MPCore technology. This integration reduces the number of separate devices and interconnects required for a processor-plus-FPGA design, but software, power delivery, thermal management, and board-level validation remain substantial engineering tasks. The XC7Z030 device provides 125K logic cells and an 800 MHz CPU according to the verified AMD and distributor listings. Its integrated 676-FCBGA package supports high-density connections among the programmable logic, processors, memory interfaces, and external I/O. The -2 designation identifies the device speed grade, while the final I suffix identifies the industrial-temperature ordering variant. Exact core voltage limits, memory data rates, transceiver capabilities, and detailed I/O characteristics must be confirmed in the AMD Zynq-7000 SoC datasheet and package documentation. The integrated FPGA fabric can accelerate parallel workloads such as image preprocessing, protocol handling, sensor data acquisition, and deterministic control pipelines. The dual Cortex-A9 subsystem is better suited to operating systems, networking stacks, control software, and human-interface logic. Designers can assign workloads between software and programmable logic, although the exact partition depends on timing, memory bandwidth, power, and tool-flow constraints. Typical applications include industrial machine vision, industrial automation controllers, networked embedded gateways, test and measurement systems, communications equipment, and high-performance embedded processing. In each case, the benefit comes from combining general-purpose Linux or bare-metal software with hardware parallelism in one device. A new design should still verify software support, memory-device compatibility, external clock requirements, and available board resources. The primary design consideration is power delivery to a large FCBGA device. Multiple voltage rails, high-current paths, decoupling, thermal vias, controlled-impedance routing, and a multilayer PCB are normally required. Designers should not infer complete pin compatibility or performance from a distributor family listing without reviewing the AMD package pinout files and comparing every power, ground, and signal connection. This page consolidates the verified package, processor, logic-cell, frequency, pricing, and sourcing information with engineering guidance and a transparent comparison of same-family alternatives. It also distinguishes verified facts from parameters that require confirmation from the manufacturer datasheet, helping engineers plan sourcing and design reviews before committing a new PCB.

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