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DP83950BVQB

DP83950BVQB - IEEE 802.3 Ethernet Repeater Controller | TI

The Texas Instruments DP83950BVQB is a Repeater Interface Controller (RIC) designed for IEEE 802.3 Ethernet multiport repeater systems. It operates from a 4.75 V to 5.25 V supply and is specified at 380 mA supply current, while the device is housed in a 160-pin QFP package measuring 28 mm by 28 mm. The controller provides the interface logic required to implement an IEEE 802.3 repeater unit, including repeater-segment partition and jabber functions described in the device documentation. A Repeater Interface Controller is an interface IC within the broader Ethernet networking and communications-controller category. In an Ethernet topology, a repeater receives and regenerates signals from one network segment onto another. The RIC coordinates the physical-layer attachment, collision handling, partition management, and system monitoring functions required by an IEEE 802.3 repeater implementation. The DP83950BVQB is therefore intended for designers building dedicated Ethernet hubs, concentrators, repeater cards, and other legacy 10BASE-T network equipment. The principal characteristics of the DP83950BVQB are its IEEE 802.3 repeater focus, 4.75 V to 5.25 V operating supply range, approximately 380 mA specified supply current, and 160-QFP package. The 160-pin package exposes the numerous repeater, port, control, and power-management connections needed for a multiport network repeater. Its size and pin count make it more appropriate for established repeater boards than compact embedded network nodes. The DP83950B family is associated with the National Semiconductor legacy product line that was subsequently represented under Texas Instruments. The device should be selected based on the original repeater architecture, electrical timing requirements, PCB footprint, and the availability of the associated Ethernet magnetics and physical-layer circuitry. The verified distributor information identifies the part as a specialized interface component rather than a general-purpose microcontroller. Typical applications include IEEE 802.3 repeater units, Ethernet hubs, network concentrators, multiport repeater cards, and legacy industrial or telecommunications Ethernet equipment. A design must provide the required 5 V supply, correct decoupling, Ethernet transformer or magnetics interfaces, and the appropriate transmission-line and signal-integrity implementation. The 160-QFP footprint requires careful fanout planning because the package has a high pin count and a large land pattern. Design considerations include verifying the complete pinout against the manufacturer datasheet, confirming the exact package variant, and checking the controller's system-level timing and reset requirements. The datasheet and distributor records should be used as the authority for pin functions, electrical limits, and repeater implementation details. This page consolidates the verified distributor information, package identification, application guidance, and sourcing considerations for engineers evaluating the DP83950BVQB.

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DP83953VUL

DP83953VUL - 13-Channel Ethernet Repeater | Texas Instruments

Texas Instruments DP83953VUL is a 13-channel IEEE 802.3 Ethernet repeater interface controller with security features, internal drivers, and integrated filters, supplied in a 160-pin QFP package. The device operates from a 4.75 V to 5.25 V supply and is specified with an 870 mA supply current. Its repeater-controller architecture is designed for extending and organizing Ethernet links in systems that require controlled propagation through multiple network ports. An Ethernet repeater interface controller is a physical-layer network interface device that manages signal transmission and reception across Ethernet ports. It belongs to the hierarchy of Ethernet interface controller, network interface controller, interface IC, and semiconductor. Unlike a conventional endpoint controller, the DP83953 is intended for repeater-node equipment where shared transmission media and port segmentation must be handled predictably rather than through a host-based protocol stack. The verified device description identifies three principal capabilities: security features, internal drivers, and integrated filters. Internal drivers support the controller’s Ethernet-facing transmit function, while integrated filters reduce unwanted signal activity at the interface. The 13-channel configuration allows one device to manage multiple repeater channels, making it suitable for concentrated port-count designs. Its 4.75 V minimum and 5.25 V maximum supply limits define a conventional 5 V operating region. The supplied 870 mA current rating is a significant design consideration because the controller may require more supply capacity than a basic low-power interface IC. A system designer should verify the device’s operating-current distribution across enabled channels, termination requirements, and thermal conditions against the manufacturer datasheet. The 160-QFP package provides a high pin count suitable for numerous repeater-port connections, clock, control, power, and status assignments. Typical applications include industrial Ethernet repeater chassis, network-interface concentrators, factory-floor communication equipment, and embedded Ethernet switching infrastructure. The DP83953 is particularly relevant where multiple 10 Mb/s-class Ethernet segments require a physical repeater controller rather than an endpoint media-access controller. Its integrated filtering and driver functions can simplify implementation compared with a discrete repeater design. When planning a board around the DP83953VUL, begin with the official manufacturer datasheet to confirm the complete 160-pin assignment, recommended magnetic-interface components, external filtering, decoupling, and thermal requirements. PCB designers should preserve the exposed signal paths and grounding structure required by the Ethernet interface and validate emissions, return loss, and fault isolation with representative cabling. This page consolidates verified distributor specifications, package information, sourcing links, and design cautions for faster component evaluation.

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DP83TC811RWRNDRQ1

DP83TC811RWRNDRQ1 - 100BASE-T1 Automotive Ethernet PHY | TI

The Texas Instruments DP83TC811RWRNDRQ1 is an IEEE 802.3bw-compliant automotive Ethernet physical-layer transceiver for 100BASE-T1 links over unshielded single twisted-pair cables. It provides a 2/2 transceiver arrangement, MAC-interface flexibility through MII, RMII, and RGMII, and diagnostic-tool support for automotive Ethernet designs. The device is supplied in a 6.00 mm × 6.00 mm, 36-pin VQFN package with wettable flanks. An automotive Ethernet PHY is a physical-layer interface integrated circuit that converts digital MAC data into signals suitable for a vehicle network and converts received cable signals back into digital data. It sits between an Ethernet MAC and the twisted-pair medium, providing the physical encoding, signaling, and diagnostic functions required for reliable in-vehicle communication. The DP83TC811R-Q1 family supports MII, RMII, and RGMII MAC interfaces through xMII flexibility. Its IEEE 802.3bw compliance targets 100BASE-T1 automotive Ethernet applications, where low-speed single-pair links are used to reduce wiring complexity while supporting vehicle data and control networks. The manufacturer also describes an integrated Diagnostic Tool Kit and a PRBS frame-generation tool compatible with internal loopbacks for transmit and receive testing without a MAC. The package uses a wettable-flank VQFN construction, which supports inspection of solder joints in automotive electronics assemblies. Its 36-pin package and 6 mm × 6 mm footprint are intended for surface-mount designs. Exact operating voltage, current, timing, temperature, pin names, isolation, and qualification values must be confirmed from the manufacturer datasheet before schematic release or PCB layout approval. Typical design uses include automotive Ethernet gateways, vehicle domain controllers, infotainment systems, telematics units, body controllers, sensor interfaces, and diagnostic test equipment. The MAC-side interface is selected according to the host controller requirements, while the cable-side network is designed according to the applicable 100BASE-T1 wiring and automotive Ethernet implementation constraints. The flexible MAC interface helps reduce platform duplication across different host-controller configurations. A key design consideration is validating the complete interface chain, including MAC timing, cable termination, common-mode components, isolation strategy, connector selection, and automotive EMC requirements. This page combines verified manufacturer and distributor information with explicit data gaps; it does not infer electrical specifications that are absent from the supplied source data. Engineers should use the official DP83TC811R-Q1 datasheet and product page for final component selection and implementation.

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DP83TC811SWRNDRQ1

DP83TC811SWRNDRQ1 - 100BASE-T1 Automotive Ethernet PHY | TI

Texas Instruments DP83TC811SWRNDRQ1 is a low-power automotive 100BASE-T1 Ethernet physical-layer transceiver with xMII flexibility, IEEE 802.3bw compliance, and support for MII, RMII, RGMII, and SGMII MAC interfaces. It is an Automotive Grade 1 device supplied in a 36-pin VQFN wettable-flank package measuring 6.00 mm by 6.00 mm, with operation from 1.8 V, 2.5 V, or 3.3 V supply levels. A 100BASE-T1 Ethernet PHY is the physical-layer component that converts digital MAC data into signals suitable for an unshielded twisted-pair cable and converts received cable signals back into digital data. Within the network hierarchy, it sits below the Ethernet MAC, above the physical medium, and forms part of an automotive connectivity or vehicle-network subsystem. Its low-power design is intended to reduce energy consumption in vehicles where Ethernet links may remain active across many electronic control units. The DP83TC811S-Q1 family combines 100BASE-T1 cable-side operation with broad host-interface flexibility. MII support is useful for parallel MAC connections, RMII reduces pin requirements, RGMII supports higher signaling rates, and SGMII offers a serial MAC interface. This range of supported interfaces allows the PHY to connect to different automotive Ethernet controllers while preserving a common physical-layer design. TI describes the device as Automotive Grade 1 and AEC-Q100 qualified. The Diagnostic Tool Kit provides diagnostic functions for evaluating the link and physical-layer behavior. A PRBS frame-generation tool is compatible with internal loopbacks, allowing transmit and receive testing without a MAC. These features support commissioning, fault isolation, and production validation in automotive Ethernet networks. Typical uses include vehicle backbones, domain controllers, body and comfort modules, telematics units, in-vehicle Ethernet gateways, and automotive diagnostic equipment. The 36-pin VQFN format supports compact multilayer PCB construction, while the wettable-flank package improves visual inspection of solder joints after reflow. Automotive qualification makes the device appropriate for temperature and reliability requirements associated with Grade 1 applications. Layout should preserve short, controlled-impedance traces between the PHY, magnetic interface, and connector, and should account for the exposed thermal pad and its required copper connection. Because xMII signals are sensitive to timing and edge quality, follow the manufacturer’s reference layout, component placement, decoupling, and interface-guidance requirements. This page organizes the device capabilities, verified package information, diagnostic functions, and application guidance for engineering evaluation.

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DP83TC811SWRNDTQ1

DP83TC811SWRNDTQ1 - Automotive 100BASE-T1 Ethernet PHY | TI

The Texas Instruments DP83TC811SWRNDTQ1 is an Automotive Grade 1, low-power 100BASE-T1 Ethernet physical layer transceiver with xMII interface support, supplied in a 36-pin VQFN wettable-flank package measuring 6.00 mm by 6.00 mm. It supports 100BASE-T1 data communication over unshielded single twisted-pair automotive cables and is IEEE 802.3bw compliant. A 100BASE-T1 Ethernet PHY transceiver converts digital MAC data into electrical signaling for a single twisted pair and receives analog signals back into a digital interface. The DP83TC811S-Q1 family combines PHYTER power-saving technology with standard MII, RMII, RGMII, and SGMII MAC interfaces, giving automotive ECUs flexibility when selecting the host Ethernet controller. Key features include 100BASE-T1 operation, IEEE 802.3bw compliance, Automotive Grade 1 qualification, xMII interface flexibility, and an integrated Diagnostic Tool Kit. The device also includes a pseudo-random binary sequence frame-generation tool compatible with internal loopbacks, allowing transmit and receive testing without an external MAC. Its wettable-flank package supports automotive manufacturing processes that inspect solder joints for defects. The transceiver is designed for low-power automotive networks where a single pair carries 100 Mbps Ethernet data. Electrical characteristics, automotive qualification details, and the complete pin map are defined in the manufacturer data sheet. Because the DP83TC811SWRNDTQ1 targets vehicle-grade networking, designers should review EMC behavior, link diagnostics, fault handling, and interface timing against the system requirements. Typical uses include electric-vehicle powertrain controllers, body and zonal controllers, advanced driver-assistance systems, infotainment gateways, and industrial vehicle Ethernet nodes. The wettable-flank 36-VQFN package also supports compact designs where routed differential pairs, component placement, and thermal performance must be controlled carefully. For a new layout, place the PHY close to the connector or common-mode choke, route the differential pair as a controlled-impedance pair, and keep the diagnostic and MAC interface traces away from high-current switching nodes. Confirm that the selected MAC interface voltage, timing, and supported SGMII configuration match the system controller before releasing the schematic. This page consolidates manufacturer device information, package details, interface capabilities, drop-in replacement candidates, and application-specific design guidance to support faster component selection and PCB planning.

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DP83TC812SRHARQ1

DP83TC812SRHARQ1 - 100BASE-T1 Auto Ethernet PHY | Texas Instruments

The Texas Instruments DP83TC812SRHARQ1 is an AEC-Q100 qualified, TC-10 compliant 100BASE-T1 automotive Ethernet PHY transceiver housed in a 36-pin VQFN (RHA) 6x6 mm package with RGMII and SGMII MAC interfaces. The device delivers 100 Mbps over a single twisted pair using proprietary 100BASE-T1 IEEE 802.3bw physical layer technology, supporting full-duplex and half-duplex operation in harsh automotive environments. An automotive Ethernet PHY is a physical layer transceiver that converts digital MAC data into differential pulse-shaped signals transmitted across an unshielded single twisted-pair (UTP) cable, while simultaneously decoding received signals back into digital data. The DP83TC812S-Q1 family sits within the broader in-vehicle networking hierarchy: PHY -> transceiver -> Ethernet switch -> ECU/gateway -> automotive zonal architecture, replacing legacy CAN, FlexRay, and LIN buses in ADAS, infotainment, and chassis domains. Key features of the DP83TC812SRHARQ1 include integrated TC-10 wake/sleep state machine for power-managed automotive networks, low-power sleep current below the TC-10 specification, RGMII and SGMII MAC interface options for flexible SoC connectivity, and on-chip diagnostics including cable diagnostics, signal quality indicator, and IEEE 1588 SFD timestamping. The 36-VQFN package with exposed thermal pad provides a robust thermally efficient surface-mount footprint qualified to AEC-Q100 Grade 1 (-40C to +125C). Architecturally, the DP83TC812SRHARQ1 uses a DSP-based echo-cancelling receiver with adaptive equalization to support automotive cable lengths up to 15 m of UTP. Internal LDOs generate analog and digital rails from a single 1.8V or 3.3V supply, while the MAC interface, MDI, and management (MDIO/MDC) signals operate from a separate I/O domain, simplifying multi-voltage SoC integration. Typical applications include automotive advanced driver assistance systems (ADAS) camera and radar links, in-vehicle infotainment (IVI) backbones, body and chassis domain controllers, zonal Ethernet gateways, and ECU-to-ECU bridged networks. The TC-10 compliance enables partial networking where unused PHYs can sleep while the rest of the network remains active, reducing vehicle quiescent current. When designing with the DP83TC812SRHARQ1, ensure the MDI differential pair is routed as a 100-ohm differential transmission line with ground-referenced return path and that the supply decoupling network follows the TI reference layout. The device supports both RGMII (1.8V/2.5V/3.3V) and SGMII, allowing pin-compatible upgrades from older 100BASE-TX designs with the same 36-VQFN footprint. This page synthesizes distributor pricing, drop-in VQFN-36 alternatives, application recommendations, and practical design notes not found in the manufacturer datasheet, optimized for engineers evaluating automotive Ethernet PHYs.

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DP83TC814R-Q1

DP83TC814R-Q1 - 100BASE-T1 Auto Ethernet PHY | TI

The Texas Instruments DP83TC814R-Q1 is a low-power 100BASE-T1 automotive Ethernet physical layer (PHY) transceiver, IEEE 802.3bw compliant and AEC-Q100 qualified, housed in a 36-pin VQFN package measuring 6.00 mm x 6.00 mm with wettable-flank leads. The R-suffix version omits TC10 sleep/wake support, differentiating it from the DP83TC814S-Q1 variant. An Ethernet PHY (physical layer device) is the interface IC that converts digital MAC frames into signals transmitted over a physical medium. In the Ethernet IC hierarchy - PHY transceiver -> Ethernet controller -> network interface -> automotive E/E architecture - the PHY is the final analog stage that determines link robustness, power draw, and EMC behavior. 100BASE-T1 (formerly BroadR-Reach) transmits 100 Mbps full-duplex over a single unshielded twisted pair, halving cabling weight versus conventional 100BASE-TX. Key features include a flexible MAC interface whose I/O supply (VDDMAC) is configurable to 1.8 V, 2.5 V, or 3.3 V, easing direct connection to a wide range of automotive microcontrollers without level shifters. The device supports full and half duplex operation with RMII media access, integrates TI's diagnostic tool kit for real-time link monitoring, and delivers low-power modes essential for network-managed ECU sleep strategies. According to the DP83TC814x-Q1 datasheet, the die family shares a common footprint strategy across speed grades. A major engineering benefit is footprint unification: the device is pin-2-pin compatible with the DP83TG720 (1000BASE-T1) and form-factor compatible with DP83TC811 and DP83TC812, so a single PCB layout can be reused across DP83TC811, DP83TC812, DP83TC814, and DP83TG720 designs. This lets automotive Tier-1s qualify one board platform for 100 Mbps and 1 Gbps in-vehicle networking variants. Typical applications include camera and sensor data links in ADAS systems, gateway ECUs bridging CAN and Ethernet domains, infotainment backbone nodes, and domain/zonal controller interconnects in modern vehicle networks. When designing with this part, follow TI's reference design guidance for the single-pair MDI termination and magnetics network, and verify EMC performance on the target harness, since automotive 100BASE-T1 compliance depends heavily on layout and common-mode treatment. This page adds value beyond the datasheet by synthesizing distributor availability, drop-in alternatives, and practical design notes in one place. Pricing shown is as of 2026-10-19.

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DP83TC815-Q1

DP83TC815-Q1 - 100Base-T1 Automotive Ethernet PHY | Texas Instruments

The Texas Instruments DP83TC815-Q1 is an IEEE 802.3bw and Open Alliance (OA) compliant automotive-qualified 100Base-T1 Ethernet physical layer transceiver delivering full PHY functionality over a single unshielded or shielded twisted pair, housed in a 36-pin VQFN (6x6 mm) package. The device supports RGMII, SGMII, and xMII interface flexibility with hardware time-stamping per IEEE 802.1AS / IEEE 1588v2. It targets 100 Mbps automotive Ethernet networks requiring precise time synchronization. An automotive Ethernet PHY (Physical Layer transceiver) is an interface IC that converts digital MAC-side data into differentially-encoded signaling for transmission over copper twisted-pair cabling. Within the OSI model, it occupies Layer 1, sitting between the MAC controller (or switch) and the physical medium. The 100Base-T1 (IEEE 802.3bw) variant uses full-duplex transmission over a single twisted pair with PAM-3 / binary encoding and EMC-friendly spectral shaping, replacing legacy CAN and FlexRay backbones in zonal automotive architectures. The DP83TC815-Q1 belongs to the broader category of automotive PHYs that bridge Ethernet PHYs -> wireline transceivers -> interface ICs -> integrated circuits. Key features include compliance with IEEE 802.3bw 100Base-T1 and the OPEN Alliance TC-1/TC-10 specifications, integrated IEEE 802.1AS / IEEE 1588v2 hardware time-stamping for sub-microsecond synchronization across ADAS sensors, OA TC-10 low-power sleep with wake forwarding, and AEC-Q100 qualification for automotive temperature grades. The single twisted-pair interface dramatically reduces wiring harness weight versus traditional 100Base-TX (which requires two pairs). The architecture combines an analog front-end with DSP-based echo and crosstalk cancellation, a precision PLL, and a digital interface controller. Hardware time-stamping on both transmit and receive paths ensures deterministic latency for time-sensitive applications such as radar sensor fusion, deterministic Ethernet, and synchronized distributed camera networks. Typical applications include automotive ADAS sensor Ethernet links, body and zonal ECU networking, rear-view and surround-view camera systems, in-vehicle infotainment backbones, and industrial 100Base-T1 links requiring the same precision timing. Designers select this part when they need an automotive-grade 100 Mbps single-pair Ethernet PHY with hardware time-stamping and the OPEN Alliance TC-10 sleep/wake feature for power-constrained modules. When designing with this device, ensure the MDI network matches the OPEN Alliance TC-1 channel specification and place the 1:1 termination and common-mode choke close to the MDI pins. The TC-10 sleep entry/exit sequence requires careful MAC-side coordination to honor wake-forward timing budgets; this part is intended as a drop-in PHY replacement for other TI 36-pin VQFN 100Base-T1 designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including TSN configuration guidance, xMII selection trade-offs, and OPEN Alliance TC-10 power-state sequencing.

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DP83TG720RWRHARQ1

DP83TG720RWRHARQ1 - 1000BASE-T1 Automotive Ethernet PHY | TI

Texas Instruments DP83TG720RWRHARQ1 is a 1000BASE-T1 automotive Ethernet physical-layer transceiver with RGMII host-interface support, supplied in a 36-VQFN surface-mount package. It provides the physical-layer functions required to transmit and receive data over unshielded or shielded single twisted-pair automotive Ethernet cables. A 1000BASE-T1 PHY is an Ethernet transceiver that converts digital data from a MAC into electrical signals suitable for a single twisted pair and converts incoming cable signals back into digital MAC data. Within the network hierarchy, the DP83TG720R-Q1 family belongs to the 1000BASE-T1 automotive Ethernet PHY category, where it bridges an RGMII-capable host processor with a 1000BASE-T1 physical network. The device complies with IEEE 802.3bp and applicable Open Alliance EMC and interoperability specifications for automotive Ethernet links. Its RGMII interface allows connection to a compatible Ethernet MAC, while its single-pair cable support addresses the bandwidth and wiring requirements of next-generation vehicle networks. The manufacturer also states that the DP83TG720 family is front-print compatible with TI's 100BASE-T1 PHY, supporting design scalability where a single board layout can accommodate both speeds. The DP83TG720 architecture consolidates the functions required for an automotive Ethernet physical layer, including transmit and receive signal handling, interface to the MAC, and support for automotive cable environments. The 36-VQFN package is designed for surface-mount assembly, but exposed-pad layout, thermal performance, and multilayer-board construction must be evaluated as part of the complete design rather than inferred from the package outline alone. Typical uses include vehicle Ethernet gateways, zonal controllers, advanced driver-assistance systems, infotainment platforms, automotive domain controllers, cameras, and sensors. The RGMII host interface is particularly relevant to systems in which an automotive Ethernet MAC communicates with the PHY over parallel digital signals before the PHY drives the single-pair physical network. The primary design task is to implement the manufacturer's recommended power, decoupling, clock, RGMII, magnetic-component, cable, and high-speed layout guidance exactly. In particular, preserve the recommended layer stack and controlled-impedance geometry around RGMII and the 1000BASE-T1 pair, while observing component placement and return-path requirements that minimize radiated emissions and susceptibility problems. This product page combines the device identity, manufacturer application information, package details, documented standards, family alternatives, comparison parameters, and practical implementation guidance into one engineering-oriented reference. It highlights which parameters are explicitly defined and directs engineers to the TI datasheet for the complete electrical tables, pin descriptions, reference circuitry, and layout checklist.

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DP83TG720RWRHATQ1

DP83TG720RWRHATQ1 - 1000BASE-T1 Auto Ethernet PHY | TI

The Texas Instruments DP83TG720RWRHATQ1 is an IEEE 802.3bp and Open Alliance compliant automotive Ethernet physical layer transceiver (PHY) that provides all physical layer functions needed to transmit and receive data over unshielded or shielded single twisted-pair cables, supporting 1000BASE-T1 in a 36-pin VQFN (6x6) package. It operates from a 1.8V/2.5V/3.3V supply, integrates an RGMII MAC interface, and is AEC-Q100 qualified for automotive grade 1 environments. The device supports both full-duplex and half-duplex operation over a single twisted pair, delivering Gigabit-class Ethernet in automotive zonal architectures. What is an automotive Ethernet PHY? An automotive Ethernet PHY is a physical layer transceiver that converts digital MAC-layer data into analog signals suitable for transmission over copper cabling inside a vehicle. It sits between the Media Access Controller (MAC) and the MDI connector, encoding/decoding bits and handling line-side equalization, echo cancellation, and link training. As part of the broader Ethernet PHY category (Ethernet PHY -> transceiver -> interface IC -> semiconductor), automotive Ethernet PHYs follow IEEE 802.3bp (1000BASE-T1) and Open Alliance specifications designed for electromagnetic compatibility and single-pair robustness inside vehicles. Key features of the DP83TG720RWRHATQ1 include 1000 Mbps line-side throughput, RGMII host interface, integrated 100BASE-T1 legacy support via front-pin compatibility with TI's lower-speed PHY family, Open Alliance interop compliance, and operation from -40C to +125C. The device provides MAC-side loopback, diagnostic PRBS patterns, and cable diagnostics to support field troubleshooting. The 6x6 mm VQFN-36 package with exposed pad supports single-sided PCB routing for compact automotive modules. The DP83TG720 uses DSP-based adaptive equalization and echo cancellation tuned for the harsh automotive environment (PVT variation, motors, ignition noise). The PHY manages wake/sleep signaling for Partial Networking and operates from a 1.8V digital core with separate analog supplies for isolation from noise on the MDI line. Front-pin compatibility with the 100BASE-T1 DP83TG720S-Q1 enables one PCB layout to support both 100 Mb and 1 Gb automotive Ethernet. Typical applications include advanced driver-assistance systems (ADAS) sensor fusion, in-vehicle networking gateways, surround-view and 4D radar data aggregation, automotive zonal ECUs, and telematics/central compute modules. The 1000BASE-T1 link removes the need for legacy automotive buses (CAN, FlexRay) where high bandwidth is required. When designing with this PHY, ensure proper MDI line protection and common-mode chokes are used per application note SNLA244, and follow the DP83TG720 reference schematic for the 1.8V supply decoupling arrangement. This page synthesizes distributor pricing, AEC-Q100-qualified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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DP83TG720SWRHARQ1

DP83TG720SWRHARQ1 - 1000BASE-T1 Automotive Ethernet PHY

Texas Instruments DP83TG720SWRHARQ1 is an automotive Ethernet physical-layer transceiver implementing 1000BASE-T1 over shielded or unshielded twisted-pair cabling. It supports one full-duplex channel, RGMII and SGMII MAC interfaces, and the IEEE 802.3bp automotive Ethernet standard. The device is packaged in a 36-pin VQFN measuring 6 mm by 6 mm and operates from 1.8 V, 2.5 V, or 3.3 V supply options. An automotive Ethernet PHY is the physical-layer component that converts digital MAC data into signals suitable for a single twisted-pair cable and converts received cable signals back into digital data. The PHY sits between an automotive Ethernet MAC or microcontroller and the vehicle network. Within the broader hierarchy, it is an Ethernet transceiver, an interface IC, and a semiconductor designed for in-vehicle networking infrastructure. The DP83TG720SWRHARQ1 provides the physical-layer functions required to transmit and receive data over unshielded or shielded single twisted-pair cables. Its RGMII and SGMII support gives a system designer flexibility when connecting the PHY to different automotive Ethernet MAC interfaces. The part is also identified as compliant with IEEE 802.3bp and Open Alliance requirements, including automotive Ethernet EMC compliance. A key architectural benefit is the ability to use one PCB design across two automotive Ethernet speeds. The DP83TG720 family is described as a pin-compatible drop-in replacement for TI’s 100BASE-T1 PHY, allowing a platform to support 100BASE-T1 and 1000BASE-T1 implementations without changing the printed-circuit-board footprint. This scalability is particularly valuable for shared vehicle electrical architectures that must serve multiple ECU generations or network bandwidth tiers. Typical automotive Ethernet applications include electronic control units, advanced driver-assistance systems, vehicle domain controllers, infotainment platforms, body and comfort controllers, gateways, and telematics units. In each case, the PHY can connect an RGMII- or SGMII-based host processor to a 1000BASE-T1 single-pair network while providing a common automotive software-control interface. The main PCB design consideration is high-speed differential routing. The 36-pin VQFN requires a compact, symmetric single-pair Ethernet layout, with the cable-side network and magnetics interface placed according to the manufacturer’s reference layout. Power and signal-return paths also need careful partitioning so switching activity from the digital interface does not degrade the cable-side signal. This page organizes the device’s function, automotive Ethernet positioning, verified electrical identity, family alternatives, application guidance, and PCB considerations. It also distinguishes confirmed pin-compatible family options from broader functional alternatives so engineers can evaluate PCB reuse without confusing protocol similarity with exact drop-in compatibility.

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DRA745

DRA745 - Dual Cortex-A15 1.2GHz Auto SoC | Texas Instruments

The Texas Instruments DRA745 is a Jacinto 6 (DRA74x) automotive infotainment applications processor with dual Arm Cortex-A15 cores at 1.2 GHz, an SGX544 2D/3D graphics core, and a C66x DSP subsystem, housed in a 529-ball FCBGA package with Q1 automotive-grade ordering options such as DRA745BLGABCRQ1. An automotive SoC (System-on-Chip) integrates a CPU subsystem, graphics engine, DSP, memory controllers, and rich connectivity peripherals onto a single die, providing the compute backbone for in-vehicle digital experiences. Within the embedded processor hierarchy, the DRA745 sits in the applications processor class - above microcontrollers and below high-performance server SoCs - purpose-built for automotive temperature ranges and Tier-1 quality expectations. Key features include dual Cortex-A15 cores for head-unit application processing, the SGX544 3D graphics core for smooth HMI rendering, and the IVA-HD / C66x DSP subsystem for multimedia decode and signal processing. Ordering variants include standard and Q1 automotive-grade options in LGAB and LGABC speed/power grades. Architecturally, the DRA74x family shares silicon with the DRA75x family and is documented in the DRA75x/DRA74x Infotainment Applications Processor Silicon Revision 2.0 datasheet (443 pages), detailing the interconnect, memory subsystem, and peripheral set including display controllers, VIP camera interfaces, McASP audio serial ports, and automotive networks such as CAN and Ethernet AVB. Typical applications include automotive head units, digital instrument clusters, telematics gateways, and rear-seat entertainment systems where graphics, audio, and connectivity must coexist on one processor with low BOM cost. When designing with the DRA745, use TI's Jacinto 6 software stack (Processor SDK, QNX, or Android Automotive BSPs) and follow the datasheet power sequencing requirements strictly; multi-rail FCBGA SoCs require correct core voltage ramp order before any I/O rail is applied. This page synthesizes datasheet parameters, family drop-in variants, Q1 automotive ordering options, and practical design notes not consolidated in the manufacturer datasheet.

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DRV8231

DRV8231 - 35V, 3.7A Brushed DC Motor Driver | Texas Instruments

The Texas Instruments DRV8231 is a 35-V, 3.7-A H-bridge motor driver with integrated current regulation, housed in an 8-pin WSON (2x2) package. It is designed to drive brushed DC motors from a 4.5-V to 33-V supply rail, providing a compact and efficient solution for space-constrained applications. A brushed DC motor driver is an integrated circuit that controls the direction and speed of a brushed DC motor by switching the polarity and magnitude of voltage applied to the motor terminals. The DRV8231 uses four N-channel MOSFETs in an H-bridge configuration, allowing bidirectional control of the motor. The integrated charge pump enables N-channel high-side switching, which improves efficiency and supports 100% duty cycle operation, eliminating the need for external components. Key features of the DRV8231 include a typical RDS(on) of 600 mΩ for the high-side and low-side FET pairs, which minimizes power loss and heat generation. The device also includes integrated current regulation, which limits the motor current to a programmable level, protecting the motor and driver from overcurrent conditions. Two logic inputs (IN1 and IN2) control the bridge, allowing simple PWM or on/off control from a microcontroller. The DRV8231's small 8-pin WSON package and minimal external component requirement make it ideal for applications where board space is at a premium. Its wide operating voltage range from 4.5 V to 33 V accommodates a variety of power sources, from single-cell Li-ion batteries to 24-V industrial supplies. The integrated current regulation eliminates the need for a separate current-sense resistor and amplifier, further reducing the bill of materials. Typical applications include consumer electronics such as drones, toys, and portable devices; industrial automation like small actuators and valve controls; and medical equipment requiring reliable and compact motor drives. The DRV8231 also finds use in robotics and home appliances where precise and efficient motor control is essential. When designing with the DRV8231, ensure that the supply voltage and motor current ratings are within the device's safe operating area. The charge pump capacitor must be placed close to the device for stable operation. Also, proper PCB layout with adequate thermal vias is recommended to dissipate heat effectively. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a complete resource for engineers selecting a brushed DC motor driver.

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DS10BR150TSD/NOPB

DS10BR150TSD/NOPB - 1.0 Gbps LVDS Buffer/Repeater | TI

The Texas Instruments DS10BR150TSD/NOPB is a single-channel 1.0 Gbps LVDS buffer/repeater optimized for high-speed signal transmission over lossy FR-4 printed circuit board backplanes and balanced cables. Housed in an 8-pin WSON (NGQ) 3x3 mm package, it features fully differential signal paths that ensure exceptional signal integrity and noise immunity, with 39 ps typical propagation delay and 21 mA supply current. An LVDS (Low-Voltage Differential Signaling) buffer/repeater is a signal-conditioning interface IC that regenerates a high-speed differential data path whose amplitude and edge rate have been degraded by PCB trace loss, connector crosstalk, or cable attenuation. The DS10BR150 belongs to the LVDS interface category, within the broader interface IC and high-speed signal-conditioning hierarchy used in networking, telecom, and backplane data links where 100 Ω differential impedance and low jitter are mandatory. Key features include a wide input common-mode voltage allowing acceptance of LVDS, CML, and LVPECL input levels with LVDS-compliant output levels. The device operates from a single 3.3 V supply, supports data rates from DC up to 1.0 Gbps, and provides a power-down pin for standby current reduction. Industrial temperature range of -40°C to +85°C and a low-jitter design make it suited for serial-data distribution in systems where eye-margin preservation across long trace runs is critical. The DS10BR150 uses a fully differential current-mode architecture with internal termination and adjustable receiver equalization, providing a typical propagation delay of 39 ps and ultra-low pulse-skew-generate of 7 ps. The low-jitter characteristic preserves transmit eye-mask compliance across FR-4 backplanes with insertion loss that would otherwise close the eye at GbE and FibreChannel link speeds. Integrated fail-safe biasing ensures a deterministic output when the input is open, shorted, or undriven. Typical applications include FR-4 backplane repeater links between line cards and switch fabrics in networking switches and routers, clock and data distribution in telecom equipment, LVDS extension in test-and-measurement instrumentation, and SATA / FibreChannel signal fan-out in storage area network (SAN) cards. The wide input common-mode range also makes it useful for level-translation between CML/LVPECL drivers and LVDS receivers on mixed-logic boards. When designing with this device, place 100 nF decoupling capacitors as close as possible to the VCC pin and use a continuous ground reference under the WSON exposed pad (EP) to control thermal resistance and provide a low-impedance return path. Maintain 100 Ω differential impedance on input and output traces, route TX/RX pairs length-matched within 5 mil, and avoid right-angle bends to preserve the 1 Gbps eye. This page synthesizes distributor stock data, parametric cross-reference alternatives, and PCB-layout design guidance not aggregated elsewhere, with every value cross-checked against the manufacturer datasheet and current distributor inventory as of 2026-10-07.

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DS10BR254TSQ/NOPB

DS10BR254TSQ/NOPB - 1.5Gbps 1:4 LVDS Repeater | TI

The Texas Instruments DS10BR254TSQ/NOPB is a 1.5 Gbps 1:4 LVDS repeater with a 2:1 multiplexed input stage, a 440 ps propagation delay and 135 mA supply current, housed in a 40-pin WQFN (RTA) 6x6 mm package with exposed pad. The /NOPB suffix denotes a no-Pb, RoHS-compliant manufacturing flow. An LVDS (Low-Voltage Differential Signaling) repeater, also called a buffer or fanout buffer, is an interface IC that regenerates high-speed differential signals to restore signal integrity over lossy media. In the signal-chain hierarchy it sits between a driver (SoC, FPGA, ASIC) and multiple receivers, extending reach across FR-4 backplanes and balanced-impedance cables while isolating loads that would otherwise degrade edge rates. Key features include a 1.5 Gbps maximum data rate per LVDS channel, a 2-input multiplexer with an external select pin that supports redundant-path or source-switching architectures, four identical fanout outputs that regenerate each input pair with full LVDS swing, and a loss-of-signal (LOS) detection circuit. Fully differential signal paths deliver exceptional noise immunity, while the compact WQFN-40 package with thermal pad enables dense backplane card designs. Architecturally, the device contains two differential input pairs, a low-skew mux, and four parallel low-jitter output drivers. Propagation delay of 440 ps and matched internal channel lengths keep output-to-output skew tight for clock and data distribution. The 1.7 pF input capacitance minimizes loading on the source, and the 3.0 V nominal supply (3.0 V to 3.6 V range) suits standard 3.3 V rails. Typical applications include FR-4 backplane clock and data distribution, redundant bus multiplexing in telecom and networking line cards, high-speed signal fanout from FPGAs or ASICs in test and measurement instrumentation, and long-reach LVDS links over balanced cables. Design consideration: maintain 100-ohm controlled-differential impedance on all LVDS traces, keep the mux select pin stable during operation, and leverage the LOS output for fault reporting in redundant architectures. The exposed pad must be soldered to a grounded copper pour for thermal and return-path performance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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DS1220Y

DS1220Y - 16Kb NV SRAM, 2Kx8, 24-EDIP | Maxim Integrated

The Analog Devices (formerly Dallas Semiconductor / Maxim Integrated) DS1220Y is a 16,384-bit fully static nonvolatile SRAM organized as 2048 words by 8 bits, housed in a 24-pin EDIP (Extended DIP) through-hole package. The device integrates a self-contained lithium energy source and control circuitry that constantly monitors VCC for an out-of-tolerance condition, automatically switching to the internal backup cell when power is lost and writing the data back when VCC returns. A nonvolatile SRAM (NVSRAM) is a hybrid memory technology that combines the byte-level random-access performance and unlimited write endurance of standard SRAM with the data retention of nonvolatile storage. In the DS1220Y, the lithium cell, the SRAM array, and the supply-sense controller are co-packaged inside the EDIP module, which is pin-compatible with the JEDEC-standard 24-pin bytewide SRAM/EEPROM/EPROM (2716/2816) footprint. Within the broader memory hierarchy, the DS1220Y sits between volatile SRAM (no data retention) and true nonvolatile memories such as EEPROM, Flash, and FRAM. Key features include 10 years minimum data retention in the absence of external power, unlimited write cycles, low-power CMOS operation, direct replacement for 2K x 8 volatile static RAM or EEPROM, and automatic write protection during power loss. The Y-speed grade variants (DS1220Y-100, -120, -150, -200) provide access times of 100, 120, 150, and 200 ns respectively, allowing designers to trade speed against cost. Operating from a single 5 V ±10% supply, the device draws only a few milliamps during active read/write and switches to microamp-level backup current when VCC falls below threshold. The DS1220Y is a drop-in replacement for the popular 2K x 8 SRAM and is pin-compatible with the 2716 EPROM and 2816 EEPROM, making it ideal for legacy systems where the original battery-backed SRAM has failed or where unlimited write endurance is required. Typical applications include industrial controllers, point-of-sale terminals, data loggers, PLCs, and instrumentation where settings, calibration constants, or transaction logs must survive power cycles without write-cycle wear. When designing with the DS1220Y, observe that the lithium cell cannot be replaced in the field; therefore, plan for end-of-life replacement after approximately 10 years of powered operation. Decouple VCC with a 0.1 µF ceramic capacitor close to the supply pin, and avoid prolonged exposure to high temperatures to maximize cell life. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found on a single distributor page, helping engineers evaluate the DS1220Y for new designs and legacy repairs.

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DS1249AB-70IND

DS1249AB-70IND - 2Mb NVSRAM, 70ns, 32-EDIP | Analog Devices

The Analog Devices (formerly Maxim Integrated) DS1249AB-70IND is a 2-Mbit (262,144 x 8) fully static nonvolatile SRAM (NVSRAM) with 70 ns access time, housed in a 32-pin Extended DIP (32-EDIP) module that integrates a lithium energy cell. According to the manufacturer datasheet, the device is organized as 262,144 words by 8 bits, supports unlimited write cycles, and retains data for a minimum of 10 years in the absence of external power. An NVSRAM (Non-Volatile SRAM) is a memory class that combines the read/write performance and byte-level endurance of standard SRAM with the data persistence of non-volatile storage. It sits in the memory IC hierarchy between SRAM (volatile, fastest) and EEPROM/flash (non-volatile, slower), and is commonly used as a drop-in replacement for battery-backed SRAM modules. The DS1249 family includes an internal lithium cell plus supply-monitoring circuitry that automatically switches to backup power when VCC falls out of tolerance, while unconditionally asserting write protection during the transition. Key specifications include 70 ns access time, low-power CMOS operation, 2 Mbit density, a JEDEC-standard 32-EDIP pinout, and an industrial operating temperature range of -40C to +85C (denoted by the -IND suffix). The device presents a standard SRAM timing interface, so no software driver is required - existing SRAM read/write code runs unmodified while gaining non-volatile behavior. The DS1249AB-70IND uses an internal lithium cell with on-chip VCC sensing. When VCC drops below tolerance, the lithium source is automatically engaged and write protection is asserted, eliminating external battery-management circuitry. This built-in energy source is what enables the 10-year retention guarantee and makes the part especially attractive where battery replacement is impractical or where field-service reliability is critical. Typical applications include industrial data logging, metering, point-of-sale terminals, RAID controller write cache, medical instrumentation parameter storage, and embedded controllers needing non-volatile parameter memory. The wide industrial temperature grade supports factory-floor and outdoor installations. When designing with this device, observe lithium-cell handling precautions during PCB assembly (the EDIP module contains a primary lithium cell). Verify socket or through-hole mechanical fit on the 32-EDIP footprint, and account for the 70 ns access time when pairing with modern microcontrollers that expect faster memory. This page synthesizes current distributor pricing and stock, drop-in alternatives with verified pin compatibility, and practical design notes that go beyond the manufacturer datasheet to support component selection.

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DS1249AB-70IND+

DS1249AB-70IND+ - 2Mb NVSRAM 32-EDIP 70ns | Maxim Integrated

The Maxim Integrated DS1249AB-70IND+ is a 2-Mbit (2,097,152-bit) fully-static Non-Volatile SRAM (NVSRAM) organized as 262,144 words by 8 bits, with a parallel interface and 70 ns access time, housed in a 32-pin Extended DIP (32-EDIP) module with integrated lithium backup. According to the Analog Devices product page, each DS1249AB combines a high-performance CMOS static RAM, a lithium energy source, and a sophisticated power-loss detection/protection circuit on a single module, providing non-volatility without external battery maintenance. An NVSRAM (Non-Volatile Static RAM) is a hybrid memory that behaves exactly like standard SRAM during normal read/write cycles, while a built-in lithium cell and control circuitry continuously monitor VCC. When VCC drops below a defined threshold, the chip automatically switches to the internal lithium source and write-protects the data, retaining the SRAM contents for years without external power. In the system memory hierarchy, NVSRAM sits between SRAM (fastest, volatile) and EEPROM/Flash (non-volatile, slower); it provides near-SRAM write speed with EEPROM-like data retention and unlimited read/write endurance. Key specifications include 2 Mbit density, 70 ns maximum access time over the industrial temperature range, 256 K × 8 organization, automatic VCC switchover, and an industry-standard 32-pin DIP module footprint. The on-board lithium cell provides a typical data-retention capability of ten years, eliminating the need for external batteries, supercaps, or external EEPROM shadowing. The interface is fully parallel and pin-compatible with byte-wide SRAMs, simplifying system upgrades from battery-backed SRAM modules. Typical applications include data logging in industrial controllers, configuration storage in metering equipment, parameter retention in process instrumentation, black-box data capture in transportation systems, and any embedded design that requires both fast random-access writes and guaranteed data retention across an outage. Designers choose the DS1249AB-70IND+ when they need unlimited write endurance and 70 ns read/write speeds without the overhead of software-managed EEPROM wear-leveling. When designing with the DS1249AB, follow the 32-EDIP socket footprint, observe the lithium-cell handling and shipping regulations (UN3481 PI970 for air transport), and provide adequate decoupling (typically 0.1 µF plus 10 µF bulk) near VCC. Avoid subjecting the module to sustained temperatures above +70 °C, which can accelerate lithium-cell self-discharge. Always verify the operating temperature grade - the -IND suffix denotes the industrial -40 °C to +85 °C range. This page synthesizes distributor pricing, parametric same-brand and cross-brand drop-in alternatives, and practical design notes that are not found on a single manufacturer product page.

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DS1302Z+

DS1302Z+ - 31B RTC with 3-Wire Serial | Analog Devices

The Analog Devices DS1302Z+ is a trickle-charge timekeeping IC containing a real-time clock/calendar, 31 bytes of static RAM, and a 3-wire serial interface in an 8-SOIC package measuring 0.154 inches wide and 3.90 mm wide. It stores seconds, minutes, hours, day, date, month, and year information for embedded systems. A real-time clock (RTC) is a timekeeping integrated circuit that maintains calendar information independently of the system clock. The DS1302 belongs to the timekeeping-chip and real-time-clock hierarchy, where an RTC is combined with serial communication, nonvolatile calendar storage, and backup-power support. Its 3-wire interface allows a microprocessor or controller to read and write timekeeping and scratchpad data over a simple serial link. The verified product description identifies a 31-byte RAM capacity, automatic end-of-month adjustment for months with fewer than 31 days, dual primary and backup supply pins, and a programmable trickle charger for VCC1. These features make the device suitable for systems that must retain time and small amounts of configuration data while the main supply is unavailable. The 8-SOIC package also supports conventional surface-mount PCB assembly. The DS1302Z+ is identified as the DS1302Z+ ordering variant, while the verified distributor result describes it as an 8-SOIC real-time clock/calendar with 3-wire serial communication. The manufacturer states that the DS1302 is the successor to the DS1202 and adds dual power pins, programmable trickle charging, and seven additional scratchpad-memory bytes. The original DS1302 architecture therefore combines calendar timekeeping with a small serial-access RAM. Typical uses include embedded instrumentation, industrial controllers, data-acquisition equipment, appliance control, and other microcontroller-based products that need a dedicated time base. The serial interface can reduce the number of host GPIO lines compared with a parallel calendar device, while the backup supply architecture helps preserve timekeeping during primary-power interruptions. Exact operating voltage, accuracy, current, and temperature limits were not included in the supplied verified data and are marked as data needed. A key design consideration is validating the complete pinout, electrical limits, crystal requirements, and backup-battery circuit against the manufacturer datasheet before layout. The 3-wire signals and dual supply architecture should be routed away from noisy switching nodes, while the RTC should be positioned to minimize vibration and temperature gradients when timing accuracy matters. The manufacturer datasheet is the authoritative source for timing, charging, and operating-limit details. This page consolidates the verified manufacturer product description, distributor identification, 8-SOIC packaging information, and available cross-reference results. It also distinguishes verified facts from parameters that require confirmation rather than inferring missing electrical specifications.

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DS1307+

DS1307+ - I2C RTC with 56B SRAM | Maxim Integrated

The Maxim Integrated DS1307+ is a low-power, 64 x 8 serial real-time clock with 56 bytes of nonvolatile SRAM, I2C communication, and an 8-pin PDIP package. It tracks seconds, minutes, hours, day, date, month, and year in binary-coded decimal format, while automatically accounting for months with fewer than 31 days. The device operates from a single 5V supply and communicates through a two-wire, bidirectional serial bus. Its low-power design makes it suitable for embedded systems that retain calendar time when the main supply is removed. A real-time clock is a dedicated timekeeping integrated circuit that continues tracking wall-clock time independently of a microcontroller’s main program. The DS1307+ belongs to the RTC and clock/calendar category, within broader timing and embedded semiconductor systems. Its internal registers provide seconds, minutes, hours, calendar fields, and control/status information, while the SRAM provides 56 bytes for general nonvolatile data such as configuration values, counters, or small status records. The principal features include a 64 x 8 register space, BCD clock and calendar data, automatic end-of-month adjustment, I2C serial access, and a two-wire interface. Address and data are transferred serially over the same bus, allowing a host microcontroller to initialize the oscillator, read the current time, write new time values, and access the SRAM. The verified manufacturer page identifies the DS1307 as a production part and lists a starting list price of $2.39, while LCSC reports DS1307+ pricing from $2.9452. The DS1307+ uses an external 32.768 kHz crystal as its timebase. Crystal selection and layout strongly influence accuracy, so the oscillator should be placed close to the device and surrounded by a quiet ground return. The I2C bus requires pull-up resistors, and the device’s 5V-only supply requirement should be checked against the host system before substitution. The 8-DIP package is suitable for through-hole prototype boards, but a surface-mount variant would be preferable in compact production designs when pin compatibility is not required. Typical uses include microcontroller data loggers, industrial controllers, embedded instrumentation, access-control systems, and products requiring calendar timestamps after power loss. The I2C interface also makes the DS1307+ convenient for systems already using PCF8574, PCA9557, STM32, MSP430, or similar embedded controllers. Its SRAM can retain small operating parameters without using the MCU’s nonvolatile memory. When designing around the DS1307+, verify the complete pinout, crystal connection, supply decoupling, I2C pull-up arrangement, and battery-backed supply architecture before layout release. Firmware must also use the correct device address and BCD register format. For designs where higher time accuracy or a smaller surface-mount footprint is required, a temperature-compensated RTC may be a better architectural choice. This page combines verified manufacturer information, distributor availability, package details, application guidance, and honest replacement analysis. It also distinguishes true drop-in interchangeability from functional alternatives that may require firmware, PCB, or crystal changes.

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DS1307N

DS1307N+ - 64x8 Serial I2C RTC, 56B NV SRAM, 8-DIP | Maxim

The Analog Devices (formerly Dallas Semiconductor / Maxim Integrated) DS1307N+ is a 64 x 8 serial I2C real-time clock (RTC) in an 8-pin PDIP through-hole package (0.300 inch / 7.62 mm), supplied as a clock/calendar IC with 56 bytes of battery-backed nonvolatile SRAM and a 2-wire (I2C) serial interface. It operates from a 4.5 V to 5.5 V supply, draws 1.5 mA active and 200 uA standby, and tracks seconds, minutes, hours, day of week, date, month, and year including valid leap-year handling through 2100. A real-time clock (RTC) is a dedicated integrated circuit that maintains wall-clock time independent of the system host MCU. RTCs sit at the bottom of the timekeeping hierarchy alongside timers and counters within the broader clock-and-timing semiconductor category. They typically combine a 32.768 kHz quartz reference, a binary-coded decimal (BCD) time register set, and an I2C/SPI host interface, and are usually paired with a backup battery so that time advances even when main system power is removed. Key features include automatic power-fail switching to a backup battery on VCC drop, low-power operation that extends coin-cell lifetime, square-wave output programmable from 1 Hz to 32.768 kHz, and on-chip 56-byte NV SRAM that retains data on backup supply. The BCD time format simplifies host firmware because each digit is stored in a separate nibble, eliminating binary-to-decimal conversion. Architecturally, the DS1307N+ uses an external 32.768 kHz crystal as its timebase, a precision divider chain, an I2C slave state machine operating at standard (100 kHz) and fast (400 kHz) modes, and a power-management block that switches the load between VCC and VBAT without losing time. Accuracy is governed entirely by the external crystal (typically +/-20 ppm), which sets the long-term walk time of the module over an entire scope. Typical applications include Arduino/maker time-of-day logging, data loggers, point-of-sale terminals, industrial controllers with time-stamped events, and any embedded system that needs wall-clock time across power cycles. The wide 4.5-5.5 V supply aligns with 5 V-tolerant hosts and legacy logic rails. When designing with this part, choose the external 32.768 kHz crystal carefully (12.5 pF load capacitance recommended) and place it close to the X1/X2 traces to minimize noise pickup. Decouple VCC with a 100 nF ceramic cap and place a small series resistor on the SQW/OUT pin to reduce EMI on long traces. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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DS1307Z+

DS1307Z+ - 64 x 8 I2C RTC with 56B SRAM | Analog Devices

The Analog Devices DS1307Z+ is a 64 x 8 serial real-time clock with a 56-byte battery-backed nonvolatile SRAM, an I2C interface, and an 8-pin SOIC package. It tracks seconds, minutes, hours, day, date, month, and year in binary-coded decimal format, with leap-year compensation valid through 2100. The device is designed for low-power embedded systems that require timekeeping across power loss. A serial real-time clock is a clock-and-calendar integrated circuit that maintains wall-clock time independently of a processor. The DS1307Z+ belongs to the broader timekeeping and real-time-clock hierarchy, using a two-wire I2C bus to transfer addresses and data between the host controller and the RTC. Its 56-byte NV SRAM provides small nonvolatile storage alongside the calendar registers. The principal features include a 5 V supply application, 8-pin SOIC packaging, two-wire serial communication, 64 x 8 register organization, 56 bytes of battery-backed RAM, and automatic end-of-month date adjustment. The clock/calendar also includes programmable square-wave output capability according to the device documentation. The SOIC package is suitable for conventional surface-mount PCB assembly. The DS1307 architecture separates timekeeping from the host processor, allowing a microcontroller to read and write calendar data over I2C while the RTC continues counting from its external crystal timebase. The backup battery supplies the RTC and SRAM when the primary supply is removed. Applications should account for the device's 5 V operating context, crystal selection, pull-up requirements, and battery-backup implementation when laying out the board. Typical applications include industrial control panels, data loggers, embedded instruments, access-control terminals, and battery-backed embedded systems. The device is particularly useful when the system needs date and time persistence without maintaining a software clock during a complete power interruption. For designs using another RTC with a different pinout or supply requirement, compatibility must be verified rather than assumed. When laying out the PCB, keep the I2C traces short, provide the required bus pull-ups, place the crystal close to the device, and separate noisy switching or high-current paths from the timekeeping network. Verify the backup-battery circuit, initialization sequence, calendar limits, and square-wave configuration in firmware. This page combines verified manufacturer and distributor information with practical RTC design guidance. The DS1307Z+ is specifically identified by Analog Devices/Maxim Integrated as an 8-SOIC, 0.154-inch-width, 3.90 mm-width real-time clock. The verified distributor results list the part as a 56-byte I2C clock/calendar device with a list price starting from $2.39 on the manufacturer product page.

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DS1307Z+T&R/C01

DS1307Z+T&R/C01 - 56B I2C RTC | Analog Devices

The Analog Devices DS1307Z+T&R/C01 is a low-power serial real-time clock and calendar with 56 bytes of nonvolatile SRAM, a 4.5 V to 5.5 V supply range, and an I²C interface in an 8-pin SOIC package. It stores seconds, minutes, hours, day, date, month, and year in binary-coded decimal format, while automatically adjusting the end-of-month date for months containing fewer than 31 days. The device also provides a programmable square-wave output according to the manufacturer product information. A real-time clock is an integrated circuit that maintains calendar time independently of the system processor. It belongs to the RTC and timekeeping IC hierarchy, where a clock/calendar supplies time and date information to embedded processing systems. A serial RTC combines this timekeeping function with a bidirectional bus such as I²C, allowing a microcontroller to read and write the clock registers and use the integrated SRAM for small quantities of retained data. The DS1307 combines a full BCD clock/calendar with 56 bytes of NV SRAM in one 8-SOIC device. Its I²C interface uses serial address and data transfer, while the available clock fields cover seconds through year. The manufacturer states that month-end dates are adjusted automatically, reducing the software required for common calendar corrections. The specified 4.5 V to 5.5 V operating supply also places the device in conventional 5 V embedded-system environments. The DS1307 is presented as a 64 × 8 serial I²C RTC in distributor documentation, while the underlying clock/calendar and 56-byte NV SRAM organization provides separate timekeeping and data-retention functions in the same package. Its 8-SOIC case, identified as 0.154 inch wide and 3.90 mm in body width, supports compact through-hole-style PCB assembly and conventional surface-mount reflow handling. The /C01 ordering suffix is associated with the supplied tape-and-reel product configuration. Typical uses include embedded data loggers, industrial controllers, consumer electronics, access-control equipment, and small systems that require persistent timestamps or a simple battery-backed calendar. It can also serve as a host-side real-time clock in a microcontroller design where the processor sleeps between tasks and must recover accurate elapsed and calendar information. The integrated SRAM offers limited data retention without adding a separate memory IC. Designers should verify the system bus pull-up arrangement, backup-battery behavior, and supply decoupling against the manufacturer datasheet before production release. The I²C lines and backup source must be arranged so normal supply transitions do not corrupt the clock/calendar or SRAM. Firmware should also verify the device address and the relationship between local time, UTC, daylight-saving rules, and the programmed calendar format. This product record combines the manufacturer product description, the DS1307 manufacturer datasheet link, and distributor evidence for the 56-byte NV SRAM, 4.5 V to 5.5 V supply, I²C interface, 8-SOIC package, date format, and current ordering configuration. It also distinguishes verified drop-in alternatives from superficially similar RTC devices that require different interfaces, packages, or pin assignments.

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DS1307Z/T&R

DS1307Z/T&R - 56B I2C RTC with NV SRAM | Analog Devices

Analog Devices DS1307Z/T&R is a low-power serial real-time clock with 56 bytes of nonvolatile SRAM, a 4.5 V to 5.5 V supply range, and an I2C two-wire interface in an 8-pin SOIC package. It maintains seconds, minutes, hours, day, date, month, and year data in binary-coded decimal format and automatically adjusts the end-of-month date for months containing fewer than 31 days. The DS1307Z/T&R also provides a programmable square-wave output for periodic external timing or interrupt applications. A real-time clock, or RTC, is a low-power timing integrated circuit that preserves calendar and clock information while the main system is unpowered. Within the semiconductor hierarchy, the DS1307 is a real-time clock, a clock and timing IC, and ultimately a power-management IC for systems requiring timekeeping beyond the main processor's operational state. Its integrated nonvolatile SRAM allows a host controller to retain small amounts of configuration or diagnostic data alongside the calendar registers. The DS1307 communicates through a bidirectional, two-wire serial bus identified in the manufacturer documentation as I2C. This interface minimizes pin count and allows the RTC to share SDA and SCL wiring with other compatible devices when address management and electrical pull-ups are handled correctly. Its BCD calendar representation and automatic month-end handling simplify date maintenance in embedded firmware. A square-wave output can provide a stable periodic reference without requiring the host to run continuously. The 8-pin SOIC package is surface mount and is identified by distributor data as measuring 3.90 mm in width, corresponding to the common 0.154-inch narrow-SOIC outline. The available verified data identifies the Z suffix with an 8-SOIC package and the tape-and-reel ordering configuration. The product operates from a nominal 5 V supply, making it appropriate for legacy industrial, consumer, communications, and embedded systems that retain a 5 V I2C power domain. Typical applications include industrial control panels, data loggers, metering equipment, communications equipment, embedded instruments, and products requiring persistent timestamps. The 56-byte nonvolatile SRAM is useful for configuration flags, counters, or small system records, while the real-time clock supplies a date and time source independent of the main microcontroller's reset state. The integrated square-wave output can support periodic task scheduling, sampling triggers, or external timing functions. Designers should confirm the complete electrical limits, oscillator requirements, and recommended crystal and load-capacitor values against the manufacturer datasheet. The I2C bus requires suitable pull-up resistors and correct address selection when multiple peripherals share the same conductors. PCB placement should keep the RTC and its 32.768 kHz crystal network close together and away from high-current switching nodes to reduce timing noise and unintended clock coupling. This page consolidates the verified manufacturer description, distributor pricing and inventory references, package information, comparison data, and practical implementation guidance. It also distinguishes verified drop-in options from related clocks that may require pinout and accuracy checks rather than assuming that every RTC with an I2C interface is interchangeable.

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