10AX115R3F40E2LG vs 10AX115R2F40E2SG तुलना
विस्तृत दोनों ओर की तुलना 10AX115R3F40E2LG द्वारा Intel और 10AX115R2F40E2SG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
10AX115R3F40E2LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
10AX115R3F40E2LG ✓ सक्रिय
विशेषता तुलना
| पैरामीटर | 10AX115R3F40E2LG | 10AX115R2F40E2SG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 GX | Arria 10 GX |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,856 bits | — |
| DSP Blocks | 1,518 (with integrated hard floating-point) | — |
| Maximum User I/O | 342 | — |
| Number of Pins / Balls | 1517 | — |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA) | — |
| Process Node | 20 nm | — |
| Core Voltage | 0.9 V | — |
| Maximum Transceiver Data Rate | 28.05 Gbps | — |
| Number of Transceiver Channels | [DATA_NEEDED: transceiver channel count] | — |
| Hard Memory Controller | Yes (DDR4/DDR3/QDR IV) | — |
| Hard PCIe Controller | Yes (PCIe Gen3 x8 hard IP) | — |
| ऑपरेटिंग तापमान | -40 C to +100 C (extended) | 0C to +100C (commercial) |
| Temperature Grade | Extended (E) | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| RoHS स्थिति | Compliant | — |
| Programming Tool | Intel Quartus Prime Pro / Standard | — |
| Embedded Memory Bits | — | 68,857,856 |
| M20K Memory Blocks | — | 2,128 |
| MLAB Memory Bits | — | 8,812,800 |
| Variable-Precision DSP Blocks | — | 1,518 |
| 18 x 19 Multipliers | — | 3,036 |
| PLLs | — | 16 |
| User I/O Pins | — | 342 |
| Transceiver Count | — | 48 (max 96 for the family) |
| Transceiver Data Rate | — | up to 17.4 Gbps (chip-to-chip) |
| Hard Memory Controllers | — | Yes |
| PCIe Hard IP | — | Gen3 x1/x2/x4/x8 |
| Process Technology | — | 20 nm TSMC |
| Speed Grade | — | -2 (E2, mid) |
| पैकेज | — | 1517-ball FCBGA, 40 x 40 mm |
| RoHS | — | Compliant |