5CSXFC5C6U23C6N vs 5CSXFC5C6U23I7-N तुलना
विस्तृत दोनों ओर की तुलना 5CSXFC5C6U23C6N द्वारा Intel और 5CSXFC5C6U23I7-N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
5CSXFC5C6U23C6N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
5CSXFC5C6U23C6N ✓ सक्रियविशेषता तुलना
| पैरामीटर | 5CSXFC5C6U23C6N | 5CSXFC5C6U23I7-N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX (SoC FPGA) |
| Logic Elements | 85,000 LE | 85,000 |
| Adaptive Logic Modules (ALMs) | 32,070 ALM | — |
| Embedded Memory | 3.88 Mbit | [DATA_NEEDED: total M10K + MLAB Kbits] |
| Number of User I/Os | 145 I/O | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of HPS Cores | 2 | — |
| HPS Maximum Clock Frequency | 925 MHz | — |
| L1 Cache (Instruction, per core) | 32 KB | — |
| L1 Cache (Data, per core) | 32 KB | — |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Speed Grade | 6 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| पैकेज | 672-pin UBGA (23x23 mm), 0.8 mm ball pitch | 672-pin UBGA (23 × 23 mm, 1.0 mm pitch) |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL स्तर | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| RoHS स्थिति | Compliant | Compliant |
| HPS Maximum Core Frequency | — | 800 MHz |
| DSP Blocks | — | 87 variable-precision DSP blocks |
| DSP Multiplier Modes | — | 18 × 18 and 27 × 27 |
| Transceivers | — | Up to 6.144 Gbps |
| PLLs | — | 6 general-purpose + 2 DLL + 5 transceiver PLLs |
| HPS Peripherals | — | 2× EMAC, USB 2.0 OTG, 2× CAN, 2× UART, 2× I²C, 2× SPI, NAND, DDR3 controller with ECC |
| Core Voltage | — | 1.1 V |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C (junction) |