A3P1000-1FG256T vs A3P1000L-1FG256 तुलना
विस्तृत दोनों ओर की तुलना A3P1000-1FG256T द्वारा Microchip Technology और A3P1000L-1FG256 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3P1000-1FG256T - ProASIC3 FPGA 1M Gates 177 I/O | Microchip
A3P1000-1FG256T ✓ सक्रियMicrochip Technology
A3P1000L-1FG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
A3P1000L-1FG256 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3P1000-1FG256T | A3P1000L-1FG256 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3 | ProASIC3L (Flash FPGA) |
| Logic Technology | Flash-based FPGA | — |
| System Gates | 1000000 gates | 1,000,000 |
| VersaTiles / Cells | 24576 | — |
| User I/O | 177 | — |
| Embedded Configuration Flash | 147456 bits | — |
| Speed Grade | -1 | -1 |
| पैकेज | 256-LBGA (FBGA-256), 1 mm pitch | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Configuration | Non-volatile, single-chip, instant-on | — |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Security Features | Flash lock, design protection from cloning | — |
| Temperature Grading | Automotive (per distributor data) | — |
| AEC-Q100 | Qualified (per Utmel listing) | — |
| Packing | Tape & Reel (T suffix) | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | [DATA_NEEDED: core supply voltage] | — |
| MSL स्तर | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Elements (VersaTiles) | — | 24,576 |
| User I/Os | — | 177 |
| Embedded SRAM | — | 147,456 bits |
| Core Voltage (L grade) | — | 1.2 V (1.2 V to 1.5 V supported) |
| अधिकतम क्लॉक फ़्रीक्वेंसी | — | [DATA_NEEDED: verified fMAX for -1 grade] |
| Technology | — | Nonvolatile flash, CMOS |
| Configuration Memory | — | On-chip flash (single-chip, Instant-On) |
| Low Power Feature | — | Flash*Freeze technology |
| Package Height | — | 1.6 mm |
| RoHS स्थिति | — | Compliant |