A3PE600-2FGG256 vs A3PE600-1FGG256I तुलना
विस्तृत दोनों ओर की तुलना A3PE600-2FGG256 द्वारा Microchip Technology और A3PE600-1FGG256I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-2FGG256 ✓ सक्रियMicrochip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3PE600-2FGG256 | A3PE600-1FGG256I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements (CLBs) | 13824 | — |
| Maximum System Frequency | 310 MHz | — |
| Process Technology | 130 nm CMOS | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Voltage | 1.5 V | — |
| Number of User I/O | 165 | — |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | On-chip Flash (Live at Power-Up, Level 0) |
| Speed Grade | -2 | -1 |
| पैकेज | 256-LBGA (FGG256) | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Reprogrammability | In-system reprogrammable | Yes (single-chip, no external boot PROM) |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | -40C to +100C (TJ), industrial |
| Embedded SRAM | [DATA_NEEDED: total embedded SRAM capacity] | 110592 bits (up to 504 kbits family density) |
| I/O Standards | [DATA_NEEDED: supported I/O standards list] | — |
| RoHS स्थिति | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class | — |
| Logic Cells | — | 13824 |
| User I/O | — | 165 |
| Maximum System Performance | — | 272 MHz |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Logic Family | — | CMOS |
| Typical Application Domains | — | Industrial, communications, medical, aerospace/defense |