ATSAMA5D34A-CUR vs ATSAMA5D41A-CUR तुलना
विस्तृत दोनों ओर की तुलना ATSAMA5D34A-CUR द्वारा Microchip Technology और ATSAMA5D41A-CUR द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
ATSAMA5D34A-CUR - Cortex-A5 MPU 536MHz 128KB SRAM LFBGA-324
ATSAMA5D34A-CUR ✓ सक्रियMicrochip Technology
ATSAMA5D41A-CUR - ARM Cortex-A5 600MHz MPU 289-LFBGA | Microchip
ATSAMA5D41A-CUR ✓ सक्रियविशेषता तुलना
| पैरामीटर | ATSAMA5D34A-CUR | ATSAMA5D41A-CUR |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| CPU Core | ARM Cortex-A5 (ARMv7-A) | — |
| Maximum CPU Clock | 536 MHz | 600 MHz |
| Core Architecture | 32-bit RISC with FPU + NEON | ARM Cortex-A5 (ARMv7-A) |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Internal SRAM | 128 KB | — |
| ROM (Boot) | 160 KB | — |
| Core Supply Voltage | 1.08 V to 1.2 V | — |
| I/O Supply Voltage | 3.3 V (typ) | — |
| पैकेज | 324-LFBGA 15x15 mm, 0.8 mm pitch | 289-LFBGA (14x14 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| ऑपरेटिंग तापमान | -40 C to +85 C (Industrial) | -40C to +85C (industrial) |
| External Memory Interface | DDR2 / LPDDR / NAND / eMMC / SD | — |
| Ethernet | Dual 10/100/1000 MAC (GMII/RGMII/MII) | Dual 10/100/1000 GMAC |
| USB | USB 2.0 High-Speed Host + Device | USB 2.0 High-Speed Host + Device |
| CAN | 2x CAN controllers | Dual CAN controllers |
| LCD Controller | Integrated, up to XGA | TFT up to XGA (2048x2048 max) |
| Image Sensor Interface | Yes (ISI) | — |
| Cryptography | AES, TDES, SHA, TRNG | — |
| GPIO Count | Up to 105 | — |
| RoHS स्थिति | Compliant (Green) | Compliant |
| Core Count | — | 1 |
| Bit Width | — | 32-bit |
| SIMD Engine | — | ARM NEON |
| Floating Point Unit | — | Yes (hardware FPU) |
| L2 Cache | — | 128 KB |
| On-chip ROM | — | 128 KB (boot ROM) |
| Operating Voltage | — | 3.3 V I/O (core rail separate) |
| External Memory | — | DDR2/LPDDR/LPDDR2, NAND, eMMC |
| Packaging | — | Tape & Reel (TR) |