EP2AGX45DF29C4N vs EP2AGX45DF29C4G तुलना
विस्तृत दोनों ओर की तुलना EP2AGX45DF29C4N द्वारा Intel और EP2AGX45DF29C4G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGX45DF29C4N | EP2AGX45DF29C4G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Arria II GX | Arria II GX |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | — |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | 8 (3.75 Gbps) |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | 4 |
| Temperature Range | 0C to +85C (commercial) | — |
| पैकेज | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-BBGA, FC-FBGA (29 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| MSL स्तर | 3 | — |
| RoHS स्थिति | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Number of Logic Elements | — | 42959 |
| Number of Logic Array Blocks (LABs) | — | 2234 |
| Total Memory Bits | — | 3517440 |
| Embedded Memory | — | 9 Kbit blocks (M9K) |
| Number of I/O | — | 364 |
| Multiplier Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Core Voltage | — | 0.9 V |
| ऑपरेटिंग तापमान | — | 0C to +85C (Commercial, 'C' suffix) |
| Configuration Memory | — | AES 256-bit encryption |