EP2AGZ300HF40C3G vs EP2AGZ350HF40C3G तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ300HF40C3G द्वारा Intel और EP2AGZ350HF40C3G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G ✓ सक्रियविशेषता तुलना
| पैरामीटर | EP2AGZ300HF40C3G | EP2AGZ350HF40C3G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Arria II GZ | — |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| पैकेज | 1517-ball FBGA | 1517-ball FineLine BGA (HF40) |
| Speed Grade | C3 (commercial) | C3 (commercial, -3) |
| Lead Finish | Pb-free (G suffix) | — |
| ऑपरेटिंग तापमान | Commercial (0C to +85C) | Commercial (0C to 85C, suffix 0C) |
| Embedded Memory | Approx. 18.7 Mbits | [DATA_NEEDED: total embedded memory bits] |
| DSP Blocks | 800+ (18x18 multipliers) | [DATA_NEEDED: DSP block count and 18x18 multiplier count] |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | — |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| RoHS स्थिति | Pb-free finish - compliant | Compliant |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Arria II GZ |
| Logic Elements (LEs) | — | 350,000 |
| User I/O Pins | — | 734 |
| Package Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Transceivers | — | Up to 6.375 Gbps (channel count [DATA_NEEDED]) |
| External Memory Interfaces | — | DDR3, DDR2, QDR II+ (up to 800 MHz) |
| PCI Express Hard Blocks | — | Yes (Gen1/Gen2) |
| Lead-Free | — | Yes |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |