APA300-BG456 - 300K-Gate 180 MHz FPGA | Microchip
MPN: APA300-BG456 ✓ सक्रियAPA300-BG456 अवलोकन
A field-programmable gate array, or FPGA, is a programmable logic semiconductor that combines configurable logic blocks, programmable interconnect, memory, and I/O in one device. The APA300 belongs to the ProASICPLUS family and occupies a practical middle ground between fixed-function ASICs and larger programmable-logic devices. It provides ASIC-like integration and predictable flash-based startup while retaining design flexibility through reusable configuration and software support.
The ProASICPLUS architecture provides 8,192 cells for logic implementation, 72 Kbit of block RAM for data storage, and up to 290 user I/O. Its maximum stated operating frequency is 180 MHz. These resources support parallel data processing, state-machine control, bus interfaces, protocol bridging, and fixed-function logic that benefits from reprogrammability. Flash-based configuration also makes the device useful where deterministic power-up behavior and elimination of a separate configuration memory are priorities.
The APA300-BG456 uses 2.5 V and 3.3 V supply terminology listed for the device and is built on a 0.22 µm CMOS process. Its 456-ball BGA construction provides a large pin and power-distribution interface for high-I/O logic designs. Because the package contains 456 balls rather than only 456 perimeter leads, board layout requires precise via, escape-routing, and thermal-management practices. The 35 mm by 35 mm body also demands a sufficiently large PCB area and careful component-to-ball alignment.
Typical implementations include industrial control and automation, communications infrastructure, instrumentation, embedded signal processing, ASIC prototyping, and general digital logic consolidation. The 290 I/O count is particularly useful for systems requiring numerous parallel connections, while 72 Kbit of block RAM can implement buffers, lookup tables, packet storage, or state data without relying entirely on external memory.
The main design consideration is board-level implementation of a large BGA. Use the manufacturer’s package drawing and pinout when defining the land pattern, power planes, decoupling, and assembly process. Validate thermal performance across the intended operating environment and configure unused I/O according to the device recommendations. Reuse of the PCB footprint must also preserve the correct voltage, bank, and I/O constraints for the selected speed or temperature grade.
This page combines the device identity, package and resource details with application-specific engineering guidance, compatibility-oriented alternatives, and a parameter comparison. These resources help designers determine whether the ProASICPLUS architecture, 456-ball footprint, and flash-programmable logic density fit an existing design before beginning board implementation.
के लिए ड्रॉप-इन विकल्प APA300-BG456 — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।
APA300-BG456I
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
APA300-BG456M
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
APA300-FBGG456
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
APA300-BG456 Maximum Ratings और Electrical Characteristics
| Device Type | ProASICPLUS Flash FPGA |
| Logic Gates | 300,000 gates |
| Configurable Cells | 8,192 cells |
| Maximum Operating Frequency | 180 MHz |
| User I/O | 290 I/O |
| Block RAM | 72 Kbit |
| पैकेज | 456-ball PBGA |
| Package Dimensions | 35 mm x 35 mm |
| Ball Pitch | 1.27 mm |
| Process Technology | 0.22 µm CMOS |
| सप्लाई वोल्टेज | 2.5 V and 3.3 V |
| Configuration Memory | Nonvolatile flash |
| Power-Up Behavior | Live at power-up |
| Programming | Reprogrammable |
| RoHS स्थिति | RoHS non-compliant |
| Lead-Free Status | Contains lead |
| माउंटिंग प्रकार | Surface mount |
APA300-BG456 35 mm x 35 mm पिन कॉन्फ़िगरेशन गाइड
APA300-BG456 (35 mm x 35 mm पैकेज) के लिए पिन कॉन्फ़िगरेशन। इस डिजिटल IC में GPIO, संचार इंटरफ़ेस (UART, SPI, I2C) और पावर पिन शामिल हैं। वैकल्पिक पिन फ़ंक्शन और कॉन्फ़िगरेशन विकल्पों के लिए निर्माता डेटाशीट देखें। एम्बेडेड सिस्टम डिज़ाइन और PCB लेआउट के लिए आवश्यक।
इसके लिए कोई विस्तृत pinout data उपलब्ध नहीं: APA300-BG456.
देखें डेटाशीट पूर्ण पिन कॉन्फ़िगरेशन के लिए।
सामान्य अनुप्रयोग
APA300-BG456 के लिए उपयुक्त है 6 अनुप्रयोगs: Industrial Control and Automation, Communications Interface and Protocol Bridging, Data Acquisition and Instrumentation, ASIC Prototyping and Logic Consolidation, Embedded Signal and Control Processing, Network Storage and Interface Cards.
Industrial Control and Automation
The APA300-BG456 fits industrial controllers that combine machine sequencing, parallel sensor acquisition, actuator control, and communications. Its 8,192 configurable cells and 300,000 logic gates provide substantial capacity for consolidating control functions, while 290 I/O reduce the need for external interface devices. The 72 Kbit of block RAM can support buffers, counters, and intermediate data paths. At the stated 180 MHz operating capability, the device can service multiple clocked logic domains, subject to the design timing and I/O standards. The nonvolatile flash configuration supports live-at-power-up startup, which is useful when equipment must enter a defined state immediately after power restoration.
अनुशंसित
Communications Interface and Protocol Bridging
The APA300-BG456 is appropriate for communications equipment requiring parallel data paths, protocol conversion, and FPGA-assisted line handling. Its 290 user I/O can accommodate byte-wide buses and control signals, while the 8,192 cells allow parallel-to-serial logic, framing logic, and state machines to be implemented together. The 72 Kbit of block RAM is useful for packet buffering, elastic stores, and clock-domain crossing where supported. With operation stated up to 180 MHz, the FPGA can process moderate-rate parallel data without an external logic device. The flash architecture also permits field upgrades of protocol or interface behavior without relying on a separate boot PROM.
अनुशंसित
Data Acquisition and Instrumentation
The APA300-BG456 can serve as the central programmable logic device in data-acquisition and test-instrumentation systems. Its large I/O count provides connections for converters, sensors, trigger logic, status indicators, and memory interfaces, while the programmable interconnect allows several acquisition sections to coexist in one package. The 72 Kbit of block RAM can implement sample buffering, calibration tables, or capture windows, and the stated 180 MHz operating frequency supports demanding parallel datapaths. Nonvolatile configuration ensures that acquisition sequencing can begin predictably at power-up, which is valuable in unattended test systems where software initialization must complete before measurements begin.
अनुशंसित
ASIC Prototyping and Logic Consolidation
The APA300-BG456 is useful for consolidating prototype logic that would otherwise be distributed across multiple programmable or fixed-function devices. The 300,000-gate capacity and 8,192 cells allow designers to implement control blocks, datapaths, counters, and interfaces before committing to an ASIC. Its 290 I/O can expose more parallel functionality than a small CPLD, and 72 Kbit of block RAM supports embedded data storage. Because the configuration is stored in nonvolatile flash, the prototype can boot directly into its programmed design. This makes the device useful for validating clocking, bus arbitration, and system-level sequencing before a high-volume custom-silicon transition.
अनुशंसित
Embedded Signal and Control Processing
The APA300-BG456 can implement parallel filtering, timing, decoding, and control functions in embedded systems where dedicated DSP or FPGA capacity would be excessive. Its 8,192 configurable cells support a mixture of sequential and combinational logic, while 72 Kbit of block RAM provides local storage for samples, symbols, or pipeline stages. The 290 I/O allow direct connection to sensors, converters, and actuators, reducing external routing requirements. Operation up to 180 MHz provides a suitable clocking range for many control loops and digital signal-processing blocks. The design must still account for timing closure, synchronous clocking, and the specified I/O behavior of each selected package suffix.
अनुशंसित
Network Storage and Interface Cards
The APA300-BG456 is suitable for interface-card logic that requires flexible parallel I/O, local buffering, and programmable data movement. Its 456-ball package exposes 290 user I/O, enabling direct connections among transceivers, memory components, and host-facing buses. The 72 Kbit of embedded block RAM can support packet buffers, command queues, or data staging, while the 300,000-gate architecture allows multiple interface channels to share one device. The nonvolatile flash configuration supports rapid system startup and field-reconfigurable behavior. For sustained traffic, engineers should balance logic timing, memory bandwidth, thermal conditions, and board signal-integrity requirements around the 1.27 mm-pitch BGA.
अनुशंसित
अनुशंसित उत्पादों का सारांश
के लिए इंजीनियरिंग संदर्भ डेटा APA300-BG456 — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।
चयन गाइड
विकल्पों के साथ तुलना
| पैरामीटर | यह उत्पाद | APA300-BG456I | APA300-BG456M | APA300-FBGG456 |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 456-ball PBGA, 35 mm x 35 mm | 456-ball PBGA, same package | 456-ball PBGA, same package | 456-ball PBGA |
| Device Family | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS |
| Logic Gates | 300,000 gates | 300,000 gates | 300,000 gates | 300,000 gates |
| Configurable Cells | 8,192 cells | 8,192 cells | 8,192 cells | 8,192 cells |
| Maximum Operating Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| User I/O | 290 I/O | 290 I/O | 290 I/O | 290 I/O |
| Block RAM | 72 Kbit | 72 Kbit | 72 Kbit | 72 Kbit |
मुख्य विशेषताएँ
- Directly documented terminal and package compatibility (बनामAPA300-BG456I)
- Complete package-compatible replacement option (बनामAPA300-BG456M)
- Substantial integration in one 456-ball device (बनामAPA300-FBGG456)
डिज़ाइन नोट्स
Treat the APA300-BG456 as a demanding fine-pitch BGA design rather than a conventional perimeter-lead package. Base the land pattern on the Microchip package drawing and verify ball numbering, power balls, ground balls, and the 1.27 mm pitch. Plan escape routing, via structures, solder-mask conditions, and component height before releasing the PCB. A 35 mm by 35 mm package also requires sufficient board area for assembly tooling and peripheral routing.
Use the manufacturer’s recommended power and ground-ball assignments when constructing the supply network. Place decoupling capacitance close to the applicable supply balls and provide low-impedance planes or polygons for both core and I/O supplies. Confirm whether the selected suffix permits 2.5 V and 3.3 V operation simultaneously, and follow the package power-up and sequencing requirements rather than assuming that either voltage is interchangeable.
Evaluate heat flow from the 456-ball package into the PCB and any thermal interface material used by the assembly process. The large BGA footprint can spread heat effectively, but internal thermal paths still depend on via arrays, copper distribution, board construction, and enclosure airflow. Validate the worst-case clocking and I/O activity at the highest intended ambient temperature, then confirm that the selected APA300-BG456 grade has an adequate operating-temperature rating.
Account for the 1.27 mm BGA pitch during return-path and escape-routing design. Keep clock and sensitive signal return paths continuous, avoid long stubs beneath the device where practical, and apply the manufacturer’s I/O recommendations to externally driven signals. For high-speed interfaces, validate the complete channel with a representative PCB stack-up because package-ball parasitics, via transitions, and split-plane effects can materially affect timing and edge quality.
Do not substitute APA300-BG456I, APA300-BG456M, or APA300-FBGG456 solely from the package drawing. Although each uses a 456-ball PBGA format, verify the exact ordering suffix, programmed device identity, voltage configuration, operating-temperature range, qualification class, and ball-level compatibility. A mechanical footprint match does not by itself prove that a replacement can be used in an already qualified production design.
अनुपालन जानकारी
The device listing identifies the APA300-BG456 as RoHS non-compliant and containing lead. No REACH, halogen-free, or conflict-minerals declaration was identified.
