EP3C10E144C8 - 10K-Cell Cyclone III FPGA | Altera | 144-Lead
MPN: EP3C10E144C8 ✓ सक्रियEP3C10E144C8 अवलोकन
A field-programmable gate array is a semiconductor whose digital logic and connectivity are configured after fabrication. FPGAs belong to the programmable-logic device hierarchy, combining configurable logic elements, programmable interconnect, memory resources, and user I/O in one device. Compared with a fixed-function microcontroller, the EP3C10E144C8 allows hardware parallelism, custom interface timing, and logic behavior to be changed without changing the PCB. Compared with an application-specific integrated circuit, it offers a shorter path to a customized implementation for prototypes and moderate-volume products.
The Cyclone III family combines 10,320 logic elements with a package offering 94 user I/O according to the verified distributor specification. The EP3C10E144C8 includes an exposed thermal pad in the 144-lead package, which requires attention to PCB thermal design and soldering. The device uses 65 nm CMOS technology and is specified as an FPGA with 10,320 cells. Its performance and I/O characteristics make it appropriate for industrial control, communications, instrumentation, consumer electronics, and embedded processing systems.
Typical uses include programmable control logic, data acquisition, protocol bridging, sensor aggregation, motor and machine control, and low-cost embedded systems. The parallel structure of an FPGA can reduce dependency on multiple discrete logic devices and can simplify timing-constrained interface designs. Designers should select the correct Cyclone III device, pin assignment, configuration source, and I/O standard for the target board.
The key design consideration is that replacing an FPGA is not automatically a drop-in substitution. A candidate must use the same physical package and meet the voltage, configuration, I/O, timing, and pin-mapping requirements of the original design. The EP3C10E144C8 should therefore be evaluated as a board-level device, not merely by logic-cell count. Verify the exact pinout, exposed-pad layout, power rails, decoupling, and configuration scheme against the manufacturer documentation before layout release.
This product page consolidates verified distributor specifications, source links, package details, pricing observations, and practical replacement criteria. It also distinguishes confirmed EP3C10 family candidates from candidates whose resource count or grade differs, helping engineers narrow a drop-in replacement without overlooking FPGA-specific compatibility constraints.
के लिए ड्रॉप-इन विकल्प EP3C10E144C8 — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।
इस सीरीज़ के वेरिएंट
समान श्रृंखला के मॉडल जो ड्रॉप-इन संगत हैं EP3C10E144C8 (समान फॉर्म फैक्टर और फुटप्रिंट) — इसमें भिन्न Family, Package, Process Technology, RoHS Status, Total Memory Bits.
EP3C10E144C8N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EP3C10E144C7N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EP3C10E144I7N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EP3C16E144C8N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EP3C25E144C8N
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
EP3C10E144C8 Maximum Ratings और Electrical Characteristics
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 10,320 cells |
| User I/O | 94 I/O |
| पैकेज | 144-LQFP Exposed Pad |
| Package Type | EQFP-144 |
| Package Body Size | 20 x 20 mm |
| Package Height | 1.60 mm |
| Lead Pitch | 0.40 mm |
| Process Technology | 65 nm CMOS |
| सप्लाई वोल्टेज | 1.2 V |
| Reported Maximum Frequency | 472.5 MHz |
| Alternate Reported Frequency | 402 MHz |
| माउंटिंग प्रकार | Surface Mount |
| Terminal Count | 144 terminals |
| RoHS स्थिति | Yes |
| REACH Compliance | compliant |
| Lead-Free Package | Yes |
EP3C10E144C8 yes पिन कॉन्फ़िगरेशन गाइड
EP3C10E144C8 (yes पैकेज) के लिए पिन कॉन्फ़िगरेशन। इस डिजिटल IC में GPIO, संचार इंटरफ़ेस (UART, SPI, I2C) और पावर पिन शामिल हैं। वैकल्पिक पिन फ़ंक्शन और कॉन्फ़िगरेशन विकल्पों के लिए निर्माता डेटाशीट देखें। एम्बेडेड सिस्टम डिज़ाइन और PCB लेआउट के लिए आवश्यक।
इसके लिए कोई विस्तृत pinout data उपलब्ध नहीं: EP3C10E144C8.
देखें डेटाशीट पूर्ण पिन कॉन्फ़िगरेशन के लिए।
सामान्य अनुप्रयोग
EP3C10E144C8 के लिए उपयुक्त है 6 अनुप्रयोगs: Industrial Control and Automation, Data Acquisition and Instrumentation, Communications Interface and Protocol Bridging, Motor and Machine Control, Consumer and Embedded Processing, Test, Measurement, and Signal Routing.
Industrial Control and Automation
The EP3C10E144C8 fits compact industrial controllers when a design needs deterministic parallel logic, 94 user I/O, and a programmable implementation. It can combine sensor conditioning interfaces, interlocks, counters, communication bridges, and actuator control in one Cyclone III FPGA instead of a network of fixed-function logic. The 144-LQFP Exposed Pad package provides 144 physical terminals and a defined thermal path, allowing the device to be placed on a conventional surface-mount board. Designers should budget timing closure for control loops and verify industrial temperature requirements, isolation boundaries, logic levels, and safety redundancy. The advantage over a microcontroller is hardware parallelism; the trade-off is that configuration memory, I/O standards, and FPGA toolchain support must be managed.
अनुशंसित
Data Acquisition and Instrumentation
The EP3C10E144C8 is suitable for instrumentation front ends that must collect, time, and route multiple digital signals in parallel. Its 10,320 logic cells can support sampling control, trigger logic, data packing, and interface conversion, while the verified 94-I/O count provides external signal access. A practical design could capture sensor or test-equipment events, timestamp them in logic, and transfer them through a parallel or serial bridge. The FPGA’s deterministic hardware structure can simplify timing-sensitive acquisition compared with a software-only implementation. Engineers should budget internal memory for buffering, confirm supported I/O standards, and apply synchronous design practices to minimize clock skew and hold-time risk.
अनुशंसित
Communications Interface and Protocol Bridging
The EP3C10E144C8 can implement custom communication adapters, protocol converters, and test interfaces when the design benefits from parallel datapaths and programmable timing. Its Cyclone III fabric can handle framing, checksum generation, FIFO control, clock-domain crossing, and bus arbitration in hardware. The 94 user I/O make the device useful for multi-bit legacy interfaces that would otherwise require several bridge ICs. For networking equipment, validate protocol timing, I/O voltage, and transceiver requirements before schematic freeze. Compared with an ASIC, the FPGA permits late logic changes and faster product revisions; compared with a low-cost MCU, it offers higher deterministic throughput and less CPU involvement.
अनुशंसित
Motor and Machine Control
The EP3C10E144C8 is appropriate for programmable motor-control and machine-sequencing systems requiring deterministic outputs and multiple discrete interfaces. It can generate pulse-width modulation, capture encoder signals, coordinate limit switches, and supervise stepper or brushless-motor sequencing in parallel. The verified 94-I/O count supports a substantial number of external control and status lines, while the 10,320-cell device is appropriate for control rather than very large datapath processing. The exposed pad should be tied to the required thermal and power ground network according to the manufacturer layout guidance. Final qualification depends on motor-drive isolation, power-conversion circuitry, timing margins, and any functional-safety requirements.
अनुशंसित
Consumer and Embedded Processing
The EP3C10E144C8 can serve as the programmable control core in cost-sensitive embedded products that need flexible logic alongside conventional processors. Typical functions include keypad scanning, display timing, sensor aggregation, boot sequencing, peripheral arbitration, and custom LED or motor patterns. Its programmable fabric allows product variants to share one PCB while changing bitstreams or interface behavior. The 144-lead exposed-pad package is compatible with automated surface-mount assembly, but exposed-pad paste, solder profile, and underfill or via requirements should be reviewed carefully. Compared with a dedicated microcontroller, the FPGA adds configuration complexity; compared with a gate-array ASIC, it reduces mask cost and shortens revision cycles.
अनुशंसित
Test, Measurement, and Signal Routing
The EP3C10E144C8 is useful in test and measurement products where flexible routing, pattern generation, sequencing, and acquisition must coexist in a compact instrument. The FPGA can implement programmable stimulus, switching control, counters, and data formatting while exposing up to the verified 94 user I/O. This supports bench equipment, automated test systems, and production-test controllers that benefit from changing test sequences without PCB changes. Timing-critical paths should use the device’s clock resources and explicit constraints, while high-speed interfaces require examination of board-level signal integrity. The reported 402 MHz and 472.5 MHz figures must be reconciled against the exact speed grade before they are used to establish system timing.
अनुशंसित
अनुशंसित उत्पादों का सारांश
के लिए इंजीनियरिंग संदर्भ डेटा EP3C10E144C8 — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।
चयन गाइड
विकल्पों के साथ तुलना
| पैरामीटर | यह उत्पाद | EP3C10E144C8N | EP3C10E144C7 | EP3C10E144I7N | EP3C16E144C8N | EP3C25E144C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-EQFP | 144-EQFP | EQFP-144 | EQFP-144 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
मुख्य विशेषताएँ
- Closest verified package and resource match (बनामEP3C10E144C8N)
- Smaller resource class than larger EP3C16 and EP3C25 options (बनामEP3C16E144C8N)
- Exact 94-I/O package positioning confirmed by distributor data (बनामEP3C10E144C7)
डिज़ाइन नोट्स
Treat the exposed pad as both a thermal path and a package-level layout item. Follow the exact manufacturer land pattern, connect the pad to the specified power or ground plane, and use multiple thermal vias only where the package drawing and assembly process permit. Validate solder-paste volume and the reflow profile for the 0.40 mm-pitch EQFP-144 package. Do not infer the pad connection from general exposed-pad practice; the exact EP3C10E144C8 pinout and power architecture must be checked.
Place configuration-interface, clock, and decoupling structures according to the Cyclone III device layout guidance. Keep sensitive clock and configuration paths short, provide the required logic levels for configuration pins, and verify that the selected configuration scheme works at power-up. The EP3C10E144C8 supports 94 user I/O in a 144-terminal package, so route escapes carefully and avoid adding undocumented test pads or stubs that could affect high-speed signal integrity.
Do not treat EP3C10E144C8N, EP3C10E144C7, or larger EP3C16/EP3C25 devices as automatic drop-in replacements merely because their package names match. Confirm the ordering code, speed grade, temperature range, pinout, configuration interface, supported I/O standards, and bitstream compatibility. Also confirm that the active lifecycle statement applies to the exact suffix; the supplied search results contain both active and related-device records, and a suffix change may affect procurement or production qualification.
अनुपालन जानकारी
RoHS and REACH compliance were extracted from the verified EP3C10E144C8 comparison data. The package is described as lead-free. AEC-Q100 qualification, halogen-free status, and conflict-minerals status were not explicitly provided and remain unknown.