Microchip Technology

M2GL025-FCS325 - 27.6K Logic Cells, 180 I/O FPGA | Microchip

MPN: M2GL025-FCS325 ✓ सक्रिय
1.2 V Vdss 325-TFBGA FCBGA Package Embedded flash Memory
न्यूनतम ऑर्डर मात्रा: 1 |

M2GL025-FCS325 अवलोकन

Microchip Technology M2GL025-FCS325 is an IGLOO2 low-density flash FPGA with 27.6K logic elements, 180 user I/O, and a 325-TFBGA FCBGA package. The device operates from a 1.2 V core supply and combines programmable logic, embedded SRAM, and flash configuration memory in one nonvolatile package.

A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, alongside complex programmable logic devices and programmable system-on-chip devices. Unlike a fixed-function microcontroller or logic ASIC, an FPGA can implement multiple interface, control, protocol, and data-processing functions in parallel while retaining its programmed configuration in nonvolatile flash memory.

The IGLOO2 family targets low-density designs requiring bridging, I/O expansion, conversion, system management, secure connectivity, and embedded control. M2GL025 provides 27,696 programmable logic cells according to the distributor record and a 1.2 V supply. Its 180 I/O complement supports systems that need numerous external connections, while the 325-ball FCBGA package supports dense board routing and high-speed interfaces.

Flash configuration is a major architectural benefit because the configuration remains present when power is removed, allowing the FPGA to operate without a separate configuration PROM. After programming, the device can implement parallel data paths, interface controllers, protocol bridges, and supervisory logic. Design partitioning and timing closure become more important as a design moves from a simple control function toward high-throughput serial or parallel data processing.

Typical uses include industrial communication equipment, medical-device control systems, defense and aviation electronics, embedded protocol bridges, and general-purpose I/O expansion. The IGLOO2 family is also used in Gigabit Ethernet and dual PCI Express control-plane designs, although the suitability of any individual interface depends on the selected device, pin assignment, speed grade, and bank constraints.

PCB implementation requires careful assignment of power, ground, configuration, clock, and user I/O balls. Follow the manufacturer’s IGLOO2 packaging and pin-description user guide for every FCS325 ball assignment. Differential pairs and high-speed interfaces should be routed with controlled impedance, while configuration pins and sensitive analog functions require the decoupling and grounding practices specified by the manufacturer.

This page combines the exact device identity, package information, source-linked technical records, practical PCB guidance, and qualified replacement analysis. It is designed to help engineers determine whether the M2GL025-FCS325 matches the required logic density, I/O count, package, temperature grade, and programming workflow before committing a board design.

के लिए ड्रॉप-इन विकल्प M2GL025-FCS325 — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।

इस सीरीज़ के वेरिएंट

समान श्रृंखला के मॉडल जो ड्रॉप-इन संगत हैं M2GL025-FCS325 (समान फॉर्म फैक्टर और फुटप्रिंट) — इसमें भिन्न Device Type, Package, User I/O.

Microchip Technology
Device Type: IGLOO2 low-density flash FPGA
Package: 325-BGA FCBGA
User I/O: 200 I/O
इसके साथ तुलना करें M2GL025-FCS325 →

M2GL025-FCS325I

✅ ड्रॉप-इन
📦 325-TFBGA FCBGA
Same 27.6K logic-element class, 180 I/O, 1.2 V core, and 325-TFBGA package; temperature-grade suffix differs and must match the system requirement.

📋 संदर्भ विकल्प (कैटलॉग में नहीं)

M2GL050-FCS325

✅ ड्रॉप-इन
Microchip Technology
📦 325-TFBGA FCBGA
IGLOO2 low-density flash FPGA · 56,340 cells · 200 I/O · 1.2 V · 325-BGA FCBGA · 325 balls · Microchip Technology · IGLOO2

कीमत के लिए संपर्क करें

डेटाशीट देखें →

M2GL025-FCS325 Maximum Ratings और Electrical Characteristics

Device Type IGLOO2 Low Density Flash FPGA
Programmable Logic Cells 27,696 cells
Advertised Logic Elements 27.6K LEs
User I/O 180 I/O
Core Supply Voltage 1.2 V
पैकेज 325-TFBGA FCBGA
Ball Count 325 balls
Configuration Memory Embedded flash
Logic Density Class Low density
Product Family IGLOO2

M2GL025-FCS325 325-tfbga fcbga पिन कॉन्फ़िगरेशन गाइड

M2GL025-FCS325 (325-tfbga fcbga पैकेज) के लिए पिन कॉन्फ़िगरेशन। इस डिजिटल IC में GPIO, संचार इंटरफ़ेस (UART, SPI, I2C) और पावर पिन शामिल हैं। वैकल्पिक पिन फ़ंक्शन और कॉन्फ़िगरेशन विकल्पों के लिए निर्माता डेटाशीट देखें। एम्बेडेड सिस्टम डिज़ाइन और PCB लेआउट के लिए आवश्यक।

M2GL025-FCS325 के लिए 325-tfbga fcbga पैकेज पिनआउट आरेख

इसके लिए कोई विस्तृत pinout data उपलब्ध नहीं: M2GL025-FCS325.

देखें डेटाशीट पूर्ण पिन कॉन्फ़िगरेशन के लिए।

सामान्य अनुप्रयोग

M2GL025-FCS325 के लिए उपयुक्त है 6 अनुप्रयोगs: Industrial Protocol Bridging, Medical Instrument Control, Aerospace and Defense Logic, Gigabit Ethernet Control Plane, PCI Express Control Plane, Secure Connectivity and System Management.

🏭

Industrial Protocol Bridging

The M2GL025-FCS325 fits industrial protocol-bridge designs that translate parallel and serial interfaces while adding control, buffering, and status functions. Its 27,696 programmable logic cells can support parallel state machines, data alignment logic, and multiple clock-domain interfaces, while 180 user I/O provide substantial connectivity for legacy peripherals and discrete sensors. The 325-TFBGA FCBGA package also supports compact layouts with short connections to supporting components. For a new bridge, verify every high-speed interface against the device’s supported I/O standards, bank voltages, clocking resources, and timing constraints. The manufacturer describes IGLOO2 devices as suitable for industrial, communications, medical, defense, and aviation markets, making the M2GL025 useful when a compact, nonvolatile configuration is more valuable than maximum logic density.

💊

Medical Instrument Control

M2GL025-FCS325 can implement control, monitoring, and data-routing logic in compact medical instruments where deterministic parallel processing and nonvolatile configuration are important. The 27.6K logic-element count can support acquisition sequencing, alarm logic, sensor conditioning control, and communication formatting, while the 180 I/O allow flexible connection to analog front ends, displays, and safety-related discrete components. The embedded flash configuration allows the controller to restart without an external configuration PROM. A medical design should select the exact temperature-grade ordering code, validate clock tolerances, and apply the isolation, creepage, leakage, and risk-control requirements of the finished equipment. Microchip specifically identifies medical applications among the intended markets for the IGLOO2 family.

✈️

Aerospace and Defense Logic

The M2GL025-FCS325 is suitable for compact aerospace, defense, and avionics subsystems requiring programmable control, monitoring, bus adaptation, or data-routing functions. Its 27,696 logic cells provide parallel capacity for state machines, redundant monitoring paths, and interface logic, while 180 user I/O support external memory, transceivers, sensors, and configuration controls. The nonvolatile flash configuration simplifies field updates and allows operation without a separate configuration device. Designers must still confirm the exact temperature grade, radiation-environment requirements, power integrity, and qualification evidence for the deployed application. Because the family is explicitly used in defense and aviation markets, engineers can base initial architecture studies on the M2GL025 while treating all program-specific reliability requirements as separate qualification tasks.

🌐

Gigabit Ethernet Control Plane

M2GL025-FCS325 can support auxiliary control-plane, status, configuration, and traffic-management logic around a dedicated Gigabit Ethernet controller. Rather than implementing the full MAC and physical layer, the FPGA can handle register-level control, packet classification, buffering, counters, and interfaces to processors or FPGAs. The 27,696-cell device offers parallel resources for packet manipulation, while 180 user I/O and the 325-ball package provide high pin density for board-level routing. Microchip identifies Gigabit Ethernet control-plane functions as an IGLOO2 use case. The implementation remains interface-specific, so engineers should verify clock-domain requirements, supported I/O standards, timing margins, and protocol timing against the current data sheet before committing to this device.

🖥️

PCI Express Control Plane

M2GL025-FCS325 can be used for dual PCI Express control-plane functions, auxiliary sequencing, configuration handling, or adjacent logic in systems that rely on other devices for the main data path. The device’s 27.6K logic-element class can implement control state machines, register interfaces, interrupt logic, and data-formatting channels in parallel. Its 180 I/O provides substantial external connectivity, making it useful where board routing, rather than processor resources, is the main constraint. The 325-TFBGA FCBGA package requires careful power-plane and return-path design, especially around high-speed links. Before implementation, verify lane support, legal I/O standards, clocking, input timing, output timing, and power sequencing against the manufacturer’s device documentation and reference designs.

🔒

Secure Connectivity and System Management

M2GL025-FCS325 is well matched to secure-connectivity and system-management tasks such as authentication sequencing, key-transfer control, policy enforcement, sensor aggregation, and platform monitoring. Its embedded flash supports a self-contained configuration model, while 27,696 logic cells can run parallel protocol engines and supervisory state machines without occupying the main application processor. The 180 I/O allow direct connection to security controllers, network devices, and status indicators. Microchip identifies secure connectivity and system management as intended IGLOO2 functions. Production implementations must follow the current security, programming, and configuration-protection guidance, including correct JTAG or programming access control and the required key-handling architecture for the selected platform.

What is the M2GL025-FCS325?
The Microchip Technology M2GL025-FCS325 is an IGLOO2 low-density flash FPGA with 27,696 programmable logic cells, 180 user I/O, a 1.2 V core supply, and a 325-TFBGA FCBGA package. According to the manufacturer product page, the M2GL025 device is in production. Its embedded flash configuration permits the programmed design to remain in the device when power is removed.
What are the key specifications of M2GL025-FCS325 that engineers should know?
The M2GL025-FCS325 combines 27.6K logic elements, 180 user I/O, 1.2 V core operation, embedded flash configuration, and a 325-ball FCBGA package. According to the Microchip M2GL025 product page and distributor technical records, the device belongs to the IGLOO2 family and is intended for general-purpose programmable logic, bridging, I/O expansion, system management, and secure connectivity functions.
Where can I download the M2GL025-FCS325 datasheet PDF?
Start with the official Microchip M2GL025 product page linked on this page to access the manufacturer Data Sheet and supporting documents. The Microchip IGLOO2 packaging and pin-description user guide also provides FCS325 ball assignments, bank information, and mechanical information. Use those documents for authoritative pin names, voltage limits, timing, and board-layout requirements.
Where can I find the M2GL025-FCS325 pinout?
The M2GL025-FCS325 pinout is documented in the Microchip IGLOO2 FPGA Packaging and Pin Descriptions User Guide, identified as m2gl_ds0124_pin_info_v6.pdf. Use its FCS325 package section together with the device data sheet. The 325-TFBGA footprint must be matched exactly, including exposed ground-ball assignments, power distribution, configuration pins, and bank-specific constraints.
Is M2GL025-FCS325 the same as M2GL025-FCS325I?
No, the suffix I identifies a distinct temperature-grade ordering code. The M2GL025-FCS325 and M2GL025-FCS325I both use the IGLOO2 325-TFBGA FCBGA package and are listed with 180 I/O and a 1.2 V core. Their operating-temperature ranges must be checked against the requirements of the target product before either part is treated as a substitute.
What can replace M2GL025-FCS325?
The closest documented drop-in candidates are the M2GL025-FCS325I temperature-grade variant and M2GL025T-FCS325 ordering variant, both using the 325-TFBGA FCBGA package. A migration to M2GL050 in the FCS325 package is technically documented, but its higher logic density changes resource availability and the application note identifies design restrictions. No confirmed cross-brand pin-compatible replacement was identified.
What is the best Microchip alternative to M2GL025-FCS325?
The best same-manufacturer starting point is the M2GL025-FCS325I because it retains the 325-TFBGA FCBGA package, 180 I/O, and 27.6K logic-element class while changing the temperature-grade suffix. Confirm the required temperature range and full timing specifications before substitution. A larger M2GL050 device in the same package is a migration path rather than an exact functional replacement.
M2GL025-FCS325 vs M2GL050-FCS325: which is better for a new design?
Choose M2GL025-FCS325 when 27.6K logic elements and 180 I/O match the design without unnecessary resource expansion. Choose the M2GL050 in the FCS325 package only when the design needs more logic capacity or a deliberate resource migration. Microchip’s migration application note states that pin compatibility does not eliminate all design restrictions and requires checking device resources and specifications.
When should I choose M2GL025-FCS325 over a larger FPGA?
Choose M2GL025-FCS325 when the required parallel logic, memory, I/O, and interface functions fit within 27,696 programmable cells and 180 user I/O. A larger device can simplify future expansion but may increase board area, power, configuration complexity, and cost. The M2GL025 is especially suitable for compact bridges, converters, control logic, and protocol-support functions.
Is M2GL025-FCS325 suitable for industrial communication equipment?
The M2GL025-FCS325 is suitable for many industrial communication functions when its I/O, timing, temperature grade, and power requirements match the system. The IGLOO2 family is specifically used for communications, industrial, medical, defense, and aviation applications. For a production design, verify the exact operating-temperature grade, supported interfaces, clock requirements, and industrial qualification obligations.
Can M2GL025-FCS325 replace M2GL025-FCS325I?
The M2GL025-FCS325 can replace M2GL025-FCS325I only after confirming that the non-I ordering code meets the required ambient-temperature range and any qualification requirements. Both parts are listed with the same IGLOO2 device family, 180 I/O, 27.6K logic-element class, and 325-TFBGA FCBGA package. Temperature-grade differences make this substitution unsuitable without a specification review.
Where can I buy M2GL025-FCS325 online?
Use the Request a Quote form on this page to ask about M2GL025-FCS325 availability, authorized sourcing, lead time, and minimum order quantity. The manufacturer lists the M2GL025 family as in production, but a quotation is required to confirm the exact suffix, package form, current inventory position, and delivery schedule for your quantity.
What is the price of M2GL025-FCS325?
Pricing for M2GL025-FCS325 depends on quantity, package form, and current channel conditions, so request a formal quotation through the Request a Quote form on this page. The form lets you specify the required MPN, order quantity, delivery location, and target schedule. This avoids relying on a stale price or substituting a different temperature or packaging suffix.
What is the lead time and stock status for M2GL025-FCS325?
Request current stock, lead time, and minimum order quantity for M2GL025-FCS325 through the Request a Quote form on this page. Microchip identifies the M2GL025 device family as in production, but that status does not guarantee immediate availability for every package and suffix. The quote response should confirm the exact ordering code and production schedule.
How is the M2GL025-FCS325 programmed and configured?
The M2GL025-FCS325 uses embedded flash configuration, allowing the programmed design to remain available after power is removed. Programming method, supported cables, voltage levels, and security features must be taken from the current Microchip programming and security documentation. Because the programming interface details are not stated on the product summary, use the manufacturer’s device and programming guides before laying out a programming connector.

के लिए इंजीनियरिंग संदर्भ डेटा M2GL025-FCS325 — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।

चयन गाइड

Choose M2GL025-FCS325 when a design fits within 27,696 logic cells and 180 user I/O and needs the IGLOO2 family’s embedded flash configuration in a 325-TFBGA FCBGA package. Choose M2GL025-FCS325I when the same logic and package resources are needed but the required operating-temperature grade calls for the I-suffixed ordering code. Consider M2GL050-FCS325 when the design exceeds the M2GL025 capacity or benefits from additional resources; Microchip documents pin compatibility for migration within the FCS325 package, but the application note identifies restrictions that require design review. No cross-brand drop-in candidate was confirmed because a same-footprint FPGA from another manufacturer would require device-specific verification of logic architecture, configuration method, voltage, timing, and I/O standards. For any substitution, validate the pin description, configuration scheme, power rails, clocking, I/O standards, and timing rather than relying on package dimensions alone.

विकल्पों के साथ तुलना

पैरामीटर यह उत्पाद M2GL025-FCS325I M2GL050-FCS325
Brand Microchip Technology Microchip Technology Microchip Technology
Package 325-TFBGA FCBGA 325-TFBGA FCBGA 325-TFBGA FCBGA
FPGA Family IGLOO2 IGLOO2 IGLOO2
Logic Element Class 27.6K LEs 27.6K LEs 50K LEs
Core Supply Voltage 1.2 V 1.2 V 1.2 V
Configuration Memory Embedded flash Embedded flash Embedded flash
Primary Use Low-density programmable logic Low-density programmable logic Higher-density programmable logic and design migration

मुख्य विशेषताएँ

  • Lower logic density supports a right-sized design (बनामM2GL050-FCS325)
  • Direct package-family alternative with matching core voltage (बनामM2GL025-FCS325I)
  • Embedded flash configuration (बनामM2GL050-FCS325)

डिज़ाइन नोट्स

Use the Microchip IGLOO2 Packaging and Pin Descriptions User Guide for the complete FCS325 footprint and ball assignment. Preserve the manufacturer’s power and ground ball pattern, place configuration and decoupling components according to the reference layout, and confirm that the PCB library represents the 325-TFBGA package rather than a generic 324-ball or similarly named BGA. Verify every signal against the selected device’s bank voltage before release.

Plan high-speed routing with continuous reference planes and short return paths. Place clock inputs at stable locations, avoid routing high-speed nets beneath noisy power circuitry, and match the manufacturer’s guidance for configuration pins and high-speed I/O. The dense FCBGA package can force simultaneous escape routing, so use the pin-out guide to group clock, serial, and I/O resources before committing to placement.

Do not treat the M2GL025-FCS325 and M2GL025-FCS325I ordering codes as automatically interchangeable. The I suffix changes the temperature-grade designation, and using the wrong grade can violate the equipment’s ambient-temperature requirements. Similarly, pin compatibility with M2GL050 in the FCS325 package does not make the designs automatically equivalent; follow Microchip’s migration guidance and recheck resources, timing, and device constraints.

Distribute the 1.2 V core rail and other required supplies across the package using the manufacturer’s recommended plane and decoupling arrangement. Keep high-current paths away from sensitive configuration and clock inputs, and check voltage-drop and return-current effects during power-up. Use the data sheet’s supply sequencing and maximum voltage limits when defining the power-management subsystem.

अनुपालन जानकारी

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
लीड फ्री
Unknown
हैलोजन फ्री
Unknown
कॉन्फ्लिक्ट मिनरल्स
Unknown

No RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements were identified in the manufacturer and distributor records reviewed on 2026-11-05. Automotive qualification is not applicable to the listed ordering code; use the appropriate qualified ordering code when required.

डेटा सत्यापन तिथि: 2026-11-05 — डेटा XAIPART की कंपोनेंट इंजीनियरिंग टीम द्वारा सत्यापित और क्यूरेट किया गया

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संबंधित कंपोनेंट्स और शब्द

Microchip Technology M2GL025-FCS325 M2GL025-FCS325I M2GL050-FCS325 IGLOO2 field-programmable gate array FPGA programmable logic complex programmable logic device programmable system-on-chip flash configuration memory logic element logic cell user I/O 325-TFBGA FCBGA ball grid array surface mount semiconductor industrial electronics medical electronics defense electronics aviation electronics Gigabit Ethernet PCI Express
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