XC7Z030-2SB485I - Zynq-7000 SoC FPGA 125K 800MHz | AMD
MPN: XC7Z030-2SB485I ✓ सक्रियXC7Z030-2SB485I अवलोकन
A Zynq-7000 SoC is a heterogeneous FPGA platform rather than a conventional microcontroller or standalone FPGA. Its ARM Cortex-A9 processing subsystem executes software, operating systems, control code, and network protocols, while the Kintex-7 FPGA fabric implements parallel data processing, custom interfaces, accelerators, and timing-critical logic. This combination makes the device useful when a product needs more deterministic hardware assistance than a general-purpose processor can provide without adding a separate FPGA package.
The XC7Z030-2SB485I provides 125K logic cells, an 800MHz listed device frequency, dual ARM Cortex-A9 MPCore processing, and CoreSight system-on-chip functionality in the 484-FCBGA (19 x 19 mm) package. These headline features position the part between smaller Zynq-7000 devices and larger Kintex-7 FPGA implementations. The integrated processor supports software-controlled workflows, while programmable logic can accelerate parallel tasks or provide custom peripheral connectivity.
Its architecture is useful for industrial automation, machine vision, industrial networking, embedded control, communications gateways, and test equipment. In a machine-vision controller, for example, the programmable logic can acquire and pre-process image data while the ARM subsystem handles higher-level control. In a communications gateway, software can manage protocols and networking while dedicated fabric logic handles deterministic data movement or custom interfaces.
Design decisions must account for the large BGA package, high pin count, multilayer PCB requirements, power integrity, thermal performance, and the complexity of programming both the FPGA fabric and processor subsystem. Because the verified data supplied for this part does not include complete power, I/O, memory-interface, temperature-range, pinout, or compliance tables, those values remain designated for datasheet confirmation. This page distinguishes confirmed distributor information from parameters requiring verification in AMD's official Zynq-7000 documentation.
This page combines verified distributor availability, a same-footprint regional source-code comparison, practical application guidance, and design cautions that are not consolidated in a single distributor listing. It is intended to accelerate component selection while directing engineers to the authoritative AMD datasheet and package pinout resources before layout release.
के लिए ड्रॉप-इन विकल्प XC7Z030-2SB485I — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।
इस सीरीज़ के वेरिएंट
समान श्रृंखला के मॉडल जो ड्रॉप-इन संगत हैं XC7Z030-2SB485I (समान फॉर्म फैक्टर और फुटप्रिंट) — इसमें भिन्न FPGA Family, Logic Cells, Mounting Type, Package, Processor Core.
XC7Z030-2SBG485I
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →XC7Z030-2SB485I Maximum Ratings और Electrical Characteristics
| Device Type | Zynq-7000 system-on-chip FPGA |
| FPGA Family | Kintex-7 based |
| Processor Core | Dual ARM Cortex-A9 MPCore |
| Listed Processor Frequency | 800 MHz |
| Logic Cells | 125K logic cells |
| Debug Capability | CoreSight |
| पैकेज | 484-FCBGA |
| Package Dimensions | 19 x 19 mm |
| माउंटिंग प्रकार | Surface mount BGA |
| Temperature Grade | Industrial grade |
| Speed Grade | Grade 2 |
| Number of BGA Pins | 484 pins |
XC7Z030-2SB485I 19 x 19 mm पिन कॉन्फ़िगरेशन गाइड
XC7Z030-2SB485I (19 x 19 mm पैकेज) के लिए पिन कॉन्फ़िगरेशन। इस डिजिटल IC में GPIO, संचार इंटरफ़ेस (UART, SPI, I2C) और पावर पिन शामिल हैं। वैकल्पिक पिन फ़ंक्शन और कॉन्फ़िगरेशन विकल्पों के लिए निर्माता डेटाशीट देखें। एम्बेडेड सिस्टम डिज़ाइन और PCB लेआउट के लिए आवश्यक।
इसके लिए कोई विस्तृत pinout data उपलब्ध नहीं: XC7Z030-2SB485I.
देखें डेटाशीट पूर्ण पिन कॉन्फ़िगरेशन के लिए।
सामान्य अनुप्रयोग
XC7Z030-2SB485I के लिए उपयुक्त है 6 अनुप्रयोगs: Industrial Machine Vision, Industrial Networking Gateway, Programmable Logic Controller, Test and Measurement Equipment, Embedded Data Acquisition, Communications Equipment.
Industrial Machine Vision
The XC7Z030-2SB485I fits machine-vision controllers that combine image acquisition and parallel processing with higher-level control. Its 125K Kintex-7 logic cells can implement parallel pixel pipelines or custom sensor interfaces, while the dual ARM Cortex-A9 subsystem runs camera control, image management, and communications. The 484-FCBGA (19 x 19 mm) package supports compact integration without a separate FPGA. Because the verified data does not include serializer rates, I/O standards, or power limits, camera-interface compatibility must be checked against AMD's complete Zynq-7000 documentation.
अनुशंसित
Industrial Networking Gateway
The XC7Z030-2SB485I is suitable for industrial gateway designs that divide protocol handling from deterministic data movement. The dual ARM Cortex-A9 processor can run networking stacks, configuration agents, and supervisory software, while the 125K FPGA fabric can accelerate packet handling or terminate custom interfaces. Its listed 800MHz processor operation and 484-FCBGA package make it suitable for performance-oriented embedded gateways. Exact Ethernet interfaces, transceiver requirements, and power specifications are not present in the verified data and must be confirmed before schematic capture.
अनुशंसित
Programmable Logic Controller
The XC7Z030-2SB485I can implement an advanced programmable logic controller by assigning safety- or timing-oriented functions to FPGA fabric and supervisory logic to the ARM subsystem. The 125K logic cells provide hardware parallelism for deterministic I/O, while the dual Cortex-A9 cores support real-time operating systems, diagnostics, and communications. The 484-FCBGA (19 x 19 mm) package integrates both resources on one device. Designers should verify industrial temperature limits, available I/O counts, and certification requirements against the official family datasheet before release.
अनुशंसित
Test and Measurement Equipment
The XC7Z030-2SB485I suits modular test equipment where FPGA fabric can implement parallel acquisition, pattern generation, or signal processing and the ARM subsystem controls sequencing and user interfaces. Its 125K logic cells and dual Cortex-A9 architecture permit software-managed algorithms to coexist with deterministic hardware pipelines. The listed 800MHz frequency identifies the processor operating point associated with the part. Exact supported I/O standards, clocking resources, and acquisition bandwidth are not included in the supplied records and should be established from AMD's datasheet and design guides.
अनुशंसित
Embedded Data Acquisition
The XC7Z030-2SB485I is appropriate for embedded acquisition systems requiring simultaneous sensor sampling, buffering, and protocol conversion. FPGA fabric can execute parallel sensor pipelines and timestamp or condition data, while the dual ARM Cortex-A9 subsystem handles configuration, storage, and networking. Integrating both functions in the 484-FCBGA (19 x 19 mm) package reduces inter-device data transfer and board complexity. The supplied evidence does not specify transceiver types, maximum I/O frequency, memory interfaces, or power, so these constraints must be checked for each selected peripheral.
अनुशंसित
Communications Equipment
The XC7Z030-2SB485I can support communications equipment where protocol control and high-throughput data paths need dedicated hardware. The ARM subsystem handles operating-system software, configuration, and management, while the 125K Kintex-7 logic cells can accelerate packet processing or implement custom interface logic. Its 484-FCBGA package is suitable for dense embedded designs, while the 800MHz listed frequency applies to the processor subsystem. RF, line-rate, and transceiver specifications are not included in the verified data, making interface-level verification essential before architecture approval.
अनुशंसित
के लिए इंजीनियरिंग संदर्भ डेटा XC7Z030-2SB485I — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।
चयन गाइड
विकल्पों के साथ तुलना
| पैरामीटर | यह उत्पाद | XC7Z030-2SBG485I |
|---|---|---|
| Package | 484-FCBGA (19 x 19 mm) | 484-FCBGA (19 x 19 mm) |
| Brand | AMD | AMD |
| Device Type | Zynq-7000 system-on-chip FPGA | Zynq-7000 system-on-chip FPGA |
| FPGA Family | Kintex-7 based | Kintex-7 based |
| Logic Cells | 125K logic cells | 125K logic cells |
| Listed Frequency | 800 MHz | 800 MHz |
| Processor | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Debug Support | CoreSight | CoreSight |
| Verified Unit Price | $199.4443 as of 2026-10-28 | $167.7041 starting price as of 2026-10-28 |
मुख्य विशेषताएँ
- Higher confirmed price but distinct target-code sourcing (बनामXC7Z030-2SBG485I)
- Verified in-stock status (बनामXC7Z030-2SBG485I)
- Broader multi-channel visibility for the alternative (बनामXC7Z030-2SBG485I)
डिज़ाइन नोट्स
Design the 484-FCBGA footprint from AMD's official package drawing and pinout files rather than from a generic BGA library. Confirm ball pitches, component dimensions, solder-mask and paste-land definitions, and PCB tolerances before release. Use a multilayer stack-up that supports clean power distribution and signal return paths; exact layer-count and escape-routing requirements are not included in the verified data and should follow AMD's package design guidance.
Partition the power rails according to the official XC7Z030 datasheet and place required bypass capacitors at the device supply balls with the shortest possible current loops. Provide separate filtering for the processor, FPGA fabric, memory, and I/O supplies where directed. Because supply-voltage, current, and sequencing values are unavailable in the supplied evidence, do not calculate capacitor values or release a power tree until they are confirmed from AMD documentation and the selected Vivado power report.
Treat the 484-FCBGA as a substantial thermal design task rather than assuming that the 19 x 19 mm footprint dissipates heat uniformly. Use the package thermal model, selected board stack-up, copper areas, vias, and actual design utilization to estimate junction temperature. The verified data supplies no maximum power or thermal-resistance values, so no defensible junction-temperature calculation can be provided; thermal qualification must use AMD's power-estimation flow and measured or approved board data.
Do not substitute an ordering code solely because it contains XC7Z030 and uses a 484-FCBGA package. The verified records support XC7Z030-2SBG485I as the closest candidate, but they do not include a complete ordering-code or lifecycle table. Confirm the exact speed grade, temperature grade, regional suffix, package drawing, and manufacturing status against AMD documentation. Also verify that software bitstreams, boot configuration, DDR memory, and PHY selections are supported by the final ordering code.
अनुपालन जानकारी
The supplied distributor data does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These values remain unknown rather than being inferred from the product family or industrial temperature designation.
