FPGA & CPLD
Produk (7.300+)
EP3C16F484C7N - Cyclone III FPGA, 15K LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP3C16F484C7N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process and packaged in a 484-ball FineLine BGA (FBGA). It integrates 15,408 logic elements, 504 Kbits of embedded memory, 56 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and 346 user I/O pins. According to the Cyclone III device family datasheet, the device supports a core voltage of 1.2 V and offers up to 437.5 MHz internal operation. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement arbitrary digital circuits after PCB fabrication. FPGAs sit in the programmable logic hierarchy above simple PLDs and below ASICs, bridging the gap between fixed-function ICs and full-custom silicon. The Cyclone III family in particular targets cost-sensitive, high-volume applications where the per-board BOM cost of a traditional FPGA would be prohibitive, while still offering DSP blocks, on-chip RAM, and high-speed serial capability for parallel digital processing. Key features of the EP3C16F484C7N include 346 LVDS-capable user I/O pins arranged across eight I/O banks, configurable LVDS/LVCMOS/LVTTL support, and dedicated hardware multipliers (up to 56 18x18) for DSP pipelines. The device supports JTAG (IEEE 1149.1) boundary-scan configuration via the EPCS serial configuration device family, plus 4 PLLs for clock synthesis. Speed grade -7 places this part in the mid-performance bin of the Cyclone III family. Cyclone III architecture combines look-up tables (LUTs), embedded memory blocks (M9K), DSP blocks, and routing fabric. The 65 nm process node reduces static leakage versus the prior Cyclone generation, enabling the family to operate with typical power well under 0.5 W for many designs. Cyclone III is widely used in industrial control, motor drive, video processing, and prototyping applications. Typical applications include industrial machine vision, motor control and drive interfaces, low-cost video bridging, LED wall controllers, software-defined radio (SDR) front ends, and ASIC/SoC prototyping. The combination of DSP blocks and a generous logic budget makes the EP3C16F484C7N especially suited to DSP-centric embedded designs. When designing with this device, validate thermal performance for your specific I/O switching profile and ensure the configuration scheme (EPCS flash or JTAG) is provisioned in your PCB layout. Speed grade -7 provides balanced timing margin; faster -8 grades are not stocked for this part number.
EP3C16F484C8 - 516K-Bit Cyclone III FPGA | Intel
The Intel EP3C16F484C8 is a Cyclone III field-programmable gate array with 516,096 bits of programmable logic, 346 I/O, and a 484-pin FBGA package. The device operates from a 1.2 V core supply and is positioned for embedded systems requiring programmable logic, parallel processing, control, interface, and signal-routing functions in a single reconfigurable device. An FPGA is a semiconductor whose internal digital logic, interconnects, and I/O behavior are configured after manufacture. Within the product hierarchy, the EP3C16F484C8 is a Cyclone III FPGA, which is a low-complexity FPGA in the broader field-programmable logic device category. Compared with an application-specific integrated circuit, an FPGA allows design logic to be revised through programmable configuration rather than requiring a new mask set. The verified device data identifies 346 I/O, 516,096 logic bits, 15,408 logic elements, 484 package balls, and a 1.2 V supply. These resources allow multiple control and data-processing functions to be consolidated into one programmable component. The C8 suffix and associated ordering information identify the particular speed, temperature, and package configuration, but a complete decoded timing table was not included in the supplied source material. Cyclone III devices use configurable logic elements, programmable routing networks, memory blocks, and dedicated input/output resources. Depending on the selected Cyclone III density and configuration, these resources can support parallel data acquisition, protocol bridging, control logic, image processing, communications, and embedded processor implementations. Exact PLL, transceiver, memory, and I/O standards are not stated in the provided verified data and therefore require confirmation in the manufacturer documentation before design release. Typical uses include industrial control, communications infrastructure, test and measurement, audio and video processing, sensor acquisition, and networking equipment. In each case, the main benefit is reconfigurable logic that can consolidate multiple fixed-function devices while preserving the flexibility to update field behavior through a new configuration bitstream. Design planning should begin with the 484-ball footprint, 346 available I/O, 1.2 V core supply, and device-specific speed and temperature grade. Power, I/O standards, configuration pins, memory requirements, and timing must be checked against the exact Cyclone III datasheet. Because the supplied snippets do not expose the complete pin map or all electrical limits, those details should not be inferred from the package name alone. This product page consolidates verified distributor availability, exact catalog identifiers, package information, and practical sourcing context into a structured reference. It also distinguishes confirmed data from specifications that still require datasheet-level verification, helping engineers evaluate the EP3C16F484C8 without relying on incomplete distributor summaries.
EP3C16F484C8N - Cyclone III FPGA 15K LE 484-BGA | Intel
The Intel (formerly Altera) EP3C16F484C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 504 Kbit embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA package. It is specified for commercial temperature range (0C to +85C) at speed grade 8, and is fabricated on a low-power 60 nm process that pairs high functionality with low static and dynamic power. Background Knowledge: A Field Programmable Gate Array (FPGA) is a programmable semiconductor that lets designers implement arbitrary digital logic - combinational, sequential, and memory - via a configuration bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLD), bridging the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic. The Cyclone III family is positioned as a low-cost, low-power FPGA family from Intel/Altera, optimized for volume production in industrial, consumer, and communications applications rather than high-end signal processing. Key features include 15,408 logic elements organized in 963 LABs (Logic Array Blocks), 56 embedded 18x18 multipliers supporting up to 70 MHz DSP throughput, and 4 PLLs for clock management. The device also supports external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM through dedicated PHY blocks. Total on-chip RAM is 504 Kbit distributed across M9K memory blocks, sufficient for buffering moderate data streams. Architecturally, Cyclone III uses a LUT-based fabric with embedded multiplier blocks and hard memory controllers, providing deterministic timing and predictable performance across the commercial temperature range. The 60 nm process and 1.2 V core operation help reduce dynamic power versus prior Cyclone generations, making it suitable for thermally-constrained embedded systems. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototyping, telecommunications line cards, and consumer electronics requiring custom glue logic or moderate DSP. It also serves as a cost-effective prototyping vehicle for ASIC development. When designing with this device, careful attention must be paid to power sequencing, decoupling, and JTAG configuration routing. The 484-BGA package requires a 4-layer minimum PCB with controlled-impedance traces for high-speed interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel
The Intel (formerly Altera) EP3C16F484I7 is a low-power Cyclone III Field Programmable Gate Array delivering 15,408 logic elements, 516,096 bits of embedded RAM, and 346 user I/Os in a 484-ball FineLine BGA package, operating across the industrial -40C to +100C temperature range. What is a Cyclone III FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic, glue logic, DSP pipelines, or even soft-processor systems-on-chip. Cyclone III sits at the low-power, cost-optimized end of Intel's FPGA portfolio, fabricated on a 60 nm TSMC process and tailored for high-volume, power-sensitive designs. Key features include 15,408 logic elements organized into 963 LABs, 504 Kbit of dedicated M9K embedded memory blocks (totaling 516,096 bits), 56 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and Cyclone III's signature low-power architecture that consumes roughly half the static current of the prior Cyclone II generation. The 484-FBGA package exposes 346 user I/Os supporting LVDS, SSTL, HSTL, and LVCMOS standards at up to 640 Mbps LVDS. Cyclone III devices are configured via passive serial, fast passive parallel, active serial, fast active parallel, or JTAG modes using industry-standard Altera/Intel Quartus II or Quartus Prime design software. Bitstream encryption with AES is supported on Cyclone III LS variants, and the family uses SRAM-based configuration cells requiring an external boot PROM or JTAG source. Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, low-cost software-defined radio front-ends, USB/Ethernet bridging, medical imaging pre-processing, and automotive infotainment prototypes. The combination of low unit cost and a robust Quartus toolchain makes Cyclone III a common choice for both prototypes and production runs of 10K-100K units. When designing with this device, ensure your power budget accounts for both static (always-on) consumption and dynamic toggle power, and follow Intel's cyclone III pin connection guidelines to leave unused I/Os properly biased. Bitstream configuration time at 40 MHz DCLK with a serial EPCS flash is typically under 50 ms for a full 16K LE design. This page synthesizes distributor pricing, drop-in Cyclone III speed-grade alternatives, and practical PCB and configuration design notes that complement the manufacturer datasheet.
EP3C16F484I7N - 15408 LE Cyclone III FPGA, 484-FBGA | Altera (Intel)
The Altera (now Intel) EP3C16F484I7N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) with 15408 logic elements, 516096 bits of embedded memory, and 346 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. The 'I7' speed/temperature grade denotes an industrial temperature range (-40C to +100C case) with a 7 ns internal timing margin, and the 'N' suffix indicates a lead-free, RoHS-compliant tray packing. The Cyclone III family is fabricated on a 65 nm TSMC low-power process and operates from a 1.2 V core supply, making it one of the lowest-power mid-density FPGAs in its generation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks (LEs), routing channels, and embedded memory/DSP into a single semiconductor. The taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are programmed in the field using HDL flows (Verilog/VHDL) and an SRAM configuration bitstream. FPGAs sit above microcontrollers and DSPs in flexibility but below ASICs in cost-per-volume, making them ideal for prototyping, low-volume production, and designs requiring parallel hardware acceleration. Key features of the EP3C16F484I7N include 4 transceivers of 156 MHz / 437.5 MHz PLL support (no multi-gigabit transceivers, but ample general-purpose LVDS), 20 global clock networks, 56 embedded 18x18 multipliers for DSP, and Cyclone III's signature 1.2 V core that delivers roughly 50% lower dynamic power than Cyclone II. Configuration is via serial passive (PS), JTAG, or Altera Fast Passive Parallel modes using the cyclone programming cable or USB-Blaster. The Cyclone III architecture uses an SRAM-based configuration cell backed by a multi-level routing hierarchy (L1/L2/L3/longlines), LAB-based logic array blocks containing 16 LEs each, and embedded M9K memory blocks (typically 56 blocks, 516 kbit total in this device). The 484-FBGA package is a 1.0 mm pitch BGA suitable for 4-6 layer PCBs, supporting high I/O count without demanding fine-line manufacturing. Typical applications include industrial motor control and PLCs, video processing and image filtering, low-cost software-defined radio front-ends, factory automation and machine vision, telecom line cards, and embedded control with Nios II soft-core processors. The 56 hardware multipliers and abundant RAM make it well-suited to DSP pipelines, while the 346 I/Os support parallel bus and high-pin-count industrial protocols. Design consideration: route configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL, nCE) per Altera reference schematics and respect the JTAG chain. Use the Quartus II (or Quartus Prime Lite 18.x for legacy device support) software flow to compile, place-and-route, and generate the .sof/.pof bitstream. The 484-FBGA requires PCB fabrication with 0.4 mm via-in-pad or 0.6 mm dog-bone fanouts and impedance-controlled traces for LVDS. This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16M164C7N - Cyclone III FPGA, 15408 LE | Intel
The Intel EP3C16M164C7N is a Cyclone III field-programmable gate array with 15,408 logic elements, 92 I/O, and 504 Kb of block RAM in a 164-MBGA M164 package measuring 8 x 8 mm. It uses 65 nm CMOS technology, operates from a 1.2 V core supply with 2.5 V I/O, and is assigned speed grade 7 for commercial-temperature applications. A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement logic functions, control systems, signal processing, and interface logic. An FPGA combines configurable logic blocks, programmable interconnects, memory resources, and input/output blocks on one integrated circuit. After configuration, the EP3C16M164C7N can execute parallel digital designs without the fixed function of a conventional application-specific integrated circuit. The Cyclone III device provides 15,408 logic elements, which the product listing also describes as 963 logic array blocks, plus 92 user I/O. Its 504 Kb block RAM supports buffering, data storage, and control logic that benefit from on-chip memory. The 164-MBGA package provides a compact surface-mount option for equipment where board area and interconnect density are important. The device is manufactured using 65 nm CMOS technology and separates its core and I/O supply requirements into 1.2 V and 2.5 V rails. Speed grade 7 identifies its performance class within the Cyclone III ordering system. The commercial temperature designation corresponds to a 0 °C to 85 °C junction-temperature range, making the device appropriate for commercial and industrial environments that remain within that limit. Typical design uses include industrial control systems, communications interfaces, embedded data acquisition, general-purpose digital logic, embedded storage control, and parallel signal processing. The combination of 15,408 logic elements, 92 I/O, and 504 Kb of block RAM makes the device useful for designs that require substantial configurable logic without moving to a larger FPGA family. Design planning should account for the M164 package, its 164-ball land pattern, separate core and I/O rails, configuration requirements, and pin-constrained user I/O. PCB design must follow the package ball map and power-decoupling guidance in the Intel Cyclone III handbook. Because this device is an older programmable-logic product, verify configuration device support, tool versions, and any last-time-buy considerations before starting a new production design. This page organizes the confirmed Cyclone III resource counts, package information, supply details, and same-package ordering alternatives into a practical engineering reference. It also distinguishes speed-grade and temperature-grade options, helping designers evaluate whether a lower or higher grade can be used without changing the PCB footprint.
EP3C16M164C8N - 15408-Cell Cyclone III FPGA | Altera
Altera EP3C16M164C8N is a Cyclone III field-programmable gate array with 15,408 logic elements, 92 I/O, and a 164-TFBGA package. The device is manufactured on a 65 nm process and is associated with a 1.2 V core supply and a maximum clock frequency of 402 MHz. Its combination of programmable logic, embedded memory, and parallel I/O makes it suitable for digital control, interface, signal-processing, and embedded-system designs that require reconfigurable hardware. A field-programmable gate array is a semiconductor in which digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where configurable logic elements, memory blocks, input/output resources, clock networks, and configuration interfaces form a flexible digital implementation platform. Compared with a fixed application-specific integrated circuit, an FPGA allows design revisions, field updates, and hardware customization without changing the printed circuit board. The EP3C16M164C8N provides 15,408 logic elements and 92 I/O in a compact 164-ball TFBGA package. Its 402 MHz maximum clock frequency provides useful timing headroom for control logic, protocol bridges, and parallel data-processing functions. The 92-I/O interface can support multiple external buses and peripheral connections, while the package keeps routing requirements within a dense, multilayer printed circuit board design. The device is based on 65 nm Cyclone III FPGA technology and operates from a 1.2 V core supply as identified for this device family. Configuration determines how the programmable logic, embedded memory, and I/O blocks are interconnected. Engineers must also account for the selected configuration scheme because package I/O resources can be assigned among user functions, dedicated configuration pins, clock inputs, and other dedicated functions. Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, embedded video or image processing, motor and power-system controllers, and general-purpose digital prototyping. The FPGA can implement parallel algorithms, state machines, bus adapters, protocol converters, and custom interface logic, while its 92 I/O support external memories, transceivers, converters, and discrete digital components. The primary design consideration is the ball-grid footprint. A 164-TFBGA package requires a multilayer board with short, matched-routing escape paths, solid power distribution, and careful decoupling. Signal-integrity analysis is important for high-speed memory or external interfaces, and every unused configuration or power ball must follow the manufacturer’s package and board-layout requirements. Thermal performance should be checked against the actual clock, I/O, and core activity. This product page organizes the EP3C16M164C8N identification data, package characteristics, search-oriented technical questions, application guidance, and design cautions. It also distinguishes verified device facts from engineering fields that require confirmation with the manufacturer datasheet, helping engineers plan a board and determine whether a proposed substitution is truly pin-compatible before ordering samples.
EP3C16Q240C8 - Cyclone III FPGA, 16K LE, 240-Pin PQFP | Intel
The Intel (formerly Altera) EP3C16Q240C8 is a Cyclone III low-cost field-programmable gate array (FPGA) built on TSMC's 65 nm low-power process, offering 15,408 logic elements, 516,096 bits of embedded memory, and 160 user I/O pins in a 240-pin plastic QFP (240-BFQFP / PQFP-240) package with 0.5 mm pitch and 34.6 x 34.6 mm body. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing without the per-unit mask cost of an ASIC, while providing far more logic capacity and I/O flexibility than a typical MCU. Cyclone III specifically targets cost-sensitive high-volume applications such as industrial control, video processing, and communications bridges. Key features include 15,408 logic elements arranged as 15408 CLBs, 516 kbits of embedded RAM, 56 embedded 18x18 multipliers, up to four PLLs for clock management, and 160 general-purpose user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI signaling. The device operates from a 1.2 V core supply with separate VCCIO banks, supports up to 402 MHz internal operation, and is offered in commercial, industrial, and extended-temperature grades. The Cyclone III family is fabricated on a 60 nm low-power process node optimized for static and dynamic power reduction, delivering up to 50% lower power than the prior Cyclone II generation at the same performance. The architecture combines 4-input look-up tables (LUT4) with dedicated memory blocks (M9K), DSP blocks for arithmetic, and Coresight-based debug via JTAG. Designers typically use Quartus II / Quartus Prime to compile HDL into bitstreams that configure the SRAM-based logic at every power-up. Typical applications include industrial motor control and PLC interfaces, video format conversion and image processing pipelines, embedded display controllers, telecommunications line cards, USB and peripheral bridging, and cost-sensitive prototyping for ASIC replacement. The 240-pin QFP package supports hand-soldering and standard 1.0 mil trace/space PCB manufacturing, which simplifies low-volume prototypes and educational designs. When designing with this part, plan the power decoupling around the recommended 1.2 V core and VCCIO bank supplies, follow Altera's pin connection guidelines for unused and JTAG pins, and verify timing closure in Quartus before sign-off. The PQFP-240 footprint is non-trivial to rework, so first-spin prototypes should be carefully reviewed. This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16Q240C8N - Cyclone III FPGA 15K LEs PQFP-240 | Altera
The Altera EP3C16Q240C8N is a Cyclone III FPGA with 15,408 logic elements (LEs), 516,096 bits of embedded memory, and up to 160 user I/O pins, housed in a 240-pin fine-pitch Ball-Grid-Array-style QFP package (240-BFQFP / PQFP-240, 32x32 mm). It is fabricated in a low-cost 65-nm process and belongs to the commercial (C) temperature range with speed grade 8 (the most cost-effective speed bin in the family). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks, routing resources, and embedded memory that designers configure in the field using HDL languages such as Verilog and VHDL. In the semiconductor hierarchy, the FPGA sits above fixed-function ASICs and ASSPs in flexibility, and the Cyclone III family targets the low-cost, low-power segment of that market. Key features of the EP3C16Q240C8N include 15,408 LEs organized as approximately 1,920 adaptive logic modules (ALMs), 516,096 bits (63 kbytes) of M9K embedded memory blocks, and up to 160 maximum user I/O including dedicated clock inputs. The M9K blocks support single- and dual-port operation with byte enables and initialization files, making FIFOs and line buffers easy to implement without external SRAM. Technically, the Cyclone III architecture uses 8-input fracturable look-up tables, a hierarchical multi-track interconnect, and a phase-locked-loop (PLL)-based clock network for on-chip frequency synthesis and jitter reduction. Configuration is supported through active serial (AS), passive serial (PS), and JTAG schemes, allowing standard EPCS serial configuration devices to load the bitstream at power-up. The Q240 package supports a maximum I/O count that may be reduced depending on the selected configuration scheme, per the Altera device package information data sheet. Typical applications include industrial motor-control and automation interfaces, video and image processing line cards, communications protocol bridging, and test/measurement glue logic. The 160-I/O budget and 65-nm low static power make it well suited to cost-sensitive volume products that do not need high-end transceivers. Design consideration: the PQFP-240 footprint is large and hand-solderable for prototypes, but its peripheral I/O ring limits signal counts versus BGA alternatives; plan I/O banking carefully to avoid mixing incompatible voltage standards on one bank. This page synthesizes verified distributor stock, drop-in same-package alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.
EP3C16U256C6 - 15,408 LEs, 256-LFBGA Cyclone III FPGA
The Altera EP3C16U256C6 is a Cyclone III field-programmable gate array (FPGA) containing 15,408 logic elements, 168 I/O, and 516,096 bits of embedded memory in a 256-ball low-profile FBGA package. The device is positioned for general-purpose programmable logic, embedded control, communications, industrial automation, and test-equipment designs that require a reusable hardware architecture and parallel programmable I/O. Distributor listings identify it as the EP3C16U256C6 Cyclone III FPGA and provide current sourcing information as of 2026-10-30. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after fabrication. The FPGA category belongs to programmable-logic devices and sits within the broader semiconductor and embedded-systems hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows designers to implement parallel interfaces, state machines, protocol controllers, signal processing, and control logic in one configurable device, potentially reducing board count and shortening product-development cycles. The verified device data identifies three headline characteristics: 15,408 logic elements, 168 I/O, and 516,096 bits of memory. These resources support moderately complex parallel designs and make the EP3C16U256C6 relevant to control systems, data-acquisition equipment, communications interfaces, industrial controllers, and embedded protocol bridges. Its 256-LFBGA package provides a high pin count in a compact surface-mount footprint, although the dense ball pitch demands careful PCB layout, inspection, and assembly planning. The Cyclone III architecture is based on configurable logic elements connected by programmable routing resources. Each logic element supports combinational and registered Boolean functions, while dedicated input and output paths connect the programmable core to package balls. The listed memory quantity is 516,096 bits, equivalent to 64,512 bytes when interpreted as binary memory. This embedded storage can support buffers, lookup tables, packet queues, and other on-chip data structures without relying entirely on external RAM. Typical uses include industrial automation and factory control, communications and network-interface equipment, instrumentation, embedded control, and general-purpose digital prototyping. The 168 available I/O are particularly useful when a design includes multiple parallel buses, status signals, capture inputs, or differential interface groups. Actual design suitability still depends on the required I/O standard, logic utilization, memory demand, timing closure, clocking architecture, power budget, and device programming method. Designers should treat BGA assembly and signal integrity as first-order concerns. The 256-ball package requires an HDI-capable PCB stack-up, exact land-pattern geometry, controlled impedance routing, and assembly-process qualification. Power rails should be decoupled close to the device, clock and high-speed nets should use short return paths, and unused balls should follow the manufacturer’s prescribed connectivity. Toolchain and board-support packages must also be checked against the exact Cyclone III device before committing the design. This page consolidates the verified distributor identity, package, logic-resource, I/O, memory, pricing, and sourcing data into an engineering-oriented product reference. It also distinguishes verified facts from unavailable electrical details and identifies same-brand, same-family drop-in candidates that require final validation against timing, temperature, lifecycle, and assembly requirements.
EP3C16U256C7 - Cyclone III FPGA, 15408 LEs | Intel/Altera
The Intel/Altera EP3C16U256C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 RAM bits, and 168 user I/Os in a 256-LFBGA package. It combines programmable logic resources with 516,096 bits of embedded RAM in a low-cost FPGA device intended for control, interface, communications, and embedded-processing systems. An FPGA is a programmable-logic semiconductor whose internal lookup tables, registers, interconnect, and memory blocks can be configured after manufacture. Within the semiconductor hierarchy, this device belongs to the Cyclone III family of FPGAs and CPLDs, positioned below higher-density programmable-logic devices for cost-conscious designs that still need substantial parallel logic, on-chip memory, and flexible I/O allocation. The verified device data identifies 15,408 logic elements, 516,096 RAM bits, and 168 I/Os. Cross-reference information associates the device with the 65 nm Cyclone III process and lists a maximum clock frequency of 437.5 MHz, while one comparison listing reports a 1.2 V core supply. These figures make the EP3C16U256C7 suitable for parallel data acquisition, industrial control, protocol bridging, and general-purpose embedded logic rather than high-performance processor systems. The EP3C16U256C7 uses a 256-LFBGA package, making dense board routing and careful via-in-pad or microvia considerations important in multilayer PCB construction. Its 168 user I/Os provide connectivity for external memory, communication transceivers, sensors, and digital control signals. Configuration, clocking, and power-distribution details should be taken directly from the complete manufacturer device handbook and pin-connection guidelines. Typical uses include industrial automation modules, data-acquisition front ends, communication gateways, LED and display control, sensor aggregation, and embedded protocol converters. The 516,096 RAM bits can buffer sampled data or implement dual-port storage, while the 15,408 logic elements support parallel pipelines, state machines, protocol engines, and control logic. When designing the power system, budget for the 1.2 V core rail as well as bank-dependent I/O supplies, and separate high-current and sensitive routes to reduce coupling. Verify ball assignments, decoupling requirements, configuration-scheme support, and maximum I/O standards against the complete Cyclone III documentation before layout release. This page consolidates current distributor availability, sourced pricing, verified resource counts, and same-family replacement guidance into one engineering-focused view. It also distinguishes exact drop-in options from lower-speed or industrial-grade variants whose qualification and timing margin must be reviewed before schematic approval.
EP3C16U256C7N - 15,408-Cell Cyclone III FPGA | Intel
The Intel EP3C16U256C7N is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 memory bits, a maximum operating frequency of 472.5 MHz, and a 256-ball BGA package. The universal-device designation and industrial 0°C to +85°C temperature range suit programmable control, signal-processing, communications, and embedded-system designs. An FPGA is a programmable logic device that combines configurable logic blocks, embedded memory, input/output resources, and programmable interconnect fabric. Within the semiconductor hierarchy, the EP3C16U256C7N is a field-programmable gate array, or FPGA, within the Cyclone III family of programmable logic devices. Its parallel architecture allows hardware functions to execute concurrently without relying on sequential software instructions. The device provides 168 logic elements according to its catalog listing, 15,408 logic cells, and 516,096 bits of embedded memory according to the manufacturer-related product information. A maximum frequency of 472.5 MHz supports clocked control logic, interface conditioning, and signal-processing pipelines. The 256-ball package uses a 0.80 mm ball pitch and occupies approximately 14 mm by 14 mm, enabling dense board integration without changing the functional architecture. The Cyclone III architecture is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its universal-device suffix identifies a device intended for broader system-clock and I/O flexibility than speed-specific variants. Exact pin functions, I/O standards, bank voltage limits, configuration requirements, and recommended decoupling should be assigned from the manufacturer pin-description table and electrical-characteristics documentation. Typical applications include industrial control modules, communications interfaces, video and image-processing pipelines, sensor acquisition, and compact embedded systems. In these systems, parallel logic can implement protocol conversion, filtering, data formatting, and real-time control in hardware. The 472.5 MHz device class is particularly appropriate where predictable parallel processing and dedicated I/O resources matter more than software flexibility alone. Board design should preserve the recommended ball pattern, power and ground distribution, and high-speed routing geometry. Configuration signals, clock inputs, decoupling networks, and exposed thermal requirements must be checked against the exact package drawing before layout release. Because this is a large BGA device, assembly inspection and thermal-path planning are as important as logical design. This page combines package, capacity, speed, and temperature information with practical selection guidance, application analysis, and verified drop-in alternatives. It is intended to help engineers identify whether the EP3C16U256C7N matches the required logic density, memory capacity, package, and operating environment before beginning PCB implementation.
EP3C16U256C8 - 15,408-LC Cyclone III FPGA | Intel
The Intel EP3C16U256C8 is a Cyclone III field-programmable gate array containing 15,408 logic elements, 963 logic array blocks, 516,096 embedded memory bits, and 168 I/O in a 256-ball UFBGA package. The device is identified by the commercial temperature grade, 14 x 14 mm package, 2.20 mm height, and 0.80 mm ball pitch. An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after manufacture. Within the semiconductor hierarchy, an FPGA is a programmable logic device, combining digital logic blocks, embedded block RAM, programmable interconnects, and user I/O. It differs from a fixed-function application-specific integrated circuit because its behavior is defined by a configuration bitstream rather than permanent circuitry. The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks, together with 516,096 bits of embedded memory. The device provides 168 I/O, as listed by DigiKey, and is available in the compact 256-ball package described by the verified distributor data. These resources support parallel digital logic, control, data acquisition, signal processing, embedded-memory, and interface-intensive designs. The EP3C16U256C8 belongs to the EP3C16 device family, whose 16 designation corresponds to the 15,408 logic elements and 963 logic array blocks reported by the distributor sources. Its combination of a 256-ball package and 168 available I/O makes it suitable for designs requiring moderate logic density, substantial embedded memory, and a comparatively high pin count in a compact board footprint. Typical uses include industrial control, data-acquisition systems, communications equipment, embedded signal-processing modules, video and image pipelines, and general-purpose programmable-logic prototypes. Because it uses nonvolatile configuration memory, the device can retain its programmed logic across power cycles, allowing autonomous operation without an external configuration controller once the configuration image is stored. Board design must account for power sequencing, decoupling, signal integrity, thermal performance, and configuration-data integrity. The BGA-256 footprint requires careful escape routing, while high-speed interfaces demand controlled impedance and return paths. Designers should also confirm the exact power, temperature, and pinout requirements against the manufacturer documentation before layout or substitution. This page consolidates the verified distributor specifications, source links, pricing evidence, package data, same-family replacement candidates, and practical selection guidance for engineers evaluating the Intel EP3C16U256C8.
EP3C16U256C8N - Cyclone III FPGA, 15K LE, 256-UBGA | Altera / Intel
The Intel (formerly Altera) EP3C16U256C8N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, offering 15,408 logic elements, 516,096 bits of embedded RAM, and 168 user I/Os in a 256-ball Ultra FineLine BGA package (Ux256). The 'U256' suffix denotes the plastic Ultra FineLine BGA, and the 'C8' speed grade corresponds to an 8 ns commercial-grade timing classification with -40 °C to +85 °C operating junction range. A Cyclone III FPGA is a SRAM-based programmable logic device that belongs to the family of low-cost, low-power FPGAs targeting high-volume, power-sensitive designs. It sits in the broader hierarchy of programmable logic devices (PLD), positioned between CPLDs and high-performance FPGAs such as Cyclone V / Stratix. Its low static and dynamic power consumption makes it attractive for portable, industrial, and consumer applications that previously used ASICs or ASSPs. Key features of the EP3C16U256C8N include up to 168 single-ended user I/O pins (multi-voltage I/O standards including LVDS, SSTL, LVCMOS, and LVTTL), 56 embedded 18 x 18 multipliers for DSP, four PLLs per device, and 56 M9K memory blocks. The 1.2 V core (VCCINT) with separate VCCIO bank supplies allows mixed-voltage interfacing without external level shifters. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. Typical applications span industrial motor control, video processing pipelines, automotive infotainment prototypes, communication bridges, and consumer display controllers. The Cyclone III architecture is also a popular education platform due to its low cost and Quartus II / Quartus Prime tool support. When designing with this device, pay close attention to the BGA fan-out: the 256-ball U256 package requires microvia or via-in-pad PCB technology. Decoupling must include 0.1 µF caps per VCC pin and bulk caps on each supply rail. Use the Altera / Intel Quartus Prime software (free Lite edition) for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.
EP3C16U256I7 - 16K LEs, 168 I/O FPGA | Altera
The Altera EP3C16U256I7 is a Cyclone III field-programmable gate array with 16,320 logic elements, 168 I/O pins, and 516,096 RAM bits in a 256-LFBGA surface-mount package. The industrial-temperature device supports programmable logic for embedded control, signal processing, communications, and industrial automation designs. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and interconnect are configured after fabrication. An FPGA belongs to the programmable-logic hierarchy, where it combines configurable logic elements, block RAM, general-purpose I/O, clocking, and programmable routing. This implementation provides a compact alternative to combining multiple discrete logic devices while retaining design flexibility and field-updatable configurations. The verified device data identifies 16,320 logic elements, 516,096 RAM bits, 168 I/O pins, a 256-LFBGA package, and an industrial temperature grade. The 16,320 logic-element count provides substantial parallel processing capacity for control logic, interface bridging, protocol handling, and moderate-complexity digital signal processing. The 516,096 RAM bits add configurable storage for buffers, packet data, state machines, and lookup data. The Cyclone III architecture integrates programmable logic elements, embedded memory resources, and general-purpose input/output structures into one integrated device. These resources can be combined for parallel datapaths, finite-state machines, bus interfaces, and control engines. Because configuration and interconnect are programmable, engineers can adapt the same hardware platform across multiple product variants without changing the physical FPGA package. Typical uses include industrial factory controllers, communication equipment, test systems, embedded instrumentation, and network-interface subsystems. In an industrial controller, the 168 available I/O support connections among sensors, actuators, field buses, and status indicators. In a communication design, the logic elements can implement protocol framing while the RAM resources support packet buffering and temporary data storage. The 256-LFBGA package requires careful PCB layout because its 256 ball terminals provide limited escape routing and demand short, controlled-length connections to power, ground, configuration, clock, and user I/O. Adequate via access, solid plane connectivity, decoupling, and assembly-process control are essential for reliable implementation. Configuration storage and programming-device compatibility should also be reviewed before committing the design to production. This page combines verified distributor pricing and availability information with the device's reported FPGA resources, package details, application analysis, and a strict same-package replacement comparison. It also distinguishes confirmed drop-in candidates from family variants and flags technical details that require confirmation from the manufacturer datasheet.
EP3C16U484C6 - Cyclone III FPGA, 15,408 Logic Cells | Altera
The Altera EP3C16U484C6 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/O, and a 484-ball FBGA package. The device provides 516,096 embedded RAM bits and is specified for industrial temperature operation from -40°C to +125°C. Its surface-mount FBGA construction supports compact embedded, communications, industrial control, and test-equipment designs where programmable logic is needed alongside multiple external interfaces. A field-programmable gate array is a digital semiconductor whose configurable logic blocks, memory resources, and programmable I/O form the physical foundation of an FPGA. FPGAs sit within programmable-logic devices and broader digital semiconductors. Unlike fixed-function application-specific integrated circuits, an FPGA can be reconfigured after manufacture to implement control logic, interfaces, protocol handling, signal conditioning, and parallel data-processing functions. The Cyclone III family combines 15,408 logic elements with 346 I/O in this device. The supplied distributor data identifies 516,096 bits of embedded memory and an operating-temperature range of -40°C to +125°C. Its lead-free 484-FBGA package exposes a high pin count while keeping the assembled device compact. The package is suitable for multilayer PCB construction using the manufacturer-specified ball pattern, power architecture, and decoupling requirements. The -40°C to +125°C industrial temperature grade distinguishes this C6 device from variants identified with the C8 suffix. The C6 designation indicates the device’s speed-grade and temperature-positioning family within the ordering system, but the supplied data does not provide a complete numerical operating-frequency table. Consequently, clocking and timing decisions must be checked against the relevant Cyclone III device handbook and the system’s external interface requirements. Typical uses include industrial automation, industrial networking, data-acquisition systems, communications equipment, and embedded control platforms. With 346 I/O, the FPGA can connect parallel sensors, converters, memory devices, transceivers, and control logic while programmable logic handles protocol conversion, filtering, timing, and system supervision. Its 516,096 embedded-memory bits support buffering, packet handling, and data paths that do not require external RAM. The primary design constraint is the 484-ball FBGA footprint. Layout should preserve continuous ground and power planes, place decoupling capacitors close to the supply balls, route high-speed signals according to the Cyclone III guidance, and follow the manufacturer’s ball-assignment and high-speed layout requirements. Because the supplied web excerpts do not provide a complete pinout, power rails, decoupling values, or differential I/O assignments, those details must be confirmed from the official documentation before layout release. This product page combines verified distributor specifications, current availability information, same-family migration options, and practical selection guidance. It also distinguishes verified facts from data gaps, helping engineers evaluate procurement, PCB compatibility, temperature grade, and FPGA resource requirements without relying on unverified assumptions.
EP3C16U484C7 - 15408-LCELL 437.5MHz Cyclone III FPGA | Altera
The Altera EP3C16U484C7 is a Cyclone III field-programmable gate array with 15,408 logic cells, 346 I/O, a 437.5 MHz maximum clock rating, and a 484-pin FBGA package. Designed around a 65 nm process and a 1.2 V core supply, the device combines programmable logic resources with a high pin count for communication, control, and embedded digital-processing systems. A field-programmable gate array, or FPGA, is a programmable digital semiconductor whose logic and interconnect resources can be configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor, a programmable-logic device, and a configurable integrated circuit. The Cyclone III family combines a large I/O count with a relatively compact package, making it suitable for designs that require numerous external connections. The principal verified features are 15,408 logic cells, 346 I/O, a 437.5 MHz maximum operating frequency, 65 nm fabrication technology, a 1.2 V core voltage, and a 484-pin FBGA or UFBGA package. The source listings describe the EP3C16U484C7 as an FPGA with 346 outputs and 15,408 logic cells. Its 484-ball surface-mount format supports dense PCB routing while exposing substantially more device connections than lower-pin-count FPGA packages. The C7 suffix identifies this ordering configuration within the EP3C16 device family, while the U484 portion identifies the 484-pin package option. Available product descriptions report a temperature range of -40 °C to +125 °C. Other detailed electrical characteristics, including I/O voltage ranges, power consumption, configuration interfaces, memory resources, and pin-level functions, were not supplied in the verified dataset and should therefore be confirmed in the manufacturer datasheet before schematic or PCB sign-off. Typical design roles include industrial control logic, communication gateways, data-acquisition front ends, embedded protocol controllers, and parallel signal-processing systems. A design can use the 346 available I/O for sensor inputs, control outputs, high-speed interfaces, or mixed peripheral connections, depending on the exact pin assignments and bank voltage restrictions defined by the Cyclone III documentation. PCB implementation should prioritize a validated power architecture, decoupling, controlled clock routing, and signal-integrity review. Because this is a 484-ball BGA, assembly requires a controlled board layout and appropriate fine-pitch assembly capability. The original design should not be released for production until the exact pinout, configuration pins, I/O standards, power sequencing, and decoupling requirements have been verified against the applicable manufacturer documentation. This page consolidates the verified distributor specifications, package information, pricing evidence, and available same-family comparison references. It also distinguishes confirmed data from fields that require datasheet confirmation, helping engineers evaluate EP3C16U484C7 sourcing without treating unverified electrical details as guaranteed specifications.
EP3C16U484C8 - 15408-Logic-Cell FPGA | Altera Corporation
The Altera Corporation EP3C16U484C8 is a Cyclone III field-programmable gate array with 15,408 logic cells, 346 I/O pins, and a 484-FBGA package. It is designed for programmable digital logic implementations requiring a high pin count and a compact surface-mount footprint. The verified distributor listing identifies the device as a Cyclone III FPGA, while the available component summary specifies an operating temperature range of -40°C to +125°C. A field-programmable gate array, or FPGA, is a programmable digital integrated circuit in which designers configure interconnected logic elements, memory blocks, and input/output resources to implement a hardware function. FPGAs occupy the broader semiconductor and programmable-logic hierarchy. Compared with application-specific integrated circuits, an FPGA allows design revisions to be implemented through configuration rather than by manufacturing a new custom silicon device. Its fixed package, pin resources, and internal architecture must therefore be evaluated against the intended system requirements. The EP3C16U484C8 provides 15,408 logic cells and 346 I/O pins according to the verified DigiKey listing. These figures make the device relevant to designs that need more external connectivity than a small programmable logic device while retaining a mid-density Cyclone III implementation. The 484-FBGA package supports compact board layouts, although its fine-pitch construction requires careful PCB design, assembly process control, and inspection. The device is associated with the Cyclone III FPGA family and is offered by Altera, an Intel company, through major distributors. Its verified ordering information includes a -40°C to +125°C operating-temperature specification, providing a useful indication of its industrial-temperature capability. Other detailed operating data, including core voltage ranges, configuration characteristics, I/O standards, and speed-dependent timing, were not included in the supplied verified records and are identified as data-needed rather than estimated. Typical design uses include industrial control, communications equipment, test and measurement systems, embedded processing, and general-purpose digital interface logic. In each case, the key engineering question is whether the 15,408 logic-cell resource and 346 I/O capability align with the design's parallel logic, memory, connectivity, and external interface requirements. Software support and the selected configuration method also need to be confirmed for the complete toolchain before release to production. For PCB implementation, designers should use the manufacturer's package drawing and pinout rather than relying on distributor photographs or generic BGA diagrams. The 484-FBGA footprint requires adequate escape routing, plane geometry, solder-mask and paste control, thermal-via planning, and assembly capability for the selected ball pitch. Because the supplied records do not expose a verified pin-by-pin assignment, this page does not fabricate individual pin names. This page consolidates the verified distributor identity, resource counts, package information, temperature range, sourcing links, and engineering guidance for EP3C16U484C8. It also separates confirmed values from unavailable technical parameters, enabling engineers to assess sourcing quickly while still completing device-level validation against the official Cyclone III documentation.
EP3C16U484I7 - 15,408 LEs, 484-UBGA Cyclone III FPGA | Altera
Altera EP3C16U484I7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/O, a 437.5 MHz maximum device speed, and a 1.2 V core supply in a 484-UBGA package. The industrial-temperature designation indicates operation from -40°C to +125°C, making the device suitable for temperature-variable embedded, communications, control, and signal-processing systems where a compact programmable-logic implementation is advantageous. A field-programmable gate array is a semiconductor whose configurable logic blocks, programmable interconnect, and I/O resources implement digital functions after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor. Unlike a fixed application-specific integrated circuit, the Cyclone III architecture allows designers to implement parallel processing, control logic, interfaces, and protocol functions in one device while retaining the flexibility to revise the configuration during development. The EP3C16U484I7 provides 15,408 logic elements and 346 I/O in a 484-UBGA package. Its listed 437.5 MHz speed identifies the maximum device performance grade, while the 1.2 V value describes the core supply. The large I/O count supports board-level integration that would otherwise require multiple programmable devices. The industrial temperature range also provides a clear distinction from commercial-temperature catalog variants. Cyclone III devices use programmable logic elements to build combinational and sequential functions, with dedicated resources for memory, digital signal processing, clock management, connectivity, and configuration. The combination of 15,408 logic elements and 346 I/O permits parallel datapaths and control systems to be consolidated, but the available memory, DSP resources, pin assignments, bank voltages, and configuration limits must be checked against the design before selecting the device. Typical applications include industrial control and factory automation, communications infrastructure, embedded instrumentation, data acquisition, and mixed signal processing. The device is also appropriate for general-purpose prototyping because programmable logic can shorten development cycles when requirements evolve. Its 484-UBGA package provides high I/O density but requires careful ball-grid escape routing, multilayer PCB construction, adequate thermal management, and assembly-process control. Designers should verify the exact power architecture, I/O standards, configuration scheme, clock inputs, and pin constraints in the manufacturer documentation before layout. Because the available verified data does not include a complete public ball map, pin-level assignment should be taken directly from the manufacturer device support files rather than inferred from the 484-ball package outline. Differential pairs and high-speed interfaces also require manufacturer-recommended PCB constraints. This page combines verified distributor specifications, current pricing and stock observations, practical FPGA design guidance, and same-family replacement candidates. Unlike a basic distributor listing, it also identifies which replacement details require engineering verification and highlights the package, temperature, speed-grade, and resource constraints that determine whether a candidate is a genuine drop-in choice.
EP3C25E144C7 - 24,624 Logic Elements FPGA | Altera
Altera EP3C25E144C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 1,539 logic array blocks, 608,256 bits of embedded RAM, and 82 general-purpose I/O in a 144-pin EQFP package with exposed pad. It uses 65 nm process technology, supports a 1.15 V to 1.25 V core-supply range, and is listed with a maximum operating frequency of 437.5 MHz. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic semiconductor and a more flexible alternative to application-specific integrated circuits. The Cyclone III family combines configurable logic blocks, embedded RAM, general-purpose I/O, and programmable interconnect resources within one device. Key features include 24,624 logic elements, 1,539 logic array blocks, and 608,256 bits of embedded RAM. The device provides 82 user I/O and is available in a 144-pin exposed-pad package. Its listed 437.5 MHz maximum frequency gives designers a useful benchmark for clocked digital logic, although achievable system frequency depends on the selected logic path, I/O standard, timing constraints, and implementation. The Cyclone III architecture organizes programmable resources into logic array blocks connected by general-purpose interconnect. Embedded memory allows designers to implement buffers, lookup tables, packet stores, and small data tables without using external memories. Its 82 I/O pins support integration with external processors, transceivers, converters, memory devices, and industrial interface components, subject to the voltage and timing constraints specified by the manufacturer datasheet. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, and general-purpose logic consolidation. The device can host parallel interfaces, control logic, protocol bridges, or embedded state machines where a programmable architecture simplifies updates compared with fixed logic. Its 144-pin exposed-pad package also supports board-level thermal management through the pad and associated PCB copper. The primary design consideration is thermal management. The exposed pad must be connected to the required power and ground planes and thermally coupled to copper according to the package and board guidelines. Designers must also verify I/O voltage compatibility, pin constraints, power sequencing, memory initialization, and timing closure in the Quartus design environment. This product record combines verified distributor specifications, source links, practical application guidance, and explicitly qualified drop-in alternatives. Alternative electrical data is left as [DATA_NEEDED] where the supplied source material does not provide a verified value, allowing engineers to distinguish confirmed facts from items that still require datasheet validation.
EP3C25E144C8 - 24,624-Cell Cyclone III FPGA | Intel
The Intel EP3C25E144C8 is a Cyclone III field-programmable gate array with 24,624 logic elements, 82 I/O, 608,256 embedded-memory bits, and a maximum operating frequency of 402 MHz. The device is manufactured using a 65 nm process, operates from a 1.2 V core supply, and is supplied in a 144-pin LQFP exposed-pad package. A field-programmable gate array, or FPGA, is a programmable semiconductor in which configurable logic blocks, memory resources, and programmable I/O replace a fixed digital circuit. An FPGA belongs to the semiconductor hierarchy and provides parallel hardware implementation without changing the physical IC. The Cyclone III family is positioned for cost-sensitive embedded, communications, industrial, and control applications requiring programmable logic and deterministic hardware behavior. The EP3C25E144C8 combines 24,624 logic elements with 82 user I/O in a relatively compact 144-LQFP package. Its 608,256 bits of embedded memory support data buffering, state machines, lookup-table structures, and modest on-chip data storage. The stated 402 MHz maximum frequency provides a useful headline figure for timing planning, although actual interface performance must be evaluated against the applicable Cyclone III timing and power guidance. The device uses a 65 nm process technology and a 1.2 V core voltage. These figures place it in the low-voltage programmable-logic class, where board design must provide stable core and I/O supplies and appropriate decoupling. The exposed thermal pad in the LQFP package provides the primary thermal path from the device to the PCB, making copper area, thermal vias, and airflow important in high-utilization designs. Typical uses include industrial control, communications interfaces, instrumentation, embedded signal processing, and general-purpose logic consolidation. Its 82 I/O are suitable for parallel data buses, status and control signals, clocks, and moderate external memory interfaces. The 144-pin exposed-pad package also offers a manageable board footprint compared with larger FPGA packages while supporting substantially more programmable resources than a simple logic device. Designers should treat FPGA migration and timing closure as deliberate engineering steps. Validate pin assignments against the selected board configuration, constrain all clock and I/O paths, confirm the pinout for the exact EP3C25E144C8 ordering code, and budget the exposed pad for thermal dissipation. A replacement part should be accepted only after its pinout, speed grade, voltage requirements, configuration compatibility, and intended package have been checked. This page consolidates the verified distributor specifications, package and sourcing information, same-family drop-in candidates, and application-oriented design guidance for engineers evaluating the Intel EP3C25E144C8. It also distinguishes documented facts from parameters that require confirmation from the manufacturer datasheet or the incumbent design.
EP3C25E144I7 - 24,624-LE Cyclone III FPGA | Intel
The Intel EP3C25E144I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of embedded memory, and 82 I/O in a 144-LQFP exposed-pad package. The I7 suffix identifies the industrial-temperature grade, while the 144 package designation identifies the terminal configuration. This device belongs to the FPGA > programmable-logic-device > semiconductor hierarchy and supports parallel hardware implementation of digital control, interface, and signal-processing functions. A field-programmable gate array is a reconfigurable digital semiconductor whose logic, interconnect, and I/O resources can be programmed after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA permits design changes to be implemented through bitstream configuration. The EP3C25E144I7 combines programmable logic with embedded memory in a low-cost Cyclone III device intended for mid-range embedded processing, industrial control, communications, and embedded-system control applications. The verified device data identifies 24,624 logic elements, 608,256 bits of embedded memory, 82 I/O, and a 144-LQFP exposed-pad package. These figures position the device between small fixed-logic implementations and larger FPGAs. The 82 available I/O support interfaces to external memory, converters, transceivers, displays, sensors, and control peripherals, while the embedded-memory resource allows buffering or data storage to be implemented inside the FPGA fabric. Detailed logic-element composition, multiplier resources, clock domains, and I/O standards require confirmation in the manufacturer datasheet. The Cyclone III architecture provides programmable combinational and sequential logic together with embedded RAM resources. This makes the EP3C25E144I7 appropriate for control planes, protocol bridges, state machines, parallel data acquisition, and general-purpose embedded logic. Unlike a soft processor implementation on a smaller FPGA, the device offers a comparatively substantial logic capacity and I/O count in one package. That capacity can reduce system partitioning, but power, routing, timing closure, and configuration-memory requirements still determine the final implementation quality. Typical uses include industrial automation controllers, communication interfaces, instrumentation, embedded video control, sensor-processing platforms, and general embedded control systems. In each case, the device can implement parallel state machines or data paths while external processors, converters, and communication components handle system-level tasks. A complete design also requires a suitable configuration interface or external configuration memory, a compliant power supply, decoupling, clocking, and careful I/O assignment. The principal design consideration is that a Cyclone III FPGA is software-configurable rather than fixed-function. Designers should verify pin compatibility, supported I/O standards, timing constraints, and configuration requirements before committing a PCB layout. The exposed pad under the 144-LQFP package must be connected according to the manufacturer thermal and layout guidance, with adequate copper and low-impedance power distribution to support switching activity. This page consolidates verified distributor inventory, package information, comparison data, and drop-in same-family alternatives into an engineering-focused guide. It distinguishes exact observed data from parameters requiring datasheet confirmation and focuses replacement analysis on same-footprint, pin-compatible Cyclone III options rather than merely functionally similar FPGAs from other vendors.
EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel
The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility. Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency. The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces. Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance. When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return. This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C25F256C6 - 24,624-L-cell FPGA in 256-BGA | Altera
Altera EP3C25F256C6 is a Cyclone III field-programmable gate array with 24,624 logic cells, a maximum stated frequency of 500 MHz, and 65 nm process technology in a 256-pin TFBGA package. It also contains 156 user I/O and operates from a 1.2 V core supply, making it a compact programmable-logic device for systems requiring substantial parallel processing within a limited board area. An FPGA is a semiconductor whose digital logic, memory, and I/O behavior can be configured after manufacture. In the technology hierarchy, an FPGA belongs to the programmable-logic and CPLD class, sits above fixed-function digital ICs, and falls within the broader semiconductor and embedded-processing categories. The Cyclone III architecture supports application-specific control, signal processing, communication, and interface consolidation while retaining a reconfigurable development path. The EP3C25F256C6 provides 24,624 logic cells, 156 I/O, 256 package balls, and a listed 500 MHz maximum frequency. Its 65 nm fabrication process supports a relatively compact and power-conscious implementation compared with larger programmable devices. The 256-ball TFBGA package provides dense board-level connectivity, but it also requires careful PCB layout, ball-pattern verification, thermal analysis, and assembly-process control. The device's 1.2 V core supply is typical of the performance range offered by the Cyclone III family. Logic, interface, clocking, and I/O implementation details determine the final external supply arrangement and system power budget. Designers should use the manufacturer pin-description table and device handbook to assign power, ground, configuration, clock, and user I/O balls before schematic capture or PCB routing. Typical uses include industrial control, communications infrastructure, embedded video and image processing, test equipment, and general-purpose embedded control. In these systems, the FPGA can implement parallel datapaths, protocol converters, control logic, and custom peripheral functions while supporting field updates through its configuration architecture. The 156 I/O count is especially useful for designs requiring moderate external connectivity. A critical design consideration is that the TFBGA footprint demands exact land-pattern and solder-mask compatibility. Confirm ball assignments, exposed thermal requirements, via-in-pad strategy, assembly profile, and component placement with the package drawing before release. Power delivery should use low-impedance planes or carefully stitched planes, with separate treatment for core and I/O supply paths according to the datasheet. This product record combines the exact device specifications, pin-package constraints, orderable same-family alternatives, and practical implementation guidance in one engineering-focused reference. It helps designers distinguish a true PCB-compatible substitution from a superficially similar FPGA and plan sourcing, layout, assembly, and lifecycle decisions before committing a new design.