EP3C16M164C8N - 15408-Cell Cyclone III FPGA | Altera
MPN: EP3C16M164C8N ✗ Akhir HidupEP3C16M164C8N Ringkasan
A field-programmable gate array is a semiconductor in which digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where configurable logic elements, memory blocks, input/output resources, clock networks, and configuration interfaces form a flexible digital implementation platform. Compared with a fixed application-specific integrated circuit, an FPGA allows design revisions, field updates, and hardware customization without changing the printed circuit board.
The EP3C16M164C8N provides 15,408 logic elements and 92 I/O in a compact 164-ball TFBGA package. Its 402 MHz maximum clock frequency provides useful timing headroom for control logic, protocol bridges, and parallel data-processing functions. The 92-I/O interface can support multiple external buses and peripheral connections, while the package keeps routing requirements within a dense, multilayer printed circuit board design.
The device is based on 65 nm Cyclone III FPGA technology and operates from a 1.2 V core supply as identified for this device family. Configuration determines how the programmable logic, embedded memory, and I/O blocks are interconnected. Engineers must also account for the selected configuration scheme because package I/O resources can be assigned among user functions, dedicated configuration pins, clock inputs, and other dedicated functions.
Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, embedded video or image processing, motor and power-system controllers, and general-purpose digital prototyping. The FPGA can implement parallel algorithms, state machines, bus adapters, protocol converters, and custom interface logic, while its 92 I/O support external memories, transceivers, converters, and discrete digital components.
The primary design consideration is the ball-grid footprint. A 164-TFBGA package requires a multilayer board with short, matched-routing escape paths, solid power distribution, and careful decoupling. Signal-integrity analysis is important for high-speed memory or external interfaces, and every unused configuration or power ball must follow the manufacturer’s package and board-layout requirements. Thermal performance should be checked against the actual clock, I/O, and core activity.
This product page organizes the EP3C16M164C8N identification data, package characteristics, search-oriented technical questions, application guidance, and design cautions. It also distinguishes verified device facts from engineering fields that require confirmation with the manufacturer datasheet, helping engineers plan a board and determine whether a proposed substitution is truly pin-compatible before ordering samples.
Alternatif penggantian untuk EP3C16M164C8N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP3C16M164C8N (sama faktor bentuk dan footprint) — berbeda di dalam Logic Elements.
Tidak ada alternatif pengganti yang tersedia untuk produk ini.
Permintaan AlternatifEP3C16M164C8N Rating Maksimal & Karakteristik Listrik
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 15408 logic elements |
| Input/Output Count | 92 I/O |
| Frekuensi Bawah Maximum | 402 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Package Type | 164-TFBGA |
| Package Pin or Ball Count | 164 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| Logic Capacity | 516096 logic elements |
| Status RoHS | unknown |
| REACH Status | unknown |
| Tipe Mounting | Surface mount |
EP3C16M164C8N square Diamant Konfigurasi Panduan
Konfigurasi pin untuk EP3C16M164C8N (square pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk EP3C16M164C8N.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
EP3C16M164C8N cocok untuk 6 aplikasis: Industrial PLC and Automation Controller, Communications Interface and Protocol Bridge, Test and Measurement Instrumentation, Image and Video Data Processing, Motor and Power-System Digital Control, Embedded Digital Prototyping.
Industrial PLC and Automation Controller
The EP3C16M164C8N fits compact industrial control logic that requires deterministic parallel processing and numerous external connections. Its 15,408 logic elements can host state machines, counters, interlocks, data acquisition control, and communication protocols, while 92 I/O provide connections to sensors, actuators, isolated digital interfaces, and industrial transceivers. The 402 MHz maximum clock supports demanding control pipelines, subject to final timing analysis. A 164-TFBGA layout keeps the processor and high-speed logic concentrated but requires multilayer PCB construction. Engineers should partition slow control signals from timing-sensitive interfaces, validate industrial temperature and EMC requirements, and reserve configuration pins according to the selected boot scheme.
Direkomendasikan
Communications Interface and Protocol Bridge
The EP3C16M164C8N is appropriate for fixed or reconfigurable communications bridges that translate between parallel data paths and serial or packet-oriented interfaces. Its 15,408 logic elements provide space for framing, buffering, clock-domain crossing, and protocol state machines, while the 92 I/O can connect controllers, memories, transceivers, and status signals. The 402 MHz maximum clock allows timing-intensive datapaths when timing closure is demonstrated. Designers should use clocking and pin-placement constraints, confirm the electrical standard for every external interface, and check whether the selected configuration scheme reserves any otherwise usable I/O resources.
Direkomendasikan
Test and Measurement Instrumentation
The EP3C16M164C8N can support programmable logic used in test, measurement, and signal-conditioning equipment. The 15,408 logic elements allow parallel sampling control, sequencing, trigger logic, data acquisition paths, and programmable filters to be implemented together, while 92 I/O supports converters, memory devices, clocks, and external test ports. Its 402 MHz maximum clock supports high-rate processing when the complete timing path meets constraints. Because the target uses a 164-TFBGA package, engineers should preserve short return paths, provide stable references, decouple each supply properly, and verify analog-interface isolation separately from the digital FPGA core.
Direkomendasikan
Image and Video Data Processing
The EP3C16M164C8N is suitable for parallel image-processing, pixel-format conversion, timing generation, and video interface bridging. Its 15,408 logic elements support row and pixel pipelines, line buffers, color processing, and control state machines, while the 92 I/O can connect parallel sensors, display controllers, memory interfaces, and synchronization signals. The 402 MHz maximum clock is relevant to pixel-clock pipelines, although achievable rate depends on memory timing and logic depth. The 164-TFBGA footprint supports dense routing but demands careful layer planning. Designs should constrain all video clocks, account for external memory latency, and validate signal integrity at the selected pixel and link rates.
Direkomendasikan
Motor and Power-System Digital Control
The EP3C16M164C8N can implement digital control, protection, and monitoring functions for motors, inverters, and power-conversion equipment. Its 15,408 logic elements accommodate sampling control, pulse-width generation, current and position loops, fault logic, and supervisory state machines. The 92 I/O supports gate drivers, position sensors, analog-converter interfaces, communication links, and discrete status signals, while the 402 MHz maximum clock supports fast control arithmetic where timing constraints allow. A multilayer 164-TFBGA board is appropriate for compact high-speed control, but power and signal domains must remain isolated. Validate fault-safe behavior, timing margins, and analog-to-digital sampling requirements independently of the FPGA logic.
Direkomendasikan
Embedded Digital Prototyping
The EP3C16M164C8N supports rapid digital prototyping because programmable logic can implement multiple interfaces and algorithms without a fixed mask set. Its 15,408 logic elements are useful for combining sensor acquisition control, custom arithmetic, protocol logic, and system supervision, while 92 I/O reduce the need for external programmable logic. The 402 MHz maximum clock enables moderately high-speed datapaths when properly constrained. Engineers should reserve enough logic and memory for the final design, maintain a reproducible pin assignment, and plan configuration storage and update procedures. Because the package is a dense 164-TFBGA, prototype board changes can be costly if power, routing, and signal integrity were not planned early.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP3C16M164C8N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini |
|---|---|
| Brand | Altera |
| Device Type | Cyclone III FPGA |
| Logic Elements | 15408 logic elements |
| Maximum Clock Frequency | 402 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Input/Output Count | 92 I/O |
| Package | 164-TFBGA |
| Package Pin or Ball Count | 164 balls |
| Mounting Type | Surface mount |
Diferensiator Kunci
- Balanced programmable resource density for compact control systems (vsEP3C16F484I7N)
- Lower package-ball count for space-constrained board planning (vsEP3C10U256C8N)
- Established Cyclone III timing target (vsEP3C16M164C7N)
Catatan Desain
Design the 164-TFBGA layout on a multilayer PCB with short escape routes for clock, configuration, and high-speed I/O. Assign pins before routing so the ball map, configuration requirements, voltage standards, and board-edge constraints remain consistent. Use the exact package drawing and ball table as the authority for land patterns, solder-mask definition, and assembly clearances. A generic BGA footprint should not be substituted without checking ball pitch, pad diameter, and package-specific recommendations.
Build the power tree around the manufacturer’s recommended core and I/O supply requirements rather than the 1.2 V core value alone. Place bulk and high-frequency decoupling capacitance close to the associated package balls, provide a continuous return path beneath signal routes, and isolate switching or high-current power systems from the FPGA. Review voltage tolerance, sequencing, and current demand during power-up and power-down because incorrect rail ordering can stress internal circuitry even when steady-state voltages appear correct.
Apply timing and signal-integrity constraints to every clocked path and high-speed interface. The 402 MHz maximum clock is a device capability rather than a guaranteed routing rate; actual performance depends on logic depth, speed grade, clock topology, and board parasitics. Use vendor timing analysis with realistic clock uncertainty, define I/O standards according to external-device requirements, and inspect return-current continuity. For external memory or serial links, validate edge rate, skew, impedance, and termination using the complete board configuration.
Do not interpret the 92-I/O figure as 92 freely assignable pins without checking the configuration scheme, dedicated inputs, clock resources, and package restrictions. The manufacturer documentation notes that I/O counts can be affected by configuration selection. Before schematic completion, map each user interface against the exact package table, reserve the configuration mechanism, confirm clock-pin capabilities, and verify that every assigned voltage domain has a corresponding power rail and level-shifting strategy.
Informasi Konformitas
No definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals statement was identified for the exact ordering code. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified discrete semiconductor. Confirm material and environmental compliance for the exact orderable part.
