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XC6SLX100T-2CSG484I - Spartan-6 FPGA 101K Logic Cells | AMD
XC6SLX100T-2CSG484I

XC6SLX100T-2CSG484I - Spartan-6 FPGA 101K Logic Cells | AMD

The AMD XC6SLX100T-2CSG484I is a member of the Spartan-6 LXT FPGA family, built on a mature 45nm low-power copper process technology. It delivers 101,261 logic cells and 296 user I/O pins in a 484-ball CSBGA package, offering a balance of density, performance, and low power for high-volume applications. The device operates from a 1.2V core supply and supports a wide range of I/O standards. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementations. FPGAs sit between ASICs and microprocessors in the design hierarchy, providing reconfigurable hardware acceleration for tasks ranging from protocol bridging to digital signal processing. The Spartan-6 family is optimized for cost-sensitive, high-volume applications where low power and system integration are critical. Key features of the XC6SLX100T-2CSG484I include 4,939,776 bits of block RAM, 268 DSP48A1 slices, and support for high-speed serial transceivers (up to 3.125 Gbps) in the LXT variant. The device also includes a hard PCI Express block, memory controllers, and advanced clock management tiles (CMTs) with PLLs and DCMs. These features enable the implementation of complete system-on-chip designs with minimal external components. From a technical perspective, the Spartan-6 family uses a 45nm process that reduces dynamic power consumption by approximately 50% compared to previous Spartan families. The fabric is based on a 6-input look-up table (LUT) architecture, providing efficient logic utilization. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include industrial automation, automotive infotainment, medical imaging, and communications equipment. The 296 I/O pins support various standards including LVCMOS, LVDS, and HSTL, making it suitable for interfacing with a wide range of peripherals and memory devices. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1.2V core supply should be regulated with low-noise LDOs or switching converters, and the device's power consumption should be estimated using the Xilinx Power Estimator (XPE) tool to ensure adequate cooling.

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XC6SLX100T-3FGG484C - Spartan-6 FPGA 101K Logic Cells | AMD
XC6SLX100T-3FGG484C

XC6SLX100T-3FGG484C - Spartan-6 FPGA 101K Logic Cells | AMD

The AMD XC6SLX100T-3FGG484C is a member of the Spartan-6 LXT family of Field Programmable Gate Arrays (FPGAs), built on a mature 45 nm low-power copper process technology. It delivers 101,261 logic cells, 296 user I/O pins, and 4,939,776 bits of block RAM, all in a 484-ball FBGA package. This device is designed for high-volume applications requiring leading system integration with the lowest total cost, offering half the power consumption of previous Spartan families and faster, more comprehensive connectivity. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs are part of the broader category of programmable logic devices (PLDs), which sit between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. They consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing designers to implement custom digital logic circuits without the high NRE costs of ASIC development. FPGAs are widely used in prototyping, aerospace, automotive, industrial, and communications applications where flexibility and time-to-market are critical. Key features of the XC6SLX100T-3FGG484C include 101,261 logic cells, 296 user I/O pins, 4,939,776 bits of block RAM, and support for various I/O standards including LVCMOS, LVDS, and HSTL. The device operates from a 1.2V core voltage and is available in the -3 speed grade, which is the fastest speed grade for this part. The 484-ball FBGA package measures 23x23 mm with a 1.0 mm ball pitch, providing a compact footprint for dense PCB designs. The device also includes advanced clock management tiles (CMTs) with PLLs and DCMs, and supports configuration via JTAG, SPI, and BPI interfaces. From a technical depth perspective, the Spartan-6 family is built on a 45 nm low-power copper process, which balances performance and power efficiency. The LXT variant includes high-speed serial transceivers (up to 3.125 Gbps), PCI Express endpoints, and advanced memory controllers, making it suitable for high-bandwidth applications. The device also features dedicated DSP48A1 slices for digital signal processing, providing up to 180 GMACs of performance. The -3 speed grade offers the highest performance, with maximum clock frequencies typically exceeding 400 MHz for internal logic. Typical applications for the XC6SLX100T-3FGG484C include software-defined radio (SDR), industrial motor control, medical imaging, and high-performance computing acceleration. Its combination of logic density, I/O count, and transceiver capabilities makes it ideal for bridging, protocol conversion, and real-time signal processing tasks. The device is also well-suited for aerospace and defense applications where long-term supply and traceability are required. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout. The core voltage (VCCINT) should be regulated at 1.2V with low-noise LDOs or switching regulators, and each power pin should have a 100 nF ceramic capacitor placed as close as possible. Additionally, the configuration bitstream must be stored in an external SPI flash or programmed via JTAG, and the device supports multi-boot for remote updates.

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XC6SLX150-3FGG676C - Spartan-6 LX FPGA 147K LE | AMD Xilinx
XC6SLX150-3FGG676C

XC6SLX150-3FGG676C - Spartan-6 LX FPGA 147K LE | AMD Xilinx

The AMD Xilinx XC6SLX150-3FGG676C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) delivering 147,443 logic cells, 23038 Adaptive Logic Modules (ALMs), and 4,939,776 system gates in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package. It carries the -3 commercial speed grade with a maximum core clock of 862 MHz, offers 498 user I/Os, and operates over the commercial 0C to +85C temperature range per the FBGA-676 27 x 27 mm, 1.0 mm pitch package profile. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines logic gates, multipliers, embedded memory, and high-speed transceivers into a configurable fabric. FPGA sits in the hierarchy of programmable logic -> programmable logic device -> semiconductor -> integrated circuit. The Spartan-6 LX family targets high-volume cost-sensitive applications that demand high logic density, abundant block RAM, and integrated DSP slices without the power overhead of Virtex-class devices. By programming the LUTs, routing, and IP cores via the ISE Design Suite, engineers create custom accelerators, glue logic, video pipelines, and connectivity subsystems on a single chip. Key features of the XC6SLX150-3FGG676C include 135 Kbit distributed RAM, 4.8 Mbit block RAM, 180 DSP48A1 slices, four clock management tiles with PLL, and 498 SelectIO signals supporting LVCMOS, LVDS, and LVTTL standards. The device integrates PCI Express Endpoint blocks, GTP transceivers are NOT present on this LX variant, and supports DDR, DDR2, DDR3, and QDRII+ memory interfaces through dedicated hardware controllers. Configuration is via SPI, BPI, JTAG, or Platform Flash XCF, enabling flexible in-system reprogrammability for field upgrades. From a system-architecture perspective, the Spartan-6 LX uses a 45 nm copper CMOS process backed by an optimized core voltage of 1.14 to 1.26 V and auxiliary supply of 2.5 / 3.3 V for I/O banks. The 676-BGA package exposes 26 user I/O banks so designers can support mixed-voltage interfaces (1.2 V to 3.3 V) on a single die, ideal for bridging legacy and modern logic families in industrial control or motor-drive boards. Typical applications include industrial motor control and factory automation backbones, video surveillance processing pipelines, medical imaging front-end buffers, automotive driver-assistance pre-processing prototypes, and avionics display controllers. The combination of abundant I/O and large block RAM makes the LX150 particularly attractive for high-channel-count data acquisition and parallel sensor aggregation. When designing with this part, validate that the 676-BGA layout supports at least four routing layers with laser-drilled microvias, since 1.0 mm pitch BGA escape routes demand controlled-impedance planning. Also confirm that the ISE WebPACK license covers all required IP cores for development. This page synthesizes distributor availability, drop-in Spartan-6 family alternatives, and practical layout notes not bundled into the manufacturer datasheet.

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XC6SLX150T-3FGG484I - Spartan-6 LXT FPGA 147K Logic Cells | AMD
XC6SLX150T-3FGG484I

XC6SLX150T-3FGG484I - Spartan-6 LXT FPGA 147K Logic Cells | AMD

The AMD XC6SLX150T-3FGG484I is a high-performance Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a 45nm CMOS process technology. It delivers 147,443 logic cells and 23,038 adaptive logic modules (ALMs) in a 484-pin FBGA package with a 19x19 mm body and 0.80 mm pitch. The device operates from a 1.2V core supply and supports up to 296 user I/O pins, making it suitable for high-volume, cost-sensitive applications requiring substantial logic density and I/O flexibility. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that can be programmed after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which themselves fall under the category of integrated circuits. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates, which is critical for evolving standards and algorithm changes. Key features of the XC6SLX150T-3FGG484I include 4.71 Mbit of embedded block RAM, integrated DSP slices for signal processing, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The -3 speed grade provides the highest performance within the Spartan-6 LXT family, with internal clock frequencies up to 667 MHz. The device also includes hardened memory controllers for DDR, DDR2, and DDR3, reducing system cost and design complexity. Technically, the Spartan-6 architecture employs a 45nm low-power copper process with a 1.2V core voltage, balancing performance and power consumption. The device integrates Clock Management Tiles (CMTs) containing DCMs and PLLs for robust clock generation and jitter filtering. The LXT variant adds high-speed serial transceivers (up to 3.125 Gbps) and PCIe endpoints, enabling advanced bridging and serial connectivity applications. Typical applications include automotive infotainment systems, industrial automation controllers, consumer electronics bridging, and high-speed data acquisition. The 296 I/Os and 4.71 Mbit memory make it ideal for video processing, motor control, and protocol conversion. The -3 speed grade ensures timing closure for demanding designs. When designing with this FPGA, careful attention to power supply decoupling is essential. Use multiple 100nF and 10uF capacitors near the VCCINT, VCCAUX, and VCCO pins to minimize noise. Additionally, configure the device's I/O standards to match the external interface voltages to prevent damage and ensure signal integrity.

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XC6SLX16-2CPG196C - Spartan-6 LX 375 MHz FPGA | AMD
XC6SLX16-2CPG196C

XC6SLX16-2CPG196C - Spartan-6 LX 375 MHz FPGA | AMD

AMD/Xilinx XC6SLX16-2CPG196C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 106 user I/Os, and a maximum stated operating frequency of 375 MHz, supplied in a 196-ball CSBGA package. The device operates from a 1.14 V to 1.26 V core-supply range and is built on 45 nm CMOS technology. It combines programmable logic, block RAM, digital clock managers, and PLL resources in a cost-sensitive FPGA platform for industrial and embedded systems. A field-programmable gate array is a semiconductor device whose digital behavior is configured through a programmable bitstream rather than a fixed circuit layout. Within the product hierarchy, an FPGA is a programmable logic device and semiconductor, while the Spartan-6 LX family combines configurable logic blocks and dedicated resources for parallel processing, control, signal generation, and interface bridging. The XC6SLX16-2CPG196C provides 14,579 logic cells, 106 user I/Os, 375 MHz stated operating performance, and 667 MHz internal frequency according to the verified product listings. Its 196-ball CSBGA footprint measures 19 mm by 19 mm with a 0.80 mm ball pitch. The commercial-temperature suffix C corresponds to the listed 0 °C to 85 °C operating range, while the -2 suffix identifies the device speed grade. Spartan-6 devices use configurable logic and dedicated resources to implement control logic, parallel data processing, memory-intensive functions, and communication bridges. The -2 grade provides a practical balance between processing performance and cost, making the LX16 suitable for cost-sensitive designs that need more integration than a small programmable logic device but do not require a large premium FPGA. Typical uses include industrial automation, motor-control interfaces, machine-vision pre-processing, sensor acquisition, communication bridging, embedded control, and high-volume consumer equipment. The combination of 106 I/Os and 14,579 logic cells allows multiple interfaces and control domains to be consolidated on one programmable device while retaining field-upgradeable behavior. Designers should treat the 1.14 V to 1.26 V core supply as a dedicated power domain, follow AMD Spartan-6 decoupling and configuration recommendations, and verify the exact CPG196 pinout and ball assignments before layout. Thermal, signal-integrity, and configuration-boot requirements must be checked against the applicable Spartan-6 hardware documentation rather than inferred solely from the distributor summary.

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XC6SLX16-2CPG196I - 14k Logic Cells Spartan-6 FPGA | AMD
XC6SLX16-2CPG196I

XC6SLX16-2CPG196I - 14k Logic Cells Spartan-6 FPGA | AMD

The AMD (Xilinx) XC6SLX16-2CPG196I is a Spartan-6 LX FPGA built on a 45 nm CMOS process, delivering 14,579 logic cells with 106 user I/Os in a 196-ball 8 mm × 8 mm CSBGA (TFBGA) package, with 576 Kbit of embedded block RAM and integrated DSP slices. The “-2” speed grade and industrial-grade (-40 °C to +100 °C) “I” temperature suffix indicate a -2 speed/performance tier intended for industrial-temperature environments. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable routing, and dedicated hardware resources such as block RAM, multipliers/DSP slices, and clock management tiles (DCMs/PLLs). The Spartan-6 LX series sits in the low-power, low-cost tier of the AMD/Xilinx product hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Spartan-6 LX devices target high-volume, cost-sensitive bridging, control, and signal-processing applications that need the parallelism and reconfigurability of an FPGA without the cost of a Virtex-class device. Key features of the XC6SLX16-2CPG196I include: 14,579 logic cells (~2,300 logic slices), 106 maximum user I/Os (some version/board use this number; package allows up to 106), 576 Kbit (72 Kbyte) of block RAM, 32 DSP48A1 slices, four DCMs and two PLLs for clock management, on-chip memory controllers (MCB) for DDR/DDR2/LPDDR, and a 1.2 V core supply with dedicated high-performance/low-power transceiverless I/O banks. The device is implemented on 45 nm process technology, delivering low static and dynamic power versus previous Spartan generations. The -2 speed grade is the mid-tier in the Spartan-6 family and balances Fmax and power for typical industrial designs. Architecturally, the XC6SLX16-2CPG196I uses a register-rich, columnar LUT-6 architecture with dedicated carry chains, distributed RAM/SRL16 shift-register logic in each CLB, and a hard PCIe endpoint block on higher-density siblings (note: LX16 does not include the integrated PCIe block; it is on LX45+). Multiple I/O standards (LVCMOS, LVDS, HSTL, SSTL) are supported with per-bank reference voltages, and the package is lead-free (Pb-free) RoHS-compliant. The 8 × 8 mm CSBGA package supports high-density board layouts in space-constrained designs. Typical applications include industrial motor control and factory automation, automotive infotainment displays and driver-assistance modules, consumer video bridging (HDMI/LVDS), low-cost software-defined radio front-ends, embedded vision pre-processing, and communication backplane bridging. The 576 Kbit of block RAM and 32 DSP slices make the LX16 well suited to small FIR/IIR filters, modest FFT engines, sensor-fusion pre-processing, and glue-logic aggregation. Pairing with a small external SPI flash for configuration memory keeps the BOM lean. When designing with this FPGA, verify that the -2 speed grade meets your target Fmax for the design floorplan, ensure JTAG and DONE pull-up values match the Spartan-6 configuration user guide, and check I/O-bank voltage compatibility before mixing 3.3 V peripherals with 1.2 V core logic. Note: the LX16 does not include the integrated PCIe block; use LX45/LX75/LX100/LX150 if PCIe hard IP is required. This page synthesizes AMD/Xilinx datasheet specifications, distributor pricing as of 2026-10-11, same-package drop-in alternatives within the Spartan-6 family, and practical design notes.

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XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD
XC6SLX16-2CSG225C

XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD

The AMD XC6SLX16-2CSG225C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 589,824 bits of block RAM, and 160 user I/O in a 225-ball CSPBGA package. The -2 device is built on 45 nm CMOS technology and operates from 0°C to +85°C. Its 225-LFBGA package measures approximately 19 mm by 19 mm with a 0.80 mm ball pitch and supports lead-free assembly. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor used to implement logic, control, signal processing, and interface functions in programmable hardware. An FPGA belongs to the semiconductor hierarchy and combines configurable logic blocks, programmable I/O, memory resources, dedicated processing blocks, and clocking circuitry. The Spartan-6 LX family is positioned for cost-sensitive, high-volume systems that need more parallelism and performance than a basic microcontroller can provide. The XC6SLX16 combines 14,579 logic cells with 589,824 bits of block RAM and 160 I/O. Dedicated 18×18 multiplier resources support efficient digital signal processing, while cascade and pipelining features allow higher-performance arithmetic and filtering structures. Its programmable I/O and 45 nm architecture are useful for custom bridges, industrial interfaces, embedded control, video data processing, and communication equipment. The -2 suffix identifies the device's performance grade, while CSG225 specifies its 225-ball CSPBGA package. The C suffix identifies the commercial temperature grade. Verified distributor data reports a maximum internal frequency of 667 MHz, although achievable system performance depends on the selected design, timing constraints, I/O standards, clocking architecture, and memory interface configuration. Typical applications include industrial automation and factory control, machine vision, automotive infotainment, consumer video processing, embedded communications, and low-cost PCI-based systems. The 160 available I/O support integration with external memory, transceivers, sensors, displays, and industrial peripherals while the programmable fabric allows product revisions and field updates without changing the PCB. PCB design must follow AMD package, pinout, solder, and thermal guidance. The CSPBGA package requires careful escape routing, a suitable PCB land pattern, adequate power and ground distribution, and attention to via-in-pad or microvia fabrication requirements. Designers should use the published package files and the Spartan-6 configuration data rather than relying on generic BGA assumptions. This product page consolidates verified distributor specifications, lifecycle-relevant sourcing information, same-footprint Spartan-6 alternatives, comparison parameters, and practical implementation guidance. It also distinguishes documented facts from parameters that require confirmation in the complete AMD device documentation before layout or production release.

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XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD
XC6SLX16-2CSG225I

XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD

The AMD Xilinx XC6SLX16-2CSG225I is a Spartan-6 LX field-programmable gate array (FPGA) with 14,579 logic cells, 1,139 configurable logic blocks, 24 hardware multipliers, and 144 I/O in a 225-LFBGA CSBGA package. The device is built on 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified with an internal frequency of 667 MHz and a -2 speed grade. The XC6SLX16-2CSG225I also carries the industrial-temperature designation and is intended for cost-sensitive, high-volume embedded systems requiring a balanced combination of programmable logic, DSP resources, and I/O flexibility. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic architecture and interconnect are defined after manufacture. Within the broader semiconductor hierarchy, this FPGA belongs to the programmable-logic device class, combines lookup-table-based combinational logic with programmable routing, and provides deterministic parallel processing for control, acquisition, communications, and signal-processing functions. The Spartan-6 LX family is positioned between fixed-function controllers and larger high-performance FPGAs. The XC6SLX16-2CSG225I provides 14,579 logic cells distributed across 1,139 CLBs, along with 24 dedicated multipliers for DSP-oriented arithmetic. Its 144 I/O support integration with external memory, converters, communication transceivers, and industrial interfaces. The 45 nm CMOS implementation supports a 1.2 V operating supply, while the -2 suffix identifies the device speed grade. The exact I/O standards, memory interface capacity, configuration data rates, and static-power limits are not present in the supplied verified records. The 225-LFBGA CSBGA package supports compact, high-density PCB integration but requires careful escape routing, via-in-pad or via-adjacent fanout, and controlled assembly-planar or ball-grid layouts. Because the verified package descriptions differ between 19 x 19 mm and 13 x 13 mm versions in secondary listings, the package dimensions should be checked against the authoritative AMD package drawing before layout release. The supplied comparison data identifies the target as a 225-pin package and also references a 484-pin listing that does not match the MPN designation. Typical uses include industrial automation and motor control, machine-vision preprocessing, sensor acquisition, programmable control, industrial communications, and embedded signal processing. These applications benefit from parallel I/O, deterministic hardware multipliers, and reconfigurable logic that can be updated without changing the PCB. The -2 speed grade and industrial-grade ordering designation are appropriate selections when a design requires a cost-sensitive Spartan-6 LX implementation rather than a higher-density or higher-performance FPGA. Designers should reserve all power, ground, configuration, clock, and decoupling connections according to the AMD Spartan-6 pinout and PCB guidelines. The verified records identify 144 I/O but do not provide a complete numbered pin map, so the pinout is intentionally not presented here. Programming toolchain compatibility, supported I/O standards, absolute maximum ratings, and exact decoupling requirements must be confirmed in the official AMD documentation for the selected package and speed grade. This product record consolidates verified distributor, manufacturer-resource, and cross-reference findings with engineering-focused application guidance, explicit uncertainty markers, and same-footprint alternatives. It also distinguishes the target from package, speed-grade, and temperature-grade variants that are related components but not automatically interchangeable for every production program.

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XC6SLX16-2CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-2CSG324C

XC6SLX16-2CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX16-2CSG324C is a Spartan-6 LX field-programmable gate array built on a 45 nm process, with 14,579 FPGA cells, 232 I/Os, a -2 speed grade, and a 324-LFBGA package. The device combines programmable logic, block RAM, and DSP resources in a single integrated circuit for compact digital control, signal-processing, communications, and industrial automation designs. Its stated internal frequency is 667 MHz, while its nominal supply voltage is 1.2 V. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor that lets engineers implement digital logic functions through programmable configuration rather than a fixed mask set. Within the broader semiconductor hierarchy, an FPGA is a programmable digital logic device that sits alongside microcontrollers, DSPs, and ASICs. It is useful when a design needs parallel hardware, adaptable interfaces, or logic that can be updated after manufacture. The Spartan-6 LX family combines configurable logic blocks with dedicated block RAM and DSP48 processing resources. The verified product listing identifies 232 I/Os and 14,579 cells, providing a substantial logic surface for control planes, data acquisition, protocol bridges, and embedded signal-processing functions. The -2 suffix denotes the device speed grade, while the CSG324 ordering code identifies the specific 324-ball package variant used by the manufacturer. The supplied data describes the device as a lead-free 19 mm by 19 mm package with 0.80 mm pitch. One retrieved specification identifies the physical description as CSBGA-484, while the distributor listing identifies the orderable package as 324-LFBGA/CSPBGA; these package descriptions require confirmation against the official ordering information before footprint release. The stated operating temperature range is 0°C to 85°C for the version described by the retrieved datasheet source. Typical applications include industrial automation, bridging, communications, consumer equipment, and control systems where programmable logic and parallel I/O are valuable. An FPGA can implement multiple interfaces concurrently, while its configurable architecture allows design revisions without changing the physical device. Compared with a fixed-function ASIC, this flexibility is useful for prototypes and evolving systems, although FPGA power, clocking, and configuration requirements must be considered during design. A key design consideration is confirming the exact package, ball map, voltage requirements, configuration interface, memory resources, and I/O standards against the official AMD Spartan-6 documentation before layout or replacement qualification. This page consolidates verified distributor metadata, pricing references, package information, and drop-in replacement guidance while clearly identifying values that still require manufacturer confirmation. This information is intended for design comparison and sourcing support rather than certification. Spartan-6 LX devices in a common supported package may be pinout compatible, but engineers must verify the specific speed grade, temperature grade, device variant, package, and intended operating conditions before substitution.

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XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD
XC6SLX16-2FT256C

XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX16-2FT256C is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 186 I/O, a 667 MHz internal frequency, and a 256-ball lead-free LBGA package. It uses 45 nm CMOS technology and a 1.2 V core supply, providing a compact programmable-logic platform for industrial, consumer, communications, and embedded-control systems. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA sits above programmable logic devices and combines configurable logic blocks, block RAM, dedicated arithmetic resources, programmable I/O, and embedded processors. This integration allows one package to replace multiple programmable logic devices and supporting discrete components while shortening development cycles. The verified specifications identify 14,579 configurable cells, 1,139 CLBs, 186 I/O, a 667 MHz internal frequency, and 45 nm CMOS fabrication. The -2 suffix identifies the middle Spartan-6 LX speed grade, while C identifies the commercial temperature grade. These resources support parallel data processing, control-plane logic, communication bridges, signal conditioning, and general-purpose embedded systems without requiring a mask change for each design. As an FPGA, the XC6SLX16-2FT256C combines programmable digital logic with fixed physical resources. Its 186 I/O provide external connectivity, while the 256-ball surface-mount package supports compact board layouts. The 45 nm process and 1.2 V core supply place the device in a mature, low-power programmable-logic architecture intended for cost-sensitive designs that require more integration than discrete logic but less complexity than a large FPGA. Typical applications include industrial automation, industrial networking, video and image processing, consumer equipment, communications infrastructure, and embedded control. The Spartan-6 LX family is specifically identified as suitable for advanced bridging applications, automotive infotainment, consumer products, and industrial automation. A board using this device also requires a suitable configuration memory or boot interface, compliant power rails, clocking, decoupling, and careful signal-integrity routing. Designers should verify the exact FT256 pinout, supported I/O standards, configuration method, power-supply sequencing, and startup behavior in the AMD package files before layout release. Because the verified data does not provide the complete 256-ball pin map, no pin names should be inferred from generic BGA numbering. Differential interfaces should be routed with controlled length and impedance, while FPGA power and ground pins should follow the manufacturer's published connectivity and plane guidance. This product page consolidates distributor availability, package information, speed-grade variants, and practical replacement guidance in one engineering-focused reference. It also distinguishes true FT256 pin-compatible alternatives from package-only equivalents and clearly identifies specifications that require confirmation from the AMD Spartan-6 documentation.

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XC6SLX16-2FT256I - Spartan-6 LX FPGA, 14K LCs, 256-BGA | AMD
XC6SLX16-2FT256I

XC6SLX16-2FT256I - Spartan-6 LX FPGA, 14K LCs, 256-BGA | AMD

The AMD (formerly Xilinx) XC6SLX16-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) with 14,579 logic cells, 589,824 bits of block RAM, and 186 user I/O, housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA-256) package with industrial-grade -40C to +100C temperature rating and -2 speed grade performance. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, and clock management tiles (CMTs). FPGAs occupy a position between general-purpose microcontrollers (software-defined behavior, sequential execution) and application-specific integrated circuits (ASICs, fixed function, highest performance per watt). The Spartan-6 family specifically targets cost-sensitive, high-volume applications where ASIC NRE costs are prohibitive but microcontroller performance is insufficient. Key features of the XC6SLX16-2FT256I include 2,278 Kbits total block RAM, 32 DSP48A1 slices for fixed-point and signal-processing arithmetic, four clock management tiles (CMTs) with digital clock managers (DCMs) and phase-locked loops (PLLs), and integrated SelectIO technology supporting single-ended and differential I/O standards up to 1080 Mbps. The device is fabricated on a 45 nm CMOS process and operates from a 1.2 V core supply with separate I/O bank voltages from 1.2 V to 3.3 V. Architecturally, the Spartan-6 LX family uses a 6-input LUT-based logic fabric with dedicated carry chains, distributed SRL16/SRL32 shift-register primitives, and a 16-bit block RAM/FIFO controller per BRAM tile. The 256-ball FTBGA package provides 186 effective user I/O after accounting for power, ground, configuration, and dedicated JTAG pins. Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, LED video wall controllers, and embedded vision pre-processing. The 256-BGA package suits designs requiring dense I/O and moderate thermal dissipation. When designing with this device, ensure proper decoupling with 100 nF ceramic capacitors at every supply pin and a 4.7-10 uF bulk capacitor near the core rail. Configuration can be sourced from SPI flash, JTAG, or BPI parallel memory; the dedicated DONE and INIT_B pins must be monitored for proper startup sequencing. This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX16-2FTG256C - Spartan-6 LX FPGA, 14K Cells, 256-BGA
XC6SLX16-2FTG256C

XC6SLX16-2FTG256C - Spartan-6 LX FPGA, 14K Cells, 256-BGA

The AMD (Xilinx) XC6SLX16-2FTG256C is a member of the Spartan-6 LX family of field-programmable gate arrays (FPGAs) providing 14,579 logic cells (approximately 1,139 CLBs), 589,824 bits of block RAM, and 186 maximum user I/Os in a 256-ball fine-pitch thin BGA (FTG256) package. Built on a 45 nm CMOS process, the LX variant targets low-cost, high-volume applications with an emphasis on logic density and embedded memory, while delivering typical core performance up to 667 MHz. FPGAs are programmable logic devices that allow hardware designers to implement arbitrary digital circuits, ranging from glue logic and bus bridges to full processor subsystems and DSP pipelines. The Spartan-6 LX series specifically targets cost-sensitive, high-volume designs such as consumer electronics, industrial control, automotive infotainment, and communications infrastructure. Within the broader taxonomy, FPGAs sit alongside CPLDs (less-dense, non-volatile), ASICs (fixed-function, high-volume), and microcontrollers (software-programmed sequential); FPGAs uniquely offer hardware-level parallelism with reconfigurable logic. Key features of the XC6SLX16 include the 256-ball FTG256 package at 1.0 mm ball pitch, a 17×17 mm body, lead-free/RoHS-compliant construction, and an industrial-class (-2) speed grade. The device integrates dual 10/100/1000 Ethernet MACs, dedicated DSP slices (32 of them, totaling 8.18 GMAC/s when fully packed), and 32 BRAM blocks supporting 18 Kb each. Configuration is supported through JTAG (IEEE 1149.1/1532), SPI (x1, x2, x4), and BPI (x8, x16) modes, while clock management is handled by up to 4 clock management tiles (CMTs) containing mixed-mode clock managers and PLLs. Typical applications include high-volume bridging between legacy video or memory interfaces and modern SoCs, motor control loops, low-cost industrial Ethernet endpoints, video processing pipelines, and embedded soft-processor cores such as MicroBlaze or PicoBlaze. Designers frequently pair the Spartan-6 LX with companion DDR memory controllers and high-speed serial transceivers (where required by the chosen package). A critical design consideration with the XC6SLX16-2FTG256C is its lifecycle status: the Spartan-6 family is generally considered NRND (Not Recommended for New Designs) per AMD/Xilinx's product longevity notice. Engineers building production hardware should evaluate Artix-7 or Spartan-7 successors for new projects while keeping this part viable for maintenance of legacy designs. Power decoupling, multi-bank I/O voltage referencing, and bitstream encryption (AES-256) also require careful PCB and firmware planning. This page synthesizes authorized distributor pricing, same-package drop-in alternatives, and practical hardware-design guidance that goes beyond the datasheet's typical-application notes — including lifecycle awareness for engineers managing long-life industrial installations.

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XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-2FTG256I

XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX16-2FTG256I is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 1,139 CLBs, 186 I/Os, and a stated internal frequency of 667 MHz, packaged in a 256-pin lead-free FTGBGA. The -2 speed grade and I temperature designation identify this device as an industrial-oriented Spartan-6 LX option for cost-sensitive embedded systems requiring substantial programmable logic, dedicated block RAM, DSP resources, and clock-management capability. A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing blocks are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and integrates configurable logic, fixed or block memory, DSP processing, clock management, and programmable I/O. This integration allows one package to replace combinations of processors, interface controllers, data converters, and discrete programmable logic while preserving upgradeability through a configuration bitstream. Key resources include 2,278 adaptive logic modules, 186 user I/Os, 14,579 logic cells, and 1,139 CLBs. The source data also identifies 375 MHz as another stated frequency and gives a core-voltage range of 1.14 V to 1.26 V. The FTG256 package uses a 17 mm by 17 mm body with a 1 mm ball pitch, supporting dense PCB integration without requiring a large leaded package. The Spartan-6 LX architecture combines programmable logic with block RAM, DSP slices, digital clock managers, and PLLs. Those resources allow parallel data-path designs, protocol bridging, control-plane logic, and fixed-point signal processing to share one FPGA. A 667 MHz stated internal frequency supports demanding clock domains, but achievable system performance remains dependent on the selected design, timing constraints, memory interface implementation, and I/O standards. Typical uses include industrial control and automation, embedded communications gateways, video and image-processing pipelines, instrumentation, and low-cost data-acquisition systems. In these applications, the 186 I/Os provide connectivity, while the 14,579 logic cells allow control logic and datapaths to be consolidated. The Spartan-6 family is particularly relevant to designs that require FPGA flexibility without moving to a larger or more expensive device family. Designers should use the official Spartan-6 package pinout files for every FTG256 ball assignment and verify the selected bank supplies, configuration pins, clock-capable pins, and I/O standards against the design constraints. PCB layout must also account for the 1 mm pitch, power and ground distribution, configuration-boot behavior, and high-speed routing required by the implemented interfaces. This page consolidates the verified specifications, distributor pricing, same-footprint alternatives, and application-oriented design guidance available for the XC6SLX16-2FTG256I. It also distinguishes documented values from unresolved lifecycle, pin-level, and pricing details so engineers can make a traceable sourcing decision.

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XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD
XC6SLX16-3CPG196C

XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD

The AMD (Xilinx) XC6SLX16-3CPG196C is a Spartan-6 LX family Field Programmable Gate Array delivering 14,579 cells, 1,451 Kbits of block RAM, and 106 user I/O in a 196-ball CSBGA (0.5 mm pitch, 8x8 mm) package. The device operates at the -3 speed grade, the highest performance bin in the Spartan-6 LX series, with a maximum internal clock frequency of 667 MHz and 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock managers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the digital-logic hierarchy: they deliver ASIC-level performance and parallelism while remaining reprogrammable in the field. The Spartan-6 family specifically targets cost-sensitive, high-volume applications where power consumption, density, and price-per-logic-cell are critical. Key features of the XC6SLX16-3CPG196C include 14,579 logic cells, 1,451 Kbits of block RAM (576 Kbits dual-port), 32 DSP48A1 slices, 2 clock management tiles (CMTs), and 2 PCIe hard IP blocks. The 106 available user I/Os support multiple I/O standards including LVCMOS, LVDS, and LVTTL at programmable slew rates and strengths. The CSBGA-196 package (8x8 mm body, 0.5 mm ball pitch) suits compact, high-density PCB layouts. The Spartan-6 LX architecture is built on a 45 nm CMOS process and provides lower static and dynamic power than the prior Spartan-3A generation. The device integrates a hard PCIe endpoint block (1-lane Gen1), hard memory controllers for DDR/DDR2/DDR3/LPDDR, and a high-speed GTP serial transceiver-free design (the LX family omits transceivers, unlike the LXT). The -3 speed grade delivers the highest Fmax in the family. Typical applications include industrial motor and motion control, video surveillance and image processing, low-cost PCIe endpoint cards, consumer display controllers, and embedded DSP systems. The CSBGA-196 footprint is particularly suitable for space-constrained designs such as portable test equipment and 4-layer FR4 carrier boards. The 45 nm process and 1.2 V core reduce thermal dissipation compared to older 90 nm and 65 nm FPGA families. When designing with this device, allocate sufficient decoupling capacitance (typically 100 nF and 4.7 uF combinations) at each supply pin and follow AMD's Spartan-6 PCB Design Guide for controlled-impedance routing. The 0.5 mm pitch CSBGA requires via-in-pad or laser-drilled microvia technology on standard 4-layer boards; ensure your PCB fabrication process supports the pitch before committing to layout.

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XC6SLX16-3CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-3CSG324C

XC6SLX16-3CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX16-3CSG324C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 232 I/O, 589,824 RAM bits, and a 667 MHz internal frequency, packaged in a 324-CSPBGA. The -3 designation identifies the highest-performance Spartan-6 speed grade in the provided source data, while the C suffix denotes the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated processing resources on one device. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic class and provides a hardware alternative to combining numerous discrete logic devices. It is widely used when design changes, parallel processing, high I/O density, or rapid product customization are more important than the lowest unit cost. The XC6SLX16 offers 14,579 logic cells organized into 1,139 LABs and CLBs, together with 589,824 bits of embedded block RAM. Its 232 user I/O support communication links, control interfaces, memory connections, and mixed-signal system integration. The 667 MHz internal frequency provides a concrete timing reference for clocked digital designs, although achievable system performance depends on the selected tools, constraints, memory interfaces, and I/O standards. This device is built on a 45 nm FPGA process and supports operating supply voltages from 1.14 V to 1.26 V. The 324-CSPBGA package supports dense surface-mount assembly while exposing a substantial pin count for high-bandwidth designs. The commercial-grade part is specified for a 0 °C to 85 °C operating range, making it appropriate for cost-sensitive equipment operating in controlled commercial environments rather than extended industrial temperature conditions. Typical uses include real-time digital signal processing, video encoding and decoding, image processing, image enhancement, industrial automation, programmable control, and high-performance computing accelerators. Its combination of logic, memory, and 232 I/O permits a complete parallel pipeline to be consolidated into one FPGA. Dedicated block RAM can buffer video lines or sample data, while programmable logic can implement filters, protocol converters, and control algorithms. Designers should obtain the AMD Spartan-6 package pinout file before assigning any board-level pins and verify the selected package, voltage requirements, and pinout against the device documentation. The provided search results conflict on package dimensions, so the exact body size and ball-pitch information must be checked in the authoritative package drawing rather than inferred from third-party listings. Commercial-temperature operation should also be confirmed against the enclosure temperature. This product page consolidates the verified distributor specifications, price, source links, package identity, and same-family drop-in options into an engineering-focused reference. It also distinguishes documented facts from unavailable details, helping teams compare sourcing options while avoiding unsupported package, pinout, or timing assumptions.

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XC6SLX16-3FT256C - 14,579 Logic Cell Spartan-6 FPGA | AMD
XC6SLX16-3FT256C

XC6SLX16-3FT256C - 14,579 Logic Cell Spartan-6 FPGA | AMD

AMD XC6SLX16-3FT256C is a Spartan-6 LX field-programmable gate array with 14,579 logic elements, 1,139 configurable logic blocks, 589,824 bits of block RAM, and a maximum clock frequency of 667 MHz, packaged in a 256-LBGA. The device combines programmable logic, embedded memory, programmable I/O, and dedicated FPGA resources in a single 45 nm CMOS device for embedded and cost-sensitive digital systems. A field-programmable gate array is a semiconductor whose digital logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy and provides parallel programmable logic, block RAM, digital signal processing resources, and clock-management functions. This makes the device useful where a fixed application-specific integrated circuit would be inflexible or uneconomic to develop. The XC6SLX16-3FT256C provides 14,579 logic elements arranged across 1,139 CLBs, with 589,824 total RAM bits supporting data buffering, packet handling, and general-purpose embedded storage. Its reported 667 MHz maximum clock frequency provides useful timing margin for control logic, interface bridges, instrumentation, and embedded processors. The -3 speed designation identifies its performance grade within the Spartan-6 LX family. Built on 45 nm CMOS technology, the device supports a 1.2 V core supply as identified in the verified product records. Its 256-LBGA package uses a 1 mm pitch and measures approximately 17 mm by 17 mm. The supplied comparison data also identifies 186 I/O resources, allowing the device to interface multiple buses, peripherals, and external control signals while preserving a compact surface-mount footprint. Typical uses include industrial automation, communications equipment, embedded control, test and measurement, signal processing, and compact network interfaces. The combination of programmable logic, block RAM, and 186 I/O permits designers to consolidate parallel control, data buffering, and protocol handling in one device. A complete design still requires suitable clocking, configuration storage, decoupling, and board-level signal-integrity implementation. When planning a board, verify every BGA-256 land pattern against the AMD Spartan-6 package pinout files and the selected device’s official package drawing. The -3 speed grade and commercial C suffix must also be treated as part of the exact ordering code rather than assumed interchangeable with other Spartan-6 grades or temperature options. This page consolidates the verified distributor specifications, 256-LBGA sourcing information, same-family replacement candidates, pricing evidence, and practical FPGA design considerations into one engineering-focused reference. It distinguishes directly documented facts from package details or operating parameters that still require confirmation from the complete AMD device documentation.

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XC6SLX16-3FT256I - Spartan-6 LX FPGA, 14579 Cells, 186 I/O | AMD
XC6SLX16-3FT256I

XC6SLX16-3FT256I - Spartan-6 LX FPGA, 14579 Cells, 186 I/O | AMD

The AMD/Xilinx XC6SLX16-3FT256I is a Spartan-6 LX field programmable gate array (FPGA) delivering 14,579 logic cells, 1,139 configurable logic blocks (CLBs) and 186 user I/O, with a maximum internal clock frequency of 667 MHz on a 1.2 V core supply, packaged in a 256-ball FTBGA (FT256) surface-mount package measuring 17 x 17 mm with 1.0 mm ball pitch. An FPGA is a reconfigurable digital integrated circuit whose logic, memory and I/O are defined by a bitstream loaded at power-up. A logic cell contains a lookup table plus flip-flops and routing resources, and thousands of such cells are interconnected by a programmable switch matrix. The Spartan-6 LX family is the logic-optimized member of the Spartan-6 series: it targets designs dominated by wide datapaths, control logic, protocol bridges and video/interface consolidation rather than maximum DSP density. In the device hierarchy, this part sits as a programmable logic device within the FPGA & CPLD family of integrated circuits. Key characteristics of the XC6SLX16-3FT256I include the -3 speed grade, which is the highest-performance Spartan-6 LX grade available, and a 45 nm CMOS process node that keeps both static power and dynamic power manageable in cost-sensitive embedded systems. The device provides 186 user I/O in a compact 256-ball grid, which is a high I/O-to-logic ratio for a device of this size. Temperature handling is specified as 0 C to +85 C (32 F to 185 F) with industrial-grade parts marking, and the FT256 package is offered in a lead-free configuration. Technically, the device combines LUT-based six-input logic architecture with dedicated block RAM for data buffering and DSP-oriented arithmetic, plus SelectIO resources that support high-speed memory interfaces and common I/O standards through selectable I/O drivers. Because the device is a -3 grade part, timing closure is the easiest of the Spartan-6 LX options, giving the highest achievable system clock and the greatest margin on demanding multi-clock domains. Configuration is handled through the standard Xilinx JTAG and configuration interface scheme, supporting both persistent and reconfiguration-oriented design flows. Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and fieldbus bridging, video and image datapath consolidation, USB and multi-protocol interface hubs, motor and motion control sequencers, and compact embedded control platforms for aerospace, telecommunications and consumer networking equipment. When designing with this device, plan the power budget and thermal design around the 1.2 V core supply and the I/O supply rails, and confirm the pinout against the AMD Spartan-6 package pinout files for the FT256 package before layout. Because the FT256 package is a dense 1.0 mm-pitch BGA, a fine-pitch assembly and adequate solder mask and paste control are required to avoid bridging defects. This page consolidates distributor pricing, verified drop-in replacement options, and packaging and thermal design notes for the XC6SLX16-3FT256I that are not consolidated in any single manufacturer document, so engineers can evaluate the device and its alternates before committing a PCB layout.

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XC6SLX16-3FTG256C - Spartan-6 LX FPGA, 14k LCs, 256-FTBGA | AMD
XC6SLX16-3FTG256C

XC6SLX16-3FTG256C - Spartan-6 LX FPGA, 14k LCs, 256-FTBGA | AMD

The AMD (formerly Xilinx) XC6SLX16-3FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) providing 14,579 logic cells, 186 maximum user I/Os, and 256 Kbits of distributed RAM in a 256-ball fine-pitch thin-ball grid array (FTBGA-256, 17 x 17 mm, 1.0 mm pitch). It uses 45 nm CMOS process technology and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital circuits using configurable logic blocks (CLBs), programmable I/Os, on-chip memory, and dedicated hard IP such as transceivers, DSP slices, and clock management tiles. FPGAs are part of the programmable logic hierarchy alongside CPLDs and sit between discrete logic and ASICs in system design trade-offs. The XC6SLX16-3FTG256C features 1139 CLBs, 32 DSP48A1 slices, two clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and SelectIO high-performance I/O supporting LVDS, LVCMOS, LVTTL, SSTL, and HSTL standards across 8 I/O banks. The -3 speed grade targets high-performance designs with up to 667 MHz internal clocking. Typical applications include industrial motor control, video processing pipelines, automotive driver assistance, low-cost wireline aggregation, and embedded control systems. Its small 17 x 17 mm BGA footprint suits cost-sensitive high-volume designs. Design tips: pay careful attention to the banked I/O supply pins (VCCO), keep the auxiliary supply VCCAUX at 2.5 V to 3.3 V, and use the -C commercial temperature grade (0 C to +85 C) only inside chassis environments. This page aggregates DigiKey/Mouser distributor pricing, same-footprint alternatives in the Spartan-6 family, and 45 nm power-rail guidance not found in the manufacturer datasheet.

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XC6SLX16-3FTG256I - Spartan-6 LX FPGA, 14K Logic Cells, 256-FTBGA | AMD Xilinx
XC6SLX16-3FTG256I

XC6SLX16-3FTG256I - Spartan-6 LX FPGA, 14K Logic Cells, 256-FTBGA | AMD Xilinx

The AMD Xilinx XC6SLX16-3FTG256I is a Spartan-6 LX field-programmable gate array (FPGA) integrating 14,579 logic cells (1,139 Configurable Logic Blocks), 589,824 bits of block RAM, and 186 user I/O into a 256-ball fine-pitch thin-ball grid array (FTBGA, 17 x 17 mm, 1.0 mm pitch) package, qualified to the industrial temperature range (-40C to +100C). It belongs to the -3 speed grade, the highest performance tier within the Spartan-6 LX family, and is fabricated on a 45 nm CMOS process that lowers static power relative to earlier 65 nm Spartan generations while preserving the 667 MHz internal operation supported by the silicon. A field-programmable gate array (FPGA) is a semiconductor device built from an array of programmable logic blocks, programmable interconnect, programmable I/O cells, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. Within the broader taxonomy it sits alongside CPLDs, gate arrays, and ASICs as a re-programmable digital logic device; FPGAs differ from CPLDs mainly in density and architectural granularity, and differ from ASICs by being configurable post-fabrication. The Spartan-6 LX family is positioned by AMD Xilinx as the cost-optimized, low-power member of the Spartan-6 generation, ideal for bridging, display, and motor-control in ASICs and ASSPs. Key features include integrated block RAM up to 589,824 bits, dual 10/100/1000 Mbps Ethernet MAC hardening options, a low-power 45 nm process with 1.2 V core voltage, integrated PCI Express endpoint block in LXT variants, and a programmable I/O voltage range that supports common single-ended and differential standards. The CLB array contains 1,139 logic cells arranged to deliver balanced logic, memory, and DSP resources, and the package's fine-pitch BGA delivers compact board area while keeping signal integrity manageable for the supported I/O rates. Spartan-6 LX uses the proven 45 nm CMOS process and the 6th-generation Xilinx FPGA architecture, bringing logic, block RAM, DSP48A1 slices, and clock management tiles (CMT) into a low-cost fabric. Memory controllers (hard MCBs) support DDR, DDR2, DDR3, and LPDDR external memory interfaces up to 800 Mb/s data rates, and the integrated GTP serial transceivers in LXT parts deliver multi-gigabit connectivity for cost-sensitive serial links. Typical applications for the XC6SLX16-3FTG256I include industrial motor-control and PLC backplanes, low-cost video bridging and consumer display controllers, automotive infotainment and telematics subsystems, machine-vision front ends, and PCIe endpoint cards in cost-sensitive computing. The wide industrial temperature range and high I/O count make it a frequent building block in factory automation and embedded vision designs. When designing with this FPGA, ensure that the I/O bank voltages reference the classfree reference design, ensure that the configuration memory (typically a SPI or BPI flash) is sized for the bitstream, and ensure that the FPGA's power-on sequencing and decoupling network match the Spartan-6 power distribution guidance in UG393 to ensure reliable industrial-temperature operation. Designers should also budget for ISE Design Suite or Vivado (legacy) toolchain support and the appropriate license. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers an at-a-glance view of where the XC6SLX16-3FTG256I fits in the Spartan-6 LX family and what alternatives exist for sourcing continuity.

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XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-2FG484C

XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX25-2FG484C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 266 I/O, a 500 MHz internal frequency, and a 484-ball FBGA package. Built on 45 nm CMOS technology and operating from a 1.2 V core supply, it combines programmable logic, 266 user I/O, and embedded block RAM in a single device. The -2 speed grade supports designs requiring predictable general-purpose FPGA performance, while the commercial temperature option covers 0°C to 85°C. A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnects, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, where it sits above fixed-function logic devices and provides parallel hardware implementation for control, signal processing, communications, and interface functions. Its value comes from combining substantial configurable logic density with reusable intellectual property cores, allowing one package to replace multiple conventional logic components. The Spartan-6 LX family provides 24,051 logic cells for this device, 266 I/O, and 45 nm CMOS fabrication. The -2 designation identifies its performance grade, while the 484-ball package supports dense board routing through an array of solder-ball connections. The device is identified as lead-free and RoHS compliant in the supplied component data. These characteristics make it relevant to industrial control, communications, instrumentation, embedded signal processing, and general-purpose prototyping systems. At the architecture level, the Spartan-6 LX FPGA combines configurable logic blocks with dedicated block RAM and programmable I/O resources. This mixed architecture allows parallel datapaths and state machines to be implemented without relying on a processor for every control function. The supplied data identifies a 500 MHz internal frequency, while actual interface and system timing remain dependent on the selected I/O standards, clocking implementation, board-level routing, external memory interface, and the selected design tools. Typical uses include industrial automation controllers, serial and parallel protocol bridges, data-acquisition front ends, communications equipment, and embedded DSP functions. Its 266 I/O count is particularly useful when a design must connect multiple buses, capture parallel sensor data, or bridge legacy peripheral logic to a modern system. The 484-ball FBGA also reduces board area compared with a large leaded package, but it demands careful escape routing and assembly control. A primary design consideration is package and PCB complexity. Unlike a fine-pitch QFP, the 484-ball FBGA is not visually inspectable after assembly and requires appropriate land patterns, via-in-pad or escape-routing rules, X-ray inspection capability, and controlled solder-assembly profiles. Designers should also confirm power sequencing, decoupling, clock integrity, and I/O voltage compatibility against the complete AMD device documentation before layout release. This page consolidates the verified device identity, package information, commercial listing, and cross-reference findings into an engineering-focused product record. It also distinguishes true package-compatible Spartan-6 options from unrelated FPGA families, helping procurement and hardware teams assess interchangeability without assuming that equivalent logic density guarantees interchangeable pinout, timing, or qualification.

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XC6SLX25-2FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
XC6SLX25-2FG484I

XC6SLX25-2FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

AMD/Xilinx XC6SLX25-2FG484I is a Spartan-6 LX FPGA with 24,051 logic cells, 266 I/O, 45 nm CMOS technology, 1.2 V operation, and a 484-pin FBGA package. The -2 speed grade is designed for industrial-temperature operation from 0 C to 85 C, as identified in the verified component listings. The device combines programmable logic, block RAM, DSP resources, and programmable I/O in a single FPGA package, making it suitable for embedded control, communications, industrial automation, signal processing, and general-purpose digital design. Its 484-ball package provides a high-density interconnect arrangement for designs requiring numerous external interfaces. The Spartan-6 LX FPGA family is a programmable-logic device family within the broader FPGA and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic behavior, interfaces, and signal processing to be configured after manufacture. This flexibility supports design revisions, shorter product-development cycles, and consolidation of multiple control functions into one programmable device when appropriate system partitioning and validation are performed. Key verified characteristics include 24,051 logic cells, 266 I/O, 1.2 V operation, 45 nm CMOS construction, and a 484-pin FBGA package. The -2 speed grade provides a defined performance class within the Spartan-6 LX family. The I/O count makes the device suitable for systems requiring parallel buses, multiple control signals, external memory interfaces, converters, and communication transceivers. Because the package is ball-grid and densely routed, PCB layout requires careful ball assignment, power planning, decoupling, and signal-integrity review. Typical uses include industrial PLC and automation controllers, embedded instrumentation, communications equipment, video and image-processing front ends, and low-power control subsystems. The FPGA can implement parallel algorithms, state machines, protocol bridges, and control logic in parallel, reducing reliance on multiple discrete controllers. Its programming flexibility also allows firmware-like field updates when the surrounding flash and configuration architecture are included. Design considerations center on thermal performance, decoupling, configuration, and high-speed board layout. The 1.2 V core and dense 484-ball package require multiple supply rails and careful placement of bypass capacitors. Designers should use the AMD Spartan-6 package pinout and device documentation for exact ball assignments, power sequencing, configuration pins, and I/O standards before layout release. This page combines verified distributor and manufacturer-source information with package, purchasing, and engineering guidance designed to make the XC6SLX25-2FG484I selection process faster.

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XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD
XC6SLX25-2FGG484I

XC6SLX25-2FGG484I - Spartan-6 FPGA 24051 Cells | AMD

The AMD XC6SLX25-2FGG484I is a Field Programmable Gate Array (FPGA) from the Spartan-6 LX family, built on a mature 45 nm low-power copper process technology. It delivers 24,051 logic cells, 958,464 bits of block RAM, and 266 user I/O pins in a 484-ball FBGA package (23x23 mm, 1 mm pitch). The device operates at a core voltage of 1.2V and supports internal clock frequencies up to 500 MHz, with a -2 speed grade providing a balanced performance-power trade-off. An FPGA is an integrated circuit that can be programmed after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and general-purpose processors in the semiconductor hierarchy. They offer reconfigurability, parallel processing, and low non-recurring engineering costs, making them ideal for prototyping, low-to-mid volume production, and applications requiring hardware flexibility. Key features of the XC6SLX25-2FGG484I include 24,051 logic cells, 52 DSP48A1 slices, 958,464 bits of block RAM, and support for multiple I/O standards including LVCMOS, LVDS, and SSTL. The device also features integrated memory controllers, clock management tiles (CMT) with PLL and DCM, and support for PCI Express (in LXT variants). The -2 speed grade offers a balance between performance and power consumption, with a maximum internal frequency of 500 MHz. The Spartan-6 family is designed for high-volume, cost-sensitive applications, offering half the power consumption of previous Spartan families. The 45 nm process technology enables high logic density and low static power. The device includes advanced power management features such as suspend mode and partial reconfiguration support, allowing dynamic power optimization in battery-powered systems. Typical applications include industrial automation, automotive infotainment, medical imaging, communications infrastructure, and video processing. The 484-ball FBGA package provides ample I/O for interfacing with external memory, ADCs, DACs, and high-speed serial transceivers (in LXT variants). The industrial temperature grade (-40°C to +100°C) makes it suitable for harsh environments. When designing with this FPGA, ensure proper decoupling of the 1.2V core supply and 2.5V/3.3V auxiliary supplies. Use the configuration pins (MODE, DONE, PROG_B) for reliable device programming. The device supports multiple configuration modes including Master SPI, Slave SelectMAP, and JTAG, providing flexibility in system design.

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XC6SLX25-2FT256I - Spartan-6 LX FPGA, 24K Logic Cells | AMD
XC6SLX25-2FT256I

XC6SLX25-2FT256I - Spartan-6 LX FPGA, 24K Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX25-2FT256I is a Spartan-6 LX Field-Programmable Gate Array (FPGA) integrating 24,051 logic cells, 1,879 Configurable Logic Blocks (CLBs), and 958 Kbits of block RAM in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA-256) package. It is built on a 45 nm CMOS process, supports up to 186 user I/O, and runs at internal frequencies up to 500 MHz in this -2 (standard performance) and -I (industrial temperature, -40C to +100C) grade. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock-management tiles (CMTs). FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class parallelism and data-path throughput while remaining fully re-programmable in the field. The Spartan-6 LX family is positioned at the low-cost, low-power end of the AMD/Xilinx FPGA portfolio and is widely used in bridging, motor control, video processing, and industrial automation. Key features of the XC6SLX25-2FT256I include 24,051 logic cells, 1,879 CLBs, 4,824 Kbits of distributed RAM, 38 DSP48A1 slices running up to 390 MHz, 2 CMTs for PLL-based clock management, and a 32-bit MultiBoot configuration controller. Industrial temperature grade -I supports -40C to +100C operation. The FT256 package provides 186 user I/O across 256 balls with 1.0 mm pitch and 17 x 17 mm body. The -2 speed grade offers the standard balance of performance and power consumption for cost-sensitive embedded designs. The architecture pairs 6-input Look-Up Tables (LUT6) with dual flip-flops per slice, enabling efficient state-machine and pipelined datapath implementations. The Memory Controller Block (MCB) supports DDR, DDR2, DDR3, and LPDDR external memories at up to 800 Mb/s, while the SelectIO technology supports voltages from 1.2 V to 3.3 V on the same bank. Typical applications include industrial control and bridging, automotive infotainment head units, motor and servo drive feedback, low-cost video processing, custom glue logic replacement, and consumer electronics requiring low-power parallel DSP. The wide temperature grade also makes it suitable for factory automation and outdoor display systems. When designing with this part, note that Spartan-6 FPGAs require a separate configuration memory or JTAG programming interface; the device does not boot from internal flash. Plan the bank I/O voltage ahead of placement to avoid level-shifter overhead. This page consolidates distributor pricing for the AMD XC6SLX25-2FT256I, drop-in FT256 Spartan-6 variants, and practical design notes that go beyond the manufacturer datasheet summary.

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XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
XC6SLX25-3FG484C

XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

Advanced Micro Devices, Inc. XC6SLX25-3FG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 24,051 configurable logic cells, a 1.2 V core supply, and a 500 MHz internal frequency in a 15 x 15 mm lead-free CSBGA package. The -3 speed grade is identified as the highest-performance Spartan-6 LX grade in the supplied technical documentation. A field-programmable gate array, or FPGA, is a programmable logic device that combines configurable logic, programmable I/O, and dedicated processing resources on one semiconductor die. FPGAs occupy the programmable-logic hierarchy between fixed-function logic ICs and higher-end adaptive computing devices. They allow hardware functions to be revised through configuration bitstreams rather than redesigning a custom ASIC, reducing prototype cycles and supporting field upgrades. The XC6SLX25-3FG484C provides 24,051 logic cells and 1,879 configurable logic blocks, according to the indexed Spartan-6 comparison data. Its 500 MHz internal-frequency listing makes it suitable for parallel logic, state-machine, control, interface, and signal-processing designs that require deterministic hardware operation. The 484-BBGA package also exposes substantially more connection options than a small quad-flat package. The device combines configurable logic with DSP48 processing resources and dedicated block RAM for filtering, transforms, communications encoding, and other data-intensive functions. Its 45 nm CMOS implementation and 1.2 V core voltage place it in the Spartan-6 generation designed to balance programmable logic capacity, I/O connectivity, power efficiency, and cost for cost-sensitive, high-volume equipment. Typical uses include industrial automation and control, video-processing pipelines, communications infrastructure, instrumentation, embedded systems, and interface consolidation. The 24,051-cell Spartan-6 LX device is particularly appropriate when parallel datapath logic, moderate DSP requirements, and extensive package I/O are needed without moving immediately to a larger FPGA or developing a custom ASIC. Design planning must account for the BGA escape routing, decoupling, clock integrity, configuration memory, and thermal performance of a 484-ball package. Although the indexed operating-temperature range is 0 to 85 °C, thermal design should be evaluated for the actual board, enclosure, airflow, and activity level rather than relying only on the commercial temperature designation. This product record combines verified distributor availability, exact package and device identifiers, Spartan-6 family specifications, drop-in same-package comparisons, and procurement-oriented guidance. It distinguishes confirmed data from unavailable numeric pricing, pin-by-pin mapping, and detailed power characteristics so engineers can make sourcing and design decisions without relying on inferred values.

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