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XC9572-7PC84C - 72-Macrocell 5V CPLD | AMD | PLCC-84
XC9572-7PC84C

XC9572-7PC84C - 72-Macrocell 5V CPLD | AMD | PLCC-84

The AMD XC9572-7PC84C is a 72-macrocell, 5 V in-system-programmable complex programmable logic device with 7.5 ns pin-to-pin logic delay, a maximum fCNT of 125 MHz, and an 84-lead PLCC package. The device provides 1,600 usable gates and up to 72 user I/O pins, while one distributor specification identifies 69 I/O pins for this exact orderable MPN. A CPLD is a programmable logic device that sits between fixed-function logic and an FPGA in the broader semiconductor hierarchy. Its nonvolatile architecture retains a programmed logic configuration after power removal, while its macrocell structure and in-system programming interface support practical field configuration, testing, and design migration. The XC9572 belongs to the XC9500 5 V CPLD family and uses Advanced CMOS 5V Fast FLASH technology. Key features include 72 macrocells, 1,600 usable gates, 7.5 ns pin-to-pin delay, operation to 125 MHz, 5 V in-system programming, and a stated programming endurance of at least 10,000 program or erase cycles. The family also supports parallel programming of multiple XC9500 devices. These characteristics make the XC9572 appropriate for consolidating medium-complexity control logic, interface decoding, state machines, and legacy glue logic. The XC9572-7PC84C is identified as a commercial-grade 84-terminal J-bend device in an 84-lead LCC package. The -7 speed designation corresponds to the verified 7.5 ns pin-to-pin delay, while the C suffix denotes the commercial ordering variant. Because this is a 5 V architecture, system designers must verify every attached signal against the device's input thresholds and supply requirements rather than treating it as a modern 3.3 V or 1.8 V CPLD. Typical applications include industrial control systems, legacy peripheral interfaces, programmable logic replacement, instrumentation, and compact control boards requiring nonvolatile logic with in-system reconfiguration. It is especially relevant where a small amount of moderate logic must be consolidated without moving the design to a larger FPGA. Its 84-lead PLCC footprint also supports migration among compatible XC9500 devices when macrocell count, timing, and pin assignment remain acceptable. The principal design consideration is compatibility with the original XC9500 implementation. Engineers should preserve the target's power architecture, verify every pin against the XC9572 package data, and confirm that the design meets the 7.5 ns timing requirement. The XC9572 is identified as RoHS non-compliant and contains lead, so new regulated production designs should require an explicit lifecycle and environmental review before procurement. This page consolidates verified manufacturer and distributor information, drop-in same-family options, parameter comparisons, and practical migration guidance. The alternatives and application passages are intentionally limited to package-compatible XC9500-family choices supported by the supplied evidence, avoiding unrelated FPGA replacements that would require redesign.

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XC9572-7PQ100C - 72-Macrocell 7.5 ns CPLD | AMD Xilinx
XC9572-7PQ100C

XC9572-7PQ100C - 72-Macrocell 7.5 ns CPLD | AMD Xilinx

AMD Xilinx XC9572-7PQ100C is a 72-macrocell, 5 V in-system programmable complex programmable logic device in a 100-pin QFP package. It provides 72 I/O, 1,600 usable gates, a maximum pin-to-pin delay of 7.5 ns, and a stated fCNT of up to 125 MHz. The device uses Advanced CMOS 5V FastFLASHTM technology, supports parallel programming of multiple XC9500 devices, and provides at least 10,000 program/erase cycles. A CPLD is a configurable logic device that combines macrocell-based programmable logic, user-programmable interconnect, and nonvolatile configuration memory. Within the product hierarchy, the XC9572-7PQ100C is a CPLD, a member of the XC9500 programmable logic family, and a 5 V logic semiconductor intended for general-purpose logic integration. Its in-system programmability permits configuration through the assembled PCB rather than requiring a separate programming operation before insertion. Key features include 72 macrocells, 72 I/O, four function blocks, 1,600 gates, and pin-to-pin logic delays specified down to 7.5 ns for this speed grade. The flexible 36V18 function block allows 90 product terms to drive any or all 18 macrocells within each block. The device also supports enhanced pin locking and programming over the full commercial voltage and temperature range. The Advanced CMOS 5V FastFLASHTM architecture provides a practical combination of nonvolatile configuration storage, predictable logic performance, and repeatable in-system programming. A system designer can use the CPLD for interface translation, control logic, bus arbitration, state-machine implementation, glue logic, and prototype logic consolidation. The 100-pin package provides more I/O than smaller XC9500 packages while retaining a conventional surface-mount form factor. Typical applications include industrial control systems, instrumentation interfaces, communications equipment, test and measurement products, and embedded control platforms. It is particularly useful when a design requires frequent field updates, nonvolatile configuration retention, or a compact replacement for multiple individually packaged logic elements. When designing around the XC9572-7PQ100C, verify the 4.75 V to 5.25 V internal supply range, respect the commercial temperature and timing limits, and confirm the exact 100-pin footprint and signal assignments against the manufacturer datasheet. Programming-file generation and device programming must also use tools supporting the legacy XC9500 architecture.

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XC9572-7TQ100C - 72-Macrocell 5V CPLD | AMD | Industrial Control
XC9572-7TQ100C

XC9572-7TQ100C - 72-Macrocell 5V CPLD | AMD | Industrial Control

AMD XC9572-7TQ100C is a 72-macrocell, 5 V in-system programmable CPLD with 72 I/O, a 7.5 ns maximum pin-to-pin propagation delay, and a 100-pin TQFP package. It belongs to the XC9500 family and uses Advanced CMOS 5 V FastFLASH technology. The device provides a practical combination of logic density, deterministic timing, and field programmability for legacy control, interface, and glue-logic designs. A complex programmable logic device, or CPLD, is a user-programmable semiconductor that combines AND-OR logic structures with nonvolatile configuration memory. The XC9500 architecture organizes its logic into macrocells, each supporting programmable interconnect and registered or combinational functions. The XC9572 provides 72 macrocells and 72 I/O, making it suitable for consolidating multiple fixed-function gates, control registers, address decoding, and peripheral interfaces onto one device. The -7 speed grade specifies a maximum propagation delay of 7.5 ns, while the family is also described as supporting 5 ns pin-to-pin logic delays and a maximum counter frequency of 125 MHz. In-system programmability allows the configuration to be updated without removing the device from the circuit, and the architecture supports at least 10,000 program and erase cycles. Parallel programming can also update multiple XC9500 devices concurrently. The XC9572 uses a 5 V internal supply architecture, with a documented operating range of 4.75 V to 5.25 V. Its nonvolatile FastFLASH configuration technology retains the programmed logic after power is removed, avoiding repeated configuration loading after every power cycle. The device also supports in-system testing, which helps production teams verify assembled boards and isolate board-level interconnect faults. Typical uses include industrial control and sequencing logic, legacy peripheral expansion, data acquisition interfaces, memory-control glue logic, and board-level test or debug infrastructure. The combination of 72 I/O and a 100-pin surface-mount package allows substantial signal connectivity without moving to a larger programmable-logic device. When designing around this device, retain the original XC9500 schematic, package, and timing constraints rather than treating newer CPLD families as direct replacements. Verify every supply rail, termination input, and pin assignment against DS065. Because the device is listed as obsolete, long-lived programs should evaluate an approved migration path before releasing new production quantities. This page organizes the obsolete-status notice, package details, programming characteristics, pin-compatible options, and practical replacement considerations. It also distinguishes same-footprint candidates from alternatives with different voltage architectures, helping engineers evaluate board reuse without overlooking configuration, timing, and lifecycle constraints.

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XC9572XL - 3.3V 72-Macrocell CPLD 5ns | Xilinx AMD
XC9572XL

XC9572XL - 3.3V 72-Macrocell CPLD 5ns | Xilinx AMD

The Xilinx (now AMD) XC9572XL is a 3.3V high-performance CPLD (Complex Programmable Logic Device) providing 1,600 usable gates, 72 macrocells, and a worst-case pin-to-pin propagation delay of 5 ns, housed in low-profile VQFP packages such as the 44-pin VQ44 and 64-pin VQ64. A CPLD is a type of programmable logic device that sits between simple PLDs and FPGAs in the programmable logic hierarchy. Unlike FPGAs, which use look-up tables and volatile configuration memory, CPLDs use macrocell-based sum-of-products architecture with nonvolatile program storage, delivering deterministic, pin-to-pin timing and instant-on operation at power-up. This makes CPLDs the workhorse choice for glue logic, bus interfacing, and power-sequencing control in embedded systems. The XC9572XL is comprised of four 54V18 Function Blocks, each containing 18 macrocells. Key features include 3.3V core operation targeted at high-performance, low-voltage applications in leading-edge communications and computing systems; industry-leading pin-locking capability through a switch matrix that routes flexibly; and multiple speed grades (-5, -7, -10) so designers can trade speed against cost. Individual output enables and slew-rate-limited outputs ease 3.3V bus interfacing. Architecturally, every macrocell is a registered or combinational function generator with product-term allocation, allowing dense state machines without wasting resources. Because configuration is stored in nonvolatile memory across the XC9500XL family, no external boot flash or configuration controller is required, simplifying BOM and board design compared with SRAM-based FPGAs. Typical applications include address decoding and glue logic in embedded processors, bus bridging and interfacing in communications equipment, power-up reset and sequencing control, industrial I/O expansion, and legacy system life-cycle extensions where deterministic timing matters. Design-wise, use the -5 speed grade only where the 5 ns timing is genuinely needed; the -10 grade offers the best value for most glue-logic tasks. Note that design entry requires the legacy Xilinx ISE toolchain, which no longer runs natively on modern Windows. This page synthesizes distributor pricing, drop-in alternatives across speed grades and packages, and practical design notes not found in the manufacturer datasheet DS057.

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XC9572XL-10VQG64C - 72-Macrocell 10ns CPLD | AMD/Xilinx
XC9572XL-10VQG64C

XC9572XL-10VQG64C - 72-Macrocell 10ns CPLD | AMD/Xilinx

The AMD/Xilinx XC9572XL-10VQG64C is a 3.3V, 10ns pin-to-pin delay, 72-macrocell high-performance CPLD housed in a 64-pin VQFP (VQG64) package. It is built on the 2.5V XC9500XL family architecture, providing four 54V18 Function Blocks (FBs) that deliver 1,600 usable gates with predictable, JTAG-programmable logic and 100,000 program/erase cycles endurance. The device targets glue-logic and bus-interface functions where deterministic timing and instant-on (in-system programmable via IEEE 1149.1 JTAG) replace discrete 74-series logic. A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device whose architecture is a sea of macrocells backed by a programmable interconnect matrix. In the system hierarchy, a CPLD sits below an FPGA (typically lower density but lower power and no configuration time) and above discrete SSI/MSI gates. CPLDs are routinely used as interface bridges, address decoders, state machines, and power-up sequencers in designs that need predictable timing in a single device. Key features of the XC9572XL-10VQG64C include 72 macrocells, 1,600 usable gates, 4 ns internal timing with 10 ns pin-to-pin (tPD) at 3.3V, 34 user I/O pins (64-pin VQFP), 5V-tolerant I/O with 3.3V core, and In-System Programmable (ISP) via JTAG. The XC9500XL family uses 5V tolerant I/O on a 3.3V core for mixed-voltage board designs. The device is specified over the commercial 0C to +70C ambient range (C suffix), with an industrial -40C to +85C option available as XC9572XL-10VQG64I. Architecturally, each Function Block contains 18 macrocells, 54 product terms, and a sum term allocated from a global pool, with the IEEE 1149.1 boundary-scan chain extending across all I/O pins. Per datasheet DS057, the Fast CONNECT switch matrix provides 100% connectivity to every FB output, enabling deterministic place-and-route timing. The I/O blocks support 5V tolerant inputs, 24 mA drive, slew-rate control, and per-pin user I/O standards. Typical applications include bus-interface bridging, address decoding, power-up logic sequencing, and I/O expansion in telecom line cards, industrial controllers, and embedded computing platforms. Because of its 5V tolerant I/O on a 3.3V core, the XC9572XL-10VQG64C is well suited to legacy systems that mix 5V peripherals with 3.3V ASICs. Designers also use it as an FPGA configuration PROM companion or as a power-sequencer for multi-rail designs. When designing with this part, ensure the JTAG TMS, TCK, TDI, and TDO pins are reserved and pulled appropriately, and provide a clean VCCAUX 3.3V rail because all outputs are powered from VCCIO while the core runs from VCCINT. Verify pin-compatibility across the family when migrating density, since the XC9536XL, XC9572XL, and XC95144XL share a footprint family plan across the 44-, 64-, and 100-pin VQFP/TQFP packages. This page synthesizes distributor stock and lead-time data, pin-compatible XC9500XL alternatives, and practical glue-logic design notes not found in the manufacturer datasheet alone.

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XC9572XL-5CS48C - 72-Macrocell CPLD 5ns 3.3V | AMD/Xilinx
XC9572XL-5CS48C

XC9572XL-5CS48C - 72-Macrocell CPLD 5ns 3.3V | AMD/Xilinx

The AMD (Xilinx) XC9572XL-5CS48C is a 3.3V in-system-programmable CPLD with 72 macrocells, 1600 usable gates, and 38 user I/O pins, delivering a fast 5 ns pin-to-pin propagation delay (tPD) in a 48-ball CSBGA (7x7 mm) package. A Complex Programmable Logic Device (CPLD) is a class of programmable logic that sits between simple PAL/GAL devices and large FPGAs in the digital-logic hierarchy. CPLDs implement sum-of-products logic arrays with deterministic, pin-to-pin timing, making them ideal for glue logic, address decoding, bus interfacing, and power-on state machine control where predictable delays matter more than logic density. Key features of the XC9572XL-5CS48C include 5 ns worst-case propagation delay, system frequencies up to 178.6 MHz, and the industry-standard XC9500XL architecture built on a 0.35 micron CMOS Flash process. Every macrocell is fully configurable, and the device supports in-system programming (ISP) with a minimum of 10,000 program/erase cycles per AMD product documentation. Flash retention is specified for 20 years, and individual macrocells provide product-term allocation, local feedback, and set/reset controls. The FastFLASH technology combines a flash memory cell with the proven XC9500 switch matrix, giving designers low standby power - important for battery-backed and always-on 3.3V systems - while eliminating configuration PROMs required by SRAM-based FPGAs. The 48-ball chip-scale BGA footprint minimizes board area while offering the power integrity and signal integrity advantages of distributed power and ground balls. Typical applications include address decoding and bus control in embedded processors, glue-logic consolidation replacing multiple 74-series devices, power-supply sequencing and reset management, industrial control I/O expansion, and communication-interface bridging. The commercial temperature rating (suffix C) suits office and laboratory environments. Designers should observe AMD power-management guidelines: the device supports a standby mode with greatly reduced ICC, and unused I/O should be terminated as recommended in the datasheet (DS057). Because the package is a BGA, rework requires a reflow station, so verify footprint land patterns per AMD package drawings. This page adds value beyond the datasheet by compiling drop-in same-family alternatives with speed-grade and temperature-suffix differences, distributor price evidence, practical design notes, and application guidance in one place.

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XC9572XL-5VQ44C - 72-Macrocell 3.3V CPLD TQFP-44 | AMD Xilinx
XC9572XL-5VQ44C

XC9572XL-5VQ44C - 72-Macrocell 3.3V CPLD TQFP-44 | AMD Xilinx

The AMD (Xilinx) XC9572XL-5VQ44C is a high-performance, low-voltage CPLD (Complex Programmable Logic Device) with 72 macrocells and 1600 usable gates, housed in a 44-pin VQFP (TQFP-44) package and rated for commercial temperature operation as indicated by the C suffix. A CPLD is a type of programmable logic device that sits between simple programmable logic devices (SPLDs such as GAL and PAL) and large FPGAs in the programmable-logic hierarchy. It consists of multiple function blocks with macrocells interconnected through a programmable switch matrix, delivering deterministic pin-to-pin timing that FPGAs cannot guarantee. This makes CPLDs ideal for glue logic, state machines, address decoding, and power-up configuration control in embedded systems. The XC9572XL family belongs to the low-voltage branch of the classic XC9500 CPLD family, operating from a 3.3V supply, which reduces power consumption and simplifies integration with modern low-voltage logic. Key features include in-system programmability (ISP), 10,000 program/erase cycles of Flash endurance, and the FastFlash zero-power technology that combines very low standby current with high speed. The -5 speed grade denotes the fastest commercial timing grade in the family. Architecturally, each macrocell is a fully flexible, registered function unit that can implement combinational or sequential logic, with product-term steering providing high DFT (design-for-test) flexibility. The switch matrix routes signals between function blocks and I/O pins with predictable, uniform delays, which is why the family is prized for timing-critical control logic and bus interfaces. Typical applications include bus-interface bridging, address decoding in microprocessor systems, power-sequencing and reset control, legacy logic consolidation, and as a configuration controller companion for larger FPGAs. Retro-computing and industrial-control designs frequently adopt this part for its deterministic timing and reprogrammability. When designing with this device, program it using the AMD/Xilinx ISE toolchain, which remains the supported software for the XC9500XL family; verify the JEDEC programming file targets the exact speed grade and package suffix. Note that ISE no longer installs natively on Windows 10, so plan a compatible tool environment early in the project. This page adds engineering value beyond the manufacturer datasheet (DS057) by compiling drop-in same-family alternatives, a parametric comparison table, practical design notes, and sourcing guidance in one place.

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XC9572XL-5VQ64C - 72-Macrocell 3.3V CPLD 5ns | AMD Xilinx
XC9572XL-5VQ64C

XC9572XL-5VQ64C - 72-Macrocell 3.3V CPLD 5ns | AMD Xilinx

The AMD (Xilinx) XC9572XL-5VQ64C is a high-performance 3.3V CPLD with 72 macrocells, 1600 usable gates, 52 user I/O pins, and a maximum propagation delay of 5 ns, housed in a 64-pin TQFP (VQ64) package for commercial temperature ranges. A CPLD (Complex Programmable Logic Device) is a class of programmable logic that sits between simple PAL/GAL devices and large FPGAs in the programmable logic hierarchy. CPLDs use macrocell-based architecture with wide, fast AND/OR arrays that deliver deterministic, pin-to-pin timing, making them ideal for glue logic, state machines, bus interfacing, and power-up management tasks that require guaranteed timing and instant-on behavior. Key features of the XC9572XL family include in-system programmability (ISP) with a minimum of 10,000 program/erase cycles, 3.3V internal supply operation from 3V to 3.6V, and a maximum clock frequency of 178.6 MHz. The device provides 36 inputs and 36 outputs with 52 I/O lines available to the user, organized into four dedicated logic array blocks (function blocks). Architecturally, the XC9572XL consists of function blocks connected by a FastCONNECT switch matrix. Each macrocell includes a registers/flip-flop that can be configured as D, T, or JK type, with individual product-term control of clock, set, and reset. The 5 ns tpd version (-5 speed grade) is the fastest in the XC9572XL lineup, and the low-voltage process reduces power consumption compared to the earlier 5V XC9500 family. Typical applications include telecom and networking line-card glue logic, industrial automation control interfaces, 5G infrastructure board management, medical instrumentation, and legacy FPGA/CPU bus-bridging designs. The instant-on, non-volatile configuration eliminates the external configuration flash required by SRAM FPGAs, simplifying power sequencing. Design consideration: verify both a 3.3V tolerant I/O budget and the 10,000-cycle program/erase endurance limit; frequent field reprogramming beyond the endurance rating can degrade flash cells. Use the AMD iMPACT tool with the standard JTAG chain for in-system programming. This page adds value beyond the manufacturer datasheet by consolidating drop-in alternatives, application guidance, procurement channels, and practical design notes for the XC9572XL-5VQ64C in one place.

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XC9572XL-7VQ44C - 72-Macrocell 3.3V CPLD | AMD
XC9572XL-7VQ44C

XC9572XL-7VQ44C - 72-Macrocell 3.3V CPLD | AMD

AMD XC9572XL-7VQ44C is a 72-macrocell in-system-programmable CPLD operating from a 3.3 V supply, providing 34 user I/O pins, 1,600 usable gates, and four 54V18 function blocks in a 44-pin VQFP package. The -7 speed designation identifies a nominal 5 ns propagation-delay class within the XC9500XL high-performance CPLD family. A complex programmable logic device, or CPLD, is a programmable logic device within the broader FPGA and CPLD category. It combines nonvolatile programmable logic with a relatively simple, deterministic architecture for control logic, interface adaptation, bus decoding, state-machine implementation, and glue logic. Unlike a mask-programmed logic device, a CPLD can be configured or reconfigured by the system designer, making it useful for prototypes, production equipment, and field-updatable embedded systems. The XC9572XL offers individual output enable per output pin, local inversion, input hysteresis on user and boundary-scan pins, bus-hold circuitry on user inputs, and hot-plugging support. Its in-system programming capability supports at least 10,000 program or erase cycles. These features make the device suitable for compact control platforms requiring configurable logic and reusable board-level programming interfaces. Internally, the device contains four 54V18 function blocks and 72 macrocells organized into 1,600 usable gates. The architecture provides a practical balance between logic density, predictable timing, and design simplicity. The 3.3 V operating supply and 34 available I/O positions make the device especially useful in modern embedded control systems where a small FPGA would add unnecessary complexity or cost. Typical uses include industrial control interfaces, peripheral bus decoding, encoder and sensor signal conditioning, display-control logic, communication protocol interfaces, and low-power supervisory sequencers. In each case, the CPLD can consolidate discrete glue logic while preserving a straightforward programming and verification workflow. PCB design should preserve the manufacturer-specified pin assignments, power routing, and programming interface connections. Because the target is a 44-pin VQFP device, adequate escape routing and careful decoupling are essential. Confirm the exact package drawing, voltage ratings, and pin definitions against the manufacturer datasheet before fabrication or replacement. This page combines the XC9572XL technical characteristics, compatible speed-grade alternatives, application guidance, and design-focused comparison points to support device selection, schematic review, PCB planning, and lifecycle risk assessment.

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XC9572XL-7VQ64C - 72-Macrocell 3.3V CPLD | AMD
XC9572XL-7VQ64C

XC9572XL-7VQ64C - 72-Macrocell 3.3V CPLD | AMD

AMD XC9572XL-7VQ64C is a 72-macrocell complex programmable logic device operating from a 3.3 V supply in a 64-pin VQFP package. It combines a 125 MHz device speed rating with a 7.5 ns stated propagation performance, making it suitable for deterministic glue logic, interface control, bus decoding, and legacy system-integration designs. The device belongs to the XC9500XL high-performance CPLD family. A CPLD is a programmable digital logic device that combines a structured array of macrocells with a global interconnect. Unlike a software-driven processor, a CPLD executes combinational and registered logic directly in hardware. Within the semiconductor hierarchy, this part is a complex programmable logic device, a user-programmable logic device, and ultimately an integrated circuit designed for deterministic logic implementation. The XC9500XL architecture provides individual output enable for each output pin, local inversion, input hysteresis on user and boundary-scan inputs, and bus-hold circuitry on user inputs. These features support dependable control of external signals, improved noise tolerance, and stable handling of partially driven buses. The family also supports hot-plugging capability and IEEE boundary-scan-oriented verification functions. For the XC9572XL-7VQ64C, the 72-macrocell architecture provides a practical balance between logic density and design effort. A 7 ns speed grade and 125 MHz maximum operating frequency support communication, control, and data-processing functions that require predictable timing. The 64-pin VQFP package provides 52 user I/O according to the published family listing while leaving dedicated supply and configuration functions. Typical applications include legacy peripheral emulation, printer and industrial-control interfaces, programmable logic glue, bus arbitration, data-format conversion, and system boot or sequencing logic. The in-system programming architecture also supports board-level configuration workflows where a programmed device must be updated without removing it from its assembled circuit. Designers should preserve the XC9500XL power architecture and decoupling strategy, leave configuration and test behavior consistent with the AMD DS057 data sheet, and verify every external interface against the selected package pinout. Device selection also requires checking tool-chain compatibility because this established CPLD family is normally programmed with AMD/Xilinx CPLD development tools and appropriate JTAG programming hardware. This product page combines the AMD family architecture, verified family variants, pin-compatible alternatives, application guidance, and practical implementation considerations in one engineering-focused reference. It supports faster device identification while highlighting the speed-grade and temperature-grade distinctions that can affect an existing design.

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XC9572XL-7VQ64I - 3.3V CPLD 72MC 7.5ns 64-TQFP | Xilinx
XC9572XL-7VQ64I

XC9572XL-7VQ64I - 3.3V CPLD 72MC 7.5ns 64-TQFP | Xilinx

The AMD/Xilinx XC9572XL-7VQ64I is a 3.3 V in-system programmable CPLD with 72 macrocells, 1600 usable gates, 52 user I/O pins and a maximum propagation delay of 7.5 ns, housed in a 64-pin TQFP (VQ64) package with 0.5 mm lead pitch. A Complex Programmable Logic Device (CPLD) is a family of programmable logic ICs that sits between simple SPLDs (such as GAL and PAL devices) and large FPGAs in the programmable logic hierarchy. CPLDs use a macrocell-based architecture with a deterministic pin-to-pin delay, making them well suited to glue logic, bus interface, state machine and power-sequencing tasks where predictable timing and instant-on operation matter more than logic density. The XC9572XL belongs to the FastFLASH XC9500XL high-performance, low-voltage CPLD family targeted at leading-edge communications and computing systems where device reliability and low power dissipation are important. Key features include individual output enable per output pin with local inversion, input hysteresis on all user and boundary-scan pin inputs, bus-hold circuitry on all user pin inputs, and hot-plugging capability. Every XC9500XL device supports in-system programming (ISP) with a minimum of 10,000 program/erase cycles, and full IEEE Std 1149.1 (JTAG) boundary-scan, giving engineers superior debug and design-iteration capability without removing devices from the board. The -7 speed grade delivers 7.5 ns maximum pin-to-pin propagation delay, and the industrial temperature rating (-40C to +85C) qualifies the part for harsh environments. Lead finish is tin with 0.5 mm lead pitch per the manufacturer product information. Typical applications include communications and networking line-card glue logic, industrial control state machines, bus-interface and address-decode functions, and microprocessor power-management sequencing, where a deterministic 7.5 ns delay and instant power-up behavior outperform FPGA-based solutions. Design consideration: the XC9500XL family is programmed with the legacy Xilinx ISE toolchain, so confirm toolchain availability in your development environment before committing to new designs; bus-hold on unused inputs removes the need for external pull resistors. This page adds value beyond the manufacturer datasheet by synthesizing distributor availability, drop-in same-package alternatives, selection guidance, and practical design notes in one place.

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XCF02SVOG20C - 2Mb Platform Flash PROM for FPGA Config | AMD/Xilinx
XCF02SVOG20C

XCF02SVOG20C - 2Mb Platform Flash PROM for FPGA Config | AMD/Xilinx

The AMD/Xilinx XCF02SVOG20C is a 2-Mbit in-system programmable configuration PROM designed to store configuration bitstreams for Xilinx FPGAs, housed in a 20-pin TSSOP package. It provides 2,097,152 bits of NOR Flash memory organized as 2,000K x 1, operates from a 3.0V to 3.6V supply, and supports the IEEE 1149.1 / IEEE 1532 JTAG standard for in-system programming and boundary-scan testing. The device delivers guaranteed endurance of 20,000 program/erase cycles and minimum data retention of 20 years, making it suitable for long-lifecycle industrial and embedded designs. A Platform Flash PROM is a non-volatile configuration memory IC purpose-built to hold FPGA bitstreams outside the FPGA fabric. In the broader component taxonomy it belongs to NOR Flash -> non-volatile memory -> memory IC -> integrated circuit. Unlike discrete SPI Flash or parallel boot memories, Platform Flash devices integrate the JTAG programming chain, FPGA hand-shake pins (CCLK, DONE, INIT, PROGRAM) and a cascade-ready architecture, so a single IC can boot a Xilinx Spartan or Virtex FPGA without external glue logic. Key features include 2Mb density in a compact 20-TSSOP footprint, low-power advanced CMOS NOR Flash process, cascadable bitstream expansion for larger FPGAs, and JTAG boundary-scan with 3-stage registers per bidirectional pin. The industrial temperature grade (VOG suffix = -40C to +85C) and lead-free TSSOP-20 packaging make XCF02SVOG20C a mainstream choice for cost-sensitive Spartan-3 / Spartan-3A designs. The OG20C suffix denotes a TSSOP-20 package supplied in tube. From a system-level perspective, XCF02SVOG20C connects directly to the FPGA's configuration mode pins (M[2:0] = 010 selects Master Serial mode). On power-up the PROM serial-clocks the bitstream via the FPGA CCLK pin, the FPGA drives DONE high, and the PROM tri-states its data line. The bidirectional pins are observable and controllable through the JTAG boundary-scan register, which speeds prototype debug and board-level interconnect testing. The NOR Flash cell array provides fast read access with low standby current. Typical applications include Spartan-3, Spartan-3A, Spartan-3E, and Virtex-II configuration storage, industrial control boards, factory automation equipment, medical imaging FPGA platforms, and any design that requires a small-footprint non-volatile boot source for Xilinx FPGAs. Two or more XCF02S PROMs can be cascaded to support larger bitstreams for higher-density FPGAs. When designing with XCF02SVOG20C, confirm the FPGA bitstream does not exceed 2Mb before committing the BOM. AMD PCN XCN20013 (2026) confirms there is NO direct drop-in replacement for XCF02SVOG20C; design teams are advised to forecast demand and place final orders before key dates in Appendix A of that PCN, or migrate the FPGA to a newer family that boots from internal SPI Flash. This page synthesizes distributor pricing, lifecycle risk context (XCN20013), drop-in alternative scarcity, and practical design notes not found in the manufacturer datasheet alone.

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XCF04S-VO20C - 4Mb FPGA Configuration PROM, 20-TSSOP | AMD/Xilinx
XCF04S-VO20C

XCF04S-VO20C - 4Mb FPGA Configuration PROM, 20-TSSOP | AMD/Xilinx

The AMD/Xilinx XCF04S-VO20C is a 4-megabit in-system programmable Platform Flash configuration PROM designed to store configuration bitstreams for Xilinx FPGAs, packaged in a 20-pin thin shrink small outline package (TSSOP) and supplied in a tube. It operates from a 3.0 V to 3.6 V single supply, uses serial SPI-like configuration interface logic, and is rated for commercial-grade environments, making it a drop-in configuration memory solution for legacy AMD/Xilinx FPGA designs. An FPGA configuration PROM is a non-volatile flash memory device that holds the FPGA's bitstream and loads it into the FPGA's internal configuration logic at power-up. In the broader component taxonomy, the XCF04S-VO20C sits in the hierarchy: configuration memory -> PROM -> non-volatile memory -> memory IC -> semiconductor. The Platform Flash family is purpose-built for AMD/Xilinx Spartan, Virtex, and CoolRunner device chains, replacing older one-time-programmable PROMs to lower board cost and shorten programming cycles via in-system programmability through JTAG or slave-serial modes. Key features include 4 Mb of flash storage, an industrial-standard 4-pin SPI/I2C-like configuration interface, in-system programmability (ISP) via JTAG, and support for daisy-chain configuration across multiple FPGA devices or PROMs. The 20-TSSOP footprint is the same as the larger XCF08P/XCF16P family members, offering a consistent PCB layout when migrating bitstream size. Commercial temperature-grade operation and a single 3.3 V supply simplify power design versus dual-supply PROMs. From a technical standpoint, the XCF04S-VO20C is built on a NOR-flash process with an internal oscillator, command state machine, and configuration-data serializer. When the FPGA releases its DONE pin (or equivalent configuration logic), the PROM shifts out the bitstream through the dedicated data/clock pins. The flash-based design supports thousands of reprogram cycles, eliminating the need for UV-erase windows of older EPROM PROMs and reducing manufacturing rework time. The 20-TSSOP package keeps the device footprint identical to peers in the Platform Flash family. Typical applications include Spartan-3 / Spartan-6 FPGA boot-memory links, Virtex-II/Virtex-4/Virtex-5 configuration-storage companions, industrial PLCs and embedded controller boards, and legacy industrial-camera or motor-control platforms that still ship with a separate configuration PROM. It is also commonly seen in test-and-measurement prototypes where designers prefer a dedicated PROM over in-FPGA bitstream compression methods. When designing with the XCF04S-VO20C, ensure the FPGA's mode pins are set to Master Serial mode (M[2:0] = 000) so the PROM drives CCLK, and confirm the JTAG chain order in software (iMPACT, Vivado hardware manager) to avoid in-system programming conflicts. As of 2026-10-11, this part shows active distributor stock but is flagged in the AMD/Xilinx product change-notification system as approaching end of life - check PCN status before new designs. This page consolidates distributor pricing, drop-in alternatives such as XCF04SVOG20C and XCF08P family members, and PCB-layout notes not included in the manufacturer datasheet.

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XCF04SVOG20C - 4Mb Platform Flash Configuration PROM | AMD/Xilinx
XCF04SVOG20C

XCF04SVOG20C - 4Mb Platform Flash Configuration PROM | AMD/Xilinx

The AMD/Xilinx XCF04SVOG20C is a 4-Mbit in-system programmable Platform Flash configuration PROM designed to store and load configuration bitstreams for Xilinx FPGAs such as Spartan-6, Virtex-5, and earlier Series-6/7 devices. The device integrates 4194 kbits of non-volatile flash organized as 4000k x 1 (4-Mbit density) in a 20-pin TSSOP plastic package rated for the industrial operating range. According to AMD/Xilinx product documentation, the part supports a simple serial configuration interface (slave serial mode), daisy-chained multi-device configuration, in-system programmability via JTAG (IEEE 1149.1), and built-in data decompression that lets the PROM hold up to 8 Mbits of compressed configuration data. A Platform Flash PROM is a non-volatile configuration memory IC that boots up an FPGA by clocking out its stored bitstream at power-on. The category belongs to the broader taxonomy of FPGA configuration memories -> serial flash for FPGAs -> non-volatile boot memory -> programmable logic support ICs. Unlike generic SPI flash, Platform Flash PROMs are designed with FPGA-specific control signals (CCLK, DONE, INIT, PROGRAM) and timing compatible with Xilinx slave-serial and SelectMAP-mapped configuration protocols, which simplifies board design and removes the need to bind an MCU to load the bitstream. Key features include a low-power advanced CMOS FLASH process, IEEE 1149.1 JTAG boundary-scan and in-system programming, configurable slave serial or daisy-chain configuration modes, an internal oscillator that drives the master CCLK output, design version storage for multi-bitstream systems, and a read-protect security fuse. The PROM is specified for 3.3V core and I/O operation and is rated for an operating temperature range appropriate to industrial environments. Architecturally, the XCF04SVOG20C combines a 4-Mbit flash array with a configuration controller state machine that handles FPGA handshaking. Endurance is rated by the manufacturer at thousands of program/erase cycles, and data retention is specified in years for industrial-grade operation. The single-pin-per-bit data path makes the device pin-compatible within the Platform Flash PROM family across densities of 1 Mbit, 4 Mbit, 8 Mbit, 16 Mbit, and 32 Mbit. Typical applications include Spartan-6 and Virtex-5 FPGA configuration, FPGA-based industrial controllers that boot from non-volatile memory, test-and-measurement loaders, and any Xilinx FPGA system that requires field-updatable configuration or daisy-chained multi-FPGA configuration. Designers also use Platform Flash PROMs in safety-critical systems because the PROM's configuration validity is verified by the FPGA's CRC logic at every boot. Design consideration: when migrating an XCF04S design to a newer Xilinx configuration solution, verify the master/slave mode and DONE polarity on the PCB. Also note that the XCF04SVOG20C has been transitioned out of production by AMD/Xilinx (see lifecycle status); users with long-lived programs should plan around the suggested active alternatives listed below. This page consolidates distributor pricing, lifecycle status, drop-in alternatives, and design notes for engineers migrating off the XCF04SVOG20C, with information that goes beyond the manufacturer datasheet.

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XCF16PVO48C0973 - 16Mb FPGA Configuration PROM | AMD Xilinx
XCF16PVO48C0973

XCF16PVO48C0973 - 16Mb FPGA Configuration PROM | AMD Xilinx

The AMD Xilinx XCF16PVO48C0973 is a 16-Mbit In-System Programmable Configuration PROM designed to store and stream configuration bitstreams to Xilinx FPGA families. Housed in a 48-pin TSOP (TFSOP) package, it provides a serial configuration interface optimized for Spartan, Virtex, and CoolRunner device chains. With an operating supply range of 1.65V to 2.0V and industrial-grade -40C to +85C temperature support, the part is suitable for commercial, industrial, and ruggedized embedded systems. A configuration PROM is a non-volatile serial memory that holds the FPGA bitstream and presents it to the FPGA at power-up, after reset, or on demand through JTAG/Serial-mode commands. Compared to parallel flash, configuration PROMs deliver a smaller footprint, simpler interface timing, and proven Xilinx ecosystem compatibility - making them a reference solution for legacy and current Spartan-3, Virtex-4/5, and CoolRunner-II designs that still rely on dedicated boot storage. Key features of the XCF16PVO48C0973 include 16-Mbit (16Mx1 serial organization) density, in-system programmability through the JTAG/standard Xilinx PROM programming interface, low standby current typical of serial PROMs, and a 48-TSOP package with a 0.724 inch (18.40 mm) body width. The part supports master-serial configuration modes and provides CRC-based bitstream integrity checking during FPGA load. From an architecture perspective, the device uses a serial-NOR-style command set with opcode-driven read operations, and integrates Xilinx-specific configuration flow states (e.g., 8-bit address counters, bitstream framing) that allow the FPGA to load its image directly without an external microcontroller. This eliminates boot firmware complexity in most FPGA designs. Typical applications include Spartan-3/3E/6 FPGA boot storage, Virtex-4/5 configuration backup, industrial controller FPGA subsystems, military/aerospace rad-tolerant FPGA designs (when paired with rad-hard FPGAs), and remote field-upgradeable embedded systems that need reliable in-system re-programmability over the JTAG port. When designing with this PROM, verify the FPGA-to-PROM pin mapping against the target FPGA's Master Serial configuration mode table, ensure the 1.8V rail meets PROM inrush current during read bursts, and place a 0.1 uF + bulk capacitor pair within 5 mm of the VCC pins to maintain clean read-clock edges. This page synthesizes current distributor pricing, in-system programming guidance, and pin-compatible alternatives across the Xilinx XCF family - content not aggregated on individual distributor listings.

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XCF16PVOG48C - 16Mb FPGA Configuration PROM | AMD Xilinx | 48-TSOP
XCF16PVOG48C

XCF16PVOG48C - 16Mb FPGA Configuration PROM | AMD Xilinx | 48-TSOP

The AMD Xilinx XCF16PVOG48C is a 16-Mbit in-system programmable configuration PROM from the Platform Flash series, supplied in a 48-pin TSOP (VOG48) package and optimized for storing Xilinx FPGA configuration bit streams at 1.8V VCCINT. According to AMD/Xilinx documentation, this serial flash device is engineered for high-density FPGA bitstream storage with JTAG-based in-system programming and supports industrial temperature operation from -40C to +85C. As part of the XCFxxP family, it pairs directly with 1.8V-core Spartan-3AN, Virtex-5, and other contemporary Xilinx FPGA families for master-serial or slave-serial boot. An FPGA configuration PROM is a non-volatile memory that holds the FPGA's bitstream image so the device can self-config at power-up without an external microcontroller. The Platform Flash family sits in the hierarchy: PROM -> non-volatile memory -> configuration storage -> FPGA boot subsystem. Modern AMD/Xilinx FPGAs often embed multi-Mbit configuration storage directly on silicon, but external Platform Flash PROMs remain widely used for multi-boot images, remote field updates, and security applications where bitstream confidentiality is enforced outside the FPGA die. Key features include 16-Mbit density (twice the capacity of the XCF08P), 48-TSOP surface-mount package (0.724 inch / 18.40 mm body width), 1.65V to 2V VCCINT supply (1.8V nominal), industrial -40C to +85C operating range, JTAG IEEE 1149.1 boundary-scan and in-system programmability, and a serial configuration interface compatible with the Xilinx FPGA serial configuration bus (CCLK, DIN, DOUT, INIT, DONE). These traits allow the XCF16PVOG48C to replace the XCF08PVOG48C directly while doubling bitstream capacity for larger FPGA families or compressed bitstream storage. The device uses a serial NOR-style architecture with command-driven read/write/erase operations, organized as 16-Mbit of main memory plus a small status register for programming state. Programming and erase are managed by an internal state machine triggered over JTAG; verification uses the standard Xilinx iMPACT/iCE tools. The architecture deliberately keeps the serial interface simple so the FPGA's existing configuration controller can stream the bitstream without glue logic. Typical applications include Spartan-3AN FPGA configuration, Virtex-5 LX/SX/TX configuration, multi-boot FPGA designs, industrial control systems requiring remote in-field firmware updates, secure bitstream storage for defense and aerospace designs, and prototyping platforms where the configuration source must be field-reprogrammable without removing the FPGA from the board. When designing with this device, ensure the JTAG chain includes the PROM between TDI and TDO and that the FPGA's mode pins (M0/M1/M2) select the correct serial configuration mode. The 1.8V VCCINT must be supplied before the FPGA begins configuration; sequence accordingly to avoid partial bitstream corruption. This page synthesizes distributor pricing, drop-in Platform Flash alternatives, and design notes on JTAG chain ordering not found in a single manufacturer document.

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XCF32PVOG48C - 32Mb FPGA Config PROM 1.8V 48-TSOP | AMD
XCF32PVOG48C

XCF32PVOG48C - 32Mb FPGA Config PROM 1.8V 48-TSOP | AMD

The AMD XCF32PVOG48C is a 32-Megabit in-system programmable configuration PROM for Xilinx FPGAs, supplied in a 48-pin TSOP package and operating from a 1.65 V to 2.0 V VCC supply. It is part of the Platform Flash PROM family and stores large FPGA configuration bitstreams that are loaded into Xilinx/AMD FPGAs at power-up. The XCF32PVOG48C variant specifically uses the 1.8 V Platform Flash XL family and is offered in a commercial operating temperature grade. A Platform Flash configuration PROM is a non-volatile NOR Flash memory device whose primary role is to hold the FPGA bitstream and present it to the target FPGA over a serial or parallel configuration interface. In the broader memory hierarchy it sits under EEPROM and Flash PROM, and above raw NOR Flash, providing a pre-validated, FPGA-aware configuration storage medium. It relieves the system designer of placing a separate boot Flash on the board and is typically the first device in the FPGA configuration chain. Key electrical features include a 32 Mbit (4 Mbyte) organized as 1-bit-wide serial/parallel PROM, a 1.65 V to 2.0 V operating voltage range with 3.3 V tolerant I/O pins, low-power advanced CMOS Flash technology, an in-system programmable JTAG/IEEE 1149.1 interface, and cascade support for storing larger bitstreams. The 48-pin TSOP provides a compact, surface-mount footprint compatible with standard PCB assembly lines. Architecturally, the device uses a NOR Flash core tied to a serial/parallel configuration controller, with dedicated CCLK, DIN/DOUT, and CF pins mapping directly to the FPGA configuration port. The 1.8 V internal core reduces power consumption versus 3.3 V PROMs, which is meaningful when the PROM is continuously powered alongside the FPGA. Typical applications include Xilinx Virtex and Spartan FPGA configuration boot storage, industrial control boards, communications infrastructure, and test/measurement platforms that require reliable field-upgradable bitstream storage. For military and aerospace designs, AMD also offers the XQF32PVOG48M variant in the same family. When designing with this part, ensure that the FPGA configuration mode (serial vs. parallel) and density match the bitstream size, and verify that the JTAG chain supports ISP programming of the PROM.

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XCKU035-1FBVA676C Kintex UltraScale FPGA 444K Cells | AMD
XCKU035-1FBVA676C

XCKU035-1FBVA676C Kintex UltraScale FPGA 444K Cells | AMD

The AMD Xilinx XCKU035-1FBVA676C is a Kintex UltraScale Field Programmable Gate Array built on TSMC's 20nm process, integrating 444,343 logic cells and 19,456,000 system gates in a 676-ball FCBGA package (27 mm × 27 mm) with 312 user I/Os. It runs a -1 speed grade targeting up to 630 MHz fabric performance, with 12.5 Gb/s capable transceivers (GTH) on select Kintex UltraScale SKUs and 240 DSP48E2 slices optimized for high-throughput fixed- and floating-point arithmetic. The commercial temperature grade (suffix C) supports 0 °C to +85 °C operation with a 0.95 V core voltage. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement custom digital circuits after PCB fabrication by configuring an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, and high-speed serial transceivers. Within the broader semiconductor hierarchy, an FPGA sits between general-purpose CPUs/GPUs (fixed instruction set, software-defined) and ASICs (fixed hardware). AMD's Kintex UltraScale family occupies the mid-range position in the UltraScale portfolio, sitting below Virtex UltraScale (highest logic density and bandwidth) and above Artix UltraScale (lowest cost and power). All Xilinx boards shift the value curve toward best-in-class price/performance/watt at 20nm. Key features of the XCKU035-1FBVA676C include up to 1,250 Mbps of DDR4 external memory interface support, integrated PCIe Gen3 hard cores, 4.7 Mb of distributed RAM, 240 DSP slices, and 16 GT transceivers on -1 speed grade parts in the larger Kintex UltraScale family. The device provides 312 high-performance SelectIO pins supporting multiple I/O standards including LVDS, HSTL, SSTL, and differential memory interfaces. The device also exposes 3 MMCM and 8 PLL mixed-mode clock managers for high-frequency clock synthesis and skew management. Architecturally, the Kintex UltraScale device uses UltraScale architecture enhancements over 7-series FPGAs - including new routing interconnect, more efficient clock networks, and improved block RAM and DSP resources. The 20nm planar CMOS process allows higher integration while keeping leakage power low, and the GT(GTH) transceivers support 12.5 Gb/s line rates for backplane and chip-to-chip serial interconnect. The XCKU035-1FBVA676C serves wireless baseband processing, software defined radio, high-definition video processing pipelines, high-speed serial backplane bridging, and PCIe accelerator card designs in the 100K–500K logic-cell density class. When laying out a board with this BGA, allocate 12 power rails (VCCINT, VCCAUX, VCCO, MGTAVCC, MGTAVTT, VBATT, MGTVCCAUX, VCCADC, VCCBRAM, VCCO_HP, VCCAUX_IO, plus GT helper rails) and follow the package-specific K7-PCB decaps guidance in UG583 to control simultaneous switching noise and SSN.

USD $467,66 Diketersediaan
XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD
XCKU035-2FBVA676E

XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD

The AMD (formerly Xilinx) XCKU035-2FBVA676E is a Kintex UltraScale field-programmable gate array (FPGA) IC delivering 355,474 logic cells (194,560 6-input LUTs), 19.45M total on-chip memory bits, and 312 user I/Os, fabricated in a 20 nm CMOS process and housed in a 676-ball flip-chip BGA (FCBGA-676) package. It is a logic-density mid-range device in the Kintex UltraScale family and is targeted at high-throughput DSP, 100G packet processing, and ASIC-prototyping workloads. The "-2" suffix denotes the -2 speed grade (the second-fastest bin in the family), and the "E" suffix denotes the extended (industrial) temperature screening of -40 C to +100 C. A Kintex UltraScale FPGA belongs to the broader UltraScale architecture family, which is positioned between cost-optimized Artix/Spartan devices and the highest-density Virtex UltraScale devices in the AMD product hierarchy. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing large arrays of configurable logic blocks (CLBs), block RAM (BRAM), DSP slices, high-speed transceiver tiles (GTX/GTH), and clock-management tiles (CMTs/PLLs/MMCMs). The Kintex UltraScale tier targets price/performance-sensitive applications such as 100G optical line cards, software-defined radio, and high-end DSP prototyping. Key headline specifications include 1,700 Configurable Logic Blocks (CLBs) and 444,343 logic cells in some datasheet groupings (the modern nominal figure is 355,474), up to 19.45 Mbits of distributed + block RAM, 312 user I/Os in the FBVA676 package, and 16.3G transceivers (per UltraScale family documentation). The device integrates 20 CMT clock tiles and 240 DSP slices, providing substantial arithmetic throughput and flexible clocking. Architecturally, the Kintex UltraScale uses the UltraScale routing fabric with stacked 3D silicon interposer-style back-bias routing, supporting up to 16.3 Gb/s transceivers for chip-to-chip and backplane SERDES. The 20 nm node and monolithic die deliver higher performance-per-watt than prior 28 nm 7-series Kintex devices while maintaining PCIe Gen3 hard-IP blocks. Typical applications for the XCKU035-2FBVA676E include 100G Ethernet bridge/router line cards, software-defined radio baseband cards, ASIC prototyping with 100% RTL mapping, high-end video processing, and DSP front-end for radar/medical imaging. The wide logic/memory/transceiver budget makes it the typical "starting point" for ADC-DAC-coupled signal-processing cards. When designing with the XCKU035-2FBVA676E, ensure multi-rail decoupling per the AMD UltraScale PCB Design Guide (UG583) for power-rail sequencing. The industrial temperature screen (E) allows deployment in outdoor telecom and industrial-control applications beyond commercial grade. This page combines verified distributor pricing, drop-in alternative analysis across the Kintex UltraScale family, and practical design notes not consolidated on the AMD datasheet.

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XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD
XCKU035-2FBVA676I

XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD

The AMD XCKU035-2FBVA676I is a Kintex UltraScale Field Programmable Gate Array (FPGA) with 444,343 logic cells and 19,456,000 bits of block RAM, housed in a 676-ball Flip-Chip BGA package. Built on a 20nm process node and offered at a -2 (mid) speed grade, this device targets mid-range high-performance applications requiring an optimal balance of price, performance, and power efficiency. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed post-manufacture to implement arbitrary digital functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically under digital semiconductors and ICs. The Kintex UltraScale family from AMD (formerly Xilinx) addresses the spectrum between cost-optimized Artix and high-end Virtex devices, focusing on DSP, memory bandwidth, and transceiver integration. Key features of the XCKU035 include 312 maximum user I/Os, integrated DSP slices for high-throughput signal processing, dedicated block RAM (BRAM) for on-chip data storage, and high-speed serial transceivers suitable for chip-to-chip and backplane links. The device supports multiple configuration modes including JTAG, SPI, and BPI, enabling flexible boot strategies in production systems. The Kintex UltraScale architecture leverages a 20nm planar process with stacked-silicon interconnect (SSI) options in larger family members. The XCKU035 uses monolithic silicon, providing predictable performance and lower cost. The UltraScale architecture introduces enhanced routing, multi-die clocking, and improved DSP and BRAM utilization rates over prior 7-Series FPGAs. Typical applications of the XCKU035-2FBVA676I include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, video broadcast equipment, industrial machine vision, 100G network interface cards, and aerospace telemetry. Its combination of logic density, memory bandwidth, and transceivers makes it well-suited for prototyping ASICs or low-volume production. When designing with the FBVA676 BGA, plan for high-density PCB fabrication with microvia or via-in-pad stackups, controlled-impedance traces for transceivers, and robust power distribution with high-frequency decoupling to satisfy simultaneous switching noise (SSN) requirements. This page synthesizes distributor pricing, FPGA drop-in alternatives within the same 676-BGA footprint, and practical design notes not typically presented in the manufacturer datasheet.

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XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD
XCKU040-2FFVA1156I

XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD

The AMD XCKU040-2FFVA1156I is a Kintex UltraScale FPGA with 520 user I/O, 21,606,000 system logic capacity, 530,250 DSP-equivalent resource units, speed grade -2, in a 1156-ball FCBGA package rated for industrial temperatures of -40C to +100C. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), DSP slices, block RAM, and programmable interconnect that designers configure after manufacturing. Within the power-management hierarchy of digital system ICs, an FPGA sits at the top of the programmable logic taxonomy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA. FPGAs are used where custom logic, parallelism, or post-deployment reconfigurability is required that fixed-function ASICs or microcontrollers cannot provide. Key features of the XCKU040-2FFVA1156I include the 20nm UltraScale architecture, which lowers total power consumption versus the previous 28nm 7-series generation, a -2 speed grade for high-performance designs, and an industrial (I-suffix) temperature rating of -40C to +100C. The 1156-ball flip-chip BGA provides 520 user I/O for high-bandwidth parallel interfaces, and the fabric includes MMCM and PLL clock management resources. On the technical side, the Kintex UltraScale family focuses on price/performance using monolithic 20nm die. The device core supply operates from 0.922V to 0.979V per the datasheet listing. The UltraScale architecture adds enhanced routing, higher DSP throughput, and improved clocking compared to Kintex-7, making the XCKU040 a popular mid-density choice between the XCKU035 and XCKU060. Typical applications include industrial image processing and machine vision, wireless baseband and RF front-end processing, medical ultrasound, and ASIC prototyping. The 520 I/O count suits multi-camera sensor aggregation and high-width data converters. Design consideration: FCBGA-1156 devices require careful PCB stackup design - escape routing under the 1.0mm ball pitch typically needs via-in-pad or at least 8 layers, and core voltage rails must meet the tight 0.922-0.979V tolerance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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XCKU3P-1FFVA676E - Kintex UltraScale+ FPGA, 676-FCBGA | AMD Xilinx
XCKU3P-1FFVA676E

XCKU3P-1FFVA676E - Kintex UltraScale+ FPGA, 676-FCBGA | AMD Xilinx

The AMD Xilinx XCKU3P-1FFVA676E is a Kintex UltraScale+ field-programmable gate array (FPGA) supplied in a 676-ball FCBGA package, with 256 user I/O, 355,950 logic cells and a 667 MHz maximum clock rating as published for this device. The -1 suffix denotes the speed grade, and the A code in the part number identifies the 676-ball package option. A field-programmable gate array is a programmable logic device: an array of configurable logic blocks, block RAM, DSP arithmetic slices and high-speed I/O that is configured at power-up from a bitstream rather than being permanently masked in silicon. FPGAs sit at the top of the programmable-logic hierarchy, above fixed-function ASICs in flexibility and above microcontrollers in datapath throughput. Kintex UltraScale+ occupies the middle of AMD's portfolio, between the cost-optimized Artix-7/Zynq families and the highest-capacity Virtex UltraScale+ devices. The KU3P device combines roughly 355,950 logic cells with the UltraScale+ DSP48E2 arithmetic pipeline and 16.3 Mb of block RAM per slice group, delivering high performance per watt for mid-range designs. Key platform features include SelectIO resources with back-ported I/O, up to 16.3 Gb/s GTY transceivers, and the AXI4 interconnect fabric that links programmable logic to hard DSP blocks and memory. A dedicated security subsystem supports bitstream encryption and authentication for design-IP protection. Mechanically, the 676-FCBGA lands on a 31 x 31 mm substrate and is intended for multilayer boards with via-in-pad and micro-BGA fanout design rules. Because the package offers no user I/O beyond the specified 256 balls, the majority of the board budget is spent on power, clocking, and high-speed routing rather than on peripheral connectivity. Configuration data is loaded through the standard AMD configuration path, and the part is supported by the AMD Vivado design suite. Typical applications for the XCKU3P-1FFVA676E include industrial control and automation platforms, professional broadcast and video infrastructure, aerospace and defence instrumentation, telecom line-card and baseband processing, and test and measurement systems that need a large amount of parallel logic and DSP throughput in a single package. When planning the board, treat power delivery as the primary risk: UltraScale+ devices require multi-rail sequencing, and decoupling must follow the recommended high-frequency capacitor layout from the AMD package pinout and design documentation. Provide a solid ground plane, follow the recommended BGA fanout and via-in-pad geometry, and keep the high-speed transceiver reference design rules intact if the design uses GTY links. This page consolidates distributor availability, verified package and speed-grade data, pin-compatible family alternatives, and practical design guidance in one place so that engineers can qualify the KU3P device quickly, and compare it against the KU5P and -2 speed-grade options before committing to a layout.

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XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD
XCKU3P-1FFVB676E

XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD

The AMD Xilinx XCKU3P-1FFVB676E is a Kintex UltraScale+ field-programmable gate array (FPGA) offering 355,950 logic cells, 31,641,600 bits of block RAM, and 1,560 DSP slices, housed in a 676-ball FCBGA package (FFVB676) at the -1 speed grade and the E (extended) temperature tier. It integrates 280 user I/O pins and 24 transceivers supporting up to 16.375 Gbps, making it the mid-density workhorse of the Kintex UltraScale+ family. Kintex UltraScale+ FPGAs occupy a specific tier in AMD's programmable-logic taxonomy: below Virtex UltraScale+ for highest performance and above Artix-7/Artix UltraScale+ for cost-optimized applications. Architecturally, the UltraScale+ generation introduces a register-rich silicon fabric, 3rd-generation SSI (stacked silicon interconnect) techniques, and tightly coupled DSP/BRAM columns, delivering up to 2x the performance-per-watt versus the prior generation for DSP-intensive workloads such as 5G baseband, machine-learning inference, and high-speed instrumentation. Key features of the XCKU3P include 16.375 Gbps GTH transceivers (24 channels), 6.6 Tbps serial bandwidth per device, integrated 100G Ethernet MACs, and a system-monitoring block that tracks on-die voltage and temperature. The device supports DDR4-2400 with on-chip ECC and offers hardware-rooted security via bitstream encryption and authentication using AES-256 and RSA-2048. The 676-ball FCBGA package has a body size of 27 mm × 27 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs using standard BGA assembly. Typical applications span high-performance digital signal processing, 100G Ethernet network interface cards, 4K/8K video processing pipelines, test and measurement instrumentation, software-defined radio (SDR), and radar/EW front-end processing. The combination of high-speed transceivers and abundant DSP resources makes it a strong fit for low-latency, line-rate processing in both wired and wireless infrastructure. When designing with the XCKU3P-1FFVB676E, allocate at least eight PCB layers with continuous GND planes and matched-length pairs for transceivers; the package's 1.0 mm pitch requires HDI stack-ups (microvias). The extended (E) temperature grade supports -40 °C to +100 °C junction, and designers must respect the 2.0 W/cm² package thermal envelope with adequate airflow or heatsinking for sustained workloads. Vivado Design Suite is required for implementation.

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XCKU3P-1FFVB676I - Kintex UltraScale+ FPGA | AMD
XCKU3P-1FFVB676I

XCKU3P-1FFVB676I - Kintex UltraScale+ FPGA | AMD

AMD XCKU3P-1FFVB676I is a Kintex UltraScale+ field-programmable gate array in a 676-pin FCBGA package. The device combines programmable logic, block RAM, DSP resources, high-speed serial connectivity, and general-purpose I/O in a single heterogeneous FPGA. Its XCKU3P designation identifies the high-performance Kintex UltraScale+ product family, while the -1 suffix identifies the -1 speed grade. The FFVB676 package designation identifies the 676-ball flip-chip BGA configuration used by this part. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. FPGA architecture belongs to the broader programmable-logic hierarchy and can be classified as a semiconductor, integrated circuit, and digital logic device. Instead of implementing every digital function with fixed application-specific circuitry, an FPGA combines configurable logic blocks and dedicated hard resources with an interconnect fabric. This enables parallel processing, rapid hardware revision, and high integration in systems that require deterministic real-time behavior. The XCKU3P family targets demanding communications, industrial, networking, signal-processing, and embedded-control systems. A Kintex UltraScale+ FPGA is useful when a design needs substantially more logic and serial throughput than lower-density programmable devices, while retaining a single-package implementation. The device combines a -1 performance grade with a large 676-pin package that provides extensive package I/O and power connectivity. Exact logic-cell, memory, DSP, I/O, and power specifications should be taken from the current AMD Kintex UltraScale+ data sheet for the selected package and speed grade. Use the part in designs that benefit from parallel datapaths, hardware-assisted filtering, protocol termination, high-speed data movement, or adaptive control. Common engineering roles include accelerator logic, video and image processing, industrial control, test instrumentation, communications infrastructure, and high-speed interface bridging. AMD UltraScale+ devices use programmable logic, block RAM, DSP slices, high-speed I/O, and integrated power-management resources, allowing one device to implement control, datapath, and interface functions in parallel rather than requiring several discrete components. The 676-ball FCBGA package is mechanically and electrically demanding. Board design must follow the AMD package pinout files and the device PCB-design guidance, including exact power and ground-plane connections, via arrays, decoupling placement, and ball-grid escape routing. Differential and high-speed interfaces require controlled impedance, careful return-path continuity, and compliance with the stated maximum transition-rate and board-routing constraints. Use the package-device pinout files from AMD when assigning every ball and when cross-checking the schematic, PCB library, and assembly drawings. Thermal design is also central to FPGA implementation because logic utilization, I/O activity, and switching can increase dynamic power. The power budget should be calculated from the actual clocking, memory, DSP, serial-link, and I/O assumptions in the design, including worst-case activity factors. A conservative approach is to use the AMD power estimator and system-design guidance with the exact device, package, speed grade, and utilization. This page identifies the verified commercial configuration and the engineering constraints that should be checked before schematic release. This product record combines the verified XCKU3P-1FFVB676I configuration, package information, related same-footprint variants, selection trade-offs, and practical implementation guidance. It is intended to help engineers identify the correct AMD/Xilinx Kintex UltraScale+ device and prepare a package-compliant, thermally valid, and production-ready FPGA design.

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