EP4CGX75CF23C6N
EP4CGX75CF23C6N - Cyclone IV GX FPGA, 75K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP4CGX75CF23C6N is a Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and 290 user I/Os, packaged in a 484-ball FineLine BGA (FBGA). It is a commercial-temperature-grade variant of the EP4CGX75 family, integrating up to 8 integrated transceivers supporting data rates up to 3.125 Gbps, which makes it a strong fit for cost-sensitive PCIe Gen1/Gen2, Gigabit Ethernet, and Serial RapidIO applications.
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources. FPGAs sit in the programmable logic family, alongside CPLDs, and are used as glue logic, parallel processors, hardware accelerators, or rapid-prototyping platforms for ASIC designs. Compared with microcontrollers, FPGAs offer deterministic parallelism and far higher I/O throughput; compared with ASICs, FPGAs are reconfigurable in the field and ship with no NRE cost. The Cyclone IV GX family specifically targets low-power, transceiver-rich designs in the 1.0-3.125 Gbps data-rate range.
Key features of the EP4CGX75CF23C6N include 73,920 logic elements (LEs), 4,257,792 bits (approximately 4.27 Mbit) of embedded SRAM, 150 embedded 18x18 multipliers, 4 PLLs, and 8 high-speed transceivers. The device is fabricated on a low-power 60 nm process and supports I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCIe. Designers can configure the FPGA via JTAG, Active Serial (AS), or Passive Serial (PS) configuration modes. The 484-ball FBGA package provides a compact footprint for high-density board designs.
Architecturally, the EP4CGX75CF23C6N uses SRAM-based configuration cells, which means the device is volatile and must be reloaded on every power-up from a configuration memory such as the EPCS or EPCQ serial flash. Logic is organized into Logic Array Blocks (LABs) of 16 LEs each, with each LE containing a 4-input LUT, a register, and a carry chain. The transceiver blocks include physical coding sublayer (PCS) and physical medium attachment (PMA) layers hard-wired for protocols including PCIe, GIGE, and Serial RapidIO.
Typical applications include low-cost PCIe endpoint cards, industrial vision and image processing, motor control and factory automation, protocol bridging (PCIe-to-Local Bus, GIGE-to-Memory), Software Defined Radio (SDR) baseband, and test & measurement equipment. The combination of built-in transceivers and large logic capacity makes this device particularly popular for embedded prototyping and small-volume production runs.
A critical design consideration for the EP4CGX75CF23C6N is power-supply sequencing - the FPGA requires multiple rails (core VCC, VCCPD, VCCA, VCCD_PLL, and transceiver supplies VCCE_GXB and VCCH_GXB) ramped in the correct order to avoid device stress. Decoupling must follow the reference board guideline, with high-frequency decoupling placed as close to each ball as possible. Designers must also allocate sufficient configuration storage (EPCS or EPCQ flash) and select the correct configuration mode via MSEL pins.
This page synthesizes distributor pricing, drop-in same-package alternatives, transceiver-count comparisons, and practical design notes not found in the manufacturer datasheet alone.
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