10AS032H2F34E2LG vs 10AS032H2F34I2SG Perbandingan

Perbandingan bersamaan detil 10AS032H2F34E2LG dari Intel dan 10AS032H2F34I2SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10AS032H2F34E2LG 10AS032H2F34I2SG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria 10 SX Arria 10 SX
Device Tier 10AS032 (mid-density) —
Configuration SoC FPGA (HPS + FPGA fabric) System-on-Chip (SoC) FPGA
Logic Elements 320,000 320,000
Processor Subsystem Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum Operating Frequency 1.5 GHz —
Paket 1152-ball FC-FBGA (F34), 35 x 35 mm 1152-FBGA, FC (35x35 mm)
Speed Grade 2 —
Temperature Grade E2 (commercial/extended) —
On-chip Memory (M20K blocks) Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] —
DSP Blocks Variable-precision, IEEE 754 single-precision FP support —
Transceivers Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] —
Memory Controller Hard IP DDR4, DDR3, QDRII+, RLDRAM3 —
Process Node 20 nm —
Tipe Mounting Surface Mount (BGA) Surface Mount (flip-chip BGA)
Status RoHS Compliant Compliant
Form of Terminal Ball (BGA) —
Terminal Pitch 1 mm —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
HPS Clock Speed (max) — 1.5 GHz
On-chip RAM (HPS) — 256 KB
Process Technology — 20 nm
Core Voltage — 0.9 V
Operating Temperature Grade — Industrial
Lead-Free — Yes
Number of Terminals — 1152 (BGA)
Package Code — BGA (Square, Flip-Chip)

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