10AS032H3F34E2LG vs 10AS032H2F34E2LG Perbandingan

Perbandingan bersamaan detil 10AS032H3F34E2LG dari Intel dan 10AS032H2F34E2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10AS032H3F34E2LG 10AS032H2F34E2LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria 10 SX SoC FPGA Arria 10 SX
Logic Elements 320,000 320,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
Processor Clock Up to 1.5 GHz —
Speed Grade H3 2
Package Code F34 (FCBGA) —
Pin/Ball Count 1152 —
Package Size 35 x 35 mm —
Tipe Mounting Surface Mount (Flip-Chip BGA) Surface Mount (BGA)
Temperature Grade E2 (Industrial) E2 (commercial/extended)
Process Node 20 nm 20 nm
DSP Blocks [DATA_NEEDED: DSP block count] Variable-precision, IEEE 754 single-precision FP support
Transceivers [DATA_NEEDED: transceiver count and rate] Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package]
Memory Interface DDR3 / DDR4 with hard controllers —
Status RoHS Compliant (lead-free) Compliant
Status Lingkungan Hidup Active —
Device Tier — 10AS032 (mid-density)
Configuration — SoC FPGA (HPS + FPGA fabric)
Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Operating Frequency — 1.5 GHz
Paket — 1152-ball FC-FBGA (F34), 35 x 35 mm
On-chip Memory (M20K blocks) — Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet]
Memory Controller Hard IP — DDR4, DDR3, QDRII+, RLDRAM3
Form of Terminal — Ball (BGA)
Terminal Pitch — 1 mm

Spek dan Sumber

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