10M25DAF484C8G vs 10M25DAF484I7G Perbandingan
Perbandingan bersamaan detil 10M25DAF484C8G dari Intel dan 10M25DAF484I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF484C8G | 10M25DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Paket | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FBGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | I7 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 |
| Status RoHS | Compliant | Compliant |
| Level MSL | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (bits) | — | 691,200 |
| User I/Os | — | 360 |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | Industrial (-40 C to +100 C ambient) |
| Tray / Reel | — | Tray |
| 18 x 18 Multipliers | — | 66 |
| On-chip Configuration Flash | — | Dual (instant-on, dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |