10M25DCF256C7G vs 10M25DAF256C8G Perbandingan
Perbandingan bersamaan detil 10M25DCF256C7G dari Intel dan 10M25DAF256C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DCF256C7G | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 (non-volatile FPGA) | MAX 10 |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 55 nm TSMC embedded flash | — |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 691,200 bits (1,728 Kbits M9K / 86 M144K blocks) | 1,728 Kbits |
| Embedded Multipliers (18x18) | 178 | — |
| User Flash Memory | 25 Kbytes | — |
| User I/O Pins | 178 | — |
| Paket | 256-ball FBGA, 17x17 mm, 1.0 mm pitch | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Suhu Kerja | 0C to +85C (Commercial) | — |
| Speed Grade | C7 | C8 |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| I/O Standard Support | LVCMOS, LVTTL, LVDS, SSTL, PCI, HSTL | — |
| Integrated ADC | 12-bit SAR ADC (1 Msps) | — |
| Configuration Method | On-die flash, dual-configuration support | — |
| RoHS / Lead-Free | Yes (lead-free finish, per '7G' suffix) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| PLLs | — | 4 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Status RoHS | — | Compliant |
| Lead-Free / Halogen-Free | — | Yes / Yes |
| Level MSL | — | [DATA_NEEDED: MSL level] |