5M2210ZF256C4N vs EPM570GF256C4N Perbandingan
Perbandingan bersamaan detil 5M2210ZF256C4N dari Altera dan EPM570GF256C4N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Altera
5M2210ZF256C4N - MAX V CPLD, 1700 LE, FBGA-256, C4 Speed | Intel / Altera
5M2210ZF256C4N ✓ AktifAltera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | 5M2210ZF256C4N | EPM570GF256C4N |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX V | MAX II G |
| Device | 5M2210Z | — |
| Logic Elements (LEs) | 1700 | 570 |
| Logic Array Blocks (LABs) | 221 | — |
| User Flash Memory | 8192 bits | — |
| Internal RAM | 212 Kbits | — |
| Maximum User I/O (family) | 203 | — |
| User I/O (this package) | 160 | — |
| Paket | FBGA-256 (FineLine BGA) | 256-ball FineLine BGA (FBGA-256) |
| Suhu Kerja | 0C to 85C (Commercial) | -40 °C to +125 °C (industrial) |
| Speed Grade | C4 (tPD ~4 ns class) | C4 (tPD = 4 ns) |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Number of I/O Banks | 4 | — |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP | JTAG (IEEE 1149.1), in-system programmable |
| Configuration Method | Internal flash (instant-on < 1 ms) | — |
| Process Technology | 0.30 um 6-metal-layer CMOS | — |
| Status RoHS | Compliant (Pb-free ball finish) | — |
| Device Series | — | EPM570G |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Memory | — | Flash (non-volatile, instant-on) |
| Lead-Free / RoHS | — | Lead-free, FBGA package |
| Tipe Mounting | — | Surface Mount (BGA) |