A3PE3000L-FGG324I vs A3PE3000L-1FG324I Perbandingan
Perbandingan bersamaan detil A3PE3000L-FGG324I dari Microchip Technology dan A3PE3000L-1FG324I dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | A3PE3000L-FGG324I | A3PE3000L-1FG324I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L Low Power Flash FPGA |
| System Gates | 3,000,000 | 3000000 |
| Total RAM Bits | 516096 | 516096 |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Paket | 324-BGA FBGA (19x19 mm) | 324-ball FBGA (FG324) |
| Tipe Mounting | Surface Mount (SMD) | Surface Mount |
| Suhu Kerja | -40C to +100C (industrial) | -40C to +100C (industrial, I suffix) |
| Technology Features | Nonvolatile Flash, Instant On, Flash*Freeze | — |
| Configuration | Single-chip, no external boot PROM | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | — |
| Number of Package Balls | 324 | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Configuration Memory | — | Non-volatile on-chip flash (single chip, secure) |
| Low Power Feature | — | Flash*Freeze technology |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |