AFS600-FG256 vs AFS600-1FG256K Perbandingan
Perbandingan bersamaan detil AFS600-FG256 dari Microchip Technology dan AFS600-1FG256K dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | AFS600-FG256 | AFS600-1FG256K |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | — |
| User I/O Count | 119 I/Os | — |
| Embedded Memory | 110,592 bits | Large flash memory blocks |
| Tegangan Pemuat | 1.5 V | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | — |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash-based CMOS | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Package Type | 256-pin low-profile BGA | — |
| Package Pitch | 1.0 mm | — |
| Jumlah Pin | 256 pins | — |
| Suhu Kerja | 0 C to 70 C | — |
| Device Type | FPGA | Fusion mixed-signal field-programmable gate array (FPGA) |
| Analog Capability | Configurable analog blocks | — |
| Clock Capability | Integrated clock generation and management circuitry | — |
| Maximum Frequency | 1098.9 MHz | 1282.05 MHz |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Programmable Logic | — | Flash-based programmable logic |
| Equivalent System Gates | — | 600,000 gates |
| Logic Cells | — | 13,824 logic cells |
| User I/O | — | 119 I/O |
| Core Supply Voltage | — | 1.5 V |
| Integrated Analog | — | Configurable analog resources |
| Clock Management | — | Comprehensive clock generation and management circuitry |
| Paket | — | 256-terminal plastic ball grid array (256-LBGA) |
| Terminal Count | — | 256 terminals |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.00 mm |
| Package Dimensions | — | 17 mm x 17 mm |
| Tipe Mounting | — | Surface mount |
| Ordering Package Option | — | Tray |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |