EP2A40F672C8N vs EP2A40F672C9N Perbandingan
Perbandingan bersamaan detil EP2A40F672C8N dari Intel dan EP2A40F672C9N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A40F672C8N | EP2A40F672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Series | EP2A40 | — |
| Logic Family | CMOS | CMOS (SRAM-based configuration) |
| System Gates | 1.5 M | 1,500,000 |
| Logic Elements / Cells | 38,400 | — |
| Maximum Operating Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | 1.55 ns |
| Technology Node | 0.15 µm | — |
| Process Feature | All-layer copper, up to 8 metal layers | — |
| Nominal Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| User I/Os | 492 | 492 |
| Number of Pins / Balls | 672 | — |
| Package Type | FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| LVDS Data Rate | 1 Gbps | 1 Gbps |
| Embedded PLLs | 4 | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Operating Temperature (Commercial) | 0 °C to 85 °C | — |
| Speed Grade | C8 | C9 (~1.55 ns propagation delay) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Device Name | — | EP2A40 |
| Logic Elements | — | 38,400 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Paket | — | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Package Code | — | FC-FBGA / PBGA672 |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage | — | 1.5 V |
| Internal Frequency | — | 366 MHz |
| Suhu Kerja | — | 0 °C to +85 °C (commercial) |
| Tipe Mounting | — | Surface Mount |